MICROSEMI LX5560L

LX5560
InGaAs – E-Mode pHEMT Low Noise Amplifier
®
TM
P RODUCTION D ATA S HEET
KEY FEATURES
DESCRIPTION
The LNA is implemented with bias
circuit and input matching circuit on
chip, resulting in simple external
circuit. In addition, the on-chip bias
circuit provides stable performance of
gain, NF and current for voltage
variation compared to a general
resistor-network bias circuit.
The LX5560 is available in a 12-pin
2mmx2mm micro-lead package(MLPQ12L).
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0.5µm InGaAs E-mode pHEMT
4.9 - 6GHz Operation
Single 3.3V Supply
Gain ~ 12dB
Noise Figure ~ 1.7dB
Input IP3 ~ +6dBm
Input P1dB ~ +2dBm
On-Chip Bias Circuit
On-Chip Input Match
Simple Output Match
2x2mm² MLPQ 12 Pin
Low Profile 0.5mm
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The LX5560 is a low noise amplifier
(LNA) for WLAN applications in the
4.9-6.0 GHz frequency range. This
LNA is manufactured with an InGaAs
Enhancement mode pseudomorphic
HEMT (E-pHEMT) process.
It operates with a single positive
voltage supply of 3.3V, with noise
figure(NF) of 1.7dB while maintaining
input third order intercept point(IIP3)
of up to +6dBm.
APPLICATIONS
BLOCK DIAGRAM
ƒ Wireless LAN 802.11a
ƒ WiMax
Vdd
Bias
Circuit
RF
Input
RF
Output
Input
Match
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
PRODUCT HIGHLIGHT
•
560
645
LX5560
PACKAGE ORDER INFO
LL
Plastic MLPQ
12 pin
RoHS Compliant / Pb-free
LX5560LL
Note: Available in Tape & Reel. Append the letters
“TR” to the part number. (i.e. LX5560LL-TR)
Copyright © 2006
Rev. 1.0, 2006-12-20
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1
LX5560
®
TM
InGaAs – E-Mode pHEMT Low Noise Amplifier
P RODUCTION D ATA S HEET
N/C
9
RF OUT
8
N/C
VDD
11
12
GND
6
5
4
N/C
7
N/C
N/C
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal.
10
1
N/C
2
RF IN
3
N/C
LL PACKAGE
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DC Supply Voltage, RF Off............................................................................................4 V
Drain Current ............................................................................................................ 40 mA
Total Power Dissipation............................................................................................0.15 W
RF Input Power..................................................................................................... +10 dBm
Operation Ambient Temperature Range ..................................................... -40°C to +85°C
Storage Temperature Range.........................................................................-65°C to 150°C
Package Peak Temp. for Solder Reflow (40 seconds maximum exposure) ... 260°C (+0 -5)
N/C
PACKAGE PIN OUT
N/C
ABSOLUTE MAXIMUM RATINGS
(Bottom View)
RoHS / Pb-free NiPdAu Lead Finish
FUNCTIONAL PIN DESCRIPTION
Name
Pin #
Description
RF IN
2
RF Input for the low noise amplifier. This pin is DC-shorted to GND but AC-coupled to the
transistor gate.
RF OUT
8
RF Output for the low noise amplifier. This pin is AC-coupled and does not require a DC-blocking
capacitor.
VDD
12
GND
Center
Metal
Supply Voltage.
N/C
1,3,4,5,6,7,
9,10,11
The center metal base of the MLP package provides both DC and RF ground.
Not Used. They may be treated either as open pins or connected to the ground.
PACKAGE DATA
Copyright © 2006
Rev. 1.0, 2006-12-20
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
LX5560
®
TM
InGaAs – E-Mode pHEMT Low Noise Amplifier
P RODUCTION D ATA S HEET
Parameter
Symbol
Application Frequency Range
Small-Signal Gain
Noise Figure
Input 3rd Order Intercept Point
Input P1dB
Input Return Loss
Output Return Loss
Supply Voltage
Supply Current
f
S21
NF
IIP3
IP1dB
S11
S22
VDD
IDD
Test Conditions
Min
4.9
Room Temperature
Freq. 1 = 5.25 GHz, Freq. 2 = 5.27 GHz
Freq. = 5.5 GHz
LX5560
Typ
12
1.7
6
2
9
10
3.3
9.5
Max
6
2.1
Units
GHz
dB
dB
dBm
dBm
dB
dB
V
mA
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ELECTRICAL CHARACTERISTICS
Nominal test conditions: VDD = 3.3V, IDD = 9.5mA, TA = 25°C (Room Temperature)
ELECTRICALS
Copyright © 2006
Rev. 1.0, 2006-12-20
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 3
LX5560
InGaAs – E-Mode pHEMT Low Noise Amplifier
®
TM
P RODUCTION D ATA S HEET
S11
S12
S21
GAIN OVER TEMP
S22
3.0V
20
3.6V
15
10
14
-40°C
0
13
S21 (dB)
S11, S12, S21, S22 (dB)
3.3V
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S-PARAMETER
-10
12
+25°C
-20
11
-30
10
+85°C
9
-40
0
1
2
3
4
5
6
4.9
7
5
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
6
Frequency (GHz)
Frequency (GHz)
Typical S-Parameter Data at Room Temperature
(Vdd = 3.3V, Idd = 9.5mA at Room Temperature)
NOISE FIGURE OVER TEMP
3.0V
3.3V
CURRENT OVER TEMP
3.6V
-40°C
2.5
+85°C
15
14
+85°C
13
2
12
+25°C
Idd (mA)
Noise Figure (dB)
+25°C
1.5
-40°C
11
10
9
8
1
7
6
5
0.5
4.9
5
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
3
6
3.1
3.2
3.3
INPUT P1DB (+25°C)
3.0V
3.3V
3.4
3.5
3.6
Vdd (V)
Frequency (GHz)
INPUT IP3 (+25°C)
3.0V
3.6V
3.3V
3.6V
12
5
11
IIP3 (dBm)
10
3
2
9
8
CHARTS
IP1dB (dBm)
4
7
6
5
1
4
0
3
4.9
5
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
6
Frequency (GHz)
Copyright © 2006
Rev. 1.0, 2006-12-20
4.9
5
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
6
Frequency (GHz)
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 4
LX5560
InGaAs – E-Mode pHEMT Low Noise Amplifier
®
TM
P RODUCTION D ATA S HEET
POWER SWEEP @ 5.5GHz
Idd
20
35
15
30
10
25
5
20
0
15
-5
10
-10
5
-15
Idd (mA)
Pout (dBm), Gain (dB)
Gain
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Pout
0
-20 -18 -16 -14 -12 -10 -8 -6 -4 -2
0
2
4
6
8 10 12
Pin (dBm)
(Vdd=3.3V, Idq=9.5mA at Room Temperature)
CHARTS
Copyright © 2006
Rev. 1.0, 2006-12-20
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 5
LX5560
TM
®
InGaAs – E-Mode pHEMT Low Noise Amplifier
P RODUCTION D ATA S HEET
APPLICATION SCHEMATIC
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BOM LIST
Reference Designator
Part Description
Case
C1
Capacitor, 1 pF
0402
C2
Capacitor,1 µF
0603
C3
Capacitor,10 µF
0805
L1
Inductor, 1.5 nH (TOKO : LL1005-FH1N5S)
0402
R1
Resistor, 30 Ohm
0402
NOTES
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It is recommended to place C1 at ~30mil from MLP package outline.
It is recommended to place L1 at ~30mil from MLP package outline.
C2 and C3 are used for standalone evaluation board test only. They can be replaced with a 1nF(0402) in final applications.
APPLICATIONS
Copyright © 2006
Rev. 1.0, 2006-12-20
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 6
LX5560
InGaAs – E-Mode pHEMT Low Noise Amplifier
®
TM
P RODUCTION D ATA S HEET
PACKAGE DIMENSIONS
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LL
12-Pin MLPQ Plastic (2x2mm)
D
D2
E
E2
L
e
b
A
A1
A3
Dim
A
A1
A3
b
D
D2
E
E2
e
L
MILLIMETERS
MIN
MAX
0.40
0.50
0.00
0.05
0.15 REF
0.15
0.25
2.00 BSC
0.77
1.02
2.00 BSC
0.77
1.02
0.40 BSC
0.19
0.39
INCHES
MIN
MAX
0.016
0.020
0.000
0.002
0.006 REF
0.006
0.010
0.079 BSC
0.030
0.040
0.079 BSC
0.030
0.040
0.016 BSC
0.007
0.015
Note:
1. Dimensions do not include mold flash or protrusions;
these shall not exceed 0.155mm(.006”) on any side.
Lead dimension shall not include solder coverage.
MECHANICALS
Recommended Land Pattern
Copyright © 2006
Rev. 1.0, 2006-12-20
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 7
LX5560
TM
®
InGaAs – E-Mode pHEMT Low Noise Amplifier
P RODUCTION D ATA S HEET
NOTES
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NOTES
PRODUCTION DATA – Information contained in this document is proprietary to
Microsemi and is current as of publication date. This document may not be modified in any
way without the express written consent of Microsemi. Product processing does not
necessarily include testing of all parameters. Microsemi reverses the right to change the
configuration and performance of the product and to discontinue product at any time.
Copyright © 2006
Rev. 1.0, 2006-12-20
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 8