ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 DUAL CHANNEL, 12-BIT, 125/105/80/65 MSPS ADC WITH SERIAL LVDS INTERFACE • FEATURES 1 • • • • • • • • • • Maximum Sample Rate: 125 MSPS 12-Bit Resolution with No Missing Codes Simultaneous Sample and Hold 3.5 dB Coarse Gain and up to 6 dB Programmable Fine Gain for SFDR/SNR Trade-Off Serialized LVDS Outputs with Programmable Internal Termination Option Supports Sine, LVCMOS, LVPECL, LVDS Clock Inputs and Amplitude Down to 400 mVpp Internal Reference with External Reference Support No External Decoupling Required for References 3.3-V Analog and Digital Supply 48 QFN Package (7 mm × 7 mm) • Pin Compatible 14-Bit Family (ADS624X SLAS542) Feature Compatible Quad Channel Family (ADS644X - SLAS531 and ADS642X - SLAS532) APPLICATIONS • • • • Base-Station IF Receivers Diversity Receivers Medical Imaging Test Equipment Table 1. ADS62XX Dual Channel Family 125 MSPS 105 MSPS 80 MSPS 65 MSPS ADS624X 14 Bit ADS6245 ADS6244 ADS6243 ADS6242 ADS622X 12 Bit ADS6225 ADS6224 ADS6223 ADS6222 Table 2. Performance Summary SFDR, dBc SINAD, dBFS ADS6225 ADS6224 ADS6223 ADS6222 Fin = 10MHz (0 dB gain) 90 91 91 93 Fin = 170MHz (3.5 dB gain) 79 81 82 83 Fin = 10MHz (0 dB gain) 70.7 70.8 71.3 71.3 Fin = 170MHz (3.5 dB gain) 67.4 68.1 68.2 68.7 500 405 350 315 Power per channel, mW DESCRIPTION ADS6225/ADS6224/ADS6223/ADS6222 (ADS622X) is a family of high performance 12-bit 125/105/80/65 MSPS dual channel A-D converters. Serial LVDS data outputs reduce the number of interface lines, resulting in a compact 48-pin QFN package (7 mm × 7 mm) that allows for high system integration density. The device includes 3.5 dB coarse gain option that can be used to improve SFDR performance with little degradation in SNR. In addition to the coarse gain, fine gain options also exist, programmable in 1 dB steps up to 6 dB. The output interface is 2-wire, where each ADC data is serialized and output over two LVDS pairs. This makes it possible to halve the serial data rate (compared to a 1-wire interface) and restrict it to less than 1 Gbps easing receiver design. The ADS622X also includes the traditional 1-wire interface that can be used at lower sampling frequencies. An internal phase lock loop (PLL) multiplies the incoming ADC sampling clock to derive the bit clock. The bit clock is used to serialize the ADC data from each channel. In addition to the serial data streams, the frame and bit clocks are also transmitted as LVDS outputs. The LVDS output buffers have features such as programmable LVDS currents, current doubling modes and internal termination options. These can be used to widen eye-openings and improve signal integrity, easing capture by the receiver. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007, Texas Instruments Incorporated ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DESCRIPTION (CONTINUED) The ADC channel outputs can be transmitted either as MSB or LSB first and 2s complement or straight binary. LVDD LGND CAP AVDD AGND ADS622X has internal references, but can also support an external reference mode. The device is specified over the industrial temperature range (–40°C to 85°C). CLKP CLKM BIT Clock DCLKP DCLKM FRAME Clock FCLKP FCLKM PLL INA_P SHA INA_M INB_P SHA 12-Bit ADC Digital Encoder and Serializer 12-Bit ADC Digital Encoder and Serializer VCM DA1_P DA1_M DB0_P DB0_M DB1_P DB1_M REFM REFP INB_M DA0_P DA0_M Reference Parallel Interface Serial Interface 2 Submit Documentation Feedback SCLK RESET SEN SDATA CFG4 CFG3 CFG1 CFG2 PDNA PDNB ADS622x B0199-06 Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 PACKAGE/ORDERING INFORMATION (1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ADS6225 QFN-48 (2) RGZ –40°C to 85°C AZ6225 ADS6224 QFN-48 (2) RGZ –40°C to 85°C AZ6224 ADS6223 QFN-48 (2) RGZ –40°C to 85°C AZ6223 ADS6222 (1) (2) QFN-48 (2) RGZ –40°C to 85°C AZ6222 ORDERING NUMBER TRANSPORT MEDIA, QUANTITY ADS6225IRGZT 250, Tape/reel ADS6225IRGZR 2000, Tape/reel ADS6224IRGZT 250, Tape/reel ADS6224IRGZR 2000, Tape/reel ADS6223IRGZT 250, Tape/reel ADS6223IRGZR 2000, Tape/reel ADS6222IRGZT 250, Tape/reel ADS6222IRGZR 2000, Tape/reel For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. For thermal pad size on the package, see the mechanical drawings at the end of this data sheet. θJA = 23.17 °C/W (0 LFM air flow), θJC = 22.1 °C/W when used with 2 oz. copper trace and pad soldered directly to a JEDEC standard four layer 3 in. x 3 in. PCB. ABSOLUTE MAXIMUM RATINGS (1) VALUE UNIT AVDD Supply voltage range –0.3 to 3.9 V LVDD Supply voltage range –0.3 to 3.9 V Voltage between AGND and DGND –0.3 to 0.3 V Voltage between AVDD to LVDD –0.3 to 3.3 V Voltage applied to external pin, VCM –0.3 to 2.0 V Voltage applied to analog input pins –0.3V to minimum ( 3.6, AVDD + 0.3V) V TA Operating free-air temperature range –40 to 85 °C TJ Operating junction temperature range 125 °C Tstg Storage temperature range –65 to 150 °C 220 °C Lead temperature 1,6 mm (1/16") from the case for 10 seconds (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 3 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT AVDD Analog supply voltage 3.0 3.3 3.6 V LVDD 3.0 3.3 3.6 V SUPPLIES LVDS Buffer supply voltage ANALOG INPUTS Differential input voltage range 2 Vpp 1.5 ±0.1 Input common-mode voltage Voltage applied on VCM in external reference mode 1.45 1.50 V 1.55 V CLOCK INPUT Input clock sample rate ADS6225 5 125 ADS6224 5 105 ADS6223 5 80 ADS6222 5 Sine wave, ac-coupled 0.4 LVPECL, ac-coupled Input clock amplitude differential (VCLKP – VCLKM) 65 1.5 ±0.8 LVDS, ac-coupled Vpp ±0.35 LVCMOS, ac-coupled MSPS 3.3 Input clock duty cycle 35% 50% 65% DIGITAL OUTPUTS Without internal termination CLOAD Maximum external load capacitance from each output pin to DGND RLOAD Differential load resistance (external) between the LVDS output pairs TA Operating free-air temperature 5 With internal termination pF 10 Ω 100 –40 85 °C ELECTRICAL CHARACTERISTICS Typical values are at 25°C, min and max values are across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = LVDD = 3.3 V, maximum rated sampling frequency, 50% clock duty cycle, –1dBFS differential analog input, internal reference mode (unless otherwise noted). PARAMETER ADS6225 Fs = 125 MSPS MIN RESOLUTION TYP ADS6224 Fs = 105 MSPS MAX MIN TYP ADS6223 Fs = 80 MSPS MAX MIN TYP ADS6222 Fs = 65 MSPS MAX MIN TYP UNIT MAX 12 12 12 12 Bits 2.0 2.0 2.0 2.0 VPP 7 7 7 7 pF Analog input bandwidth 500 500 500 500 MHz Analog input common mode current (per input pin of each ADC) 155 130 100 81 μA ANALOG INPUT Differential input voltage range Differential input capacitance REFERENCE VOLTAGES VREFB Internal reference bottom voltage 1.0 1.0 1.0 1.0 V VREFT Internal reference top voltage 2.0 2.0 2.0 2.0 V ΔVREF Internal reference error, (VREFT–VREFB) VCM Common mode output voltage 4 –15 ±2 1.5 Submit Documentation Feedback 15 –15 ±2 1.5 15 –15 ±2 1.5 15 –15 ±2 1.5 15 mV V Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 ELECTRICAL CHARACTERISTICS (continued) Typical values are at 25°C, min and max values are across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = LVDD = 3.3 V, maximum rated sampling frequency, 50% clock duty cycle, –1dBFS differential analog input, internal reference mode (unless otherwise noted). PARAMETER ADS6225 Fs = 125 MSPS MIN VCM output current capability TYP ADS6224 Fs = 105 MSPS MAX MIN 4 TYP ADS6223 Fs = 80 MSPS MAX MIN 4 TYP ADS6222 Fs = 65 MSPS MAX MIN 4 TYP UNIT MAX 4 mA DC ACCURACY No missing codes EO Offset error, across devices and across channels within a device Assured –15 Offset error temperature coefficient, across devices and across channels within a device ±2 Assured 15 –15 0.05 ±2 Assured 15 –15 0.05 Assured ±2 15 –15 0.05 ±2 15 0.05 mV mV/°C There are two sources of gain error - internal reference inaccuracy and channel gain error EGREF Gain error due to internal reference inaccuracy alone, (ΔVREF /2.0)% –0.75 Reference gain error temperature coefficient EGCHAN Gain error of channel alone, across devices and across channels within a device (1) Differential nonlinearity INL Integral nonlinearity PSRR DC power supply rejection ratio 0.75 –0.75 0.0125 –1 Channel gain error temperature coefficient, across devices and across channels within a device DNL ±0.1 ±0.3 ±0.1 0.75 –0.75 0.0125 1 –1 0.005 ±0.3 ±0.1 0.75 –0.75 0.0125 1 –1 0.005 ±0.1 0.75 Δ%/°C 0.0125 ±0.3 1 –1 0.005 ±0.3 % FS 1 % FS Δ%/°C 0.005 –0.95 ±0.5 2.0 –0.95 ±0.5 2.0 –0.9 ±0.4 1.8 –0.9 ±0.4 1.8 -2.5 ±1.25 2.5 -2.2 ±1.25 2.2 -2.0 ±1.25 2.0 -2.0 ±1.0 2.0 LSB LSB 0.5 0.5 0.5 0.5 mV/V POWER SUPPLY ICC Total supply current 300 245 210 190 mA IAVDD Analog supply current 237 185 155 140 mA ILVDD LVDS supply current 63 60 55 50 Total power 1.0 1.2 0.81 0.97 0.7 0.85 0.63 0.8 W Power down (with input clock stopped) 77 150 77 150 77 150 77 150 mW (1) mA This is specified by design and characterization; it is not tested in production. Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 5 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 ELECTRICAL CHARACTERISTICS Typical values are at 25°C, min and max values are across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = LVDD = 3.3 V, maximum rated sampling frequency, 50% clock duty cycle, –1dBFS differential analog input, internal reference mode (unless otherwise noted). PARAMETER ADS6225 Fs = 125 MSPS TEST CONDITIONS MIN TYP MAX ADS6224 Fs = 105 MSPS MIN TYP MAX ADS6223 Fs = 80 MSPS MIN TYP MAX ADS6222 Fs = 65 MSPS MIN TYP UNIT MAX DYNAMIC AC CHARACTERISTICS Fin = 10 MHz Fin = 50 MHz SNR Signal to noise ratio 67.5 Fin = 100 MHz 70.1 70.5 70.5 0 dB Gain 68.5 68.8 69 69.1 3.5 dB Coarse gain 68.1 68.4 68.4 68.8 0 dB Gain 67.4 67.8 66.9 68.1 3.5 dB Coarse gain 67.1 67.3 67.3 67.8 70.7 70.8 71.3 71.3 70 69.8 67 69.2 Fin = 100 MHz SINAD Signal to 0 dB Gain noise and Fin = 170 3.5 dB distortion ratio MHz Coarse gain 0 dB Gain 3.5 dB Coarse gain Fin = 10 MHz Fin = 50 MHz 73 70.9 71 69.7 70 70.1 70 66.9 68.5 68.6 68.9 67.4 68.1 68.2 68.7 67.5 70.7 66 66.8 66.5 67.3 66.5 66.8 67.2 67.4 90 91 91 93 83 80 Fin = 100 MHz 87 86 87 85 85 83 0 dB Gain 75 78 79 80 3.5 dB Coarse gain 79 81 82 83 0 dB Gain 74 76 77 78 3.5 dB Coarse gain 78 79 80 81 93 94 96 97 91 88 90 92 Fin = 50 MHz 73 76 90 88 90 Fin = 100 MHz 90 90 87 87 0 dB Gain 85 84 86 86 3.5 dB Coarse gain 88 86 88 88 0 dB Gain 82 81 82 83 3.5 dB Coarse gain 85 83 84 85 Fin = 230 MHz Submit Documentation Feedback 76 87 Fin = 70 MHz Fin = 170 MHz 73 76 dBFS 88 81 Fin = 10 MHz 73 76 dBFS 71 70.6 78 Fin = 230 MHz 67 67.5 68 70 Fin = 70 MHz Fin = 170 MHz 71.2 69.9 Fin = 70 MHz Fin = 230 MHz 71.4 71.1 70.9 Fin = 50 MHz 67.5 71.4 68 70.6 Fin = 10 MHz 6 70.8 70.3 Fin = 230 MHz HD2 Second harmonic 71 70.5 Fin = 70 MHz Fin = 170 MHz SFDR Spurious free dynamic range 70.9 dBc 92 dBc Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 ELECTRICAL CHARACTERISTICS (continued) Typical values are at 25°C, min and max values are across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = LVDD = 3.3 V, maximum rated sampling frequency, 50% clock duty cycle, –1dBFS differential analog input, internal reference mode (unless otherwise noted). PARAMETER ADS6225 Fs = 125 MSPS TEST CONDITIONS MIN Fin = 10 MHz Fin = 50 MHz HD3 Third harmonic THD Total harmonic distortion Cross-talk TYP 90 91 83 80 MIN 76 TYP MAX MIN TYP 91 93 87 88 81 86 87 85 85 83 0 dB Gain 75 78 79 80 3.5 dB Coarse gain 79 82 82 83 0 dB Gain 74 76 77 78 3.5 dB Coarse gain 78 79 80 81 Fin = 10 MHz 95 95 96 98 Fin = 50 MHz 94 94 95 95 Fin = 70 MHz 92 94 95 95 Fin = 100 MHz 91 92 93 93 Fin = 170 MHz 88 89 90 90 Fin = 230 MHz 86 86 87 87 Fin = 10 MHz 88 89.5 89.5 91 81 78.5 Fin = 170 MHz Fin = 50 MHz 70 Fin = 70 MHz 73 MAX 78 70 74 76 85.5 77 84 83 80.5 Fin = 170 MHz 73 76 77.5 78.5 Fin = 230 MHz 72 74 75.5 76.5 11.4 10.9 10.8 11.5 dBc dBc 11.5 Bits 10.9 11.4 dBc 86 74 84 10.8 UNIT MAX 86 Fin = 100 MHz F1= 46.09 MHz, F2 = 50.09 MHz 90 90 94 97 F1= 185.09 MHz, F2 = 190.09 MHz 82 88 92 96 105 105 106 108 1 1 1 1 Clock cycles 35 35 35 35 dBc dBFS Cross-talk signal frequency = 10 MHz Recovery to within 1% (of final Input overload value) for 6-dB overload with recovery sine wave input AC PSRR Power Supply Rejection Ratio MIN ADS6222 Fs = 65 MSPS Fin = 100 MHz ENOB Fin = 50 MHz Effective number of bits Fin = 70 MHz IMD 2-Tone intermodulatio n distortion MAX ADS6223 Fs = 80 MSPS Fin = 70 MHz Fin = 230 MHz Worst harmonic (other than HD2, HD3) 73 TYP ADS6224 Fs = 105 MSPS Up to 100 MHz, 100 mVPP on AVDD Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 dBc 7 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 DIGITAL CHARACTERISTICS The DC specifications refer to the condition where the digital outputs are not switching, but are permanently at a valid logic level 0 or 1 AVDD = LVDD = 3.3V, IO = 3.5mA, RLOAD = 100Ω (1). All LVDS specifications are characterized, but not tested at production. PARAMETER ADS6225/ADS6224/AD S6223/ADS6222 TEST CONDITIONS MIN TYP UNIT MAX DIGITAL INPUTS High-level input voltage 2.4 V Low-level input voltage 0.8 V High-level input current 10 μA Low-level input current 10 μA 4 pF High-level output voltage 1375 mV Low-level output voltage 1025 Input capacitance DIGITAL OUTPUTS |VOD| Output differential voltage VOS Output offset voltage Common-mode voltage of OUTP and OUTM Output capacitance Output capacitance inside the device, from either output to ground (1) 8 250 350 mV 450 mV 1200 mV 2 pF IO refers to the LVDS buffer current setting, RLOAD is the external differential load resistance between the LVDS output pair. Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 TIMING SPECIFICATIONS (1) Typical values are at 25°C, min and max values are across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = LVDD = 3.3 V, maximum rated sampling frequency, sine wave input clock, 1.5 VPP clock amplitude, CL = 5 pF (2), IO = 3.5 mA, RL = 100 Ω (3), no internal termination, unless otherwise noted. PARAMETER tJ TEST CONDITIONS ADS6225 MIN Aperture jitter Uncertainty in the sampling instant ADS6224 TYP MAX MIN 250 ADS6223 TYP MAX MIN 250 ADS6222 TYP MAX MIN 250 TYP MAX UNIT 250 fs rms Interface: 2-wire, DDR bit clock, 14x serialization tsu Data setup time (4) (5) (6) From data cross-over to bit clock cross-over 0.35 0.55 0.45 0.65 0.65 0.85 0.8 1.1 ns th Data hold time (4) (5) (6) From bit clock cross-over to data cross-over 0.35 0.58 0.5 0.7 0.7 0.9 0.8 1.1 ns tpd_clk Clock propagation delay (6) Input clock rising edge cross-over to frame clock rising edge cross-over 3.4 4.4 3.4 4.4 3.4 4.4 3.4 4.4 5.4 5.4 5.4 5.4 ns Bit clock cycle-cycle jitter (5) 350 350 350 350 ps pp Frame clock cycle-cycle jitter (5) 75 75 75 75 ps pp Below specifications apply for 5 MSPS ≤ Sampling freq ≤ 125 MSPS and all interface options Aperture delay tA Aperture delay variation ADC Latency (7) Delay from input clock rising edge to the actual sampling instant Channel-channel within same device 1 2 –250 ±80 Time for a sample to propagate to ADC outputs, see Figure 1 3 1 2 250 –250 ±80 12 Time to valid data after coming out of global power down 3 1 2 250 –250 ±80 12 3 1 2 3 ns 250 –250 ±80 250 ps 12 Clock cycles 12 100 100 100 100 μs Time to valid data Wake up time after input clock is re-started 100 100 100 100 μs Time to valid data after coming out of channel standby 200 200 200 200 clock cycles tRISE Data rise time From –100 mV to +100 mV 50 100 200 50 100 200 50 100 200 50 100 200 tFALL Data fall time From +100 mV to –100 mV 50 100 200 50 100 200 50 100 200 50 100 200 ps tRISE Bit clock and Frame clock rise time From –100 mV to +100 mV 50 100 200 50 100 200 50 100 200 50 100 200 ps (1) (2) (3) (4) (5) (6) (7) ps Timing parameters are ensured by design and characterization and not tested in production. CL is the External single-ended load capacitance between each output pin and ground. Io Refers to the LVDS buffer current setting; RL is the external differential load resistance between the LVDS output pair. Timing parameters are measured at the end of a 2 inch pcb trace (100-Ω characteristic impedance) terminated by RLand CL. Setup and hold time specifications take into account the effect of jitter on the output data and clock. Refer to Output Timings in application section for timings at lower sampling frequencies and other interface options. Note that the total latency = ADC latency + internal serializer latency. The serializer latency depends on the interface option selected as listed in Table 28. Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 9 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 TIMING SPECIFICATIONS (continued) Typical values are at 25°C, min and max values are across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = LVDD = 3.3 V, maximum rated sampling frequency, sine wave input clock, 1.5 VPP clock amplitude, CL = 5 pF , IO = 3.5 mA, RL = 100 Ω , no internal termination, unless otherwise noted. TEST CONDITIONS PARAMETER tFALL Bit clock and Frame clock fall time From +100 mV to –100 mV ADS6225 MIN ADS6224 TYP MAX MIN ADS6223 TYP MAX MIN ADS6222 TYP MAX MIN 50 100 200 50 100 200 50 100 200 50 100 200 LVDS Bit clock duty cycle 45% 50% 55% 45% 50% 55% 45% 50% 55% 45% 50% 55% LVDS Frame clock duty cycle 47% 50% 53% 47% 50% 53% 47% 50% 53% 47% 50% 53% ps Sample N+13 Sample N+12 Sample N+11 UNIT TYP MAX Sample N Input Signal tA Input Clock CLKM CLKP tPD_CLK Latency 12 Clocks DCLKP Bit Clock DCLKM Output Data DOM DOP D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 D11 D10 D9 D8 D7 Sample N–1 Frame Clock D6 D5 D4 D3 D2 D1 D0 Sample N FCLKM FCLKP T0105-03 Figure 1. Latency 10 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 DCLKP Bit Clock DCLKM tsu th tsu Output Data DOP, DOM th Dn+1 Dn T0106-03 Figure 2. LVDS Timings Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 11 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 DEVICE PROGRAMMING MODES ADS622X offers flexibility with several programmable features that are easily configured. The device can be configured independently using either parallel interface control or serial interface programming. In addition, the device supports a third configuration mode, where both the parallel interface and the serial control registers are used. In this mode, the priority between the parallel and serial interfaces is determined by a priority table (Table 4). If this additional level of flexibility is not required, the user can select either the serial interface programming or the parallel interface control. USING PARALLEL INTERFACE CONTROL ONLY To control the device using parallel interface, keep RESET tied to high (LVDD). Pins CFG1, CFG2, CFG3, CFG4, PDNA, PDNB, SEN, SCLK, and SDATA are used to directly control certain functions of the ADC. After power-up, the device will automatically get configured as per the parallel pin voltage settings (Table 5 to Table 9) and no reset is required. In this mode, SEN, SCLK, and SDATA function as parallel interface control pins. Frequently used functions are controlled in this mode—output data interface and format, power down modes, coarse gain and internal/external reference. The parallel pins can be configured using a simple resistor string as illustrated in Figure 3. Table 3 has a description of the modes controlled by the parallel pins. Table 3. Parallel Pin Definition PIN SEN CONTROL FUNCTIONS Coarse gain and internal/external reference. SCLK, SDATA Sync, deskew patterns and global power down. PDNA, PDNB Dedicated pins for individual channel ADC power down CFG1 1-Wire/2-wire and DDR/SDR bit clock CFG2 12x/14x Serialization and SDR bit clock capture edge CFG3 Reserved function. Tie CFG3 to Ground. CFG4 MSB/LSB First and data format. USING SERIAL INTERFACE PROGRAMMING ONLY In this mode, SEN, SDATA, and SCLK function as serial interface pins and are used to access the internal registers of ADC. The registers must first be reset to their default values either by applying a pulse on RESET pin or by a high setting on the <RST> bit (in register ). After reset, the RESET pin must be kept low. The serial interface section describes the register programming and register reset in more detail. Since the parallel pins (CFG1-4, PDNA and PDNB) are not used in this mode, they must be tied to ground. The register override bit <OVRD> - D10 in register 0x0D has to be set high to disable the control of parallel interface pins in this serial interface control ONLY mode. USING BOTH THE SERIAL INTERFACE AND PARALLEL CONTROLS For increased flexibility, a combination of serial interface registers and parallel pin controls (CFG1-4, PDNA and PDNB) can also be used to configure the device. The parallel interface control pins CFG1-4, PDNA and PDNB are available. After power-up, the device will automatically get configured as per the parallel pin voltage settings (Table 5 to Table 12) and no reset is required. A simple resistor string can be used as illustrated in Figure 3. SEN, SDATA, and SCLK function as serial interface pins and are used to access the internal registers of ADC. The registers must first be reset to their default values either by applying a pulse on RESET pin or by a high setting on the <RST> bit (in register ). After reset, the RESET pin must be kept low. The serial interface section describes the register programming and register reset in more detail. Since some functions are controlled using both the parallel pins and serial registers, the priority between the two is determined by a priority table (Table 4). 12 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 Table 4. Priority Between Parallel Pins and Serial Registers PIN CFG1 to CFG4 FUNCTIONS SUPPORTED PRIORITY As described in Table 9 to Table 12 Register bits can control the modes ONLY if the <OVRD> bit is high. If the <OVRD> bit is LOW, then the control voltage on these parallel pins determines the function as per Tables PDN Global power down D0 Bit of register 0x00 controls Power down global ONLY if PDN pin is LOW. If PDN is high, device is in global power down mode. SEN Serial Interface Enable Coarse Gain setting is controlled by bit D5 of register 0x0D ONLY if the <OVRD> bit is high. Else, it is in default register setting of 0 dB COARSE GAIN. Internal/external reference setting is determined by bit D6 of register 0x00. SCLK, SDATA D7, D6, D5 Bits of register 0x0A control the sync and deskew output patterns. Serial Interface Clock and Serial Interface Data pins Power down is determined by bit D0 of 0x00 register. AVDD (5/8) AVDD 3R (5/8) AVDD GND 2R AVDD (3/8) AVDD (3/8) AVDD 3R To Parallel Pin GND Figure 3. Simple Scheme to Configure Parallel Pins DESCRIPTION OF PARALLEL PINS Table 5. SCLK, SDATA Control Pins SCLK SDATA LOW LOW NORMAL conversion. DESCRIPTION LOW HIGH SYNC – ADC Outputs sync pattern on all channels. This pattern can be used by the receiver to align the deserialized data to the frame boundary. See Capture Test Patterns for details. HIGH LOW POWER DOWN – Global power down, all channels of the ADC are powered down, including internal references, PLL and output buffers. HIGH HIGH DESKEW – ADC outputs deskew pattern on all channels. This pattern can be used by the receiver to ensure deserializer uses the right clock edge. See Capture Test Patterns for details. Table 6. SEN Control Pin SEN 0 DESCRIPTION External reference and 0 dB coarse gain (full-scale = 2 Vpp) (3/8)LVDD External reference and 3.5 dB coarse gain (full-scale = 1.34 Vpp) (5/8)LVDD Internal reference and 3.5 dB coarse gain (full-scale = 1.34 Vpp) LVDD Internal reference and 0 dB coarse gain (full-scale = 2 Vpp) Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 13 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 Independent of the programming mode used, after power-up the parallel pins PDNA,PDNB,CFG1 to CFG4 will automatically configure the device as per the voltage applied (Table 7 to Table 12). Table 7. PDNA Control Pin PDNA 0 AVDD DESCRIPTION Normal operation Channel A ADC power down global Table 8. PDNB Control Pin PDNB 0 AVDD DESCRIPTION Normal operation Channel B ADC power down global Table 9. CFG1 Control Pin CFG1 0 DESCRIPTION DDR Bit clock and 1-wire interface (3/8)LVDD Not used (5/8)LVDD SDR Bit clock and 2-wire interface LVDD DDR Bit clock and 2-wire interface Table 10. CFG2 Control Pin CFG2 DESCRIPTION 0 12x Serialization and capture at falling edge of bit clock (only in 2-wire SDR bit clock mode) (3/8)LVDD 14x Serialization and capture at falling edge of bit clock (only in 2-wire SDR bit clock mode) (5/8)LVDD 14x Serialization and capture at rising edge of bit clock (only in 2-wire SDR bit clock mode) LVDD 12x Serialization and capture at rising edge of bit clock (only in 2-wire SDR bit clock mode) Table 11. CFG3 Control Pin CFG3 RESERVED – TIE TO GROUND Table 12. CFG4 Control Pin CFG4 0 MSB First and 2s complement (3/8)LVDD MSB First and offset binary (5/8)LVDD LSB First and offset binary LVDD 14 DESCRIPTION LSB First and 2s complement Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 SERIAL INTERFACE The ADC has a serial interface formed by pins SEN (serial interface enable), SCLK (serial interface clock), SDATA (serial interface data) and RESET. Serial shift of bits into the device is enabled when SEN is low. Serial data SDATA is latched at every falling edge of SCLK when SEN is active (low). The serial data is loaded into the register at every 16th SCLK falling edge when SEN is low. In case the word length exceeds a multiple of 16 bits, the excess bits are ignored. Data can be loaded in multiple of 16-bit words within a single active SEN pulse. The interface can work with SCLK frequency from 20 MHz down to very low speeds (few hertz) and even with non-50% duty cycle SCLK. The first 5 bits of the 16-bit word are the address of the register while the next 11 bits are the register data. Register Reset After power-up, the internal registers must be reset to their default values. This can be done in one of two ways: 1. Either by applying a high-going pulse on RESET (of width greater than 10ns) OR 2. By applying software reset. Using the serial interface, set the <RST> bit in register 0x00 to high – this resets the registers to their default values and then self-resets the <RST> bit to LOW. When RESET pin is not used, it must be tied to LOW. Register Address SDATA A4 A3 A2 A1 Register Data A0 D10 D9 D8 D7 D6 t(SCLK) D5 D4 D3 D2 D1 D0 t(DH) t(DSU) SCLK t(SLOADH) t(SLOADS) SEN RESET T0109-03 Figure 4. Serial Interface Timing Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 15 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 SERIAL INTERFACE TIMING CHARACTERISTICS Typical values at 25°C, min and max values across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = LVDD = 3.3 V, unless otherwise noted. PARAMETER MIN TYP > DC MAX UNIT 20 MHz fSCLK SCLK Frequency, fSCLK = 1/tSCLK tSLOADS SEN to SCLK Setup time 25 ns tSLOADH SCLK to SEN Hold time 25 ns tDSU SDATA Setup time 25 ns tDH SDATA Hold time 25 ns 100 ns Time taken for register write to take effect after 16th SCLK falling edge RESET TIMING Typical values at 25°C, min and max values across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = LVDD = 3.3 V, unless otherwise noted. PARMATER CONDITIONS MIN t1 Power-on delay time Delay from power-up of AVDD and LVDD to RESET pulse active t2 Reset pulse width t3 tPO TYP MAX UNIT 5 ms Pulse width of active RESET signal 10 ns Register write delay time Delay from RESET disable to SEN active 25 ns Power-up delay time Delay from power-up of AVDD and LVDD to output stable 6.5 ms Power Supply AVDD, LVDD t1 RESET t2 t3 SEN T0108-03 Figure 5. Reset Timing 16 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 SERIAL REGISTER MAP Table 13. Summary of Functions Supported By Serial Interface REGISTER ADDRESS A4–A0 REGISTER FUNCTIONS (1)(2) D10 D9 D8 D7 00 <RST> S/W RESET 0 0 0 04 0 0 0 0 0 <DF> DATA FORMAT 2S COMP OR STRAIGHT BINARY 0 0A 0D 10 11 (1) (2) 0 D5 <REF> INTERNAL OR EXTERNAL D4 D3 <PDN CHB> POWER DOWN CHB 0 D2 <PDN CHA> POWER DOWN CH A <CLKIN GAIN> INPUT CLOCK BUFFER GAIN CONTROL <PATTERNS> TEST PATTERNS 0 0 0 D1 D0 0 <PDN GLOBAL> GLOBAL POWER DOWN 0 0 0 0 <CUSTOM A> CUSTOM PATTERN (LOWER 11 BITS) 0B 0C D6 <FINE GAIN> FINE GAIN CONTROL (1dB to 6 dB) <OVRD> OVERRIDE BIT 0 0 0 0 0 0 0 0 0 <CUSTOM B> CUSTOM PATTERN (MSB BIT) BYTE-WISE OR BIT-WISE MSB OR LSB FIRST <COARSE GAIN> COURSE GAIN ENABLE FALLING OR RISING BIT CLOCK CAPTURE EDGE 0 12-BIT OR 14-BIT SERIALIZE DDR OR SDR BIT CLOCK 1-WIRE OR 2-WIRE INTERFACE <TERM CLK> LVDS INTERNAL TERMINATION BIT AND WORD CLOCKS WORD-WISE CONTROL 0 0 <LVDS CURR> LVDS CURRENT SETTINGS 0 0 <CURR DOUBLE> LVDS CURRENT DOUBLE <TERM DATA> LVDS INTERNAL TERMINATION - DATA OUTPUTS The unused bits in each register (shown by blank cells in above table) must be programmed as 0. Multiple functions in a register can be programmed in a single write operation. Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 17 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 DESCRIPTION OF SERIAL REGISTERS Table 14. REGISTER ADDRESS A4–A0 BITS D10 <RST> S/W RESET 00 D9 D8 0 0 D7 0 D6 D5 0 <REF> INTERNAL OR EXTERNAL D4 D3 D2 0 <PDN CHB> POWER DOWN CHB <PDN CHA> POWER DOWN CH A D1 D0 0 <PDN> GLOBAL POWER DOWN D0 - D4 Power down modes D0 <PDN GLOBAL> 0 Normal operation 1 Global power down, including all channels ADCs, internal references, internal PLL and output buffers D2 <PDN CHA> 0 CH A Powered up 1 CH A ADC Powered down D3 <PDN CHB> 0 CH B Powered up 1 CH B ADC Powered down D5 <REF> Reference 0 Internal reference enabled 1 External reference enabled D10 <RST> 1 Software reset applied – resets all internal registers and self-clears to 0 18 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 Table 15. REGISTER ADDRESS A4 - A0 04 BITS D10 0 D9 0 D8 D7 0 D6 D5 D4 D3 D2 <CLKIN GAIN> INPUT CLOCK BUFFER GAIN CONTROL 0 D6–D2 <CLKIN GAIN> Input clock buffer gain control 11000 Gain 0 minimum gain 00000 Gain 1 01100 Gain 2 01010 Gain 3 01001 Gain 4 01000 Gain 5 maximum gain D1 D0 0 0 Table 16. REGISTER ADDRESS A4–A0 00 BITS D10 D9 D8 0 <DF> DATA FORMAT 2S COMP OR STRAIGHT BINARY 0 D7 D6 D5 <PATTERNS> TEST PATTERNS D4 D3 D2 D1 D0 0 0 0 0 0 D7–D5 <PATTERNS> Capture test patterns 000 Normal ADC operation 001 Output all zeros 010 Output all ones 011 Output toggle pattern 100 Unused 101 Output custom pattern (contents of CUSTOM pattern registers 0x0B and 0x0C) 110 Output DESKEW pattern (serial stream of 1010..) 111 Output SYNC pattern D9 <DF> Data format selection 0 2s Complement format 1 Straight binary format Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 19 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 Table 17. REGISTER ADDRESS A4–A0 BITS D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 <CUSTOM A> CUSTOM PATTERN (LOWER 11 BITS) 0B D10 - D0 <CUSTOM A> Lower 11 bits of custom pattern <DATAOUT10>…<DATAOUT0> Table 18. REGISTER ADDRESS A4–A0 BITS D10 D9 D8 <FINE GAIN> FINE GAIN CONTROL (1 dB to 6 dB) 0C D7 D6 0 D5 0 0 D4 0 D3 0 D0 <CUSTOM B> MSB of 12-bit custom pattern <DATAOUT11> D10–D8 <FINE GAIN> Fine gain control 000 0 dB Gain (full-scale range = 2.00 Vpp) 001 1 dB Gain (full-scale range = 1.78 Vpp) 010 2 dB Gain (full-scale range = 1.59 Vpp) 011 3 dB Gain (full-scale range = 1.42 Vpp) 100 4 dB Gain (full-scale range = 1.26 Vpp) 101 5 dB Gain (full-scale range = 1.12 Vpp) 110 6 dB Gain (full-scale range = 1.00 Vpp) D2 D1 D0 0 0 <CUSTOM B> CUSTOM PATTERN (MSB) Table 19. REGISTER ADDRESS A4–A0 0D BITS D10 <OVRD> OVER-RIDE BITE D9 D8 0 0 D7 BYTE-WISE OR BIT-WISE D6 MSB OR LSB FIRST D5 D4 D3 D2 D1 D0 <COARSE GAIN> COURSE GAIN ENABLE FALLING OR RISING BIT CLOCK CAPTURE EDGE 0 14-BIT OR 16-BIT SERIALIZE DDR OR SDR BIT CLOCK 1-WIRE OR 2-WIRE INTERFACE D0 Interface selection 0 1 Wire interface 1 2 Wire interface D1 Bit clock selection (only in 2-wire interface) 0 DDR Bit clock 1 SDR Bit clock D2 Serialization selection 0 12x Serialization 1 14x Serialization 20 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 D4 Bit clock capture edge (only when SDR bit clock is selected, D1 = 1) 0 Capture data with falling edge of bit clock 1 Capture data with rising edge of bit clock D5 <COARSE GAIN>Coarse gain control 0 0 dB Coarse gain 1 3.5dB Coarse gain (Full-scale range = 1.34 Vpp) D6 MSB or LSB first selection 0 MSB First 1 LSB First D7 Byte/bit wise outputs (only when 2-wire is selected) 0 Byte wise 1 Bit wise D10 <OVRD> Over-ride bit. All the functions in register 0x0D can also be controlled using the parallel control pins. By setting bit <OVRD> = 1, the contents of register 0x0D will over-ride the settings of the parallel pins. 0 Disable over-ride 1 Enable over-ride Table 20. REGISTER ADDRESS A4–A0 10 BITS D10 D9 D8 D7 D6 D5 <TERM CLK> LVDS INTERNAL TERMINATION BIT AND WORD CLOCKS D4 D3 D2 <LVDS CURR> LVDS CURRENT SETTINGS D0 <CURR DOUBLE> LVDS current double for data outputs 0 Nominal LVDS current, as set by <D5…D2> 1 Double the nominal value D1 <CURR DOUBLE> LVDS current double for bit and word clock outputs 0 Nominal LVDS current, as set by <D5…D2> 1 Double the nominal value D3–D2 <LVDS CURR> LVDS current setting for data outputs 00 3.5 mA 01 4 mA 10 2.5 mA 11 3 mA D5–D4 <LVDS CURR> LVDS current setting for bit and word clock outputs 00 3.5 mA 01 4 mA 10 2.5 mA 11 3 mA Copyright © 2007, Texas Instruments Incorporated D1 Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 D0 <LVDS DOUBLE> LVDS CURRENT DOUBLE 21 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 D10–D6 <TERM CLK> LVDS internal termination for bit and word clock outputs 00000 No internal termination 00001 166 Ω 00010 200 Ω 00100 250 Ω 01000 333 Ω 10000 500 Ω Any combination of above bits can also be programmed, resulting in a parallel combination of the selected values. For example, 00101 is the parallel combination of 166||250 = 100 Ω 100 Ω 00101 Table 21. REGISTER ADDRESS A4–A0 BITS D10 11 D9 D8 WORD-WISE CONTROL 0 D7 0 D6 D5 0 0 D4 D3 D2 D1 D0 <TERM DATA> LVDS INTERNAL TERMINATION - DATA OUTPUTS D4–D0 <TERM DATA> LVDS internal termination for data outputs 00000 No internal termination 00001 166 Ω 00010 200 Ω 00100 250 Ω 01000 333 Ω 10000 500 Ω Any combination of above bits can also be programmed, resulting in a parallel combination of the selected values. For example, 00101 is the parallel combination of 166||250 = 100 Ω 00101 100 Ω D10–D9 Only when 2-wire interface is selected 00 Byte-wise or bit-wise output, 1x frame clock 11 Word-wise output enabled, 0.5x frame clock 01,10 Do not use 22 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 PIN CONFIGURATION (2-WIRE INTERFACE) DA0_P DA1_M DA1_P DCLK_M DCLK_P FCLK_M FCLK_P DB0_M DB0_P DB1_M DB1_P 46 45 44 43 42 41 40 39 38 37 LVDD 47 1 DA0_M LGND 48 ADS622x RGZ PACKAGE (TOP VIEW) 36 LVDD 2 35 LGND CAP 3 34 SCLK RESET 4 33 SDATA LVDD 5 32 SEN AGND 6 31 PDNA PAD 24 AGND AVDD 25 23 12 CFG1 AGND 22 INB_P CFG2 26 21 11 CFG3 INA_P 20 INB_M AGND 27 19 10 CLKM INA_M 18 AGND CLKP 28 17 9 AGND AGND 16 AGND CM 29 15 8 CFG4 AGND 14 PDNB NC 30 13 7 AVDD AVDD P0023-07 PIN ASSIGNMENTS (2-WIRE INTERFACE) PINS NAME NO. I/O NO. OF PINS DESCRIPTION SUPPLY AND GROUND PINS AVDD 7,13,24 3 Analog power supply AGND 6,8,9,12,17, 20,25,28,29 9 Analog ground LVDD 2,5,36 3 Digital power supply LGND 1,35 2 Digital ground INPUT PINS CLKP, CLKM 18,19 I 2 Differential input clock pair INA_P, INA_M 11,10 I 2 Differential input signal pair, channel A. If unused, the pins should be tied to VCM. Do not float. INB_P, INB_M 26,27 I I2 Differential input signal pair, channel B. If unused, the pins should be tied to VCM. Do not float. 3 I 1 Connect 2-nF capacitor from pin to ground CAP Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 23 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 PIN ASSIGNMENTS (2-WIRE INTERFACE) (continued) PINS I/O NO. OF PINS 34 I 1 This pin functions as serial interface clock input when RESET is low. When RESET is high, it controls DESKEW, SYNC and global POWER DOWN modes (along with SDATA). See Table 5 for description. This pin has an internal pull-down resistor. 33 I 1 This pin functions as serial interface data input when RESET is low. When RESET is high, it controls DESKEW, SYNC and global POWER DOWN modes (along with SCLK). See Table 5 for description. This pin has an internal pull-down resistor. 1 This pin functions as serial interface enable input when RESET is low. When RESET is high, it controls coarse gain and internal/external reference modes. See Table 6 for description. This pin has an internal pull-up resistor. NAME NO. SCLK SDATA SEN 32 I DESCRIPTION Serial interface reset input. When using the serial interface mode, the user MUST initialize internal registers through hardware RESET by applying a high-going pulse on this pin or by using software reset option. Refer to the Serial Interface section. In parallel interface mode, tie RESET permanently high. (SCLK, SDATA and SEN function as parallel control pins in this mode). RESET 4 I 1 PDNA 31 I 1 Channel A ADC power down control pin. PDNB 30 I 1 Channel B ADC power down control pin. CFG1 23 I 1 Parallel input pin. It controls 1-wire or 2-wire interface and DDR or SDR bit clock selection. See Table 9 for description. Tie to AVDD for 2-wire interface with DDR bit clock. CFG2 22 I 1 Parallel input pin. It controls 12x or 14x serialization and SDR bit clock capture edge. See Table 10 for description. For 12x serialization with DDR bit clock, tie to ground or AVDD. CFG3 21 I 1 RESERVED pin - TIE to ground. CFG4 15 I 1 Parallel input pin. It controls data format and MSB or LSB first modes. See Table 12 for description. VCM 16 IO 1 Internal reference mode – common-mode voltage output External reference mode – reference input. The voltage forced on this pin sets the internal reference. DA0_P,DA0_M 47,48 O 2 Channel A differential LVDS data output pair, wire 0 DA1_P,DA1_M 45,46 O 2 Channel A differential LVDS data output pair, wire 1 DB0_P,DB0_M 39,40 O 2 Channel B differential LVDS data output pair, wire 0 DB1_P,DB1_M 37,38 O 2 Channel B differential LVDS data output pair, wire 1 DCLKP,DCLKM 43,44 O 2 Differential bit clock output pair FCLKP,FCLKM 41,42 O The pin has an internal pull-down resistor to ground. OUTPUT PINS 2 Differential frame clock output pair NC 14 1 Do Not Connect PAD 0 1 Connect to ground plane using multiple vias. Refer to Board Design Considerations in application section 24 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 PIN CONFIGURATION (1-WIRE INTERFACE) UNUSED DA_M DA_P DCLK_M DCLK_P FCLK_M FCLK_P DB_M DB_P UNUSED UNUSED 46 45 44 43 42 41 40 39 38 37 LVDD 47 1 UNUSED LGND 48 ADS622x RGZ PACKAGE (TOP VIEW) 36 LVDD 2 35 LGND CAP 3 34 SCLK RESET 4 33 SDATA LVDD 5 32 SEN AGND 6 31 PDNA PAD 24 AGND AVDD 25 23 12 CFG1 AGND 22 INB_P CFG2 26 21 11 CFG3 INA_P 20 INB_M AGND 27 19 10 CLKM INA_M 18 AGND CLKP 28 17 9 AGND AGND 16 AGND CM 29 15 8 CFG4 AGND 14 PDNB NC 30 13 7 AVDD AVDD P0023-08 PIN ASSIGNMENTS (1-WIRE INTERFACE) PINS NAME NO. I/O NO. OF PINS DESCRIPTION SUPPLY AND GROUND PINS AVDD 7,13,24 3 Analog power supply AGND 6,8,9,12,1 7, 20,25,28,2 9 9 Analog ground LVDD 2,5,36 3 Digital power supply LGND 1,35 2 Digital ground 2 Differential input clock pair INPUT PINS CLKP, CLKM 18,19 I INA_P, INA_M 11,10 I 2 Differential input signal pair, channel A. If unused, the pins should be tied to VCM. Do not float. IND_P, IND_M 26,27 I I2 Differential input signal pair, channel D. If unused, the pins should be tied to VCM. Do not float. 3 I 1 Connect 2-nF capacitance from pin to ground CAP Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 25 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 PIN ASSIGNMENTS (1-WIRE INTERFACE) (continued) PINS NAME NO. SCLK 34 SDATA 33 SEN 32 I/O I I I NO. OF PINS DESCRIPTION 1 This pin functions as serial interface clock input when RESET is low. When RESET is high, it controls DESKEW, SYNC and global POWER DOWN modes (along with SDATA). See Table 5 for description. This pin has an internal pull-down resistor. 1 This pin functions as serial interface data input when RESET is low. When RESET is high, it controls DESKEW, SYNC and global POWER DOWN modes (along with SCLK). See Table 5 for description. This pin has an internal pull-down resistor. 1 This pin functions as serial interface enable input when RESET is low. When RESET is high, it controls coarse gain and internal/external reference modes. See Table 6 for description. This pin has an internal pull-up resistor. Serial interface reset input. When using the serial interface mode, the user MUST initialize internal registers through hardware RESET by applying a high-going pulse on this pin or by using software reset option. Refer to the Serial Interface section. In parallel interface mode, tie RESET permanently high. (SCLK, SDATA and SEN function as parallel control pins in this mode). RESET 4 I 1 PDNA 31 I 1 Channel A ADC power down control pin. PDNB 30 I 1 Channel B ADC power down control pin. CFG1 23 I 1 Parallel input pin. It controls 1-wire or 2-wire interface and DDR or SDR bit clock selection. See Table 9 for description. Tie to ground for 1-wire interface with DDR bit clock. CFG2 22 I 1 Parallel input pin. It controls 12x or 14x serialization and SDR bit clock capture edge. See Table 10 for description. For 12x serialization with DDR bit clock, tie to ground or AVDD. CFG3 21 I 1 RESERVED pin - TIE to ground. CFG4 15 I 1 Parallel input pin. It controls data format and MSB or LSB first modes. See Table 12 for description. VCM 16 IO 1 Internal reference mode – common-mode voltage output External reference mode – reference input. The voltage forced on this pin sets the internal reference. DA_P,DA_M 45,46 O 2 Channel A differential LVDS data output pair DB_P,DB_M 39,40 O 2 Channel B differential LVDS data output pair DCLKP,DCLKM 43,44 O 2 Differential bit clock output pair FCLKP,FCLKM 41,42 O 2 Differential frame clock output pair 37,38,47,4 8 4 These pins are unused in the 1-wire interface. Do not connect NC 14 1 Do not connect PAD 0 1 Connect to ground plane using multiple vias. Refer to Board Design Considerations in application section The pin has an internal pull-down resistor to ground. OUTPUT PINS UNUSED 26 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 TYPICAL CHARACTERISTICS All plots are at 25°C, AVDD = LVDD = 3.3 V, maximum rated sampling frequency, sine wave input clock, 1.5 VPP differential clock amplitude, 50% clock duty cycle, –1 dBFS differential analog input, internal reference mode, 0 dB gain (unless otherwise noted) ADS6225 (FS = 125 MSPS) FFT for 10 MHz INPUT SIGNAL FFT for 100 MHz INPUT SIGNAL 0 SFDR = 91 dBc SINAD = 71.35 dBFS SNR = 71.41 dBFS THD = 89.5 dBc −20 SFDR = 86.7 dBc SINAD = 69.9 dBFS SNR = 70.1 dBFS THD = 82.7 dBc −20 −40 Amplitude − dB −40 Amplitude − dB 0 −60 −80 −100 −60 −80 −100 −120 −120 −140 −140 −160 −160 0 10 20 30 40 50 60 f − Frequency − MHz 0 10 20 30 G001 Figure 6. 50 60 G003 Figure 7. FFT for 230 MHz INPUT SIGNAL INTERMODULATION DISTORTION (IMD) vs FREQUENCY 0 0 SFDR = 79.2 dBc SINAD = 67.4 dBFS SNR = 68 dBFS THD = 77.9 dBc −20 fIN1 = 185.1 MHz, –7 dBFS fIN2 = 190.1 MHz, –7 dBFS 2-Tone IMD = –81 dBFS SFDR = –91 dBFS −20 −40 Amplitude − dB −40 Amplitude − dB 40 f − Frequency − MHz −60 −80 −100 −60 −80 −100 −120 −120 −140 −140 −160 −160 0 10 20 30 40 50 f − Frequency − MHz 60 0 10 20 30 40 50 f − Frequency − MHz G005 Figure 8. 60 G021 Figure 9. SFDR vs INPUT FREQUENCY SNR vs INPUT FREQUENCY 90 72 88 71 84 82 SNR − dBFS SFDR − dBc 86 Gain = 3.5 dB 80 78 70 Gain = 0 dB 69 68 Gain = 3.5 dB 76 67 74 Gain = 0 dB 72 66 0 50 100 150 fIN − Input Frequency − MHz 200 250 G007 0 50 100 Figure 10. Copyright © 2007, Texas Instruments Incorporated 150 200 fIN − Input Frequency − MHz 250 G008 Figure 11. Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 27 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 ADS6225 (FS = 125 MSPS) (continued) SFDR vs INPUT FREQUENCY ACROSS GAINS SINAD vs INPUT FREQUENCY ACROSS GAINS 92 72 Input adjusted to get −1dBFS input 3 dB 90 88 4 dB 84 82 6 dB 70 SINAD − dBFS SFDR − dBc 4 dB 5 dB 86 80 0 dB 71 2 dB 69 3.5 dB 3 dB 1 dB 68 67 2 dB 78 76 0 dB 66 1 dB 6 dB 74 5 dB 65 50 70 90 110 130 150 170 190 210 230 fIN − Input Frequency − MHz 20 40 60 80 100 120 140 160 180 200 220 fIN − Input Frequency − MHz G009 Figure 12. PERFORMANCE vs AVDD 76 86 75 94 SFDR 80 72 SNR 71 76 SFDR − dBc 73 70 fIN = 50.1 MHz LVDD = 3.3 V 74 72 3.0 3.1 73 fIN = 50.1 MHz AVDD = 3.3 V 72 74 82 78 98 SNR − dBFS SFDR − dBc PERFORMANCE vs LVDD 88 84 3.2 3.3 3.4 3.5 SNR 90 86 70 SFDR 82 69 78 3.0 68 3.6 3.1 3.2 3.3 PERFORMANCE vs TEMPERATURE 73 71 SNR 78 70 76 69 SNR − dBFS SFDR − dBc 72 68 T − Temperature − °C G013 74 80 73 SNR (dBFS) 70 71 50 70 Submit Documentation Feedback 69 SFDR (dBc) −50 −40 fIN = 20 MHz −30 −20 Input Amplitude − dBFS Figure 16. 28 72 60 30 −60 80 75 SFDR (dBFS) 90 40 fIN = 50.1 MHz 60 76 100 SFDR 82 40 G012 110 SFDR − dBc, dBFS 84 20 68 3.6 PERFORMANCE vs INPUT AMPLITUDE 74 0 3.5 Figure 15. 86 −20 3.4 LVDD − Supply Voltage − V G011 Figure 14. 74 −40 71 69 AVDD − Supply Voltage − V 80 G010 Figure 13. SNR − dBFS 30 SNR − dBFS 10 −10 68 0 G014 Figure 17. Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 ADS6225 (FS = 125 MSPS) (continued) PERFORMANCE vs CLOCK AMPLITUDE fIN = 50.1 MHz 90 73 77 89 75 SFDR 71 84 70 82 69 SFDR 80 SFDR − dBc SNR 86 1.0 1.5 73 87 71 86 2.0 67 fIN = 20.1 MHz 66 3.0 2.5 Input Clock Amplitude − VPP 84 65 35 40 45 50 60 65 Input Clock Duty Cycle − % G015 G020 Figure 19. POWER DISSIPATION vs SAMPLING FREQUENCY OUTPUT NOISE HISTOGRAM WITH INPUTS TIED TO COMMON-MODE 80 0.9 70 RMS (LSB) = 0.407 0.8 60 0.6 Occurence − % 0.7 AVDD 0.5 0.4 0.3 LVDD 50 40 30 20 0.2 10 0.1 0 0.0 0 25 50 75 100 fS − Sampling Frequency − MSPS 2044 125 2045 2046 G015 92 72 90 71 SNR 88 70 SNR − dBFS fIN = 50.1 MHz External Reference Mode SFDR 86 69 1.45 1.50 1.55 VVCM − VCM Voltage − V 2050 G017 1.60 1.65 68 1.70 G018 0 −10 −20 −30 −40 −50 −60 −70 −80 −90 −100 0 50 100 150 200 250 f − Frequency − MHz Figure 22. Copyright © 2007, Texas Instruments Incorporated 2049 CMRR vs FREQUENCY 73 CMRR − Common-Mode Rejection Ratio − dBc PERFORMANCE IN EXTERNAL REFERENCE MODE 1.40 2048 Figure 21. 94 1.35 2047 Output Code Figure 20. SFDR − dBc 55 Figure 18. 1.0 84 1.30 69 SNR 85 67 76 0.5 88 68 78 PD − Power Dissipation − W 90 72 SNR − dBFS 88 SFDR − dBc PERFORMANCE vs CLOCK DUTY CYCLE 74 SNR − dBFS 92 300 G018 Figure 23. Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 29 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 ADS6224 (FS = 105 MSPS) FFT for 10 MHz INPUT SIGNAL FFT for 100 MHz INPUT SIGNAL 0 −20 −40 −60 −80 −100 −60 −80 −100 −120 −120 −140 −140 −160 −160 0 10 20 30 40 50 f − Frequency − MHz 0 10 20 30 40 50 f − Frequency − MHz G001 G002 Figure 24. Figure 25. FFT for 230 MHz INPUT SIGNAL INTERMODULATION DISTORTION (IMD) vs FREQUENCY 0 0 SFDR = 80 dBc SINAD = 67.5 dBFS SNR = 67.8 dBFS THD = 79.5 dBc −20 fIN1 = 185.1 MHz, –7 dBFS fIN2 = 190.1 MHz, –7 dBFS 2-Tone IMD = –88 dBFS SFDR = –88 dBFS −20 −40 Amplitude − dB −40 Amplitude − dB SFDR = 81.1 dBc SINAD = 69.7 dBFS SNR = 70.4 dBFS THD = 79.8 dBc −20 Amplitude − dB −40 Amplitude − dB 0 SFDR = 91.7 dBc SINAD = 71.2 dBFS SNR = 71.2 dBFS THD = 89.8 dBc −60 −80 −100 −60 −80 −100 −120 −120 −140 −140 −160 −160 0 10 20 30 40 f − Frequency − MHz 50 0 10 20 30 40 f − Frequency − MHz G003 Figure 26. 50 G004 Figure 27. SFDR vs INPUT FREQUENCY SNR vs INPUT FREQUENCY 92 72 90 71 Gain = 0 dB 86 SNR − dBFS SFDR − dBc 88 Gain = 3.5 dB 84 82 80 70 69 Gain = 3.5 dB 68 78 Gain = 0 dB 67 76 74 66 0 50 100 150 fIN − Input Frequency − MHz 200 250 G005 0 50 100 Figure 28. 30 Submit Documentation Feedback 150 fIN − Input Frequency − MHz 200 250 G006 Figure 29. Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 ADS6224 (FS = 105 MSPS) (continued) SFDR vs INPUT FREQUENCY ACROSS GAINS SINAD vs INPUT FREQUENCY ACROSS GAINS 92 72 Input adjusted to get −1dBFS input 90 4 dB 88 2 dB 70 3 dB 84 82 6 dB 80 69 68 67 2 dB 66 78 4 dB 1 dB 0 dB 76 65 74 64 10 30 50 70 90 110 130 150 170 190 210 230 fIN − Input Frequency − MHz 5 dB 6 dB 20 40 60 80 100 120 140 160 180 200 220 fIN − Input Frequency − MHz G007 Figure 30. PERFORMANCE vs AVDD PERFORMANCE vs LVDD fIN = 70.1 MHz LVDD = 3.3 V 77 94 73 fIN = 70.1 MHz AVDD = 3.3 V 72 75 80 74 78 73 76 72 SNR 3.1 3.2 3.3 86 70 SFDR 82 3.4 78 3.0 70 3.6 3.5 3.1 3.2 PERFORMANCE vs TEMPERATURE 100 74 73 80 72 SNR 71 76 SNR − dBFS SFDR − dBc SFDR 82 70 60 90 SFDR (dBFS) 80 80 75 SNR (dBFS) 70 70 60 65 SFDR (dBc) 50 60 80 G011 55 fIN = 20.1 MHz −30 −20 −10 50 0 Input Amplitude − dBFS Figure 34. Copyright © 2007, Texas Instruments Incorporated 85 90 30 −40 69 T − Temperature − °C G010 40 fIN = 70.1 MHz 40 68 3.6 110 SFDR − dBc, dBFS 84 20 3.5 PERFORMANCE vs INPUT AMPLITUDE 75 0 3.4 Figure 33. 86 −20 3.3 LVDD − Supply Voltage − V G009 Figure 32. 74 −40 69 71 AVDD − Supply Voltage − V 78 71 SNR SNR − dBFS 74 90 SNR − dBFS SFDR 82 SFDR − dBc 76 SNR − dBFS SFDR − dBc 98 78 84 72 3.0 G008 Figure 31. 88 86 1 dB 3 dB SINAD − dBFS 5 dB 86 SFDR − dBc 3.5 dB 0 dB 71 G012 Figure 35. Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 31 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 ADS6224 (FS = 105 MSPS) (continued) PERFORMANCE vs CLOCK AMPLITUDE PERFORMANCE vs CLOCK DUTY CYCLE 74 90 82 74 fIN = 20.1 MHz 73 fIN = 70.1 MHz 80 71 84 70 82 69 80 SFDR − dBc SNR 86 68 SFDR 78 78 72 76 71 SNR 74 70 67 76 0.5 1.0 1.5 2.0 66 3.0 2.5 72 69 35 Input Clock Amplitude − VPP 40 45 50 55 60 65 Input Clock Duty Cycle − % G013 Figure 36. G014 Figure 37. POWER DISSIPATION vs SAMPLING FREQUENCY PERFORMANCE IN EXTERNAL REFERENCE MODE 1.0 85 74 fIN = 70.1 MHz External Reference Mode 0.9 0.8 84 72 0.6 AVDD 0.5 0.4 0.3 SNR 83 82 70 68 SFDR SNR − dBFS 0.7 SFDR − dBc PD − Power Dissipation − W 73 SFDR 72 SNR − dBFS SFDR − dBc 88 SNR − dBFS 92 LVDD 0.2 81 66 0.1 0.0 0 20 40 60 80 80 1.30 100 fS − Sampling Frequency − MSPS 1.35 1.40 1.45 1.50 1.55 VVCM − VCM Voltage − V G033 Figure 38. 1.60 1.65 64 1.70 G017 Figure 39. CMRR − Common-Mode Rejection Ratio − dBc CMRR vs FREQUENCY 0 −10 −20 −30 −40 −50 −60 −70 −80 −90 −100 0 50 100 150 200 f − Frequency − MHz 250 300 G018 Figure 40. 32 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 ADS6223 (FS = 80 MSPS) FFT for 10 MHz INPUT SIGNAL FFT for 100 MHz INPUT SIGNAL 0 −20 −40 −60 −80 −100 −60 −80 −100 −120 −120 −140 −140 −160 −160 0 10 20 30 f − Frequency − MHz 40 0 10 20 G019 40 G020 Figure 41. Figure 42. FFT for 230 MHz INPUT SIGNAL INTERMODULATION DISTORTION (IMD) vs FREQUENCY 0 SFDR = 81 dBc SINAD = 68.3 dBFS SNR = 68.4 dBFS THD = 79.5 dBc −20 fIN1 = 185.1 MHz, –7 dBFS fIN2 = 190.1 MHz, –7 dBFS 2-Tone IMD = –92 dBFS SFDR = –93 dBFS −20 −40 Amplitude − dB −40 −60 −80 −100 −60 −80 −100 −120 −120 −140 −140 −160 −160 0 10 20 30 f − Frequency − MHz 40 0 10 20 30 f − Frequency − MHz G021 Figure 43. 40 G022 Figure 44. SFDR vs INPUT FREQUENCY SNR vs INPUT FREQUENCY 94 74 92 73 90 72 Gain = 3.5 dB 88 SNR − dBFS SFDR − dBc 30 f − Frequency − MHz 0 Amplitude − dB SFDR = 85.8 dBc SINAD = 70.6 dBFS SNR = 70.9 dBFS THD = 83.9 dBc −20 Amplitude − dB −40 Amplitude − dB 0 SFDR = 91.2 dBc SINAD = 71.2 dBFS SNR = 71.3 dBFS THD = 88.3 dBc 86 84 82 Gain = 0 dB 70 69 Gain = 3.5 dB 68 80 67 78 66 76 65 74 Gain = 0 dB 71 64 0 50 100 150 fIN − Input Frequency − MHz 200 250 G023 0 50 100 Figure 45. Copyright © 2007, Texas Instruments Incorporated 150 200 fIN − Input Frequency − MHz 250 G024 Figure 46. Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 33 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 ADS6223 (FS = 80 MSPS) (continued) SFDR vs INPUT FREQUENCY ACROSS GAINS SINAD vs INPUT FREQUENCY ACROSS GAINS 94 74 Input adjusted to get −1dBFS input 92 72 5 dB 88 86 3 dB 84 82 6 dB 2 dB 71 SINAD − dBFS 90 SFDR − dBc 73 4 dB 3.5 dB 3 dB 0 dB 70 69 68 2 dB 67 80 66 1 dB 78 4 dB 5 dB 65 0 dB 76 6 dB 64 10 30 50 70 90 20 110 130 150 170 190 210 230 fIN − Input Frequency − MHz 40 60 80 100 120 140 160 180 200 220 fIN − Input Frequency − MHz G025 Figure 47. G026 Figure 48. PERFORMANCE vs AVDD PERFORMANCE vs LVDD 94 92 76 fIN = 50.1 MHz LVDD = 3.3 V 92 1 dB 91 75 73 fIN = 50.1 MHz AVDD = 3.3 V 72 88 73 86 72 90 71 89 70 88 69 SFDR SNR 84 87 71 82 3.0 3.1 3.2 3.3 3.4 86 3.0 70 3.6 3.5 AVDD − Supply Voltage − V 68 3.1 3.2 3.4 3.5 67 3.6 G028 Figure 50. PERFORMANCE vs TEMPERATURE 92 PERFORMANCE vs INPUT AMPLITUDE 75 fIN = 50.1 MHz 110 90 100 85 88 73 86 72 SNR 84 71 90 80 SFDR (dBFS) 80 75 70 70 SNR (dBFS) 60 65 SFDR (dBc) 50 60 40 82 −40 70 −20 0 20 40 T − Temperature − °C 60 30 −40 80 G029 55 fIN = 20.1 MHz 50 −30 −20 Input Amplitude − dBFS Figure 51. Submit Documentation Feedback SNR − dBFS SFDR SNR − dBFS 74 SFDR − dBc, dBFS 90 SFDR − dBc 3.3 LVDD − Supply Voltage − V G027 Figure 49. 34 SNR − dBFS 74 SFDR SFDR − dBc 90 SNR − dBFS SFDR − dBc SNR −10 0 G030 Figure 52. Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 ADS6223 (FS = 80 MSPS) (continued) PERFORMANCE vs CLOCK AMPLITUDE PERFORMANCE vs CLOCK DUTY CYCLE 75 88 73 SFDR 86 SFDR 72 84 71 SNR 82 70 80 69 78 68 73 80 72 78 76 71 SNR 74 fIN = 50.1 MHz 1.0 1.5 2.0 67 3.0 2.5 70 72 35 Input Clock Amplitude − VPP 40 45 50 60 69 65 Input Clock Duty Cycle − % G031 Figure 53. G032 Figure 54. POWER DISSIPATION vs SAMPLING FREQUENCY PERFORMANCE IN EXTERNAL REFERENCE MODE 1.0 96 75 fIN = 50.1 MHz External Reference Mode 0.9 0.8 94 73 0.7 SFDR − dBc PD − Power Dissipation − W 55 0.6 AVDD 0.5 0.4 0.3 LVDD 0.2 SNR 92 71 SFDR 90 69 88 SNR − dBFS 76 0.5 SNR − dBFS 74 fIN = 20.1 MHz SNR − dBFS 90 74 82 SFDR − dBc SFDR − dBc 92 67 0.1 0.0 0 20 40 60 86 1.30 80 fS − Sampling Frequency − MSPS 1.35 1.40 1.45 1.50 1.55 1.60 1.65 65 1.70 VVCM − VCM Voltage − V G051 Figure 55. G035 Figure 56. CMRR − Common-Mode Rejection Ratio − dBc CMRR vs FREQUENCY 0 −10 −20 −30 −40 −50 −60 −70 −80 −90 −100 0 50 100 150 200 f − Frequency − MHz 250 300 G018 Figure 57. Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 35 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 ADS6222 (FS = 65 MSPS) FFT for 10 MHz INPUT SIGNAL FFT for 100 MHz INPUT SIGNAL 0 −20 −40 −60 −80 −100 −60 −80 −100 −120 −120 −140 −140 −160 −160 0 10 20 30 f − Frequency − MHz 0 10 20 G037 Figure 59. FFT for 230 MHz INPUT SIGNAL INTERMODULATION DISTORTION (IMD) vs FREQUENCY 0 fIN1 = 185.1 MHz, –7 dBFS fIN2 = 190.1 MHz, –7 dBFS 2-Tone IMD = –96 dBFS SFDR = –87 dBFS −20 −40 Amplitude − dB −40 −60 −80 −100 −60 −80 −100 −120 −120 −140 −140 −160 −160 0 10 20 30 f − Frequency − MHz 0 10 20 30 f − Frequency − MHz G039 Figure 60. G040 Figure 61. SFDR vs INPUT FREQUENCY SNR vs INPUT FREQUENCY 96 74 94 73 92 72 90 88 SNR − dBFS SFDR − dBc G038 Figure 58. SFDR = 81.5 dBc SINAD = 68.1 dBFS SNR = 68.4 dBFS THD = 80.3 dBc −20 Gain = 3.5 dB 86 84 82 Gain = 0 dB 71 70 Gain = 3.5 dB 69 68 80 Gain = 0 dB 67 78 76 66 0 50 100 150 fIN − Input Frequency − MHz 200 250 G041 0 50 100 Submit Documentation Feedback 150 fIN − Input Frequency − MHz Figure 62. 36 30 f − Frequency − MHz 0 Amplitude − dB SFDR = 86.7 dBc SINAD = 71 dBFS SNR = 71.3 dBFS THD = 83.7 dBc −20 Amplitude − dB −40 Amplitude − dB 0 SFDR = 92.5 dBc SINAD = 71.3 dBFS SNR = 71.4 dBFS THD = 90.1 dBc 200 250 G042 Figure 63. Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 ADS6222 (FS = 65 MSPS) (continued) SFDR vs INPUT FREQUENCY ACROSS GAINS SINAD vs INPUT FREQUENCY ACROSS GAINS 96 74 Input adjusted to get −1dBFS input 94 92 3 dB 4 dB 88 86 84 6 dB 82 3.5 dB 1 dB 72 2 dB 71 SINAD − dBFS 90 SFDR − dBc 73 5 dB 3 dB 70 69 68 67 2 dB 80 66 1 dB 78 4 dB 5 dB 65 0 dB 76 6 dB 64 10 30 50 70 90 110 130 150 170 190 210 230 fIN − Input Frequency − MHz 20 40 60 80 100 120 140 160 180 200 220 fIN − Input Frequency − MHz G043 Figure 64. G044 Figure 65. PERFORMANCE vs AVDD PERFORMANCE vs LVDD 94 92 0 dB 92 76 fIN = 50.1 MHz LVDD = 3.3 V 91 75 73 fIN = 50.1 MHz AVDD = 3.3 V 72 88 73 86 72 90 71 89 70 SFDR 88 69 87 68 SNR − dBFS 74 SFDR SFDR − dBc 90 SNR − dBFS SFDR − dBc SNR SNR 84 3.1 3.2 3.3 3.4 86 3.0 70 3.6 3.5 AVDD − Supply Voltage − V 3.1 3.2 3.4 PERFORMANCE vs TEMPERATURE 94 75 74 90 73 88 72 SNR − dBFS 92 SNR 86 71 SFDR − dBc, dBFS SFDR 110 90 100 85 90 80 SFDR (dBFS) 80 75 SNR (dBFS) 70 60 70 65 SFDR (dBc) 50 60 40 55 fIN = 50.1 MHz 30 −40 70 0 20 40 T − Temperature − °C 60 80 G047 fIN = 20.1 MHz −30 −20 −10 50 0 Input Amplitude − dBFS Figure 68. Copyright © 2007, Texas Instruments Incorporated G046 PERFORMANCE vs INPUT AMPLITUDE 76 −20 67 3.6 Figure 67. 96 84 −40 3.5 LVDD − Supply Voltage − V G045 Figure 66. SFDR − dBc 3.3 SNR − dBFS 82 3.0 71 G048 Figure 69. Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 37 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 ADS6222 (FS = 65 MSPS) (continued) PERFORMANCE vs CLOCK AMPLITUDE 96 PERFORMANCE vs CLOCK DUTY CYCLE 78 fIN = 50.1 MHz 94 83 74 fIN = 20.1 MHz 77 81 73 75 SFDR 88 74 86 73 84 72 SNR 82 SFDR 79 72 77 71 SNR 75 70 71 80 0.5 1.0 1.5 70 2.5 2.0 73 69 35 Input Clock Amplitude − VPP 40 45 50 55 60 65 Input Clock Duty Cycle − % G049 Figure 70. G050 Figure 71. POWER DISSIPATION vs SAMPLING FREQUENCY PERFORMANCE IN EXTERNAL REFERENCE MODE 1.0 96 74 fIN = 50.1 MHz External Reference Mode 0.9 0.8 94 72 0.6 0.5 AVDD 0.4 SNR 92 90 70 68 SFDR SNR − dBFS 0.7 SFDR − dBc PD − Power Dissipation − W SNR − dBFS 90 SFDR − dBc 76 SNR − dBFS SFDR − dBc 92 0.3 LVDD 0.2 88 66 0.1 0.0 0 10 20 30 40 50 86 1.30 60 fS − Sampling Frequency − MSPS 1.35 1.40 1.45 1.50 1.55 VVCM − VCM Voltage − V G069 Figure 72. 1.60 1.65 64 1.70 G053 Figure 73. CMRR − Common-Mode Rejection Ratio − dBc CMRR vs FREQUENCY 0 −10 −20 −30 −40 −50 −60 −70 −80 −90 −100 0 50 100 150 200 f − Frequency − MHz 250 300 G018 Figure 74. 38 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 Contour Plots Across Input and Sampling Frequencies 105 fS - Sampling Frequency - MSPS 100 90 84 87 90 69 81 66 84 75 81 80 72 78 69 84 84 70 63 75 87 90 66 72 78 60 84 84 50 69 78 93 40 87 75 84 96 72 66 84 30 10 50 150 100 200 250 300 400 350 450 500 fIN - Input Frequency - MHz 60 70 65 75 90 85 80 95 SFDR - dBc M0049-10 Figure 75. SFDR Contour (no gain) 105 95 100 fS - Sampling Frequency - MSPS 89 90 83 86 80 83 68 83 89 92 71 74 77 74 80 80 95 70 92 83 86 89 71 77 68 95 60 74 77 50 95 40 92 98 95 30 10 86 89 83 80 80 68 80 92 50 71 150 100 200 250 77 300 74 400 350 450 500 fIN - Input Frequency - MHz 65 70 75 80 85 90 SFDR - dBc 95 M0049-11 Figure 76. SFDR Contour (3.5 dB coarse gain) Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 39 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 Contour Plots Across Input and Sampling Frequencies (continued) 105 100 69 70 71 64 65 fS - Sampling Frequency - MSPS 66 90 67 68 80 70 70 71 65 69 64 66 60 67 68 50 71 66 68 30 10 50 200 63 64 67 150 100 64 65 69 70 40 250 300 62 400 350 450 500 fIN - Input Frequency - MHz 60 66 64 62 68 70 72 SNR - dBFS M0048-10 Figure 77. SNR Contour (no gain) 105 100 fS - Sampling Frequency - MSPS 68 69 70 65 67 90 66 64 80 68 69 70 65 70 60 67 64 66 50 68 40 30 10 50 65 69 70 150 100 67 200 64 66 250 300 63 63 62 62 61 61 400 350 450 500 fIN - Input Frequency - MHz 60 62 64 66 68 SNR - dBFS 70 M0048-11 Figure 78. SNR Contour (3.5 dB coarse gain) 40 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 APPLICATION INFORMATION THEORY OF OPERATION ADS6225/ADS6224/ADS6223/ADS6222 (ADS622X) is a family of dual channel, 12-bit pipeline ADCs based on switched capacitor architecture in CMOS technology. The conversion is initiated simultaneously by all the four channels at the rising edge of the external input clock. After the input signals are captured by the sample and hold circuit of each channel, the samples are sequentially converted by a series of low resolution stages. The stage outputs are combined in a digital correction logic block to form the final 12-bit word with a latency of 12 clock cycles. The 12-bit word of each channel is serialized and output as LVDS levels. In addition to the data streams, a bit clock and frame clock are also output. The frame clock is aligned with the 12-bit word boundary. ANALOG INPUT The analog input consists of a switched-capacitor based differential sample and hold architecture, shown in Figure 79. This differential topology results in very good AC performance even for high input frequencies. The INP and INM pins have to be externally biased around a common-mode voltage of 1.5 V, available on VCM pin 13. For a full-scale differential input, each input pin INP, INM has to swing symmetrically between VCM + 0.5 V and VCM – 0.5 V, resulting in a 2-Vpp differential input swing. The maximum swing is determined by the internal reference voltages REFP (2.0V nominal) and REFM (1.0 V, nominal). The sampling circuit has a 3 dB bandwidth that extends up to 500 MHz (Figure 80, shown by the transfer function from the analog input pins to the voltage across the sampling capacitors). Sampling Switch Lpkg 3 nH 25 W Sampling Capacitor RCR Filter INP Cbond 2 pF 50 W Resr 200 W Lpkg 3 nH 3.2 pF Cpar2 Ron 1 pF 15 W Csamp 4.0 pF Cpar1 0.8 pF Ron 10 W 50 W Csamp 4.0 pF Ron 15 W 25 W INM Cpar2 1 pF Cbond 2 pF Resr 200 W Sampling Capacitor Sampling Switch S0237-01 Figure 79. Input Sampling Circuit Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 41 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 1 Magnitude − dB 0 −1 −2 −3 −4 −5 −6 0 100 200 300 400 500 600 fIN − Input Frequency − MHz 700 G073 Figure 80. Analog Input Bandwidth Drive Circuit Requirements For optimum performance, the analog inputs must be driven differentially. This improves the common-mode noise immunity and even order harmonic rejection. A 5-Ω resistor in series with each input pin is recommended to damp out ringing caused by the package parasitics. It is also necessary to present low impedance (< 50 Ω) for the common mode switching currents. For example, this is achieved by using two resistors from each input terminated to the common mode voltage (VCM). In addition to the above, the drive circuit may have to be designed to provide a low insertion loss over the desired frequency range and matched impedance to the source. While doing this, the ADC input impedance has to be taken into account. Figure 81 shows that the impedance (Zin, looking into the ADC input pins) decreases at high input frequencies. The smith chart shows that the input impedance is capacitive and can be approximated by a series R-C up to 500 MHz. 42 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 F1 Freq = 50 MHz S(1, 1) = 0.967 / –13.241 Impedance = 62.211 – j421.739 1000 F1 Frequency = 50 MHz Mag(Zin1) = 426.302 900 700 F2 Frequency = 400 MHz Mag(Zin1) = 65.193 600 F1 500 S(1, 1) Magnitude of Zin -- W 800 400 F2 300 200 F1 F2 100 0 0 50 100 150 200 250 300 350 400 450 500 fI -- Input Frequency -- MHz Frequency (100 kHz to 500 MHz) F2 Freq = 400 MHz S(1, 1) = 0.273 / –59.329 Impedance = 58.132 – j29.510 M0087-01 Figure 81. ADC Input Impedance, Zin Using RF-Transformer Based Drive Circuits For optimum performance, the analog inputs must be driven differentially. This improves the common-mode noise immunity and even order harmonic rejection. An example of input drive using RF transformers is shown in Figure 83. The single-ended signal is fed to the primary winding of the RF transformer. The transformer is terminated on the secondary side. Putting the termination on the secondary side helps to shield the kickbacks caused by the sampling circuit from the RF transformer’s leakage inductances. The termination is accomplished by two resistors connected in series, with the center point connected to the 1.5 V common mode (VCM pin). The value of the termination resistors (connected to common mode) has to be low (< 100 Ω) to provide a low-impedance path for the ADC common-mode switching current. Figure 82 shows a configuration using a single 1:1 turns ratio transformer (for example, WBC1-1) that can be used for low input frequencies up to 100 MHz. Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 43 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 TF_ADC 0.1 mF ADS6xxx 5W INP 0.1 mF 25 W 25 W INM 5W 1:1 VCM S0256-01 Figure 82. Single Transformer Drive Circuit At high input frequencies, the mismatch in the transformer parasitic capacitance (between the windings) results in degraded even-order harmonic performance. Connecting two identical RF transformers back-to-back helps minimize this mismatch, and good performance is obtained for high frequency input signals. Figure 83 shows an example using two transformers (Coilcraft WBC1-1). An additional termination resistor pair (enclosed within the shaded box in Figure 83) may be required between the two transformers to improve the balance between the P and M sides. The center point of this termination must be connected to ground. ADS6xxx 0.1 mF 5W INP 50 W 0.1 mF 50 W 50 W 50 W INM 1:1 5W 1:1 VCM S0164-04 Figure 83. Two Transformer Drive Circuit 44 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 Using Differential Amplifier Drive Circuits Figure 84 shows a drive ciruit using a differential amplifier (TI's THS4509) to convert a single-ended input to differential output that can be interfaced to the ADC input pins. In addition to the single-ended to differential conversion, the amplifier also provides gain (10 dB in Figure 84). As shown in the figure, RFIL helps to isolate the amplifier output from the switching inputs of the ADC. Together with CFIL, it also forms a low-pass filter that bandlimits the noise (and signal) at the ADC input. As the amplifier outputs are ac-coupled, the common-mode of the ADC input pins is set using two resistors connected to VCM. The amplifier outputs can also be dc-coupled. Using the output common-mode control of the THS4509, the ADC input pins can be biased to 1.5 V. RF +VS 500 W 0.1 mF RS 0.1 mF 10 mF RFIL 0.1 mF 5W INP RG 0.1 mF RT CFIL 200 W CFIL 200 W CM THS4509 RG RFIL INM 5W 0.1 mF 500 W RS || RT VCM 0.1 mF –VS ADS6xxx 0.1 mF 10 mF 0.1 mF RF S0259-01 Figure 84. Drive Circuit using THS4509 Refer to the EVM User Guide (SLAU196) for more information. INPUT COMMON MODE To ensure a low-noise common-mode reference, the VCM pin is filtered with a 0.1-μF low-inductance capacitor connected to ground. The VCM pin is designed to directly drive the ADC inputs. The input stage of the ADC sinks a common-mode current in the order of 155 μA at 125 MSPS (per input pin). Equation 1 describes the dependency of the common-mode current and the sampling frequency. 155 mAxFs 125 MSPS (1) This equation helps to design the output capability and impedance of the CM driving circuit accordingly. REFERENCE The ADS622X has built-in internal references REFP and REFM, requiring no external components. Design schemes are used to linearize the converter load seen by the references; this and the on-chip integration of the requisite reference capacitors eliminates the need for external decoupling. The full-scale input range of the converter can be controlled in the external reference mode as explained below. The internal or external reference modes can be selected by programming the register bit <REF> (Table 14). Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 45 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 INTREF Internal Reference VCM 1 kW INTREF 4 kW EXTREF REFM REFP ADS6xxx S0165-04 Figure 85. Reference Section Internal Reference When the device is in internal reference mode, the REFP and REFM voltages are generated internally. Common-mode voltage (1.5 V nominal) is output on VCM pin, which can be used to externally bias the analog input pins. External Reference When the device is in external reference mode, the VCM acts as a reference input pin. The voltage forced on the VCM pin is buffered and gained by 1.33 internally, generating the REFP and REFM voltages. The differential input voltage corresponding to full-scale is given by Equation 2. Full−scale differential input pp + (Voltage forced on VCM) 1.33 (2) In this mode, the range of voltage applied on VCM should be 1.45 V to 1.55 V. The 1.5-V common-mode voltage to bias the input pins has to be generated externally. COARSE GAIN AND PROGRAMMABLE FINE GAIN ADS622X includes gain settings that can be used to get improved SFDR performance (compared to 0 dB gain mode). The gain settings are 3.5 dB coarse gain and programmable fine gain from 0 dB to 6 dB. For each gain setting, the analog input full-scale range scales proportionally, as shown in Table 22. The coarse gain is a fixed setting of 3.5 dB and is designed to improve SFDR with little degradation in SNR. The fine gain is programmable in 1 dB steps from 0 to 6 dB. With fine gain also, SFDR improvement is achieved, but at the expense of SNR (there is about 1 dB SNR degradation for every 1 dB of fine gain). 46 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 So, the fine gain can be used to trade-off between SFDR and SNR. The coarse gain makes it possible to get best SFDR but without losing SNR significantly. At high input frequencies, the gains are especially useful as the SFDR improvement is significant with marginal degradation in SINAD. The gains can be programmed using the register bits <COARSE GAIN> (Table 19) and <FINE GAIN> (Table 18). Note that the default gain after reset is 0 dB. Table 22. Full-Scale Range Across Gains GAIN, dB TYPE FULL-SCALE, Vpp 0 Default (after reset) 2 3.5 Coarse setting (fixed) 1.34 1 1.78 2 1.59 3 1.42 Fine setting (programmable) 4 1.26 5 1.12 6 1.00 CLOCK INPUT The ADS622X clock inputs can be driven differentially (SINE, LVPECL or LVDS) or single-ended (LVCMOS), with little or no difference in performance between them. The common-mode voltage of the clock inputs is set to VCM using internal 5-kΩ resistors as shown in Figure 86. This allows using transformer-coupled drive circuits for sine wave clock or ac-coupling for LVPECL, LVDS clock sources (see Figure 88 and Figure 90). Figure 87 shows the impedance looking into the clock input pins. Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 47 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 Clock Buffer Lpkg » 3 nH 10 W CLKP Cbond » 1 pF Ceq Ceq 5 kW Resr » 100 W VCM 6 pF 5 kW Lpkg » 3 nH 10 W CLKM Cbond » 1 pF Resr » 100 W Ceq » 1 to 3 pF, equivalent input capacitance of clock buffer S0275-01 Figure 86. Internal Clock Buffer 1000 Impedance (Magnitude) − Ω 900 800 700 600 500 400 300 200 100 0 0 25 50 75 100 125 Clock Frequency − MHz G082 Figure 87. Clock Buffer Input Impedance 48 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 0.1 mF CLKP Differential Sine-Wave or PECL or LVDS Clock Input 0.1 mF CLKM ADS6xxx S0167-05 Figure 88. Differential Clock Driving Circuit Figure 89 shows a typical scheme using PECL clock drive from a CDCM7005 clock driver. SNR performance with this scheme is comparable with that of a low jitter sine wave clock source. VCC Reference Clock REF_IN VCC Y0 CLKP Y0B CLKM CDCM7005 VCXO_INP OUTM VCXO_INM CP_OUT ADS6xxx VCXO OUTP CTRL S0238-02 Figure 89. PECL Clock Drive Using CDCM7005 Single-ended CMOS clock can be ac-coupled to the CLKP input, with CLKM (pin) connected to ground with a 0.1-μF capacitor, as shown in Figure 90. 0.1 mF CMOS Clock Input CLKP 0.1 mF CLKM ADS6xxx S0168-07 Figure 90. Single-Ended Clock Driving Circuit Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 49 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 For best performance, the clock inputs have to be driven differentially, reducing susceptibility to common-mode noise. For high input frequency sampling, it is recommended to use a clock source with very low jitter. Bandpass filtering of the clock source can help reduce the effect of jitter. There is no change in performance with a non-50% duty cycle clock input. CLOCK BUFFER GAIN When using a sinusoidal clock input, the noise contributed by clock jitter improves as the clock amplitude is increased. Hence, it is recommended to use large clock amplitude. Use clock amplitude greater than 1 Vpp to avoid performance degradation. In addition, the clock buffer has programmable gain to amplify the input clock to support very low clock amplitude. The gain can be set by programming the register bits <CLKIN GAIN> (Table 15) and increases monotonically from Gain 0 to Gain 4 settings. Table 23 shows the minimum clock amplitude supported for each gain setting. Table 23. Minimum Clock Amplitude across gains CLOCK BUFFER GAIN MINIMUM CLOCK AMPLITUDE SUPPORTED, mVpp differential Gain 0 (minimum gain) 800 Gain 1 (default gain) 400 Gain 2 300 Gain 3 200 Gain 4 (highest gain) 150 POWER DOWN MODES The ADS622X has three power down modes – global power down, channel standby, and input clock stop. Global Power Down This is a global power down mode in which almost the entire chip is powered down, including the four ADCs, internal references, PLL and LVDS buffers. As a result, the total power dissipation falls to about 77 mW typical (with input clock running). This mode can be initiated by setting the register bit <PDN GLOBAL> (Table 14). The output data and clock buffers are in high impedance state. The wake-up time from this mode to data becoming valid in normal mode is 100 μs. Channel Standby In this mode, only the ADC of each channel is powered down and this helps to get very fast wake-up times. Each of the four ADCs can be powered down independently using the register bits <PDN CH> (Table 14). The output LVDS buffers remain powered up. The wake-up time from this mode to data becoming valid in normal mode is 200 clock cycles. Input Clock Stop The converter enters this mode: • If the input clock frequency falls below 1 MSPS or • If the input clock amplitude is less than 400 mV (pp, differential with default clock buffer gain setting) at any sampling frequency. All ADCs and LVDS buffers are powered down and the power dissipation is about 235 mW. The wake-up time from this mode to data becoming valid in normal mode is 100 μs. 50 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 Table 24. Power Down Modes Summary (1) POWER DOWN MODE AVDD POWER (mW) LVDD POWER (mW) WAKE UP TIME In power-up 782 208 – Global power down 65 12 100 μs 1 Channel in standby 208 200 Clocks 2 Channels in standby 208 200 Clocks 100 μs Input clock stop (1) Sampling frequency = 125 MSPS. POWER SUPPLY SEQUENCING During power-up, the AVDD and LVDD supplies can come up in any sequence. The two supplies are separated inside the device. Externally, they can be driven from separate supplies or from a single supply. Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 51 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 DIGITAL OUTPUT INTERFACE ADS622X offers several flexible output options making it easy to interface to an ASIC or an FPGA. Each of these options can be easily programmed using either parallel pins or the serial interface. The output interface options are: • 1-Wire, 1× frame clock, 12× and 14× serialization with DDR bit clock • 2-Wire, 1× frame clock, 12× serialization, with DDR and SDR bit clock, byte wise/bit wise/word wise • 2-Wire, 1× frame clock, 14× serialization, with SDR bit clock, byte wise/bit wise/word wise • 2-Wire, (0.5 x) frame clock, 14× serialization, with DDR bit clock, byte wise/bit wise/word wise. The maximum sampling frequency, bit clock frequency and output data rate will vary depending on the interface options selected (refer to Table 12). Table 25. Maximum Recommended Sampling Frequency for Different Output Interface Options INTERFACE OPTIONS MAXIMUM RECOMMENDED SAMPLING FREQUENCY, MSPS BIT CLOCK FREQUENCY, MHZ FRAME CLOCK FREQUENCY, MHZ SERIAL DATA RATE, Mbps 1-Wire DDR Bit clock 12× Serialization 65 390 65 780 14× Serialization 65 455 65 910 2-Wire DDR Bit clock 12× Serialization 125 375 125 750 14× Serialization 125 437.5 62.5 875 SDR Bit clock 12× Serialization 65 390 65 390 14× Serialization 65 455 65 455 2-Wire Each interface option is described in detail below. 1-WIRE INTERFACE – 12× AND 14× SERIALIZATION WITH DDR BIT CLOCK Here the device outputs the data of each ADC serially on a single LVDS pair (1-wire). The data is available at the rising and falling edges of the bit clock (DDR bit clock). The ADC outputs a new word at the rising edge of every frame clock, starting with the MSB. Optionally, it can also be programmed to output the LSB first. The data rate is 12 × sample frequency (12× serialization) and 14 × sample frequency (14× serialization). 52 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 Input Clock, CLK Freq = Fs 14-Bit Serialization (1) 12-Bit Serialization Frame Clock, FCLK Freq = 1 ´ Fs Bit Clock, DCLK Freq = 6 ´ Fs Output Data DA, DB, DC, DD Data Rate = 12 ´ Fs D11 (D0) D10 (D1) D9 (D2) D8 (D3) D7 (D4) D6 (D5) D5 (D6) D7 (D6) D6 (D7) D4 (D7) D3 (D8) D2 (D9) D1 (D10) D0 (D11) D11 (D0) D0 (0) 0 (D0) D10 (D1) Bit Clock, DCLK Freq = 7 ´ Fs Output Data DA, DB, DC, DD Data Rate = 14 ´ Fs 0 (D0) 0 (D1) D11 (D2) D10 (D3) D9 (D4) D8 (D5) D5 (D8) D4 (D9) D3 D2 (D10) (D11) D1 (0) Sample N 0 (D1) Sample N + 1 Data Bit in MSB First Mode D13 (D2) Data Bit in LSB First Mode (1) In 14-Bit serialization, two zero bits are padded to the 12-bit ADC data on the MSB side. T0225-01 Figure 91. 1-Wire Interface 2-WIRE INTERFACE – 12× SERIALIZATION WITH DDR/SDR BIT CLOCK The 2-wire interface is recommended for sampling frequencies above 65 MSPS. The device outputs the data of each ADC serially on two LVDS pairs (2-wire). The data rate is 6 × Sample frequency since 6 bits are sent on each wire every clock cycle. The data is available along with DDR bit clock or optionally with SDR bit clock. Each ADC sample is sent over the 2 wires as byte-wise or bit-wise or word-wise. Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 53 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 Input Clock, CLK Freq = Fs Frame Clock, FCLK Freq = 1 ´ Fs Bit Clock – SDR, DCLK Freq = 6 ´ Fs In Byte-Wise Mode Bit Clock – DDR, DCLK Freq = 3 ´ Fs Output Data DA0, DB0, DC0, DD0 D5 (D0) D4 (D1) D3 (D2) D2 (D3) D1 (D4) D0 (D5) D5 (D0) D4 (D1) D3 (D2) D2 (D3) D1 (D4) D0 (D5) Output Data DA1, DB1, DC1, DD1 D11 (D6) D10 (D7) D9 (D8) D8 (D9) D7 D6 D11 (D6) D10 (D7) D9 (D8) D8 (D9) D7 D6 (D10) (D11) (D10) (D11) D10 (D0) D8 (D2) D6 (D4) D4 (D6) D2 (D8) (D10) In Word-Wise Mode In Bit-Wise Mode Data Rate = 6 ´ Fs Output Data DA0, DB0, DC0, DD0 D10 (D0) D8 (D2) D6 (D4) D4 (D6) D2 (D8) (D10) Output Data DA1, DB1, DC1, DD1 D11 (D1) D9 (D3) D7 (D5) D5 (D7) D3 (D9) (D11) D11 (D1) D9 (D3) D7 (D5) D5 (D7) D3 (D9) (D11) Output Data DA0, DB0, DC0, DD0 D11 (D0) D10 (D1) D9 (D2) D8 (D3) D7 (D4) D6 (D5) D5 (D6) D4 (D7) D3 (D8) D2 (D9) D1 D0 (D10) (D11) Output Data DA1, DB1, DC1, DD1 D11 (D0) D10 (D1) D9 (D2) D8 (D3) D7 (D4) D6 (D5) D5 (D6) D4 (D7) D3 (D8) D2 (D9) (D10) (D11) D0 D1 Data Bit in MSB First Mode D1 D0 D1 D0 White Cells – Sample N D5 (D0) Data Bit in LSB First Mode Grey Cells – Sample N + 1 T0226-01 Figure 92. 2-Wire Interface 12× Serialization 54 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 2-WIRE INTERFACE - 14× SERIALIZATION In 14× serialization, two zero bits are padded to the 14-bit ADC data on the MSB side and the combined 14-bit data is serialized and output over two LVDS pairs. A frame clock at 1 × sample frequency is also available with an SDR bit clock. With DDR bit clock option, the frame clock frequency is 0.5 × sample frequency. The output data rate will be 7 × Sample frequency as 7 data bits are output every clock cycle on each wire. Each ADC sample is sent over the 2 wires as byte-wise or bit-wise or word-wise. Using the 14× serialization makes it possible to upgrade to a 14-bit ADC in the 64xx family in the future seamlessly, without requiring any modification to the receiver capture logic design. Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 55 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 Input Clock, CLK Freq = Fs Frame Clock, FCLK Freq = 1 ´ Fs In Byte-Wise Mode Bit Clock – SDR, DCLK Freq = 7 ´ Fs Output Data DA0, DB0, DC0, DD0 D6 (D0) D5 (D1) D4 (D2) D3 (D3) D2 (D4) D1 (D5) D0 (D6) D6 (D0) D5 (D1) D4 (D2) D3 (D3) D2 (D4) D1 (D5) D0 (D6) D6 (D0) D5 (D1) Output Data DA1, DB1, DC1, DD1 0 (D7) 0 (D8) D11 (D9) D10 D9 D8 (0) D7 (0) 0 (D7) 0 (D8) D11 (D9) D10 D9 (D10) (D11) (D10) (D11) D8 (0) D7 (0) 0 (D7) 0 (D8) D2 D0 (0) 0 (D0) D10 (D2) D8 (D4) D6 (D6) D4 (D8) D2 (D10) D0 (0) 0 (D0) D10 (D2) (D11) D1 (0) 0 (D1) D11 (D3) D1 (0) D0 (0) 0 (D0) 0 (D1) D1 (0) D0 (0) 0 (D0) 0 (D1) In Word-Wise Mode In Bit-Wise Mode Data Rate = 7 ´ Fs Output Data DA0, DB0, DC0, DD0 0 (D0) D10 (D2) D8 (D4) D6 (D6) D4 (D8) (D10) Output Data DA1, DB1, DC1, DD1 0 (D1) D11 (D3) D9 (D5) D7 (D7) D5 (D9) (D11) D1 (0) 0 (D1) D11 (D3) D9 (D5) D7 (D7) D5 (D9) Output Data DA0, DB0, DC0, DD0 0 (D0) 0 (D1) D11 (D2) D10 (D3) D9 (D4) D8 (D5) D7 (D6) D6 (D7) D5 (D8) D4 (D9) D3 D2 (D10) (D11) Output Data DA1, DB1, DC1, DD1 0 (D0) 0 (D1) D11 (D2) D10 (D3) D9 (D4) D8 (D5) D7 (D6) D6 (D7) D5 (D8) D4 (D9) (D10) (D11) D3 D3 D2 D3 White Cells – Sample N Data Bit in MSB First Mode D6 (D0) Data Bit in LSB First Mode Grey Cells – Sample N + 1 T0227-01 Figure 93. 2-Wire Interface 14× Serialization – SDR Bit Clock 56 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 Input Clock, CLK Freq = Fs Frame Clock, FCLK Freq = 0.5 ´ Fs In Byte-Wise Mode Bit Clock – DDR, DCLK Freq = 3.5 ´ Fs Output Data DA0, DB0, DC0, DD0 D6 (D0) D5 (D1) D4 (D2) D3 (D3) D2 (D4) D1 (D5) D0 (D6) D6 (D0) D5 (D1) D4 (D2) D3 (D3) D2 (D4) D1 (D5) D0 (D6) D6 (D0) D5 (D1) Output Data DA1, DB1, DC1, DD1 0 (D7) 0 (D8) D11 (D9) D10 D9 D8 (0) D7 (0) 0 (D7) 0 (D8) D11 (D9) D10 D9 (D10) (D11) (D10) (D11) D8 (0) D7 (0) 0 (D7) 0 (D8) D2 D0 (0) 0 (D0) D10 (D2) D8 (D4) D6 (D6) D4 (D8) D2 (D10) D0 (0) 0 (D0) D10 (D2) (D11) D1 (0) 0 (D1) D11 (D3) D1 (0) D0 (0) 0 (D0) 0 (D1) D1 (0) D0 (0) 0 (D0) 0 (D1) In Word-Wise Mode In Bit-Wise Mode Data Rate = 7 ´ Fs Output Data DA0, DB0, DC0, DD0 0 (D0) D10 (D2) D8 (D4) D6 (D6) D4 (D8) (D10) Output Data DA1, DB1, DC1, DD1 0 (D1) D11 (D3) D9 (D5) D7 (D7) D5 (D9) (D11) D1 (0) 0 (D1) D11 (D3) D9 (D5) D7 (D7) D5 (D9) Output Data DA0, DB0, DC0, DD0 0 (D0) 0 (D1) D11 (D2) D10 (D3) D9 (D4) D8 (D5) D7 (D6) D6 (D7) D5 (D8) D4 (D9) D3 D2 (D10) (D11) Output Data DA1, DB1, DC1, DD1 0 (D0) 0 (D1) D11 (D2) D10 (D3) D9 (D4) D8 (D5) D7 (D6) D6 (D7) D5 (D8) D4 (D9) (D10) (D11) D3 D3 D2 D3 White Cells – Sample N Data Bit in MSB First Mode D6 (D0) Data Bit in LSB First Mode Grey Cells – Sample N + 1 T0228-01 Figure 94. 2-Wire Interface 14× Serialization – DDR Bit Clock Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 57 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 OUTPUT BIT ORDER In the 2-wire interface, three types of bit order are supported - byte-wise, bit-wise and word-wise. Byte-wise: Each sample is split across the 2 wires. Wires DA0 and DB0 carry the 6 LSB bits D5-D0 and wires DA1 and DB1 carry the 6 MSB bits. Bit-wise: Each sample is split across the 2 wires. Wires DA0 and DB0 carry the 6 even bits (D0,D2,D4..) and wires DA1 and DB1 carry the 6 odd bits (D1,D3,D5...). Word-wise: In this case, all bits of every sample are sent over a single wire. Successive samples are sent over the 2 wires. For example sample N is sent on wires DA0 and DB0, while sample N+1 is sent over wires DA1 and DB1. The frame clock frequency is 0.5x sampling frequency, with the rising edge aligned with the start of each word. MSB/LSB FIRST By default after reset, the ADC data is output serially with the MSB first (D11,D10,...D1,D0). The data can be output LSB first also by programming the register bit <MSB_LSB_First>. In the 2-wire mode, the bit order in each wire is flipped in the LSB first mode. OUTPUT DATA FORMATS Two output data formats are supported – 2s complement (default after reset) and offset binary. They can be selected using the serial interface register bit <DF>. In the event of an input voltage overdrive, the digital outputs go to the appropriate full-scale level. For a positive overdrive, the output code is 0xFFF in offset binary output format, and 0x7FF in 2s complement output format. For a negative input overdrive, the output code is 0x000 in offset binary output format and 0x800 in 2s complement output format. LVDS CURRENT CONTROL The default LVDS buffer current is 3.5 mA. With an external 100-Ω termination resistance, this develops ±350-mV logic levels at the receiver. The LVDS buffer currents can also be programmed to 2.5 mA, 3.0 mA and 4.5 mA using the register bits <LVDS CURR>. In addition, there exists a current double mode, where the LVDS nominal current is doubled (register bits <CURR DOUBLE>, Table 20). LVDS INTERNAL TERMINATION An internal termination option is available (using the serial interface), by which the LVDS buffers are differentially terminated inside the device. Five termination resistances are available – 166, 200, 250, 333, and 500 Ω (nominal with ±20% variation). Any combination of these terminations can be programmed; the effective termination will be the parallel combination of the selected resistances. The terminations can be programmed separately for the clock and data buffers (bits <TERM CLK> and <TERM DATA>, Table 21). The internal termination helps to absorb any reflections from the receiver end, improving the signal integrity. This makes it possible to drive up to 10 pF of load capacitance, compared to only 5 pF without the internal termination.Figure 95 and Figure 96 show the eye diagram with 5 pF and 10 pF load capacitors (connected from each output pin to ground). With 100-Ω internal and 100-Ω external termination, the voltage swing at the receiver end will be halved (compared to no internal termination). The voltage swing can be restored by using the LVDS current double mode (bits <CURR DOUBLE>, Table 20). 58 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 C001 Figure 95. LVDS Data Eye Diagram with 5-pF Load Capacitance (No Internal Termination) C002 Figure 96. LVDS Data Eye Diagram with 10-pF Load Capacitance (100 Ω Internal Termination) Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 59 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 CAPTURE TEST PATTERNS ADS622X outputs the bit clock (DCLK), positioned nearly at the center of the data transitions. It is recommended to route the bit clock, frame clock and output data lines with minimum relative skew on the PCB. This ensures sufficient setup/hold times for a reliable capture by the receiver. The DESKEW is a 1010... or 0101... pattern output on the serial data lines that can be used to verify if the receiver capture clock edge is positioned correctly. This may be useful in case there is some skew between DCLK and serial data inside the receiver. Once deserialized, it is required to ensure that the parallel data is aligned to the frame boundary. The SYNC test pattern can be used for this. For example, in the 1-wire interface, the SYNC pattern is 6 '1's followed by 6 '0's (from MSB to LSB). This information can be used by the receiver logic to shift the deserialized data till it matches the SYNC pattern. In addition to DESKEW and SYNC, the ADS622X includes other test patterns to verify correctness of the capture by the receiver such as all zeros, all ones and toggle. These patterns are output on all four channel data lines simultaneously. Some patterns like custom and sync are affected by the type of interface selected, serialization and bit order. Table 26. Test Patterns PATTERN DESCRIPTION All zeros Outputs logic low. All ones Outputs logic high. Toggle Outputs toggle pattern – <D11-D0> alternates between 101010101010 and 010101010101 every clock cycle. Custom Outputs a 12-bit custom pattern. The 12-bit custom pattern can be specified into two serial interface registers. In the 2-wire interface, each code is sent over the 2 wires depending on the serialization and bit order. Sync Deskew Outputs a sync pattern. Outputs deskew pattern. Either <D11–D0> = 101010101010 OR <D11–D0> = 010101010101 every clock cycle. Table 27. SYNC Pattern INTERFACE OPTION 1-Wire 2-Wire 60 Submit Documentation Feedback SERIALIZATION SYNC PATTERN ON EACH WIRE 12x MSB-111111000000-LSB 14x MSB-11111110000000-LSB 12x MSB-111000-LSB 14x MSB-1111000-LSB Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 OUTPUT TIMINGS AT LOWER SAMPLING FREQUENCIES Setup, hold and other timing parameters are specified across sampling frequencies and for each type of output interface in the tables below. Table 29 to Table 32: Typical values are at 25°C, min and max values are across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = LVDD = 3.3 V, CL = 5 pF , IO = 3.5 mA, RL = 100 Ω , no internal termination, unless otherwise noted. Timing parameters are ensured by design and characterization and not tested in production. Ts = 1/ Sampling frequency = 1/Fs Table 28. Clock Propagation Delay and Serializer Latency for Different Interface Options INTERFACE SERIALIZATION 1-Wire with DDR bit clock 2-Wire with DDR bit clock 12x tpd_clk = 0.5xTs + tdelay 14x tpd_clk = 0.428xTs + tdelay 12x 2-Wire with SDR bit clock 2-Wire with DDR bit clock (1) 0 tpd_clk = tdelay 1 tpd_clk = 0.5xTs + tdelay 0 2 (when tpd_clk ≥ Ts) tpd_clk = 0.857xTs + tdelay 14X 2-Wire with SDR bit clock (1) SERIALIZER LATENCY clock cycles CLOCK PROPAGATION DELAY, tpd_clk 1 (when tpd_clk < Ts) tpd_clk = 0.428xTs + tdelay 0 Note that the total latency = ADC latency + serializer latency. The ADC latency is 12 clocks Table 29. Timings for 1-Wire Interface SERIALIZATION 12× 14× SAMPLING FREQUENCY MSPS DATA SETUP TIME, tsu ns MAX DATA HOLD TIME, th ns MIN TYP MIN TYP 65 0.4 0.6 0.5 0.7 40 0.8 1.0 0.9 1.1 20 1.6 2.0 1.8 2.2 10 3.5 4.0 3.5 4.2 65 0.3 0.5 0.4 0.6 40 0.65 0.85 0.7 0.9 20 1.3 1.65 1.6 1.9 10 3.2 3.5 3.2 3.6 MAX tdelay ns MIN TYP MAX Fs ≥ 40 MSPS 3 4 5 Fs < 40 MSPS 3 4.5 6 Fs ≥ 40 MSPS 3 4 5 Fs < 40 MSPS 3 4.5 6 Table 30. Timings for 2-Wire Interface, DDR Bit Clock SERIALIZATION 12× 14× SAMPLING FREQUENCY MSPS DATA SETUP TIME, tsu ns MIN TYP MIN TYP 105 0.55 0.75 0.6 0.8 92 0.65 0.85 0.7 0.9 80 0.8 1.0 0.8 1.05 65 0.9 1.2 1.0 1.3 40 1.7 2.0 1.1 2.1 105 0.45 0.65 0.6 0.7 92 0.55 0.75 0.7 0.8 80 0.65 0.85 0.8 0.9 65 0.8 1.1 1.0 1.1 40 1.4 1.7 1.1 1.9 Copyright © 2007, Texas Instruments Incorporated MAX DATA HOLD TIME, th ns MAX tdelay ns MIN TYP MAX Fs ≥ 45 MSPS 3.4 4.4 5.4 Fs < 45 MSPS 3.7 5.2 6.7 Fs ≥ 45 MSPS 3 4 5 Fs < 45 MSPS 3 4.5 Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 6 61 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 Table 31. Timings for 2-Wire Interface, SDR Bit Clock SERIALIZATION DATA SETUP TIME, tsu ns SAMPLING FREQUENCY MSPS 12× 14× MAX DATA HOLD TIME, th ns MIN TYP MIN TYP 65 1.0 1.2 1.1 1.3 40 1.8 2.0 1.9 2.1 20 3.9 4.1 3.8 4.1 10 8.2 8.4 7.8 8.2 65 0.8 1.0 1.0 1.2 40 1.5 1.7 1.6 1.8 20 3.4 3.6 3.3 3.5 10 6.9 7.2 6.6 6.9 MAX tdelay ns MIN TYP MAX Fs ≥ 40 MSPS 3.4 4.4 5.4 Fs < 40 MSPS 3.7 5.2 6.7 Fs ≥ 40 MSPS 3.4 4.4 5.4 Fs < 40 MSPS 3.7 5.2 6.7 Table 32. Output Jitter (applies to all interface options) BIT CLOCK JITTER, CYCLE-CYCLE ps, peak-peak SAMPLING FREQUENCY MSPS MIN ≥ 65 62 TYP MAX FRAME CLOCK JITTER, CYCLE-CYCLE ps, peak-peak MIN 350 Submit Documentation Feedback TYP MAX 75 Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 BOARD DESIGN CONSIDERATIONS Grounding A single ground plane is sufficient to give optimum performance, provided the analog, digital and clock sections of the board are cleanly partitioned. Refer to the EVM User Guide (SLAU196) for more layout details. Supply Decoupling As the ADS622X already includes internal decoupling, minimal external decoupling can be used without loss in performance. Note that the decoupling capacitors can help to filter external power supply noise, so the optimum number of decoupling capacitors would depend on actual application. It is recommended to use separate supplies for the analog and digital supply pins to isolate digital switching noise from sensitive analog circuitry. In case only a single 3.3 V supply is available, it should be routed first to AVDD. It can then be tapped and isolated with a ferrite bead (or inductor) with decoupling capacitor, before being routed to LVDD. Exposed Thermal Pad It is necessary to solder the exposed pad at the bottom of the package to a ground plane for best thermal performance. For detailed information, see application notes QFN Layout Guidelines (SLOA122A) and QFN/SON PCB Attachment (SLUA271A). Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 63 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 DEFINITION OF SPECIFICATIONS Analog Bandwidth – The analog input frequency at which the power of the fundamental is reduced by 3 dB with respect to the low frequency value. Aperture Delay – The delay in time between the rising edge of the input sampling clock and the actual time at which the sampling occurs. Aperture Uncertainty (Jitter) – The sample-to-sample variation in aperture delay. Clock Pulse Width/Duty Cycle – The duty cycle of a clock signal is the ratio of the time the clock signal remains at a logic high (clock pulse width) to the period of the clock signal. Duty cycle is typically expressed as a percentage. A perfect differential sine-wave clock results in a 50% duty cycle. Maximum Conversion Rate – The maximum sampling rate at which certified operation is given. All parametric testing is performed at this sampling rate unless otherwise noted. Minimum Conversion Rate – The minimum sampling rate at which the ADC functions. Differential Nonlinearity (DNL) – An ideal ADC exhibits code transitions at analog input values spaced exactly 1 LSB apart. The DNL is the deviation of any single step from this ideal value, measured in units of LSBs. Integral Nonlinearity (INL) – The INL is the deviation of the ADC's transfer function from a best fit line determined by a least squares curve fit of that transfer function, measured in units of LSBs. Gain Error – The gain error is the deviation of the ADC's actual input full-scale range from its ideal value. The gain error is given as a percentage of the ideal input full-scale range. Offset Error – The offset error is the difference, given in number of LSBs, between the ADC's actual average idle channel output code and the ideal average idle channel output code. This quantity is often mapped into mV. Temperature Drift – The temperature drift coefficient (with respect to gain error and offset error) specifies the change per degree Celsius of the parameter from TMIN to TMAX. It is calculated by dividing the maximum deviation of the parameter across the TMIN to TMAX range by the difference TMAX–TMIN. Signal-to-Noise Ratio – SNR is the ratio of the power of the fundamental (PS) to the noise floor power (PN), excluding the power at DC and the first nine harmonics. P SNR + 10Log10 S PN (3) SNR is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full scale) when the power of the fundamental is extrapolated to the converter’s full-scale range. Signal-to-Noise and Distortion (SINAD) – SINAD is the ratio of the power of the fundamental (PS) to the power of all the other spectral components including noise (PN) and distortion (PD), but excluding dc. PS SINAD + 10Log10 PN ) PD (4) SINAD is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full scale) when the power of the fundamental is extrapolated to the converter's full-scale range. Effective Number of Bits (ENOB) – The ENOB is a measure of a converter’s performance as compared to the theoretical limit based on quantization noise. ENOB + SINAD * 1.76 6.02 (5) Total Harmonic Distortion (THD) – THD is the ratio of the power of the fundamental (PS) to the power of the first nine harmonics (PD). P THD + 10Log10 S PD (6) THD is typically given in units of dBc (dB to carrier). 64 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 ADS6225,, ADS6224 ADS6223, ADS6222 www.ti.com SLAS543A – MAY 2007 – REVISED SEPTEMBER 2007 Spurious-Free Dynamic Range (SFDR) – The ratio of the power of the fundamental to the highest other spectral component (either spur or harmonic). SFDR is typically given in units of dBc (dB to carrier). Two-Tone Intermodulation Distortion – IMD3 is the ratio of the power of the fundamental (at frequencies f1 and f2) to the power of the worst spectral component at either frequency 2f1–f2 or 2f2–f1. IMD3 is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full scale) when the power of the fundamental is extrapolated to the converter’s full-scale range. DC Power Supply Rejection Ratio (DC PSRR) – The DC PSSR is the ratio of the change in offset error to a change in analog supply voltage. The DC PSRR is typically given in units of mV/V. AC Power Supply Rejection Ratio (AC PSRR) – AC PSRR is the measure of rejection of variations in the supply voltage by the ADC. If ΔVsup is the change in supply voltage and ΔVout is the resultant change of the ADC output code (referred to the input), then PSRR + 20Log10 DVout , expressed in dBc DVsup (7) Voltage Overload Recovery – The number of clock cycles taken to recover to less than 1% error after an overload on the analog inputs. This is tested by separately applying a sine wave signal with 6dB positive and negative overload. The deviation of the first few samples after the overload (from their expected values) is noted. Common Mode Rejection Ratio (CMRR) – CMRR is the measure of rejection of variations in the analog input common-mode by the ADC. If ΔVcm_in is the change in the common-mode voltage of the input pins and ΔVout is the resultant change of the ADC output code (referred to the input), then CMRR + 20Log10 DVout , expressed in dBc DVcm_in (8) Cross-Talk (only for multi-channel ADC)– This is a measure of the internal coupling of a signal from adjacent channel into the channel of interest. It is specified separately for coupling from the immediate neighbouring channel (near-channel) and for coupling from channel across the package (far-channel). It is usually measured by applying a full-scale signal in the adjacent channel. Cross-talk is the ratio of the power of the coupling signal (as measured at the output of the channel of interest) to the power of the signal applied at the adjacent channel input. It is typically expressed in dBc. Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS6225 ADS6224 ADS6223 ADS6222 65 PACKAGE OPTION ADDENDUM www.ti.com 19-Nov-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty ADS6222IRGZR ACTIVE QFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS6222IRGZRG4 ACTIVE QFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS6222IRGZT ACTIVE QFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS6222IRGZTG4 ACTIVE QFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS6223IRGZR ACTIVE QFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS6223IRGZRG4 ACTIVE QFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS6223IRGZT ACTIVE QFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS6223IRGZTG4 ACTIVE QFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS6224IRGZR ACTIVE QFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS6224IRGZRG4 ACTIVE QFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS6224IRGZT ACTIVE QFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS6224IRGZTG4 ACTIVE QFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS6225IRGZR ACTIVE QFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS6225IRGZRG4 ACTIVE QFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS6225IRGZT ACTIVE QFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR ADS6225IRGZTG4 ACTIVE QFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 19-Nov-2007 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 12-Jan-2008 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant ADS6222IRGZR RGZ 48 SITE 60 330 16 7.3 7.3 1.5 12 16 Q2 ADS6222IRGZT RGZ 48 SITE 60 330 16 7.3 7.3 1.5 12 16 Q2 ADS6223IRGZR RGZ 48 SITE 60 330 16 7.3 7.3 1.5 12 16 Q2 ADS6223IRGZT RGZ 48 SITE 60 330 16 7.3 7.3 1.5 12 16 Q2 ADS6224IRGZR RGZ 48 SITE 60 330 16 7.3 7.3 1.5 12 16 Q2 ADS6224IRGZT RGZ 48 SITE 60 330 16 7.3 7.3 1.5 12 16 Q2 ADS6225IRGZR RGZ 48 SITE 60 330 16 7.3 7.3 1.5 12 16 Q2 ADS6225IRGZT RGZ 48 SITE 60 330 16 7.3 7.3 1.5 12 16 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 12-Jan-2008 Device Package Pins Site Length (mm) Width (mm) Height (mm) ADS6222IRGZR RGZ 48 SITE 60 342.9 345.9 28.58 ADS6222IRGZT RGZ 48 SITE 60 342.9 345.9 28.58 ADS6223IRGZR RGZ 48 SITE 60 342.9 345.9 28.58 ADS6223IRGZT RGZ 48 SITE 60 342.9 345.9 28.58 ADS6224IRGZR RGZ 48 SITE 60 342.9 345.9 28.58 ADS6224IRGZT RGZ 48 SITE 60 342.9 345.9 28.58 ADS6225IRGZR RGZ 48 SITE 60 342.9 345.9 28.58 ADS6225IRGZT RGZ 48 SITE 60 342.9 345.9 28.58 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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