ONSEMI MBR130LSFT1

MBR130LSFT1
Surface Mount
Schottky Power Rectifier
Plastic SOD−123 Package
Using the Schottky Barrier principle with a large area
metal−to−silicon power diode. Ideally suited for low voltage, high
frequency rectification or as free wheeling and polarity protection
diodes in surface mount applications where compact size and weight
are critical to the system. This package also provides an easy to work
with alternative to leadless 34 package style. Because of its small size,
it is ideal for use in portable and battery powered products such as
cellular and cordless phones, chargers, notebook computers, printers,
PDAs and PCMCIA cards. Typical applications are ac/dc and dc−dc
converters, reverse battery protection, and “Oring” of multiple supply
voltages and any other application where performance and size are
critical. These state−of−the−art devices have the following features:
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SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES
30 VOLTS
Guardring for Stress Protection
Low Forward Voltage
125°C Operating Junction Temperature
Epoxy Meets UL 94, V−0
Package Designed for Optimal Automated Board Assembly
This device is manufactured with a Pb−Free external lead finish only.
ESD Ratings: Machine Model, C
ESD Ratings: Human Body Model, 3B
SOD−123FL
CASE 498
PLASTIC
DEVICE MARKING
Mechanical Characteristics
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Reel Options: MBR130LSFT1 = 3,000 per 7″ reel/8 mm tape
Device Marking: L3L
Polarity Designator: Cathode Band
Weight: 11.7 mg (approximately)
Case: Epoxy, Molded
Lead Finish: 100% Matte Sn (Tin)
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Device Meets MSL 1 Requirements
L3LD
L3L
D
= Specific Device Code
= Date Code
ORDERING INFORMATION
Device
Package
Shipping†
MBR130LSFT1 SOD−123FL* 3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*This package is inherently Pb−Free.
 Semiconductor Components Industries, LLC, 2005
January, 2005 − Rev. 1
1
Publication Order Number:
MBR130LSFT1/D
MBR130LSFT1
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VRRM
VRWM
VR
30
V
IO
1.0
A
Peak Repetitive Forward Current
(At Rated VR, Square Wave, 100 kHz, TL = 110°C)
IFRM
2.0
A
Non−Repetitive Peak Surge Current
(Non−Repetitive peak surge current, halfwave, single phase, 60 Hz)
IFSM
40
A
Storage Temperature
Tstg
−55 to 150
°C
Operating Junction Temperature
TJ
−55 to 125
°C
dv/dt
10,000
V/s
Rtjl
Rtjl
Rtja
Rtja
26
21
325
82
°C/W
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current (At Rated VR, TL = 117°C)
Voltage Rate of Change (Rated VR, TJ = 25°C)
THERMAL CHARACTERISTICS
Thermal Resistance − Junction−to−Lead (Note 1)
Thermal Resistance − Junction−to−Lead (Note 2)
Thermal Resistance − Junction−to−Ambient (Note 1)
Thermal Resistance − Junction−to−Ambient (Note 2)
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Mounted with minimum recommended pad size, PC Board FR4.
2. Mounted with 1 in. copper pad (Cu area 700 mm2).
ELECTRICAL CHARACTERISTICS
VF
Maximum Instantaneous Forward Voltage (Note 3)
(IF = 0.1 A)
(IF = 0.7 A)
(IF = 1.0 A)
IR
Maximum Instantaneous Reverse Current (Note 3)
(VR = 30 V)
3. Pulse Test: Pulse Width ≤ 250 µs, Duty Cycle ≤ 2%.
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2
TJ = 25°C
TJ = 100°C
0.29
0.36
0.38
0.18
0.27
0.30
TJ = 25°C
TJ = 100°C
1.0
25
V
mA
MBR130LSFT1
TYPICAL CHARACTERISTICS
TJ = 125°C
TJ = 100°C
TJ = 25°C
0.1
0.10
TJ = −55°C
0.20
0.30
0.50
0.40
0.60
0.70
1 T = 125°C
J
TJ = 100°C
0.1
0.10
0.80
0.30
0.20
0.50
0.40
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
TJ = 125°C
10E−3
TJ = 25°C
10E−6
1E−6
TJ = −55°C
100E−9
TJ = 125°C
10E−3
TJ = 100°C
1E−3
TJ = 25°C
100E−6
10E−9
1E−9
1E+0
100E−3
TJ = 100°C
1E−3
0
10
20
VR, REVERSE VOLTAGE (VOLTS)
30
TJ = −55°C
10E−6
0
10
20
VR, REVERSE VOLTAGE (VOLTS)
1.8
freq = 20 kHz
dc
1.6
1.4
SQUARE WAVE
1.2
1.0
Ipk/IO = 0.8
Ipk/IO = 5
0.6
Ipk/IO = 10
0.4
Ipk/IO = 20
0.2
45
65
85
105
30
Figure 4. Maximum Reverse Current
125
145
TL, LEAD TEMPERATURE (°C)
PFO, AVERAGE POWER DISSIPATION (WATTS)
Figure 3. Typical Reverse Current
0
25
0.70
0.60
VF, MAXIMUM INSTANTANEOUS FORWARD
VOLTAGE (VOLTS)
100E−6
IO, AVERAGE FORWARD CURRENT (AMPS)
TJ = −55°C
TJ = 25°C
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
100E−3
IR, REVERSE CURRENT (AMPS)
IF, INSTANTANEOUS FORWARD
CURRENT (AMPS)
1
10
IR, MAXIMUM REVERSE CURRENT (AMPS)
IF, INSTANTANEOUS FORWARD
CURRENT (AMPS)
10
0.6
0.5
Ipk/IO = 0.4
dc
SQUARE
WAVE
Ipk/IO = 5
Ipk/IO = 10
0.3
Ipk/IO = 20
0.2
0.1
0
0
Figure 5. Current Derating
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 6. Forward Power Dissipation
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3
1.8
MBR130LSFT1
C, CAPACITANCE (pF)
1000
TJ, DERATED OPERATING TEMPERATURE (°C)
TYPICAL CHARACTERISTICS
TJ = 25 °C
100
10
0
5
10
15
20
25
VR, REVERSE VOLTAGE (VOLTS)
30
125
RJA = 25.6 °C/W
120
115
110
105
RJA = 130 °C/W
100
95
90
RJA = 235 °C/W
85
80
75
70
65
RJA = 324.9 °C/W
RJA = 400 °C/W
0
r(t), TRANSIENT THERMAL RESISTANCE
Figure 7. Capacitance
2
4
6
8
10 12
14 16
VR, DC REVERSE VOLTAGE (VOLTS)
18
20
Figure 8. Typical Operating Temperature
Derating
1000
D = 0.5
100
0.2
0.1
0.05
P(pk)
10
0.01
t1
t2
DUTY CYCLE, D = t1/t2
1
SINGLE PULSE
JA = 321.8 °C/W
Test Type > Min Pad < Die Size 38x38 @ 75% mils
0.1
0.000001 0.00001
0.0001
0.001
0.01
0.1
t1, TIME (sec)
Figure 9. Thermal Response
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4
1
10
100
1000
MBR130LSFT1
PACKAGE DIMENSIONS
SOD−123LF
CASE 498−01
ISSUE O
B
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH.
4. DIMENSIONS D AND J ARE TO BE MEASURED
ON FLAT SECTION OF THE LEAD: BETWEEN 0.10
AND 0.25 MM FROM THE LEAD TIP.
E
D
A
H
POLARITY INDICATOR
OPTIONAL AS NEEDED
C
DIM
A
B
C
D
E
H
J
K
L
K
L
J
SOLDERING FOOTPRINT*
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
0.91
0.036
2.36
0.093
4.19
0.165
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
1.22
0.048
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
MILLIMETERS
MIN
MAX
1.50
1.80
2.50
2.90
0.90
1.00
0.70
1.10
0.55
0.95
0.00
0.10
0.10
0.20
3.40
3.80
0°
8°
INCHES
MIN
MAX
0.059
0.071
0.098
0.114
0.035
0.039
0.028
0.043
0.022
0.037
0.000
0.004
0.004
0.008
0.134
0.150
0°
8°
MBR130LSFT1
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
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Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
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6
For additional information, please contact your
local Sales Representative.
MBR130LSFT1/D