MBRA340T3 Surface Mount Schottky Power Rectifier SMA Power Surface Mount Package Employing the Schottky Barrier principle in a large area metal−to−silicon power diode. State of the art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity diodes in surface mount applications where compact size and weight are critical to the system. Features • • • • • • Small Compact Surface Mountable Package with J−Bent Leads Rectangular Package for Automated Handling Highly Stable Oxide Passivated Junction Very Low Forward Voltage Drop Guardring for Stress Protection Pb−Free Package is Available http://onsemi.com SCHOTTKY BARRIER RECTIFIER 3.0 AMPERES 40 VOLTS 1 Cathode 2 Anode 1 Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 70 mg (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • • • • • Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Shipped in 12 mm tape, 5000 units per 13 inch reel Polarity: Cathode Lead Indicated by Polarity Band ESD Ratings: Machine Model = C ESD Ratings: Human Body Model = 3B Device Meets MSL 1 Requirements MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TL = 100°C) Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Storage/Operating Case Temperature Operating Junction Temperature (Note 1) Voltage Rate of Change (Rated VR, TJ = 25°C) Symbol Value Unit VRRM VRWM VR 40 V IO 3.0 2 SMA CASE 403D PLASTIC MARKING DIAGRAM A34 AYWWG A34 A Y WW G = Device Code = Assembly Location = Year = Work Week = Pb−Free Package ORDERING INFORMATION A Device MBRA340T3 IFSM 100 A Tstg, TC −55 to +150 °C TJ −55 to +150 °C dv/dt 10,000 V/ms MBRA340T3G Package Shipping † SMA 5000/Tape & Reel SMA (Pb−Free) 5000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA. © Semiconductor Components Industries, LLC, 2006 October, 2006 − Rev. 4 1 Publication Order Number: MBRA340T3/D MBRA340T3 THERMAL CHARACTERISTICS Characteristic Symbol Value Unit RθJL RθJA 15 81 °C/W Thermal Resistance − Junction−to−Lead (Note 2) Thermal Resistance − Junction−to−Ambient (Note 2) ELECTRICAL CHARACTERISTICS VF Maximum Instantaneous Forward Voltage (Note 3) TJ = 25°C TJ = 100°C 0.450 0.390 TJ = 25°C TJ = 100°C 0.3 15 (IF = 3.0 A) IR Maximum Instantaneous Reverse Current (VR = 40 V) Volts mA 2. Mounted on 2″ Square PC Board with 1″ Square Total Pad Size, PC Board FR4. 3. Pulse Test: Pulse Width ≤ 250 μs, Duty Cycle ≤ 2.0%. TYPICAL CHARACTERISTICS IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 10 1 T = 125°C J 0.1 0.10 TJ = 100°C 0.20 TJ = 25°C 0.30 TJ = −55°C 0.40 0.50 0.60 TJ = 125°C TJ = 100°C TJ = −55°C TJ = 25°C 0.20 0.30 0.40 0.50 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 100E−3 IR, REVERSE CURRENT (AMPS) 1 0.1 0.10 IR, MAXIMUM REVERSE CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 10 0.60 100E−3 TJ = 125°C 10E−3 1E−3 TJ = 100°C 100E−6 10E−6 TJ = 25°C 1E−6 TJ = 125°C 10E−3 TJ = 100°C 1E−3 TJ = 25°C 100E−6 100E−9 TJ = −55°C 10E−9 1E−9 100E−12 0 10 20 30 VR, REVERSE VOLTAGE (VOLTS) 40 TJ = −55°C 10E−6 1E−6 0 Figure 3. Typical Reverse Current 10 20 30 VR, REVERSE VOLTAGE (VOLTS) Figure 4. Maximum Reverse Current http://onsemi.com 2 40 MBRA340T3 PFO, AVERAGE POWER DISSIPATION (WATTS) IO, AVERAGE FORWARD CURRENT (AMPS) TYPICAL CHARACTERISTICS 5 4.5 freq = 20 kHz dc 4 3.5 3 SQUARE WAVE Ipk/IO = p 2.5 2 1.5 1 Ipk/IO = 5 Ipk/IO = 10 Ipk/IO = 20 0.5 0 25 45 65 85 105 125 145 TL, LEAD TEMPERATURE (°C) 1.8 1.6 SQUARE WAVE 1.4 dc 1.2 1.0 0.8 Ipk/IO = p 0.6 Ipk/IO = 5 0.4 Ipk/IO = 10 0.2 0 Ipk/IO = 20 0 TJ, DERATED OPERATING TEMPERATURE (°C) TJ = 25 °C 0 5 10 15 20 25 30 VR, REVERSE VOLTAGE (VOLTS) 1.5 2 2.5 3 3.5 4 4.5 5 Figure 6. Forward Power Dissipation C, CAPACITANCE (pF) 100 1 IO, AVERAGE FORWARD CURRENT (AMPS) Figure 5. Current Derating 1000 0.5 35 40 125 RqJA = 22 °C/W 115 RqJA = 43 °C/W 105 95 RqJA = 63 °C/W 85 RqJA = 81 °C/W 75 RqJA = 96 °C/W 65 55 0 Figure 7. Capacitance 5 35 10 15 20 25 30 VR, DC REVERSE VOLTAGE (VOLTS) Figure 8. Typical Operating Temperature Derating http://onsemi.com 3 40 R(t), TRANSIENT THERMAL RESISTANCE (°C/W) MBRA340T3 100 D = 0.5 0.2 0.1 10 0.05 0.02 0.01 1 SINGLE PULSE 0.1 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 100 1000 t, TIME (S) R(t), TRANSIENT THERMAL RESISTANCE (°C/W) Figure 9. Thermal Response, Junction−to−Ambient (min pad) 100 D = 0.5 0.2 10 0.1 0.05 1 0.1 0.02 0.01 SINGLE PULSE 0.00001 0.0001 0.001 0.01 0.1 1 10 t, TIME (S) Figure 10. Thermal Response, Junction to Ambient (1 inch pad) http://onsemi.com 4 MBRA340T3 PACKAGE DIMENSIONS SMA CASE 403D−02 ISSUE C HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02. E b DIM A A1 b c D E HE L D POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES) MIN 1.91 0.05 1.27 0.15 2.29 4.06 4.83 0.76 MILLIMETERS NOM MAX 2.16 2.41 0.10 0.15 1.45 1.63 0.28 0.41 2.60 2.92 4.32 4.57 5.21 5.59 1.14 1.52 MIN 0.075 0.002 0.050 0.006 0.090 0.160 0.190 0.030 INCHES NOM 0.085 0.004 0.057 0.011 0.103 0.170 0.205 0.045 MAX 0.095 0.006 0.064 0.016 0.115 0.180 0.220 0.060 A L c A1 SOLDERING FOOTPRINT* 4.0 0.157 2.0 0.0787 2.0 0.0787 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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