LTC4012/ LTC4012-1/LTC4012-2 High Efficiency, Multi-Chemistry Battery Charger with PowerPath Control DESCRIPTION FEATURES n n n n n n n n n n n n n General Purpose Battery Charger Controller Efficient 550kHz Synchronous Buck PWM Topology ±0.5% Output Float Voltage Accuracy Programmable Charge Current: 4% Accuracy Programmable AC Adapter Current Limit: 3% Accuracy No Audible Noise with Ceramic Capacitors INFET Low Loss Ideal Diode PowerPath™ Control Wide Input Voltage Range: 6V to 28V Wide Output Voltage Range: 2V to 28V Indicator Outputs for AC Adapter Present, Charging, C/10 Current Detection and Input Current Limiting Analog Charge Current Monitor Micropower Shutdown 20-Pin 4mm × 4mm × 0.75mm QFN Package APPLICATIONS n n n Notebook Computers Portable Instruments Battery Backup Systems L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. PowerPath is a trademark of Linear Technology Corporation. All other trademarks are the property of their respective owners. Protected by U.S. Patents including 5723970. The LTC4012 is a constant-current/constant-voltage battery charger controller. It uses a synchronous quasi-constant frequency PWM control architecture that will not generate audible noise with ceramic bulk capacitors. Charge current is set by external resistors and can be monitored as an output voltage. With no built-in termination, the LTC4012 family charges a wide range of batteries under external control. The LTC4012 features fully adjustable output voltage, while the LTC4012-1 and LTC4012-2 can be pin-programmed for Lithium-Ion/Polymer battery packs of 1-, 2-, 3- or 4-series cells. The LTC4012-1 provides output voltage of 4.1V/cell and the LTC4012-2 is a 4.2V/cell version. The device includes AC adapter input current limiting, which maximizes charge rate for a fixed input power level. An external sense resistor programs the input current limit, and the ICL status pin indicates reduced charge current as a result of AC adapter current limiting. Ideal diode control at the adaptor input improves charger efficiency. The CHRG status pin is active during all charging modes, including special indication for low charge current. TYPICAL APPLICATION FROM ADAPTER 13V TO 28V 25mΩ 0.1μF CLP DCIN CLN BOOST EFFICIENCY (%) TGATE ACP CHRG SW INTVDD ICL BGATE SHDN GND ITH CSP 100 10000 EFFICIENCY 95 0.1μF 0.1μF TO/FROM MCU 5.1k Efficiency at DCIN = 20V POWER TO SYSTEM 2μF 6.8μH 90 POWER LOSS 85 80 VOUT = 12.3V RSENSE = 33mΩ RIN = 3.01k RPROG = 26.7k 75 3.01k 6.04k 70 0.1μF 4.7nF 3.01k CSN PROG 26.7k 33mΩ LTC4012 BAT FBDIV 1000 POWER LOSS (mW) INFET 20μF 0 0.5 1 1.5 2 CHARGE CURRENT (A) 2.5 3 100 PIN NAME 20μF 301k VFB 32.8k + PART INFET DCDIV LTC4009 X LTC4012 X 12.3V Li-Ion BATTERY 4012 TA02 4012 TA01 4012f 1 LTC4012/ LTC4012-1/LTC4012-2 ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) LTC4012-1 LTC4012-2 BGATE INTVDD TOP VIEW SW BGATE INTVDD SW TGATE BOOST TOP VIEW BOOST LTC4012 BOOST to SW............................................... –0.3V to 7V SHDN, FVS0, FVS1 or VFB to GND................ –0.3V to 7V ACP, CHRG or ICL to GND ......................... –0.3V to 30V Operating Temperature Range (Note 2)........................................................ 0°C to 85°C Junction Temperature (Note 3) ............................. 125°C Storage Temperature Range...................–65°C to 150°C TGATE DCIN ........................................................... –14V to 30V DCIN to CLP ................................................ –32V to 20V CLP, CLN or SW to GND ............................. –0.3V to 30V CLP to CLN ............................................................±0.3V CSP, CSN or BAT to GND ............................ –0.3V to 28V CSP to CSN ............................................................±0.3V BOOST to GND ........................................... –0.3V to 36V 20 19 18 17 16 20 19 18 17 16 CLN 1 15 CSP CLN 1 CLP 2 14 CSN CLP 2 15 CSP 14 CSN 13 PROG INFET 3 DCIN 4 12 ITH DCIN 4 12 ITH ACP 5 11 BAT ACP 5 11 BAT 8 9 10 FVS1 7 FVS0 ICL 6 ICL CHRG 9 10 13 PROG 21 CHRG 8 VFB 7 FBDIV 6 SHDN 21 SHDN INFET 3 UF PACKAGE 20-LEAD (4mm s 4mm) PLASTIC QFN UF PACKAGE 20-LEAD (4mm s 4mm) PLASTIC QFN TJMAX = 125°C, JA = 37°C/W EXPOSED PAD (PIN 21) IS GND, MUST BE SOLDERED TO PCB TJMAX = 125°C, JA = 37°C/W EXPOSED PAD (PIN 21) IS GND, MUST BE SOLDERED TO PCB ORDER INFORMATION LEAD FREE FINISH TAPE AND REEL PART MARKING PACKAGE DESCRIPTION TEMPERATURE RANGE LTC4012CUF#PBF LTC4012CUF#TRPBF 4012 20-Lead (4mm × 4mm) Plastic QFN 0°C to 85°C LTC4012CUF-1#PBF LTC4012CUF-1#TRPBF 40121 20-Lead (4mm × 4mm) Plastic QFN 0°C to 85°C LTC4012CUF-2#PBF LTC4012CUF-2#TRPBF 40122 20-Lead (4mm × 4mm) Plastic QFN 0°C to 85°C Consult LTC Marketing for parts specified with wider operating temperature ranges. Consult LTC Marketing for information on non-standard lead based finish parts. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ 4012f 2 LTC4012/ LTC4012-1/LTC4012-2 ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. DCIN = 20V, BAT = 12V, GND = 0V unless otherwise noted. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS Charge Voltage Regulation VTOL VBAT Accuracy (See Test Circuits) LTC4012 LTC4012-1/LTC4012-2 l –0.5 –0.8 0.5 0.8 % % l –0.6 –0.8 0.6 0.8 % % IVFB VFB Input Bias Current VFB = 1.2V RON FBDIV On Resistance ILOAD = 100μA l ±20 ILEAK-FBDIV FBDIV Output Leakage Current SHDN = 0V, FBDIV = 0V l VBOV VFB Overvoltage Threshold LTC4012 BAT Overvoltage Threshold LTC4012-1/LTC4012-2, Relative to Selected Output Voltage nA 85 190 Ω –1 0 1 μA l 1.235 1.281 1.32 V l 103 106 109 % l –4 –5 4 5 % % Charge Current Regulation Charge Current Accuracy with RIN = 3.01k, 6V < BAT < 18V (LTC4012) 6V < BAT < 15V (LTC4012-1, LTC4012-2) RPROG = 26.7k VSENSE = 0mV, PROG = 1.2V –12.75 –11.67 –10.95 μA AI Current Sense Amplifier Gain (PROG ΔI) with RIN = 3.01k, 6V < BAT < 18V (LTC4012) 6V < BAT < 15V (LTC4012-1, LTC4012-2) VSENSE Step from 0mV to 5mV, PROG = 1.2V –1.78 –1.66 –1.54 μA VCS-MAX Maximum Peak Current Sense Threshold Voltage per Cycle (RIN = 3.01k) ITH = 2V ITH = 5V 140 195 325 250 430 mV mV VC10 C/10 Indicator Threshold Voltage PROG Falling 340 400 460 mV VREV Reverse Current Threshold Voltage PROG Falling 180 253 295 mV 97 96 100 100 103 104 mV mV ITOL l l Input Current Regulation VCL Current Limit Threshold CLP – CLN ICLN CLN Input Bias Current CLN = CLP VICL ICL Indicator Threshold (CLP – CLN) – VCL l ±100 –8 –5 nA –2 mV 28 V 5.25 V CLP Supply OVR Operating Voltage Range 6 VUVLO CLP Undervoltage Lockout Threshold VUV(HYST) UVLO Threshold Hysteresis ICLPO CLP Operating Current CLP = 20V, No Gate Loads VACP AC Present Threshold Voltage DCIN – BAT, DCIN Rising VACP(HYST) ACP Threshold Hysteresis Voltage VIL SHDN Input Voltage Low l VIH SHDN Input Voltage High l RIN SHDN Pull-Down Resistance CLP Increasing l 4.65 4.85 200 mV 2 3 mA 500 650 mV Shutdown l 350 200 mV 300 1.4 V 40 ICLPS CLP Shutdown Current CLP = 12V, DCIN = 0V SHDN = 0V l ILEAK-BAT BAT Leakage Current SHDN = 0V or DCIN = 0V, 0V ≤ CSP = CSN = BAT ≤ 18V l ILEAK-CSN CSN Leakage Current SHDN = 0V or DCIN = 0V, 0V ≤ CSP = CSN = BAT ≤ 20V l mV kΩ 15 350 25 500 μA μA –1 0 1 μA –1 0 1 μA 4012f 3 LTC4012/ LTC4012-1/LTC4012-2 ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. DCIN = 20V, BAT = 12V, GND = 0V unless otherwise noted. SYMBOL PARAMETER CONDITIONS MIN TYP MAX ILEAK-CSP CSP Leakage Current SHDN = 0V or DCIN = 0V, 0V ≤ CSP = CSN = BAT ≤ 20V l –1 0 1 UNITS μA ILEAK-SW SW Leakage Current SHDN = 0V or DCIN = 0V, 0V ≤ SW ≤ 20V l –1 0 2 μA l 4.85 5 5.15 V –0.4 –1 % 85 130 mA 633 kHz INTVDD Regulator INTVDD Output Voltage No Load ΔVDD Load Regulation IDD = 20mA IDD Short-Circuit Current (Note 5) INTVDD = 0V 50 Switching Regulator IITH ITH Current fTYP Typical Switching Frequency fMIN Minimum Switching Frequency DCMAX tR-TG ITH = 1.4V –40/+90 μA 467 550 CLOAD = 3.3nF 20 25 Maximum Duty Cycle CLOAD = 3.3nF 98 99 TGATE Rise Time CLOAD = 3.3nF, 10% – 90% 60 110 ns tF-TG TGATE Fall Time CLOAD = 3.3nF, 90% – 10% 50 110 ns tR-BG BGATE Rise Time CLOAD = 3.3nF, 10% – 90% 60 110 ns tF-BG BGATE Fall Time CLOAD = 3.3nF, 90% – 10% 60 110 ns tNO TGATE, BGATE Non-Overlap Time CLOAD = 3.3nF, 10% – 10% 110 kHz % ns PowerPath Control IDCIN DCIN Input Current 0V ≤ DCIN ≤ CLP l –10 15 60 mV 15 25 35 mV –45 –25 VFTO Forward Turn-on Voltage (DCIN Detection Threshold) DCIN-CLP, DCIN rising l VFR Forward Regulation Voltage DCIN-CLP l l 60 μA VRTO Reverse Turn-Off Voltage DCIN-CLP, DCIN falling –15 mV VOL(INFET) INFET Output Low Voltage, Relative to CLP DCIN-CLP = 0.1V, IINFET =1μA –6.5 –5 V VOH(INFET) INFET Output High Voltage, Relative to CLP DCIN-CLP = –0.1V, IINFET =–5μA –250 250 mV tIF(ON) INFET Turn-On Time To CLP-INFET > 3V, CINFET = 1nF 85 180 μs tIF(OFF) INFET Turn-Off Time To CLP-INFET < 1.5V, CINFET = 1nF 2.5 6 μs 0.5 V Float Voltage Select Inputs (LTC4012-1/LTC4012-2 Only) VIL Input Voltage Low VIH Input Voltage High IIN Input Current 3.5 0V ≤ VIN ≤ 5V –10 V 10 μA 500 mV Indicator Outputs VOL Output Voltage Low ILOAD = 100μA, PROG = 1.2V Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LTC4012 is guaranteed to meet performance specifications over the 0°C to 85°C operating temperature range. Note 3: Operating junction temperature TJ (in °C) is calculated from the ambient temperature TA and the total continuous package power dissipation PD (in watts) by the formula TJ = TA + (θJA • PD). Refer to the Applications Information section for details. Note 4: All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to GND, unless otherwise specified. Note 5: Output current may be limited by internal power dissipation. Refer to the Applications Information section for details. 4012f 4 LTC4012/ LTC4012-1/LTC4012-2 TEST CIRCUITS LTC4012 FROM ICL (CLP = CLN) 1.2085V PROG 13 – – – + EA ITH VFB 9 12 + 1.2085V TARGET LTC1055 – 0.6V 40012 TC01 LTC4012-1 LTC4012-2 FROM ICL (CLP = CLN) 1.2085V PROG 13 – – – + EA BAT ITH 11 12 TARGET VARIES WITH FVSO,1 + LTC1055 – 0.6V 40012 TC02 4012f 5 LTC4012/ LTC4012-1/LTC4012-2 TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C unless otherwise noted. L = IHLP-2525 6.8μH) Efficiency at DCIN = 20V, BAT = 8V Efficiency at DCIN = 20V, BAT = 12V 100 10000 100 10000 RSENSE = 33mΩ RIN = 3.01k RSENSE = 33mΩ RIN = 3.01k EFFICIENCY (%) 1000 POWER LOSS 85 POWER LOSS 90 1000 POWER LOSS(mW) EFFICIENCY 90 80 EFFICIENCY 95 POWER LOSS(mW) EFFICIENCY (%) 95 85 0 0.5 1 1.5 2 CHARGE CURRENT (A) 2.5 100 3 80 0 0.5 1 1.5 2 CHARGE CURRENT (A) 2.5 4012 G01 3 100 4012 G02 Efficiency at DCIN = 20V, BAT = 16V 100 VFB Line Regulation 10000 0.10 LTC4012 TEST CIRCUIT 0.08 EFFICIENCY 0.06 1000 POWER LOSS VFB ERROR (%) 90 POWER LOSS(mW) EFFICIENCY (%) 95 0.5 1 1.5 2 CHARGE CURRENT (A) 2.5 0 –0.02 –0.06 RSENSE = 33mΩ RIN = 3.01k 0 0.02 –0.04 85 80 0.04 –0.08 3 100 –0.10 10 5 20 25 15 CLP PIN VOLTAGE (V) 30 4012 G03 4012 G04 2 250 RON (Ω) 225 200 175 LOAD STATE 150 1 2A 1A 12.1V 1A 3A RECONNECT DISCONNECT TIME (1ms/DIV) CLP = 20V VOUT = 12.3V 125 100 4012 G06 CHARGE CURRENT ERROR (%) BATTERY VOLTAGE (500mV/DIV) CLP = BAT + 3V (CLP ≥ 6V) 275 Charge Current Accuracy Battery Load Dump FBDIV Pin RON vs Battery Voltage 300 0 DCIN = 24V RPROG = 35.7k –1 –2 DCIN = 12V RPROG = 26.7k –3 –4 RSENSE = 33mΩ RIN = 3.01k –5 –6 75 0 5 20 15 10 BATTERY VOLTAGE (V) 25 4012 G05 0 2 4 6 8 10 12 14 16 18 20 22 24 BATTERY VOLTAGE (V) 4012 G07 4012f 6 LTC4012/ LTC4012-1/LTC4012-2 TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C unless otherwise noted. L = IHLP-2525 6.8μH) Charge Current Line Regulation ICHG = 2A 0 ICHG = 3A –0.2 ICHG = 3A 3.0 0.1 –0.1 3.0 2.5 2.5 ICHG = 2A 2.0 1.5 ICHG = 1A 1.0 0.5 DCIN = 20V RSENSE = 33mΩ RIN = 3.01k 0 –0.5 –0.5 11.0 25 15 10 20 DCIN PIN VOLTAGE (V) 5 ICHG 1.5 1.0 0.5 2.5A BULK CHARGE 2.1A INPUT CURRENT LIMIT 0 –0.3 –0.4 IIN 2.0 CURRENT (A) BAT = 6V 0.4 RSENSE = 33mΩ RIN = 3.01k 0.3 ICHG = 1A 0.2 CHARGE CURRENT (A) CHARGE CURRENT ERROR (%) Input Current Limit Charge Current Load Regulation 3.5 0.5 11.4 ICL STATE –0.5 12.6 11.8 12.2 BATTERY VOLTAGE (V) –1.0 13.0 0 0.5 1.0 1.5 SYSTEM LOAD (A) 2.5 4012 G09 4012 G08 PWM Soft-Start 4012 G10 PWM Frequency vs Duty Cycle Gate Drive Non-Overlap EXTERNAL FET DRIVE (1V/DIV) 600 ITH 1V/DIV PROG 1V/DIV SHDN 5V/DIV BGATE TGATE 4012 G11 ICHG = 750mA 500 PWM FREQUENCY (kHz) ICHG 2A/DIV TIME (500μs/DIV) 2.0 4012 G12 TIME (80ns/DIV) 400 300 200 CLP = 6V CLP = 12V CLP = 20V CLP = 25V 100 0 0 20 40 60 DUTY CYCLE (%) 100 80 4012 G13 PWM Frequency vs Charge Current 25 600 BATTERY CURRENT (μA) PWM FREQUENCY (kHz) DC1256-CLASS APPLICATION DCIN = 0V BAT = 5V 500 BAT = 12V 400 CLP = 15V RSENSE = 33mΩ RIN = 3.01k 300 200 0 0.5 1.0 1.5 2.0 CHARGE CURRENT (A) 20 2.5 3.0 4012 G14 VGS = 0V LTC4012, ALL PINS DCIN = 0V 10 0 PFET VGS (1V/DIV) IDCIN, REVERSE (5A/DIV) 15 0A LTC4012, BAT PINS DCIN = 20V 5 BAT = 14.5V 100 0 INFET Response Time to DCIN Short to Ground Battery Shutdown Current 0 5 20 10 15 BATTERY VOLTAGE (V) 25 TIME (1μs/DIV) DCIN = 15V INFET = Si7423DN IOUT = <50mA VOUT = 12.3V COUT = 0.27F 4012 G16 4012 G15 4012f 7 LTC4012/ LTC4012-1/LTC4012-2 PIN FUNCTIONS CLN (Pin 1): Adapter Input Current Limit Negative Input. The LTC4012 senses voltage on this pin to determine if less charge current should be sourced to limit total input current. The threshold is set 100mV below the CLP pin. An external filter should be used to remove switching noise. This input should be tied to CLP if not used. Operating voltage range is (CLP – 110mV) to CLP. CLP (Pin 2): Adapter Input Current Limit Positive Input. The LTC4012 also draws power from this pin, including a small amount for some shutdown functions. Operating voltage range is GND to 28V. INFET (Pin 3): PowerPath Control Output. This output drives the gate of a PMOS pass transistor connected between the DC input (DCIN) and the raw system supply rail (CLP) to maintain a forward voltage of 25mV when a DC input source is present. INFET is internally clamped about 6V below CLP. Maximum operating voltage is CLP, which is used to turn off the input PMOS transistor when the DC input is removed. DCIN (Pin 4): DC Sense Input. One of two voltage sense inputs to the internal PowerPath controller (the other input to the controller is CLP). This input is usually supplied from an input DC power source. Operating voltage ranges from GND to 28.2V. ACP (Pin 5): Active-Low AC Adapter Present Indicator Output. This open-drain output pulls to GND when adequate AC adapter (DCIN) voltage is present. This output should be left floating if not used. SHDN (Pin 6): Active-low Shutdown Input. Driving SHDN below 300mV unconditionally forces the LTC4012 into the shutdown state. This input has a 40kΩ internal pulldown to GND. Operating voltage range is GND to INTVDD. CHRG (Pin 7): Active-Low Charge Indicator Output. This open-drain output provides three levels of information about charge status using a strong pull-down, 25μA weak pull-down or high impedance. Refer to the Operation and Applications Information sections for further details. This output should be left floating if not used. ICL (Pin 8): Active-Low Input Current Limit Indicator Output. This open-drain output pulls to GND when the charge current is reduced because of AC adapter input current limiting. This output should be left floating if not used. VFB (Pin 9, LTC4012): Battery Voltage Feedback Input. An external resistor divider between FBDIV and GND with the center tap connected to VFB programs the charger output voltage. In constant voltage mode, this pin is nominally at 1.2085V. Refer to the Applications Information section for complete details on programming battery voltage. Operating voltage range is GND to 1.25V. FVS0 (Pin 9, LTC4012-1/LTC4012-2): Battery Voltage Select Input (LSB). This pin is one of two pins used on the LTC4012-1 or LTC4012-2 to select one of four preset battery voltages. Selection is done by connecting to either GND or INTVDD. Operating voltage range is GND to INTVDD. FBDIV (Pin 10, LTC4012): Battery Voltage Feedback Resistor Divider Source. The LTC4012 connects this pin to BAT when charging is in progress. FBDIV is an opendrain PFET output to BAT with an operating voltage range of GND to BAT. FVS1 (Pin 10, LTC4012-1/LTC4012-2): Battery Voltage Select Input (MSB). This pin is one of two pins used on the LTC4012-1 or LTC4012-2 to select one of four preset battery voltages. Selection is done by connecting to either GND or INTVDD. Operating voltage range is GND to INTVDD. BAT (Pin 11): Battery Pack Connection. The LTC4012 uses the voltage on this pin to control PWM operation when charging. Operating voltage range is GND to CLN. ITH (Pin 12): PWM Control Voltage and Compensation Node. The LTC4012 develops a voltage on this pin to control cycle-by-cycle peak inductor current. An external R-C network connected to ITH provides PWM loop compensation. Refer to the Applications Information section for further details on establishing loop stability. Operating voltage range is GND to INTVDD. 4012f 8 LTC4012/ LTC4012-1/LTC4012-2 PIN FUNCTIONS PROG (Pin 13): Charge Current Programming and Monitoring Pin. An external resistance connected between PROG and GND, along with the current sense and PWM input resistors, programs the maximum charge current. The voltage on this pin can also provide a linearized indicator of charge current. Refer to the Applications Information section for complete details on current programming and monitoring. Operating voltage range is GND to INTVDD. CSN (Pin 14): Charge Current Sense Negative Input. Place an external input resistor (R IN , Figure 1) between this pin and the negative side of the charge current sense resistor. Operating voltage ranges from (BAT – 50mV) to (BAT + 200mV). CSP (Pin 15): Charge Current Sense Positive Input. Place an external input resistor (RIN , Figure 1) between this pin and the positive side of the charge current sense resistor. Operating voltage ranges from (BAT – 50mV) to (BAT + 200mV). BGATE (Pin 16): External Synchronous NFET Gate Control Output. This output provides gate drive to an external NMOS power transistor switch used for synchronous rectification to increase efficiency in the step-down DC/DC converter. Operating voltage is GND to INTVDD. BGATE should be left floating if not used. SW (Pin 18): PWM Switch Node. The LTC4012 uses the voltage on this pin as the source reference for its topside NFET (PWM switch) driver. Refer to the Applications Information section for additional PCB layout suggestions related to this critical circuit node. Operating voltage range is GND to CLN. TGATE (Pin 19): External NFET Switch Gate Control Output. This output provides gate drive to an external NMOS power transistor switch used in the DC/DC converter. Operating voltage range is GND to (CLN + 5V). BOOST (Pin 20): TGATE Driver Supply Input. A bootstrap capacitor is returned to this pin from a charge network connected to SW and INTVDD. Refer to the Applications Information section for complete details on circuit topology and component values. Operating voltage ranges from (INTVDD – 1V) to (CLN + 5V). Exposed Pad (Pin 21): Ground. The package paddle provides a single-point ground for the internal voltage reference and other critical LTC4012 circuits. It must be soldered to a suitable PCB copper ground pad for proper electrical operation and to obtain the specified package thermal resistance. INTVDD (Pin 17): Internal 5V Regulator Output. This pin provides a means of bypassing the internal 5V regulator used to power the LTC4012 PWM FET drivers. This supply shuts down when the LTC4012 shuts down. Refer to the Application Information section for details if additional power is drawn from this pin by the application circuit. 4012f 9 LTC4012/ LTC4012-1/LTC4012-2 BLOCK DIAGRAM 4 (LTC4012) DCIN – 3 INFET IF FAULT DETECTION + 2 1 8 CLP INPUT CURRENT LIMIT CLN ICL CHRG C/10 DETECTION 7 9 VFB + CSP 15 CA 5 SHUTDOWN CONTROL CC TO INTERNAL CIRCUITS – EA ACP TO INTERNAL CIRCUITS CSN PROG 11 TGATE CHARGE 10 12 OSCILLATOR BOOST FBDIV 13 1.2085V REFERENCE ITH BAT 14 R1 + – – – 6 SHDN – + SHUTDOWN PWM LOGIC TO INTERNAL CIRCIUTS 5V REGULATOR SW 20 19 18 INTVDD 17 BGATE GND (PADDLE) 16 21 4012 BD01 4012f 10 LTC4012/ LTC4012-1/LTC4012-2 BLOCK DIAGRAM 4 (LTC4012-1/LTC4012-2) DCIN – 3 INFET IF + 2 1 8 FAULT DETECTION CLP INPUT CURRENT LIMIT CLN ICL CHRG C/10 DETECTION 7 VFB 10 9 SHDN SHUTDOWN TO INTERNAL CIRCUITS FVS0 – CC FVS1 – Output Voltage Select CSP 15 CA + EA TO INTERNAL CIRCUITS CSN 14 R1 + – – – 6 SHUTDOWN CONTROL + PROG 13 1.2085V REFERENCE ITH 12 BAT 11 ACP BOOST 5 20 CHARGE TGATE OSCILLATOR PWM LOGIC SW 19 18 TO INTERNAL CIRCIUTS 5V REGULATOR INTVDD 17 BGATE GND (PADDLE) 16 P 4012 BD02 4012f 11 LTC4012/ LTC4012-1/LTC4012-2 OPERATION Overview The LTC4012 is a synchronous step-down (buck) current mode PWM battery charger controller. The maximum charge current is programmed by the combination of a charge current sense resistor (RSENSE), matched input resistors (RIN , Figure 1), and a programming resistor (RPROG) between the PROG and GND pins. Battery voltage is programmed with an external resistor divider between FBDIV and GND (LTC4012) or two digital battery voltage select pins (LTC4012-1/LTC4012-2). In addition, the PROG pin provides a linearized voltage output of the actual charge current. The LTC4012 family does not have built-in charge termination and is flexible enough for charging any type of battery chemistry. These are building block ICs intended for use with an external circuit, such as a microcontroller, capable of managing the entire algorithm required for the specific battery being charged. Each member of the LTC4012 family features a shutdown input and various state indicator outputs, allowing easy and direct management by a wide range of external (digital) charge controllers. Due to the popularity of rechargeable Lithium-Ion chemistries, the LTC4012-1 and LTC4012-2 also offer internal precision resistors that can be digitally selected to produce one of four preset output voltages for simplified design of those charger types. Shutdown The LTC4012 remains in shutdown until DCIN is greater than 5.1V and exceeds CLP by 60mV and SHDN is driven above 1.4V. In shutdown, current drain from the battery is reduced to the lowest possible level, thereby increasing standby time. When in shutdown, the ITH pin is pulled to GND and CHRG, ICL, FET gate drivers and INTVDD output are all disabled. The charging can be stopped at any time by forcing SHDN below 300mV. AC Present Indication The ACP status output correctly indicates sensed adapter input voltage during all LTC4012 states. AC present is indicated (ACP output low) as soon as DCIN exceeds BAT by at least 500mV. Charging is not enabled until this condition is first met. After this event, charging is no longer gated by AC present detection. If battery voltage rises due to ESR, or DCIN droops due to current load, AC present may no longer be indicated by the IC if charging was started with very low input overhead. However, charging will remain enabled unless DCIN falls below the supply voltage on CLP. Input PowerPath Control The input PFET controller performs many important functions. First, it monitors DCIN and enables the charger when this input voltage is higher than the raw CLP system supply. Next, it controls the gate of an external input power PFET to maintain a low forward voltage drop when charging, creating improved efficiency. It also prevents reverse current flow through this same PFET, providing a suitable input blocking function. Finally, it helps avoid synchronous boost operation during invalid operating conditions by detecting elevated CLP voltage and forcing the charger off. If DCIN voltage is less than CLP, then DCIN must rise 60mV higher than CLP to enable the charger and activate the ideal diode control. At this point, the ACPb status output also transitions to low impedance to indicate to the host system that an external adapter is present. The gate of the input PFET is driven to a voltage sufficient to regulate a forward drop between DCIN and CLP of about 25mV. If the input voltage differential drops below this point, the FET is turned off slowly. If the voltage between DCIN and CLP drops to less than –25mV, the input FET is turned off in less than 6μs to prevent significant reverse current from flowing back through the PFET. In this case, ACPb also switches back to high impedance and the charger is disabled. Soft-Start Exiting the shutdown state enables the charger and releases the ITH pin. When enabled, switching will not begin until DCIN exceeds BAT by 500mV and ITH exceeds a threshold that assures initial current will be positive (about 5% to 25% of the maximum programmed current). To limit inrush current, soft-start delay is created with the compensation values used on the ITH pin. Longer soft-start times can be realized by increasing the filter capacitor on ITH, if reduced loop bandwidth is acceptable. The actual charge current at 4012f 12 LTC4012/ LTC4012-1/LTC4012-2 OPERATION LTC4012 WATCHDOG TIMER SYSTEM POWER 2 11 CLP BAT CLOCK OSCILLATOR S TGATE Q 19 L1 PWM LOGIC RD BGATE + + CSP 16 RIN CA CC R1 – – CSN PROG FROM ICL VFB RSENSE RIN 14 VSENSE – ICHRG 13 RPROG + – – – EA + 15 CPROG + 9 1.2085V ITH 12 LOOP COMPENSATION 4012 F01 Figure 1. PWM Circuit Diagram the end of soft-start will depend on which loop (current, voltage or adapter limit) is in control of the PWM. If this current is below that required by the ITH start-up threshold, the resulting charge current transient duration depends on loop compensation but is typically less than 100μs. Bulk Charge When soft-start is complete, the LTC4012 begins sourcing the current programmed by the external components connected to CSP, CSN and PROG. Some batteries may require a small conditioning trickle current if they are heavily discharged. As shown in the Applications Information section, the LT4012 can address this need through a variety of low current circuit techniques on the PROG pin. Once a suitable cell voltage has been reached, charge current can be switched to a higher, bulk charge value. End of Charge and CHRG Output As the battery approaches the programmed output voltage, charge current will begin to decrease. The open-drain CHRG output can indicate when the current drops to 10% of its programmed full-scale value by turning off the strong pull-down (open-drain FET) and turning on a weak 25μA pull-down current. This weak pull-down state is latched until the part enters shutdown or the sensed current rises to roughly C/6. C/10 indication will not be set if charge current has been reduced due to adapter input current limiting. As the charge current approaches 0A, the PWM continues to operate in full continuous mode. This avoids generation of audible noise, allowing bulk ceramic capacitors to be used in the application. Charge Current Monitoring When the LTC4012 is charging, the voltage on the PROG pin varies in direct proportion to the charge current. Referring to Figure 1, the nominal PROG voltage is given by VPROG = ICHRG • RSENSE • RPROG + 11.67μA • RPROG RIN Voltage tolerance on PROG is limited by the charge current accuracy specified in the Electrical Characteristics table. Refer to the Applications Information section on programming charge current for additional details. 4012f 13 LTC4012/ LTC4012-1/LTC4012-2 OPERATION Adapter Input Current Limit Table 1. LTC4012 Open-Drain Indicator Outputs The LTC4012 can monitor and limit current from the input DC supply, which is normally an AC adapter. When the programmed adapter input current is reached, charge current is reduced to maintain the desired maximum input current. The ITH and PROG pins will reflect the reduced charge current. This limit function avoids overloading the DC input source, allowing the product to operate at the same time the battery is charging without complex load management algorithms. The battery will automatically be charged at the maximum possible rate that the adapter will support, given the application’s operating condition. The LTC4012 can only limit input current by reducing charge current, and in this case the charger uses nonsynchronous PWM operation to prevent boosting if the average charge current falls below about 25% of the maximum programmed current. Note that the ICL indicator output becomes active (low) at an adapter input current level just slightly less than that required for the internal amplifier to begin to assert control over the PWM loop. Charger Status Indicator Outputs The LTC4012 open-drain indicator outputs provide valuable information about the IC’s operating state and can be used for a variety of purposes in applications. Table 1 summarizes the state of the three indicator outputs as a function of LTC4012 operation. ON ACP Off On On On CHRG Off Off On 25μA ICL Off Off Off Off On On On On 25μA On Off On or 25μA On or Off CHARGER STATE No DC Input (Shutdown) Shutdown or Reverse Current Bulk Charge Low Current Charge or Initial DCIN – BAT <500mV Input Current Limit During Bulk Charge Input Current Limit During Low Current Charge Indicated Charge with DCIN - BAT < 300mV. Bulk charge may be less than programmed value. PWM Controller The LTC4012 uses a synchronous step-down architecture to produce high operating efficiency. The nominal operating frequency of 550kHz allows use of small filter components. The following conceptual discussion of basic PWM operation references Figure 1. The voltage across the external charge current sense resistor RSENSE is measured by current amplifier CA. This instantaneous current (VSENSE/RIN) is fed to the PROG pin where it is averaged by an external capacitor and converted to a voltage by the programming resistor RPROG between PROG and GND. The PROG voltage becomes the average charge current input signal to error amplifier EA. EA also receives loop control information from the battery voltage feedback input VFB and the adapter input current limit circuit. tOFF TOP FET OFF ON BOTTOM FET OFF THRESHOLD SET BY ITH VOLTAGE INDUCTOR CURRENT 4012 F02 Figure 2. PWM Waveforms 4012f 14 LTC4012/ LTC4012-1/LTC4012-2 OPERATION The ITH output of the error amplifier is a scaled control voltage for one input of the PWM comparator CC. ITH sets a peak inductor current threshold, sensed by R1, to maintain the desired average current through RSENSE. The current comparator output does this by switching the state of the RS latch at the appropriate time. At the beginning of each oscillator cycle, the PWM clock sets the RS latch and turns on the external topside NFET (bottom-side synchronous NFET off) to refresh the current carried by the external inductor L1. The inductor current and voltage across RSENSE begin to rise linearly. CA buffers this instantaneous voltage rise and applies it to CC with gain supplied by R1. When the voltage across R1 exceeds the peak level set by the ITH output of EA, the top FET turns off and the bottom FET turns on. The inductor current then ramps down linearly until the next rising PWM clock edge. This closes the loop and sources the correct inductor current to maintain the desired parameter (charge current, battery voltage, or input current). To produce a near constant frequency, the PWM oscillator implements the equation: tOFF = CLP – BAT CLP • 550kHz Repetitive, closed-loop waveforms for stable PWM operation appear in Figure 2. PWM Watchdog Timer As input and output conditions vary, the LTC4012 may need to utilize PWM duty cycles approaching 100%. In this case, operating frequency may be reduced well below 550kHz. An internal watchdog timer observes the activity on the TGATE pin. If TGATE is on for more than 40μs, the watchdog activates and forces the bottom NFET on (top NFET off) for about 100ns. This avoids a potential source of audible noise when using ceramic input or output capacitors and prevents the boost supply capacitor for the top gate driver from discharging. In low drop out operation, the actual charge current may not be able to reach the programmed full-scale value due to the watchdog function. Overvoltage Protection The LTC4012 also contains overvoltage detection that prevents transient battery voltage overshoots of more than about 6% above the programmed output voltage. When battery overvoltage is detected, both external MOSFETs are turned off until the overvoltage condition clears, at which time a new soft start sequence begins. This is useful for properly charging battery packs that use an internal switch to disconnect themselves for performing functions such as calibration or pulse mode charging. Reverse Charge Current Protection (Anti-Boost) Because the LTC4012 always attempts to operate synchronously in full continuous mode (to avoid audible noise from ceramic capacitors), reverse average charge current can occur during some invalid operating conditions. INFET PowerPath control avoids boosting a lightly loaded system supply during reverse operation. However, under heavier system loads, CLP may not boost above DCIN, even though reverse average current is flowing. In this case a second circuit monitors indication of reverse average current on PROG. If either of these circuits detects boost operation, The LTC4012 turns off both external MOSFETs until the reverse current condition clears. At that point, a new soft-start sequence begins. 4012f 15 LTC4012/ LTC4012-1/LTC4012-2 APPLICATIONS INFORMATION Programming Charge Current The formula for charge current is: ICHRG = RIN RSENSE ⎛ 1.2085V ⎞ •⎜ – 11.67μA⎟ ⎝ RPROG ⎠ The LTC4012 operates best with 3.01k input resistors, although other resistors near this value can be used to accommodate standard sense resistor values. Refer to the subsequent discussion on inductor selection for other considerations that come into play when selecting input resistors RIN. RSENSE should be chosen according to the following equation: RSENSE = 100mV IMAX However, some batteries require a low charge current for initial conditioning when they are heavily discharged. The charge current can then be safely switched to a higher level after conditioning is complete. Figure 3 illustrates one method of doing this with 2-level control of the PROG pin resistance. Turning Q1 off reduces the charge current to IMAX/10 for battery conditioning. When Q1 is on, the LTC4012 is programmed to allow full IMAX current for bulk charge. This technique can be expanded through the use of additional digital control inputs for an arbitrary number of pre-programmed current values. For a truly continuous range of maximum charge current control, pulse width modulation can be used as shown in Figure 4. LTC4012 where IMAX is the desired maximum charge current ICHRG. The 100mV target can be adjusted to some degree to obtain standard RSENSE values and/or a desired RPROG value, but target voltages lower than 100mV will cause a proportional reduction in current regulation accuracy. The required minimum resistance between PROG and GND can be determined by applying the suggested expression for RSENSE while solving the first equation given above for charge current with ICHRG = IMAX: PROG 13 The resistance between PROG and GND can simply be set with a single a resistor, if only maximum charge current needs to be controlled during the desired charging algorithm. Q1 2N7002 PRECHARGE CPROG 4.7nF R2 53.6k 4012 F03 Figure 3. Programming 2-Level Charge Current 1.2085V • RIN RPROG(MIN) = 0.1V + 11.67μA • RIN If RIN is chosen to be 3.01k with a sense voltage of 100mV, this equation indicates a minimum value for RPROG of 26.9k. Table 6 gives some examples of recommended charge current programming component values based on these equations. R1 26.7k BULK CHARGE LTC4012 PROG 13 RPROG 5V 0V CPROG Q1 2N7002 RMAX 511k 4012 F04 Figure 4. Programming PWM Current 4012f 16 LTC4012/ LTC4012-1/LTC4012-2 APPLICATIONS INFORMATION The value of RPROG controls the maximum value of charge current which can be programmed (Q1 continuously on). PWM of the Q1 gate voltage changes the value of RPROG to produce lower currents. The frequency of this modulation should be higher than a few kHz, and CPROG must be increased to reduce the ripple caused by switching Q1. In addition, it may be necessary to increase loop compensation capacitance connected to ITH to maintain stability or prevent large current overshoot during start-up. Selecting a higher Q1 PWM frequency (≈10kHz) will reduce the need to change CPROG or other compensation values.Charge current will be proportional to the duty cycle of the PWM input on the gate of Q1. Programming LTC4012 Output Voltage BAT 85Ω TYPICAL FBDIV 11 10 CZ R1 LTC4012 + VFB 9 R2A GND (EXPOSED PAD) 21 *OPTIONAL TRIM RESISTOR R2B* 4012 F05 Figure 5. Programming Output Voltage Figure 5 shows the external circuit for programming the charger voltage when using the LTC4012. The voltage is then governed by the following equation: VBAT = 1.2085V • (R1+ R2) R2 , R2 = R2A + R2B See Table 2 for approximate resistor values for R2. ⎛ V ⎞ R1 = R2 ⎜ BAT – 1⎟ , R2 = R2A + R2B ⎝1.2085V ⎠ Selecting R2 to be less than 50k and the sum of R1 and R2 at least 200k or above, achieves the lowest possible error at the VFB sense input. Note that sources of error such as R1 and R2 tolerance, FBDIV RON or VFB input impedance are not included in the specifications given in the Electrical Characteristics. This leads to the possibility that very accurate (0.1%) external resistors might be required. Actually, the temperature rise of the LTC4012 will rarely exceed 50°C at the end of charge, because charge current will have tapered to a low level. This means that 0.25% resistors will normally provide the required level of overall accuracy. Table 2 gives recommended values for R1 and R2 for popular lithium-ion battery voltages. For values of R1 above 200k, addition of capacitor CZ may improve transient response and loop stability. A value of 10pF is normally adequate. Table 2. Programming Output Voltage VBAT (V) R1 (0.25%) (kΩ) 4.1 165 69 – 4.2 167 67.3 200 8.2 162 28 – R2A (0.25%) (kΩ) R2B (1%)* (Ω) 8.4 169 28.4 – 12.3 301 32.8 – 12.6 294 31.2 – 16.4 284 22.6 – 16.8 271 21 – 20.5 316 19.8 – 21 298 18.2 – 24.6 298 15.4 – 25.2 397 20 – *To Obtain Desired Accuracy Requires Series Resistors For R2. 4012f 17 LTC4012/ LTC4012-1/LTC4012-2 APPLICATIONS INFORMATION Programming LTC4012-1/LTC4012-2 Output Voltage The LTC4012-1/LTC4012-2 feature precision internal battery voltage feedback resistor taps configured for common lithium-ion voltages. All that is required to program the desired voltage is proper pin programming of FVS0 and FVS1 as shown in Table 3. Table 3. LTC4012-1/LTC4012-2 Output Voltage Programming VBAT VOLTAGE LTC4012-1 LTC4012-2 FVS1 FVS0 4.1V 4.2V GND GND 8.2V 8.4V GND INTVDD 12.3V 12.6V INTVDD GND 16.4V 16.8V INTVDD INTVDD Often an AC adapter will include a rated current output margin of at least +10%. This can allow the adapter current limit value to simply be programmed to the actual minimum rated adapter output current. Table 4 shows some common RCL current limit programming values. A lowpass filter formed by RF (5.1k) and CF (0.1μF) is required to eliminate switching noise from the LTC4012 PWM and other system components. If input current limiting is not desired, CLN should be shorted to CLP while CLP remains connected to power. Table 4. Common RCL Values ADAPTER RATING (A) RCL VALUE (1%) (Ω) RCL POWER DISSIPATION (W) RCL POWER RATING (W) Programming Input Current Limit 1.00 0.100 0.100 0.25 To set the input current limit ILIM, the minimum wall adapter current rating must be known. To account for the tolerance of the LTC4012 input current sense circuit, 5% should be subtracted from the adapter’s minimum rated output. Refer to Figure 6 and program the input current limit function with the following equation. 1.25 0.080 0.125 0.25 1.50 0.068 0.150 0.25 1.75 0.056 0.175 0.25 2.00 0.050 0.200 0.25 2.50 0.039 0.244 0.50 3.00 0.033 0.297 0.50 3.50 0.027 0.331 0.50 4.00 0.025 0.400 0.50 RCL = 100mV ILIM where ILIM is the desired maximum current draw from the DC (adapter) input, including adjustments for tolerance, if any. FROM DC POWER INPUT RCL CDC TO REMAINDER OF SYSTEM RF 5.1k CF 0.1μF 10k Figure 7 shows an optional circuit that can influence the parameters of the input current limit in two ways. FROM INFET CLP CF 0.22μF RF 2.49k 1% LTC4012 CLN 2 2 1 1 CLP CLN LTC4012 3 INFET INTVDD 17 4012 F06 Figure 6. Programming Input Current Limit R2 RCL 1% TO REMAINDER OF SYSTEM Q2 2SC2412 Q1 IMX1 R1 1% R3 = R1 1% 4012 F07 Figure 7. Adjusting Input Current Limit 4012f 18 LTC4012/ LTC4012-1/LTC4012-2 APPLICATIONS INFORMATION The first option is to lower the power dissipation of RCL at the expense of accuracy without changing the input current limit value. The second is to make the input current limit value programmable. The overall accuracy of this circuit needs to be better than the power source current tolerance or be margined such that the worse-case error remains under the power source limits. The accuracy of the Figure 7 circuit is a function of the INTVDD, VBE, RCL, RF , R1 and R3 tolerances. To improve accuracy, the tolerance of RF should be changed from 5.1k, 5% to a 2.49k 1% resistor. RCL and the programming resistors R1 and R3 should also be 1% tolerance such that the dominant error is INTVDD (±3%). Bias resistor R2 can be 5%. When choosing NPN transistors, both need to have good gain (>100) at 10μA levels. Low gain NPNs will increase programming errors. Q1 must be a matched NPN pair. Since RF has been reduced in value by half, the capacitor value of CF should double to 0.22μF to remain effective at filtering out any noise. If you wish to reduce RCL power dissipation for a given current limit, the programming equation becomes: RCL ⎛ 5 • 2.49k ⎞ 100mV – ⎜ ⎝ R1 ⎟⎠ = ILIM If you wish to make the input current limit programmable, the equation becomes: ⎛ 5 • 2.49k ⎞ 100mV – ⎜ ⎝ R1 ⎟⎠ ILIM = RCL The equation governing R2 for both applications is based on the value of R1. R3 should always be equal to R1. In many notebook applications, there are situations where two different ILIM values are needed to allow two different power adapters or power sources to be used. In such cases, start by setting RLIM for the high power ILIM configuration and then use Figure 7 to set the lower ILIM value. To toggle between the two ILIM values, take the three ground connections shown in Figure 7, combine them into one common connection and use a small-signal NFET (2N7002) to open or close that common connection to circuit ground. When the NFET is off, the circuit is defeated (floating) allowing ILIM to be the maximum value. When the NFET is on, the circuit will become active and ILIM will drop to the lower set value. Monitoring Charge Current The PROG pin voltage can be used to indicate charge current where 1.2085V indicates full programmed current (1C) and zero charge current is approximately equal to RPROG • 11.67μA. PROG voltage varies in direct proportion to the charge current between this zero-current (offset) value and 1.2085V. When monitoring the PROG pin voltage, using a buffer amplifier as shown in Figure 8 will minimize charge current errors. The buffer amplifier may be powered from the INTVDD pin or any supply that is always on when the charger is on. INTVDD 17 LTC4012 – + PROG 13 <30nA TO SYSTEM MONITOR 4012 F08 Figure 8. PROG Voltage Buffer R2 = 0.875 • R1 4012f 19 LTC4012/ LTC4012-1/LTC4012-2 APPLICATIONS INFORMATION C/10 CHRG Indicator The value chosen for RPROG has a strong influence on charge current monitoring and the accuracy of the C/10 charge indicator output (CHRG). The LTC4012 uses the voltage on the PROG pin to determine when charge current has dropped to the C/10 threshold. The nominal threshold of 400mV produces an accurate low charge current indication of C/10 as long as RPROG = 26.7k, independent of all other current programming considerations. However, it may sometimes be necessary to deviate from this value to satisfy other application design goals. If RPROG is greater than 26.7k, the actual level at which low charge current is detected will be less than C/10. The highest value of RPROG that can be used while reliably indicating low charge current before reaching final VBAT is 30.1k. RPROG can safely be set to values higher than this, but low current indication will be lost. If RPROG is less than 26.7k, low charge current detection occurs at a level higher than C/10. More importantly, the LTC4012 becomes increasingly sensitive to reverse current. The lowest value of RPROG that can be used without the risk of erroneous boost operation detection at end of charge is 26.1k. Values of RPROG less than this should not be used. See the Operation section for more information about reverse current. Table 5. Digital Read Back State (IN, Figure 10) OUT STATE LTC4012 CHARGER STATE Hi-Z 1 Off 1 1 C/10 Charge 0 1 Bulk Charge 0 0 Input and Output Capacitors In addition to typical input supply bypassing (0.1μF) on DCIN, the relatively high ESR of aluminum electrolytic capacitors is helpful for reducing ringing when hot pluging the charger to the AC adapter. Refer to LTC Application Note 88 for more information. The input capacitor between system power (drain of top FET, Figure 1) and GND is required to absorb all input PWM ripple current, therefore it must have adequate ripple current rating. Maximum RMS ripple current is typically one-half of the average battery charge current. Actual capacitance value is not critical, but using the highest possible voltage rating on PWM input capacitors will minimize problems. Consult with the manufacturer before use. VLOGIC INTVDD 17 100k 100k Q1 TP0610T LTC4012 CHRG Q3 2N7002 100k 4012 F09 Figure 9. Digital C/10 Indicator Direct digital monitoring of C/10 indication is possible with an external application circuit like the one shown in Figure 9. By using two different value pull-up resistors, a microprocessor can detect three states from this pin (charging, C/10 and not charging). See Figure 10. When a digital output port (OUT) from the microprocessor drives one of the resistors and a second digital input port polls the network, the charge state can be determined as shown in Table 5. C/10 CHRG Q2 2N7002 7 The nominal fractional value of IMAX at which C/10 indication occurs is given by: 400mV – (RPROG • 11.67μA) IC10 = IMAX 1.2085V – (RPROG • 11.67μA) 100k 3.3V LTC4012 CHRG 7 VDD 200k 33k μP OUT IN 4012 F10 Figure 10. Microprocessor Status Interface 4012f 20 LTC4012/ LTC4012-1/LTC4012-2 APPLICATIONS INFORMATION The output capacitor shown across the battery and ground must also absorb PWM output ripple current. The general formula for this capacitor current is: ⎛ V ⎞ 0.29 • VBAT • ⎜1 – BAT⎟ ⎝ VCLP ⎠ IRMS = L1 • fPWM For example, IRMS = 0.22A with: VBAT = 12.6V VCLP = 19V L1 = 10μH fPWM = 550kHz High capacity ceramic capacitors (20μF or more) available from a variety of manufacturers can be used for input/output capacitors. Other alternatives include OS-CON and POSCAP capacitors from Sanyo. Low ESR solid tantalum capacitors have high ripple current rating in a relatively small surface mount package, but exercise caution when using tantalum for input or output bulk capacitors. High input surge current can be created when the adapter is hot-plugged to the charger or when a battery is connected to the charger. Solid tantalum capacitors have a known failure mechanism when subjected to very high surge currents. Select tantalum capacitors that have high surge current ratings or have been surge tested. EMI considerations usually make it desirable to minimize ripple current in battery leads. Adding Ferrite beads or inductors can increase battery impedance at the nominal 550KHz switching frequency. Switching ripple current splits between the battery and the output capacitor in inverse relation to capacitor ESR and the battery impedance. If the ESR of the output capacitor is 0.2Ω and the battery impedance is raised to 4Ω with a ferrite bead, only 5% of the current ripple will flow to the battery. Inductor Selection Higher switching frequency generally results in lower efficiency because of MOSFET gate charge losses, but it allows smaller inductor and capacitor values to be used. A primary effect of the inductor value L1 is the amplitude of ripple current created. The inductor ripple current ΔI L decreases with higher inductance and PWM operating frequency: ⎛ V ⎞ VBAT • ⎜1 – BAT ⎟ ⎝ VCLP ⎠ ΔIL = L1 • fPWM Accepting larger values of ΔIL allows the use of low inductance, but results in higher output voltage ripple and greater core losses. Lower charge currents generally call for larger inductor values. The LTC4012 limits maximum instantaneous peak inductor current during every PWM cycle. To avoid unstable switch waveforms, the ripple current must satisfy: ⎛150mV ⎞ ΔIL < 2 • ⎜ – IMAX ⎟ ⎝RSENSE ⎠ so choose: L1 > 0.125 • VCLP ⎛ 150mV ⎞ fPWM • ⎜ – IMAX ⎟ ⎝ RSENSE ⎠ A reasonable starting point for setting ripple current is ΔIL = 0.4 • IMAX. The voltage compliance of internal LTC4012 circuits also imposes limits on ripple current. Select RIN (in Figure 1) to avoid average current errors in high ripple designs. The following equation can be used for guidance: RSENSE • ΔIL R • ΔIL ≤ RIN ≤ SENSE 50μA 20μA 4012f 21 LTC4012/ LTC4012-1/LTC4012-2 APPLICATIONS INFORMATION RIN should not be less than 2.37k or more than 6.04k. Values of RIN greater than 3.01k may cause some reduction in programmed current accuracy. Use these equations and guidelines, as represented in Table 6, to help select the correct inductor value. This table was developed to maintain maximum ΔIL near 0.6 • IMAX with fPWM at 550kHz and VBAT = 0.5 • VCLP (the point of maximum ΔIL), assuming that inductor value could also vary by 25% at IMAX. TGATE BOOST Supply Table 6. Minimum Typical Inductor Values VCLP L1 IMAX RSENSE where QG is the rated gate charge of the top external NFET with VGS = 4.5V. The maximum average diode current is then given by: (Typ) <10V ≥10μH 1A 100mΩ RIN RPROG 3.01k 26.7k 10V to 20V ≥20μH 1A 100mΩ 3.01k 26.7k >20V ≥28μH 1A 100mΩ 3.01k 26.7k <10V ≥5.1μH 2A 50mΩ 3.01k 26.7k 10V to 20V ≥10μH 2A 50mΩ 3.01k 26.7k >20V ≥14μH 2A 50mΩ 3.01k 26.7k <10V ≥3.4μH 3A 33mΩ 3.01k 26.7k 10V to 20V ≥6.8μH 3A 33mΩ 3.01k 26.7k >20V ≥9.5μH 3A 33mΩ 3.01k 26.7k <10V ≥2.5μH 4A 25mΩ 3.01k 26.7k 10V to 20V ≥5.1μH 4A 25mΩ 3.01k 26.7k >20V ≥7.1μH 4A 25mΩ 3.01k 26.7k To guarantee that a chosen inductor is optimized in any given application, use the design equations provided and perform bench evaluation in the target application, particularly at duty cycles below 20% or above 80% where PWM frequency can be much less than the nominal value of 550kHz. Use the external components shown in Figure 11 to develop a bootstrapped BOOST supply for the TGATE FET driver. A good set of equations governing selection of the two capacitors is: C1 = 20 • QG , C2 = 20 • C1 4.5V ID = QG • 665kHz To improve efficiency by increasing VGS applied to the top FET, substitute a Schottky diode with low reverse leakage for D1. PWM jitter has been observed in some designs operating at higher VIN/VOUT ratios. This jitter does not substantially affect DC charge current accuracy. A series resistor with a value of 5Ω to 20Ω can be inserted between the cathode of D1 and the BOOST pin to remove this jitter, if present. A resistor case size of 0603 or larger is recommended to lower ESL and achieve the best results. BOOST 20 D1 1N4148 LTC4012 INTVDD 17 C2 2μF C1 0.1μF L1 SW 18 4012 F11 TO RSENSE Figure 11. TGATE Boost Supply 4012f 22 LTC4012/ LTC4012-1/LTC4012-2 APPLICATIONS INFORMATION FET Selection Two external power MOSFETs must be selected for use with the charger: an N-channel power switch (top FET) and an N-channel synchronous rectifier (bottom FET). Peak gate-to-source drive levels are internally set to about 5V. Consequently, logic-level FETs must be used. In addition to the fundamental DC current, selection criteria for these MOSFETs also include channel resistance RDS(ON), total gate charge QG, reverse transfer capacitance CRSS, maximum rated drain-source voltage BVDSS and switching characteristics such as td(ON/OFF). Power dissipation for each external FET is given by: PD(TOP) = VBAT • IMAX 2 • (1+ δΔT) RDS(ON) VCLP + k • VCLP 2 • IMAX • CRSS • 665kHz PD(BOT) = (VCLP – VBAT) • IMAX 2 • (1+ δΔT)RDS(ON) VCLP The synchronous (bottom) FET losses are greatest at high input voltage or during a short circuit, which forces a low side duty cycle of nearly 100%. Increasing the size of this FET lowers its losses but increases power dissipation in the LTC4012. Using asymmetrical FETs will normally achieve cost savings while allowing optimum efficiency. Select FETs with BVDSS that exceeds the maximum VCLP voltage that will occur. Both FETs are subjected to this level of stress during operation. Many logic-level MOSFETs are limited to 30V or less. The LTC4012 uses an improved adaptive TGATE and BGATE drive that is insensitive to MOSFET inertial delays, td(ON/OFF), to avoid overlap conduction losses. Switching characteristics from power MOSFET data sheets apply only to a specific test fixture, so there is no substitute for bench evaluation of external FETs in the target application. In general, MOSFETs with lower inertial delays will yield higher efficiency. Diode Selection where δ is the temperature dependency of RDS(ON), ΔT is the temperature rise above the point specified in the FET data sheet for RDS(ON) and k is a constant inversely related to the internal LTC4012 top gate driver. The term (1 + δΔT) is generally given for a MOSFET in the form of a normalized RDS(ON) curve versus temperature, but δ of 0.005/°C can be used as a suitable approximation for logic-level FETs if other data is not available. CRSS = ΔQGD /ΔVDS is usually specified in the MOSFET characteristics. The constant k = 2 can be used in estimating top FET dissipation. The LTC4012 is designed to work best with external FET switches with a total gate charge at 5V of 15nC or less. A Schottky diode in parallel with the bottom FET and/or top FET in an LTC4012 application clamps SW during the non-overlap times between conduction of the top and bottom FET switches. This prevents the body diode of the MOSFETs from forward biasing and storing charge, which could reduce efficiency as much as 1%. One or both diodes can be omitted if the efficiency loss can be tolerated. A 1A Schottky is generally a good size for 3A chargers due to the low duty cycle of the non-overlap times. Larger diodes can actually result in additional efficiency (transition) losses due to larger junction capacitance. For VCLP < 20V, high charge current efficiency generally improves with larger FETs, while for VCLP > 20V, top gate transition losses increase rapidly to the point that using a topside NFET with higher RDS(ON) but lower CRSS can actually provide higher efficiency. If the charger will be operated with a duty cycle above 85%, overall efficiency is normally improved by using a larger top FET. The three separate PWM control loops of the LTC4012 can be compensated by a single set of components attached between the ITH pin and GND. As shown in the typical LTC4012 application, a 6.04k resistor in series with a capacitor of at least 0.1μF provides adequate loop compensation for the majority of applications. Loop Compensation and Soft-Start 4012f 23 LTC4012/ LTC4012-1/LTC4012-2 APPLICATIONS INFORMATION The LTC4012 can be soft-started with the compensation capacitor on the ITH pin. At start-up, ITH will quickly rise to about 0.25V, then ramp up at a rate set by the compensation capacitor and the 40μA ITH bias current. The full programmed charge current will be reached when ITH reaches approximately 2V. With a 0.1μF capacitor, the time to reach full charge current is usually greater than 1.5ms. This capacitor can be increased if longer start-up times are required, but loop bandwidth and dynamic response will be reduced. INTVDD Regulator Output Bypass the INTVDD regulator output to GND with a low ESR X5R or X7R ceramic capacitor with a value of 0.47μF or larger. The capacitor used to build the BOOST supply (C2 in Figure 11) can serve as this bypass. Do not draw more than 30mA from this regulator for the host system, governed by IC power dissipation. Calculating IC Power Dissipation The user should ensure that the maximum rated junction temperature is not exceeded under all operating conditions. The thermal resistance of the LTC4012 package (θJA) is 37°C/W, provided the Exposed Pad is in good thermal contact with the PCB. The actual thermal resistance in the application will depend on forced air cooling and other heat sinking means, especially the amount of copper on the PCB to which the LTC4012 is attached. The following formula may be used to estimate the maximum average power dissipation PD (in watts) of the LTC4012, which is dependent upon the gate charge of the external MOSFETs. This gate charge, which is a function of both gate and drain voltage swings, is determined from specifications or graphs in the manufacturer’s data sheet. For the equation below, find the gate charge for each transistor assuming 5V gate swing and a drain voltage swing equal to the maximum VCLP voltage. Maximum LTC4012 power dissipation under normal operating conditions is then given by: PD = DCIN(3mA + IDD + 665kHz(QTGATE + QBGATE)) – 5IDD where: IDD = Average external INTVDD load current, if any QTGATE = Gate charge of external top FET in Coulombs QBGATE = Gate charge of external bottom FET in Coulombs PCB Layout Considerations To prevent magnetic and electrical field radiation and high frequency resonant problems, proper layout of the components connected to the LTC4012 is essential. Refer to Figure 12. For maximum efficiency, the switch node rise and fall times should be minimized. The following PCB design priority list will help insure proper topology. Layout the PCB using this specific order. 1. Input capacitors should be placed as close as possible to switching FET supply and ground connections with the shortest copper traces possible. The switching FETs must be on the same layer of copper as the input capacitors. Vias should not be used to make these connections. 2. Place the LTC4012 close to the switching FET gate terminals, keeping the connecting traces short to produce clean drive signals. This rule also applies to IC supply and ground pins that connect to the switching FET source pins. The IC can be placed on the opposite side of the PCB from the switching FETs. SWITCH NODE L1 RSENSE VIN VBAT CIN HIGH FREQUENCY CIRCULATING PATH COUT D1 + BAT ANALOG GROUND GND SWITCHING GROUND 4012 F12 SYSTEM GROUND Figure 12. High Speed Switching Path 4012f 24 LTC4012/ LTC4012-1/LTC4012-2 APPLICATIONS INFORMATION 3. Place the inductor input as close as possible to the switching FETs. Minimize the surface area of the switch node. Make the trace width the minimum needed to support the programmed charge current. Use no copper fills or pours. Avoid running the connection on multiple copper layers in parallel. Minimize capacitance from the switch node to any other trace or plane. 4. Place the charge current sense resistor immediately adjacent to the inductor output, and orient it such that current sense traces to the LTC4012 are not long. These feedback traces need to be run together as a single pair with the smallest spacing possible on any given layer on which they are routed. Locate any filter component on these traces next to the LTC4012, and not at the sense resistor location. 5. Place output capacitors adjacent to the sense resisitor output and ground. 6. Output capacitor ground connections must feed into the same copper that connects to the input capacitor ground before connecting back to system ground. 7. Connection of switching ground to system ground, or any internal ground plane, should be single-point. If the system has an internal system ground plane, a good way to do this is to cluster vias into a single star point to make the connection. 8. Route analog ground as a trace tied back to the LTC4012 GND paddle before connecting to any other ground. Avoid using the system ground plane. A useful CAD technique is to make analog ground a separate ground net and use a 0Ω resistor to connect analog ground to system ground. 9. A good rule of thumb for via count in a given high current path is to use 0.5A per via. Be consistent when applying this rule. 10. If possible, place all the parts listed above on the same PCB layer. 11. Copper fills or pours are good for all power connections except as noted above in Rule 3. Copper planes on multiple layers can also be used in parallel. This helps with thermal management and lowers trace inductance, which further improves EMI performance. 12. For best current programming accuracy, provide a Kelvin connection from RSENSE to CSP and CSN. See Figure 13 for an example. 13. It is important to minimize parasitic capacitance on the CSP and CSN pins. The traces connecting these pins to their respective resistors should be as short as possible. DIRECTION OF CHARGING CURRENT RSENSE 4012 F13 TO CSP RIN TO CSN RIN Figure 13. Kelvin Sensing of Charge Current 4012f 25 LTC4012/ LTC4012-1/LTC4012-2 TYPICAL APPLICATION 12.6V 4 Amp Charger FROM ADAPTER 15V AT 4A R7 25mΩ Q5 C1 0.1μF POWER TO SYSTEM R1 3k D1 R 7 4 3 CHRG DCIN C4 0.1μF INFET CLP CLN 2 20 19 TGATE LTC4012 18 SW 5 17 ACP INTVDD 8 16 ICL BGATE 6 SHDN 21 GND 15 12 ITH CSP C2 0.1μF R4 6.04k 13 C3 4.7nF R5 26.7k BULK CHARGE Q1 R6 53.6k CSN D5 1 C8 10μF R15 0Ω* BOOST TO/FROM MCU R8 5.1k 14 C5 0.1μF D4 C6 2μF L1 4.7μH R9 3.01k R11 25mΩ R10 3.01k 11 BAT 10 FBDIV PROG VFB 9 R14 100k D6 18V ZENER Q4 TO POWER SYSTEM LOAD WHEN ADAPTER IS NOT PRESENT, USE SCHOTTKY DIODE D5 OR THE COMBINATION OF R14, D6 AND Q4 Q2 D3 Q3 OR R12 294k R13 31.2k C10 10pF C9 10μF + 12.6V Li-Ion BATTERY 4012 TA03 D3: CMDSH-3 D4: MBR230LSFT1 Q1: 2N7002 Q2, Q3: Si7212DN OR SiA914DJ OR Si4816BDY (OMIT D4) Q4, Q5: Si7423DN L1: 1HLP-2525CZER4R7M11 *: SEE TGATE BOOST SUPPLY IN APPLICATIONS INFORMATION 4012f 26 LTC4012/ LTC4012-1/LTC4012-2 PACKAGE DESCRIPTION UF Package 20-Lead Plastic QFN (4mm × 4mm) (Reference LTC DWG # 05-08-1710 Rev A) 0.70 ±0.05 4.50 ± 0.05 3.10 ± 0.05 2.00 REF 2.45 ± 0.05 2.45 ± 0.05 PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 0.75 ± 0.05 4.00 ± 0.10 R = 0.05 TYP R = 0.115 TYP 19 20 0.40 ± 0.10 PIN 1 TOP MARK (NOTE 6) 1 2.45 ± 0.10 4.00 ± 0.10 PIN 1 NOTCH R = 0.20 TYP OR 0.35 s 45° CHAMFER BOTTOM VIEW—EXPOSED PAD 2 2.00 REF 2.45 ± 0.10 (UF20) QFN 01-07 REV A 0.200 REF 0.00 – 0.05 0.25 ± 0.05 0.50 BSC NOTE: 1. DRAWING IS PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-1)—TO BE APPROVED 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 4012f Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 27 LTC4012/ LTC4012-1/LTC4012-2 RELATED PARTS PART NUMBER DESCRIPTION COMMENTS LTC1760 Smart Battery System Manager Autonomous Power Management and Battery Charging for Two Smart Batteries, SMBus Rev 1.1 Compliant LTC1769 2A Switching Battery Charger Constant-Current/Constant-Voltage Switching Regulator, Input Current Limiting Maximizes Charge Current LTC1960 Dual Battery Charger/Selector with SPI 11-bit V-DAC, 0.8% Voltage Accuracy, 10-Bit I-DAC, 5% Current Accuracy LTC4006 Small, High Efficiency, Fixed Voltage, Lithium-Ion Battery Chargers with Termination Complete Charger for 3- or 4-Cell Li-Ion Batteries, AC Adapter Current Limit and Thermistor Sensor, 16-pin SSOP Package LTC4007 High Efficiency, Programmable Voltage, Lithium-Ion Battery Charger with Termination Complete Charger for 3- or 4-Cell Li-Ion Batteries, AC Adapter Current Limit, Thermistor Sensor and Indicator Outputs LTC4008/LTC4008-1 High Efficiency, Programmable Voltage/Current Battery Constant-Current/Constant-Voltage Switching Regulator, Resistor Chargers Voltage/Current Programming, Thermistor Sensor and Indicator Outputs, AC Adapter Current Limit (Omitted on 4008-1) LTC4009/LTC4009-1 LTC4009-2 High Efficiency, Multichemistry Battery Charger Constant-Current/Constant-Voltage Switching Regulator in a 20-Lead QFN Package, AC Adapter Current Limit, Indicator Outputs LTC4010 High Efficiency Standalone Nickel Battery Charger Complete NiMH/NiCd Charger in a Small 16-Lead Package, ConstantCurrent Switching Regulator LTC4011 High Efficiency Standalone Nickel Battery Charger Complete NiMH/NiCd Charger in a Small 20-Lead Package, ConstantCurrent Switching Regulator, PowerPath Control and Indicators LTC4060 Standalone Linear NiMH/NiCd Fast Charger Complete NiMH/NiCd Charger in a Small 16-Pin Package, No Sense Resistor or Blocking Diode Required LTC4100 Smart Battery Charger Controller Level 2 Charger Operates with or without MCU Host, SMBus Rev 1.1 Compliant LTC4110 Battery Backup Manager Multi-Chemistry and Smart Battery Charge and Discharge Manager. Four Operating Modes: Battery Backup, Battery Charge, Battery Calibration, Shutdown. 5mm × 7mm QFN-38 Package LTC4150 Coulomb Counter/Battery Gas Gauge High Side Sense of Charge Quantity and Polarity in a 10-Pin MSOP LTC4411 2.6A Low Loss Idea Diode No External MOSFET, Automatic Switching Between DC sources, 140mΩ On Resistance in ThinSOTTM package LTC4412/LTC4412HV Low Loss PowerPath Controllers Very Low Loss Replacement for Power Supply ORing Diodes Using Minimal External Complements, Operates up to 28V (36V for HV) LTC4413 Dual 2.6A, 2.5V to 5.5V Ideal Diodes Low Loss Replacement for ORing Diodes, 100mΩ On Resistance LTC4414 36V, Low Loss PowerPath Controller for Large PFETs Low Loss Replacement for ORing Diodes, Operates up to 36V LTC4416 Dual Low Loss PowerPath Controllers Low Loss Replacement for ORing Diodes, Operates up to 36V, Drives Large PFETs, Programmable, Autonomous Switching ThinSOT is a trademark of Linear Technology Corporation. 4012f 28 Linear Technology Corporation LT 0509 • PRINTED IN USA 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com © LINEAR TECHNOLOGY CORPORATION 2009