VISHAY SIHFR9310T-E3

IRFR9310, IRFU9310, SiHFR9310, SiHFU9310
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
•
•
•
•
•
•
•
- 400
RDS(on) (Ω)
VGS = - 10 V
7.0
Qg (Max.) (nC)
13
Qgs (nC)
3.2
Qgd (nC)
5.0
Configuration
Single
P-Channel
Surface Mount (IRFR9310/SiHFR9310)
Straight Lead (IRFU9310/SiHFU9310)
Advanced Process Technology
Fast Switching
Fully Avalanche Rated
Lead (Pb)-free Available
Available
RoHS*
COMPLIANT
DESCRIPTION
S
D PAK
(TO-252)
IPAK
(TO-251)
Third generation Power MOSFETs from Vishay utilize
advanced processing techniques to achieve low
on-resistance per silicon area. This benefit, combined with
the fast switching speed and ruggedized device design that
Power MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use in a
wide variety of applications.
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU/SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
G
D
P-Channel MOSFET
ORDERING INFORMATION
Package
Lead (Pb)-free
SnPb
DPAK (TO-252)
DPAK (TO-252)
DPAK (TO-252)
DPAK (TO-252)
IPAK (TO-251)
IRFR9310PbF
IRFR9310TRLPbFa
IRFR9310TRPbFa
IRFR9310TRRPbFa
IRFU9310PbF
SiHFR9310-E3
SiHFR9310TL-E3a
SiHFR9310T-E3a
SiHFR9310TR-E3a
SiHFU9310-E3
IRFR9310
IRFR9310TRLa
IRFR9310TRa
-
IRFU9310
SiHFR9310
SiHFR9310TLa
SiHFR9310Ta
-
SiHFU9310
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Currenta
Linear Derating Factor
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
Repetitive Avalanche Energya
Maximum Power Dissipation
Peak Diode Recovery dV/dtc
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
SYMBOL
VDS
VGS
VGS at - 10 V
TC = 25 °C
TC = 100 °C
ID
IDM
TC = 25 °C
for 10 s
EAS
IAR
EAR
PD
dV/dt
TJ, Tstg
LIMIT
- 400
± 20
- 1.8
- 1.1
- 7.2
0.40
92
- 1.8
5.0
50
- 24
- 55 to + 150
300d
UNIT
V
A
W/°C
mJ
A
mJ
W
V/ns
°C
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Starting TJ = 25 °C, L = 57 mH, RG = 25 Ω, IAS = - 1.8 A (see fig. 12).
c. ISD ≤ - 1.1 A, dI/dt ≤ 450 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91284
S-81378-Rev. A, 07-Jul-08
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IRFR9310, IRFU9310, SiHFR9310, SiHFU9310
Vishay Siliconix
THERMAL RESISTANCE RATINGS
SYMBOL
MIN.
TYP.
MAX.
Maximum Junction-to-Ambient
PARAMETER
RthJA
-
-
110
Maximum Junction-to-Ambient
(PCB Mount)a
RthJA
-
-
50
Maximum Junction-to-Case (Drain)
RthJC
-
-
2.5
UNIT
°C/W
Note
a. When mounted on 1" square PCB (FR-4 or G-10 material).
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
Drain-Source On-State Resistance
Forward Transconductance
VDS
VGS = 0 V, ID = - 250 µA
- 400
-
-
V
ΔVDS/TJ
Reference to 25 °C, ID = - 1 mA
-
- 0.41
-
V/°C
VGS(th)
VDS = VGS, ID = - 250 µA
- 2.0
-
- 4.0
V
nA
VGS = ± 20 V
-
-
± 100
VDS = - 400 V, VGS = 0 V
-
-
- 100
VDS = - 320 V, VGS = 0 V, TJ = 125 °C
-
-
- 500
IGSS
IDSS
RDS(on)
gfs
ID = - 1.1 Ab
VGS = - 10 V
VDS = - 50 V, ID = - 1.1 A
µA
-
-
7.0
Ω
0.91
-
-
S
-
270
-
Dynamic
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
VGS = 0 V,
VDS = - 25 V,
f = 1.0 MHz, see fig. 5
50
-
8.0
-
-
-
13
pF
Gate-Source Charge
Qgs
-
-
3.2
Gate-Drain Charge
Qgd
-
-
5.0
Turn-On Delay Time
td(on)
-
11
-
tr
-
10
-
-
25
-
-
24
-
-
4.5
-
-
7.5
-
-
-
- 1.9
-
-
- 7.6
-
-
- 4.0
-
170
260
ns
-
640
960
nC
Rise Time
Turn-Off Delay Time
Fall Time
td(off)
VGS = - 10 V
ID = - 1.1 A, VDS = - 320 V,
see fig. 6 and 13b
-
VDD = - 200 V, ID = - 1.1 A,
RG = 21 Ω, RD = 180 Ω, see fig. 10b
tf
Internal Drain Inductance
LD
Internal Source Inductance
LS
Between lead,
6 mm (0.25") from
package and center of
die contactc
D
nC
ns
nH
G
S
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
IS
Pulsed Diode Forward Currenta
ISM
Body Diode Voltage
VSD
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Qrr
Forward Turn-On Time
ton
MOSFET symbol
showing the
integral reverse
p - n junction diode
D
A
G
S
TJ = 25 °C, IS = - 1.1 A, VGS = 0 Vb
TJ = 25 °C, IF = -1.1 A, dI/dt = 100 A/µsb
V
Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width ≤ 300 µs; duty cycle ≤ 2 %.
c. This is applied for IPAK, LS of DPAK is measured between lead and center of die contact.
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Document Number: 91284
S-81378-Rev. A, 07-Jul-08
IRFR9310, IRFU9310, SiHFR9310, SiHFU9310
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
10
10
VGS
-15V
-10V
-8.0V
-7.0V
-6.0V
-5.5V
-5.0V
BOTTOM -4.5V
-I D , Drain-to-Source Current (A)
-I D , Drain-to-Source Current (A)
TOP
1
-4.5V
20μs PULSE WIDTH
TJ = 25 °C
0.1
1
10
100
TJ = 25 ° C
TJ = 150 ° C
1
V DS = -50V
20μs PULSE WIDTH
0.1
4
-VDS , Drain-to-Source Voltage (V)
Fig. 1 - Typical Output Characteristics
2.5
VGS
-15V
-10V
-8.0V
-7.0V
-6.0V
-5.5V
-5.0V
BOTTOM -4.5V
-I D , Drain-to-Source Current (A)
TOP
1
-4.5V
0.1
20μs PULSE WIDTH
TJ = 150 °C
1
10
-VDS , Drain-to-Source Voltage (V)
Fig. 2 - Typical Output Characteristics
Document Number: 91284
S-81378-Rev. A, 07-Jul-08
6
7
8
9
10
Fig. 3 - Typical Transfer Characteristics
100
RDS(on) , Drain-to-Source On Resistance
(Normalized)
10
5
-VGS, Gate-to-Source Voltage (V)
ID = -1.8A
2.0
1.5
1.0
0.5
0.0
-60 -40 -20
VGS = -10V
0
20
40
60
80 100 120 140 160
TJ , Junction Temperature ( °C)
Fig. 4 - Normalized On-Resistance vs. Temperature
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IRFR9310, IRFU9310, SiHFR9310, SiHFU9310
Vishay Siliconix
VGS = 0V,
f = 1MHz
Ciss = Cgs + Cgd , Cds SHORTED
Crss = Cgd
Coss = Cds + Cgd
C, Capacitance (pF)
400
Ciss
300
200
Coss
100
Crss
10
-ISD , Reverse Drain Current (A)
500
0
1
10
TJ = 150 ° C
1
TJ = 25 ° C
0.1
1.0
100
-VDS , Drain-to-Source Voltage (V)
3.0
4.0
5.0
Fig. 7 - Typical Source-Drain Diode Forward Voltage
100
ID = -1.1A
OPERATION IN THIS AREA LIMITED
BY RDS(on)
VDS =-320V
VDS =-200V
VDS =-80V
16
-IID , Drain Current (A)
-VGS , Gate-to-Source Voltage (V)
2.0
-VSD ,Source-to-Drain Voltage (V)
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage
20
V GS = 0 V
12
8
10
10us
100us
1
1ms
4
FOR TEST CIRCUIT
SEE FIGURE 13
0
0
4
8
12
16
QG , Total Gate Charge (nC)
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage
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0.1
TC = 25 °C
TJ = 150 °C
Single Pulse
10
10ms
100
1000
-VDS , Drain-to-Source Voltage (V)
Fig. 8 - Maximum Safe Operating Area
Document Number: 91284
S-81378-Rev. A, 07-Jul-08
IRFR9310, IRFU9310, SiHFR9310, SiHFU9310
Vishay Siliconix
RD
VDS
2.0
VGS
1.6
-ID , Drain Current (A)
D.U.T.
RG
+VDD
- 10 V
Pulse width ≤ 1 µs
Duty factor ≤ 0.1 %
1.2
Fig. 10a - Switching Time Test Circuit
0.8
td(on)
0.4
td(off) tf
tr
VGS
10 %
0.0
25
50
75
100
125
150
TC , Case Temperature ( °C)
90 %
VDS
Fig. 9 - Maximum Drain Current vs. Case Temperature
Fig. 10b - Switching Time Waveforms
Thermal Response (Z thJC )
10
D = 0.50
1
0.20
0.10
0.05
0.1
0.02
0.01
0.01
0.00001
PDM
SINGLE PULSE
(THERMAL RESPONSE)
t1
t2
Notes:
1. Duty factor D = t 1 / t 2
2. Peak T J = P DM x Z thJC + TC
0.0001
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
Document Number: 91284
S-81378-Rev. A, 07-Jul-08
www.vishay.com
5
IRFR9310, IRFU9310, SiHFR9310, SiHFU9310
Vishay Siliconix
L
VDS
IAS
+ VDD
A
D.U.T.
RG
IAS
- 20 V
tp
Driver
0.01 Ω
tp
15 V
VDS
EAS , Single Pulse Avalanche Energy (mJ)
Fig. 12a - Unclamped Inductive Test Circuit
Fig. 12b - Unclamped Inductive Waveforms
300
ID
-0.49A
-0.7A
BOTTOM -1.1A
TOP
250
200
150
100
50
0
25
50
75
100
125
150
Starting TJ , Junction Temperature ( °C)
Fig. 12c - Maximum Avalanche Energy vs. Drain Current
Current regulator
Same type as D.U.T.
50 kΩ
QG
- 10 V
12 V
0.2 µF
0.3 µF
QGS
-
QGD
D.U.T.
VG
+ VDS
VGS
- 3 mA
Charge
IG
ID
Current sampling resistors
Fig. 13a - Basic Gate Charge Waveform
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Fig. 13b - Gate Charge Test Circuit
Document Number: 91284
S-81378-Rev. A, 07-Jul-08
IRFR9310, IRFU9310, SiHFR9310, SiHFU9310
Vishay Siliconix
Peak Diode Recovery dV/dt Test Circuit
D.U.T.
+
Circuit layout considerations
• Low stray inductance
• Ground plane
• Low leakage inductance
current transformer
+
-
-
RG
+
• dV/dt controlled by RG
• ISD controlled by duty factor "D"
• D.U.T. - device under test
+
- VDD
Compliment N-Channel of D.U.T. for driver
Driver gate drive
P.W.
Period
D=
P.W.
Period
VGS = - 10 V*
D.U.T. ISD waveform
Reverse
recovery
current
Body diode forward
current
dI/dt
D.U.T. VDS waveform
Diode recovery
dV/dt
Re-applied
voltage
VDD
Body diode forward drop
Inductor current
Ripple ≤ 5 %
*
ISD
VGS = - 5 V for logic level and - 3 V drive devices
Fig. 14 - For P-Channel
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?91284.
Document Number: 91284
S-81378-Rev. A, 07-Jul-08
www.vishay.com
7
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Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
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Document Number: 91000
Revision: 18-Jul-08
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