FDC6332L Common Source Load Switch P-Channel 1.8V Specified PowerTrench MOSFET General Description Features This Load Switch integrates an N-Channel Power MOSFET that drives Common-Source P-Channels and TM in a small SuperSot –6 package. It uses Fairchild’s advanced low voltage PowerTrench process. The RDS(ON) is 750 mΩ per the switch @ VGS 1.8Vand is optimized for battery power management applications. • –1 A, 8 V. RDS(ON) = 350 mΩ @ VGS = –4.5 V RDS(ON) = 500 mΩ @ VGS = –2.5 V RDS(ON) = 750 mΩ @ VGS = –1.8 V Applications • High performance trench technology for extremely • N-Channel MOSFET includes Zener protection for ESD ruggedness (>6KV Human body model) low RDS(ON) • Battery management/Charger Application • Accessory load switching S1 D2 Vin 1 6 S1/S2 On/Off 2 5 Vout G1/G2 3 4 GND D1 V DROP IN OUT G2 SuperSOT TM Pin 1 -6 G1 S2 ON/OFF Equivalent Circuit SuperSOT™-6 Absolute Maximum Ratings Symbol TA=25oC unless otherwise noted Parameter VIN Input Voltage VON Turn-On Voltage ILoad Load Current PD Maximum Power Dissipation TJ, TSTG Operating and Storage Junction Temperature Range – Continuous (Note 1) – Pulsed Ratings Units ±8 V 8 V –1.0 A –2.0 (Note 1) 0.7 W –55 to +150 °C °C/W Thermal Characteristics RθJA Thermal Resistance, Junction-to-Ambient (Note 1) 160 RθJC Thermal Resistance, Junction-to-Case (Note 1) 90 Package Marking and Ordering Information .332 2003Fairchild Semiconductor Corporation Device Reel Size Tape width Quantity FDC6332L 7’’ 8mm 3000 units FDC6332L Rev D(W) FDC6332L June 2003 Symbol TA = 25°C unless otherwise noted Parameter Test Conditions Min Typ Max Units Off Characteristics BVIN Input – Output Breakdown Voltage VON/OFF = 0 V, ID = –250 µA IRIN Reverse Input Current VIN = –8V, VON/OFF = 0 V BVGOFF Driver FET Gate Breakdown Voltage IG = 250uA IGOFF Driver FET Gate Leakage Current VG = 8 V On Characteristics –20 V –1 µA 100 nA 8 V 8 V (Note 2) VIN Input Voltage Range 1.8 VON Turn-On Voltage Range 1.5 2.5 8 V VOFF Turn-off Voltage Range –0.2 0.2 V ILOAD Output Load Current VIN = –5 V VON = –4.5V RDS(on) Static Drain–Source On–Resistance mΩ Loadswitch On-Resistance ID = –1.0A ID = –0.9 A ID = –0.7 A ID = –1.0 A ID = –0.9 A ID = –0.7 A 350 500 750 RON VGS = 4.5 V, VGS = 2.5 V, VGS = 1.8 V, VIN = 8 V, VIN = 8 V, VIN = 8 V, –1 A 230 338 643 409 411 420 mΩ Drain–Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain–Source Diode Forward Current VSD Drain–Source Diode Forward Voltage VON/OFF = 0 V, IS = –0.6 A (Note 2 –0.9 –0.6 A –1.2 V Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. a) 90°C/W when mounted on a 1in2 pad of 2 oz copper b) 160°C/W when mounted on a minimum pad of 2 oz copper Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0% FDC6332L Load Switch Application Circuit S1/S2 Q2 Q3 OUT IN G1/G2 ON/OFF Q1 LOAD FDC6332L Rev D(W) FDC6332L Electrical Characteristics FDC6332L Typical Characteristics 1 1.2 VIN = 2.5V VON/OFF = 2.5V to 8V PW = 300us, D < 2% 1 VIN = 3.3V VON/OFF = 2.5V to 8V PW = 300us, D < 2% 0.8 TJ = 125OC -VDROP, (V) -VDROP, (V) 0.8 0.6 O TJ = 25 C 0.6 TJ = 125OC 0.4 0.4 TJ = 25OC 0.2 0.2 0 0 0 0.2 0.4 0.6 0.8 0 1 0.2 0.4 Figure 1. Conduction Voltage Drop Variation with Load Current. 1 RDS(ON), ON-RESISTANCE (W) 2 VIN = 8V VON/OFF = 2.5V to 8V PW = 300us, D < 2% 0.5 TJ = 125OC 0.4 -VDROP, (V) 0.8 Figure 2. Conduction Voltage Drop Variation with Load Current. 0.6 0.3 O TJ = 25 C 0.2 0.1 0 IL = 1A VON/OFF = 2.5V to 8V PW = 300us, D < 2% 1.6 1.2 TJ = 125OC 0.8 TJ = 25OC 0.4 0 0 0.2 0.4 0.6 0.8 1 1 2 -IL, (A) 3 4 5 6 7 8 -VIN, INPUT VOLTAGE (V) Figure 3. Conduction Voltage Drop Variation with Load Current. r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE 0.6 -IL, (A) -IL, (A) Figure 4. On-Resistance Variation With Input Voltage 1 R θJA(t) = r(t) * R θJA R θJA = 160 °C/W D = 0.5 0.2 0.1 P(pk) 0.1 t1 0.05 0.02 0.01 SINGLE PULSE 0.01 0.0001 0.001 t2 T J - T A = P * R θJA(t) Duty Cycle, D = t1 / t2 0.01 0.1 1 10 100 1000 t1, TIME (sec) Figure 5. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1 Transient thermal response will change depending on the circuit board design. FDC6332L Rev D(W) TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx FACT ActiveArray FACT Quiet Series Bottomless FASTâ CoolFET FASTr CROSSVOLT FRFET DOME GlobalOptoisolator EcoSPARK GTO E2CMOSTM HiSeC EnSignaTM I2C Across the board. Around the world. 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A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I2