IRONWOOD CA-QFE64SA-L-Z-01

34.00mm
[1.339"]
OTQ - 64 - 0.8 -02
34.00mm
[1.339"]
Top View
1
25.91mm[1.020"] assembled
3
8.32mm[0.328"] assembled
2
1
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
FR4/G10 or equivalent high temp material. 17µm [1/2
oz.] Cu clad. SnPb plating.
2
Pins: material- Brass Alloy 360 1/2 hard; finish0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
3
Pins: shell material- Brass Alloy 360 1/2 hard;
finish- 0.25µm [10µ"] Au over 1.27µm [50µ"] Ni
(min.). Contact material- BeCu; finish 0.25µm
[10µ"] Au over 2.54µm [100µ"] Ni (min. ).
Side View
Description: Carrier Adaptor
64 position (0.8mm pitch) QFP ZIF socket to 64 position surface mountable QFP emulator foot.
The 2 piece adaptor interconnects via a gold plated (1.27mm[0.050"] center) Mini-grid socket interface.
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise.
CA-QFE64SA-L-Z-01 Drawing
© 2000 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
www.ironwoodelectronics.com
Status: Released
Scale 2:1
Rev: A
Drawing: W. Watson
Date: 4/3/00
File: CA-QFE64SA-L-Z-01 Dwg
Modified: