ONSEMI CSP

0.4mm Pitch Daisy Chain
CM6100
Product Description
The 6100 is a 4-bump very low capacitance ESD protection device in 0.4mm CSP form factor. It is fully
compliant with IEC 61000-4-2. The CM6100 is RoHS II compliant.
Electrical Schematic / Pin Description
WHERE X =
©2010 SCILLC. All rights reserved.
May 2010 Rev. 6
A = ww01, ww02
J = ww19, ww20
S = ww37, ww38
B = ww03, ww04
K = ww21, ww22
T = ww39, ww40
C = ww05, ww06
L = ww23, ww24
U = ww41, ww42
D = ww06, ww08
M = ww25, ww26
V = ww43, ww44
E = ww08, ww10
N = ww27, ww28
W = ww45, ww46
F = ww11, ww12
O = ww29, ww30
X = ww47, ww48
G = ww13, ww14
P = ww31, ww32
Y = ww49, ww50
H = ww15, ww16
Q = ww33, ww34
Z = ww51, ww52
I = ww17, ww18
R = ww35, ww36
Publication Order Number:
CM6100/D
CM6100
Pin Information
PIN DESCRIPTIONS
PIN
DESCRIPTION
PIN
DESCRIPTION
A1
ESD Channel 1
B1
Device Ground
A2
ESD Channel 2
B2
Device Ground
Ordering Information
PART NUMBERING INFORMATION
Bumps
Package
Variation
Ordering Part
Number1
Part Marking
4
CSP
CSP-SAC105
CM6100
P
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Electrical Specifications and Conditions
PARAMETERS AND OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Storage Temperature Range
-55 to +150
°C
Operating Temperature Range
-40 to +85
°C
Rev. 6 | Page 2 of 6 | www.onsemi.com
CM6100
ELECTRICAL OPERATING CHARACTERISTICS(SEE NOTE 1)
SYMBOL PARAMETER
CONDITIONS
VIN
Input Operating Supply Voltage
VB
Breakdown Voltage (Positive)
IF = 8mA
ILEAK
Channel Leakage Current
VIN = 3V
CIN
Channel Input Capacitance
At 1 MHz, VIN=0V
ΔC
Channel Input Capacitance Matching
At 1 MHz, VIN=0V
VESD
ESD Protection Peak Discharge
Voltage at any channel input
a) Contact discharge per
IEC 61000-4-2 standard
b) Air discharge per
IEC 61000-4-2 standard
Notes 2
Channel Clamp Voltage
Positive Transients
Negative Transients
IPP = 1A, tP = 8/20μs
Dynamic Resistance
Positive Transients
Negative Transients
IPP = 1A, tP = 8/20μS
Any I/O pin to Ground
IN
VCL
RDYN
Note 1: All parameters specified at TA = 25°C unless otherwise noted.
Note 2: Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330Ω.
Rev. 6 | Page 3 of 6 | www.onsemi.com
MIN
TYP
MAX
UNITS
3.0
5.5
V
6
V
±0.1
0.02
±0.30
μA
1.5
pF
pF
±8
kV
±15
kV
+9.8
-1.5
V
V
0.7
0.5
Ω
Ω
CM6100
Mechanical Specification
CSP-4 Mechanical Specifications
The CM6100 is supplied in a 4 bump Chip Scale Package (CSP).
Controlling dimension: millimeters
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
4
BOTTOM VIEW
Millimeters
Inches
A1
Dim
C1
Nom
Max
Min
Nom
Max
A1
0.755 0.800 0.845 0.0297 0.0315 0.0333
A2
0.755 0.800 0.845 0.0297 0.0315 0.0333
B1
0.395 0.400 0.405 0.0156 0.0157 0.0159
B1
B2
Min
A
C1
0.150 0.200 0.250 0.0059 0.0079 0.0098
C2
0.150 0.200 0.250 0.0059 0.0079 0.0098
D1
0.570 0.600 0.630 0.0224 0.0236 0.0248
D2
0.394 0.406 0.418 0.0155 0.0160 0.0165
A2
0.395 0.400 0.405 0.0156 0.0157 0.0159
2
1
0.27 DIA.
SOLDER BUMPS
C2
B2
B
D1
D2
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM6100 Chip Scale Package
Rev. 6 | Page 4 of 6 | www.onsemi.com
SIDE
VIEW
CM6100
Vertical Structure Specification*
Vertical Structure Dimensions (nominal)
REF.
Parameter
Figure 1. Sectional View
Dimension
a
Die Thickness
Silicon
396μm
h
Repassivation
Polyimide
10μm
UBM-(Ti/Cu)
Plated Cu
5.0μm
Sputtered Cu
0.4μm
Sputtered Ti
0.1μm
d
* Daisy Chain CM6000
Material
e
UBM Wetting Area
Diameter
240μm
b
Bump Standoff
194μm
Solder Bump
Diameter after
Bump Reflow
270μm
f
c
Metal Pad Height
g
Metal Pad Diameter
1.5μm
310μm
0.406mm
D2
D1
AlSiCu
Finished Thickness
Rev. 6 | Page 5 of 6 | www.onsemi.com
0.600mm
CM6100
Mechanical Specification (cont’d)
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
CM6100
0.8 X 0.8 X 0.60
POCKET SIZE (mm) TAPE WIDTH
B0 X A0 X K0
W
0.89 x 0.91 x 0.67
+
8mm
+
REEL
DIA.
QTY
PER
REEL
P0
P1
178mm (7")
5000
4mm
4mm
+
Figure 2. Tape and Reel Mechanical Data
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the
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support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or
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unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action
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Rev. 6 | Page 6 of 6 | www.onsemi.com
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