VISHAY SS33

SS32 thru SS36
Vishay General Semiconductor
Surface Mount Schottky Barrier Rectifier
FEATURES
• Low profile package
• Ideal for automated placement
• Guardring for overvoltage protection
• Low power losses, high efficiency
• Low forward voltage drop
• High surge capability
• Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C
DO-214AB (SMC)
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
TYPICAL APPLICATIONS
For use in low voltage high frequency inverters,
freewheeling, dc-to-dc converters, and polarity
protection applications.
PRIMARY CHARACTERISTICS
IF(AV)
3.0 A
VRRM
20 V to 60 V
IFSM
100 A
EAS
20 mJ
VF
0.5 V, 0.75 V
TJ max.
125 °C, 150 °C
MECHANICAL DATA
Case: DO-214AB (SMC)
Epoxy meets UL 94V-0 flammability rating
Terminals: Matte tin plated leads, solderable per
J-STD-002 and JESD22-B102
E3 suffix for consumer grade, meets JESD 201 class
1A whisker test, HE3 suffix for high reliability grade
(AEC Q101 qualified), meets JESD 201 class 2
whisker test
Polarity: Color band denotes the cathode end
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
Device marking code
SS32
SS33
SS34
SS35
SS36
S2
S3
S4
S5
S6
UNIT
Maximum repetitive peak reverse voltage
VRRM
20
30
40
50
60
V
Maximum RMS voltage
VRMS
14
21
28
35
42
V
Maximum DC blocking voltage
VDC
20
30
40
50
60
V
Maximum average forward rectified current at TL (Fig. 1)
IF(AV)
3.0
A
Peak forward surge current 8.3 ms single half sine-wave
superimposed on rated load
IFSM
100
A
Non-repetitive avalanche energy at TA = 25 °C,
IAS = 2.0 A, L = 10 mH
EAS
20
mJ
Voltage rate of change (rated VR)
dv/dt
Operating junction temperature range
Storage temperature range
Document Number: 88751
Revision: 23-Jan-08
TJ
TSTG
10 000
- 55 to + 125
- 55 to + 150
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
V/µs
- 55 to + 150
°C
°C
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SS32 thru SS36
Vishay General Semiconductor
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
TEST CONDITIONS
Maximum instantaneous
forward voltage (1)
SYMBOL
3.0 A
SS33
VF
TA = 25 °C
TA = 100 °C
Maximum DC reverse current
at rated DC blocking voltage (1)
SS32
SS34
SS35
0.5
SS36
UNIT
0.75
V
0.5
IR
20
mA
10
Note:
(1) Pulse test: 300 µs pulse width, 1 % duty cycle
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
SS32
SS33
SS34
RθJA
RθJL
Typical thermal resistance (1)
SS35
SS36
UNIT
55
17
°C/W
Note:
(1) P.C.B. mounted 0.55 x 0.55" (14 x 14 mm) copper pad areas
ORDERING INFORMATION (Example)
PREFERRED P/N
UNIT WEIGHT (g)
PREFERRED PACKAGE CODE
BASE QUANTITY
DELIVERY MODE
0.235
57T
850
7" diameter plastic tape and reel
3500
13" diameter plastic tape and reel
SS34-E3/57T
SS34-E3/9AT
0.235
9AT
(1)
0.235
57T
850
7" diameter plastic tape and reel
SS34HE3/9AT (1)
0.235
9AT
3500
13" diameter plastic tape and reel
SS34HE3/57T
Note:
(1) Automotive grade AEC Q101 qualified
RATINGS AND CHARACTERISTICS CURVES
(TA = 25 °C unless otherwise noted)
100
3.5
Peak Forward Surge Current (A)
Average Forward Current (A)
Resistive or Inductive Load
3.0
2.5
SS32 - SS34
SS35 & SS36
2.0
1.5
1.0
P.C.B. Mounted on
0.55 x 0.55" (14 x 14 mm)
Copper Pad Areas
0.5
0
At Rated TL
8.3 ms Single Half Sine-Wave
80
60
40
20
0
50
70
90
110
130
150
170
1
10
100
Ambient Temperature (°C)
Number of Cycles at 60 Hz
Figure 1. Forward Current Derating Curve
Figure 2. Maximum Non-Repetitive Peak Forward Surge Current
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For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
Document Number: 88751
Revision: 23-Jan-08
SS32 thru SS36
Vishay General Semiconductor
1000
TJ = 125 °C
Junction Capacitance (pF)
Instantaneous Forward Current (A)
100
TJ = 150 °C
10
Pulse Width = 300 µs
1 % Duty Cycle
1
TJ = 25 °C
0.1
SS32 - SS34
SS35 & SS36
0.01
0.2
0.6
0.4
1.0
0.8
1.4
1.2
1.6
TJ = 25 °C
f = 1.0 MHz
Vsig = 50 mVp-p
SS32 - SS34
SS35 & SS36
10
0
0.1
1
10
100
Instantaneous Forward Voltage (V)
Reverse Voltage (V)
Figure 3. Typical Instantaneous Forward Characteristics
Figure 5. Typical Junction Capacitance
100
100
SS32 - SS34
SS35 & SS36
Transient Thermal Impedance (°C/W)
Instantaneous Reverse Current (mA)
100
10
TA = 125 °C
1
0.1
TA = 75 °C
0.01
TA = 25 °C
0.001
0
20
40
60
1
0.1
0.01
100
80
10
0.1
1
10
100
Percent of Rated Peak Reverse Voltage (%)
t - Pulse Duration (s)
Figure 4. Typical Reverse Current Characteristics
Figure 6. Typical Transient Thermal Impedance
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
DO-214AB (SMC)
Mounting Pad Layout
Cathode Band
0.185 (4.69)
MAX.
0.126 (3.20)
0.246 (6.22)
0.220 (5.59)
0.114 (2.90)
0.126 (3.20)
MIN.
0.280 (7.11)
0.060 (1.52)
MIN.
0.260 (6.60)
0.012 (0.305)
0.006 (0.152)
0.320 REF.
0.103 (2.62)
0.079 (2.06)
0.060 (1.52)
0.008 (0.2)
0 (0)
0.030 (0.76)
0.320 (8.13)
0.305 (7.75)
Document Number: 88751
Revision: 23-Jan-08
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
www.vishay.com
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Vishay
Disclaimer
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Document Number: 91000
Revision: 11-Mar-11
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