Amplifier, Distributed Power, 0.5 W 2.0-18.0 GHz MAAPGM0053-DIE 903217 — Preliminary Information Features ♦ ♦ ♦ ♦ 0.5 Watt Saturated Output Power Level Variable Drain Voltage (5-10V) Operation MSAG™ Process Proven Manufacturability and Reliability No Airbridges Polyimide Scratch Protection No Hydrogen Poisoning Susceptibility Description The MAAPGM0053-Die is a single stage power amplifier with onchip bias networks. This product is fully matched to 50 ohms on both the input and output. It can be used as a power amplifier stage or as a driver stage in high power applications. Fabricated using M/A-COM’s repeatable, high performance and highly reliable GaAs Multifunction Self-Aligned Gate (MSAG™) Process, each device is 100% RF tested on wafer to ensure performance compliance. M/A-COM’s MSAG™ process features robust silicon-like manufacturing processes, planar processing of ion implanted transistors, multiple implant capability enabling power, low-noise, switch and digital FETs on a single chip, and polyimide scratch protection for ease of use with automated manufacturing processes. The use of refractory metals and the absence of platinum in the gate metal formulation prevents hydrogen poisoning when employed in hermetic packaging. Primary Applications ♦ Test Equipment ♦ Electronic Warfare ♦ Radar Electrical Characteristics: TB = 40°C1, Z0 = 50Ω, VDD = 8V, IDQ ≈ 250 mA2, Pin = 22 dBm Parameter 1. 2. Symbol Typical Units Bandwidth f 2.0-18.0 GHz Output Power POUT 27.0 dBm 1 dB Compression Point P1dB 26 dB Small Signal Gain G 6 dB Input VSWR VSWR 1.5:1 Output VSWR VSWR 1.5:1 Gate Supply Current IGG 3 mA Drain Supply Current IDD 400 mA Noise Figure NF 7 dB TB = MMIC Base Temperature Adjust VGG between –2.4 and –1.5V to achieve IDQ indicated. 1 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Amplifier, Distributed Power, 0.5 W 2.0-18.0 GHz MAAPGM0053-DIE 903217 — Preliminary Information Maximum Operating Conditions 3 Parameter Symbol Absolute Maximum Units Input Power PIN 25.0 dBm Drain Supply Voltage VDD +12.0 V Gate Supply Voltage VGG -3.0 V Quiescent Drain Current (No RF, 40% Idss) IDQ 400 mA PDISS 4.0 W Junction Temperature TJ 180 °C Storage Temperature TSTG -55 to +150 °C 310 °C Quiescent DC Power Dissipated (No RF) Die Attach Temperature 3. Operation outside of these ranges may reduce product reliability. Operation at other than the typical values may result in performance outside the guaranteed limits. Recommended Operating Conditions Characteristic Symbol Min Typ Max Unit Drain Supply Voltage VDD 5.0 8.0 10.0 V Gate Supply Voltage VGG -2.4 -2.0 -1.5 V Input Power PIN 22.0 24.0 dBm 150 °C Junction Temperature TJ Thermal Resistance ΘJC MMIC Base Temperature TB 19.6 °C/W Note 4 °C 4. Maximum MMIC Base Temperature = 150°C —ΘJC* VDD * IDQ Operating Instructions This device is static sensitive. Please handle with care. To operate the device, follow these steps. 1. Apply VGG = -2 V, VDD= 0 V. 2. Ramp VDD to desired voltage, typically 8 V. 3. Adjust VGG to set IDQ. 4. Set RF input. 5. Power down sequence in reverse. Turn VGG off last. 2 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 2 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Amplifier, Distributed Power, 0.5 W 2.0-18.0 GHz MAAPGM0053-DIE 903217 — Preliminary Information 33 Power Out 0.9 9 31 Drain Current 0.8 8 29 0.7 7 27 0.6 25 0.5 23 0.4 21 0.3 19 0.2 17 0.1 15 0.0 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 5 4 VSWR Gain (dB) 6 5 4 3 3 2 2 1 0 18 1 2 Frequency (GHz) Figure 1. Output Power and Drain Current at Pin = 22 dBm and VDD = 8V. 3 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Frequency (GHz) 30 0.50 30 0.50 28 0.46 28 0.46 26 0.42 26 0.42 24 0.38 24 0.38 22 0.34 22 0.34 20 0.30 20 0.30 18 0.26 18 0.26 16 0.22 16 0.22 0.18 14 14 12 Po @ 2GHz Po @ 6GHz Po @ 10GHz Po @ 14GHz Po @ 18GHz Ids @ 2GHz Ids @ 6GHz Ids @ 10GHz Ids @ 14GHz Ids @ 18GHz 10 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Power Out (dBm) 0.14 12 0.10 10 25 0.18 Power In (dBm) 10 0.46 9 26 0.42 8 24 0.38 7 22 0.34 20 0.30 18 0.26 16 0.22 3 14 0.18 2 0.14 1 0.10 0 Po @ 2GHz Po @ 6GHz Po @ 10GHz Po @ 14GHz Po @ 18GHz Ids @ 2GHz Ids @ 6GHz Ids @ 10GHz Ids @ 14GHz Ids @ 18GHz 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 Power In (dBm) Figure 5. Output Power and Drain Current vs. Input Power at VDD = 10V. 3 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. Po @ 10GHz Po @ 14GHz Po @ 18GHz Ids @ 2GHz Ids @ 6GHz Ids @ 10GHz Ids @ 14GHz Ids @ 18GHz 0.14 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 6 Gain (dB) Drain Current (A) 0.50 28 10 Po @ 6GHz Power In (dBm) Figure 4. Output Power and Drain Current vs. Input Power at VDD = 8V. 30 12 Po @ 2GHz 0.10 10 Figure 3. Output Power and Drain Current vs. Input Power at VDD = 5V. Power Out (dBm) 4 Figure 2: Small Signal Gain and VSWR at VD=5V Drain Current (A) Power Out (dBm) Gain Input VSWR Output VSWR Drain Current (A) 2 6 10 1.0 Drain Current (A) Power Out (dBm) 35 5 4 Gain @ 2GHz Gain @ 6GHz Gain @ 10GHz Gain @ 14GHz Gain @ 18GHz 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Power Out (dBm) Figure 6. Compression Characteritics, Gain vs Power Out at VDD = 8V. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Amplifier, Distributed Power, 0.5 W 2.0-18.0 GHz MAAPGM0053-DIE 903217 — Preliminary Information Mechanical Information Chip Size: 3.000 x 2.000 x 0.075 mm (118 x 79 x 3 mils) 3.000mm 1.042mm 0.137mm 2.000mm 1.838mm VD GND:D GND:G GND:G GND:G GND:G GND:G 1.216mm OUT GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G G ND:G GND:G G ND:G G ND:G G ND:G GND:G G ND:G GND:G GND:G GND:G G ND:G IN 0.467mm GND:D GND:G GND:G VG G ND:G GND:G 0.177mm G ND:G 0 2.843mm 2.341mm 0 Figure 7. Die Layout Chip edge to bond pad dimensions are shown to the center of the bond pad. Bond Pad Dimensions Pad Size (μm) Size (mils) RF In and Out 100 x 150 4x8 DC Drain Supply Voltage VDD 150 x 150 8x6 DC Gate Supply Voltage VGG 150 x 150 4x6 4 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Amplifier, Distributed Power, 0.5 W 2.0-18.0 GHz MAAPGM0053-DIE 903217 — Preliminary Information Assembly and Bonding Diagram VDD 0.1 μF 100 pF VD GND:D GN D:G GN D:G GND:G GN D:G RFOUT GND:G OUT GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND :G GND:G GND:G RFIN GND:G GND:G GND:G G ND:G GND:G GND:G IN GND:D GN D:G G ND:G VG GN D:G GND:G GND:G VGG 100 pF 0.1 μF Figure 6. Recommended bonding diagram for pedestal mount. Support circuitry typical of MMIC characterization fixture for CW testing. Assembly Instructions: Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 300 °C to less than 5 minutes. Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply negative bias to VGG before applying positive bias to VDD to prevent damage to amplifier. 5 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.