XTR108-DIE www.ti.com SBOS615 – JUNE 2012 TWO-WIRE TRANSMITTER "SMART" PROGRAMMABLE WITH SIGNAL CONDITIONING FEATURES 1 • • • • • Complete Transmitter + RTD Linearization Two-Wire Output Eliminates Potentiometers and Trimming Digitally Calibrated Serial SPI Bus Interface APPLICATIONS • • • • • • Remote RTD Transmitters Pressure Bridge Transmitters Strain Gate Transmitters SCADA Remote Data Acquisition Weighing Systems Industrial Process Control DESCRIPTION The XTR108 is a “smart” programmable, two-wire transmitter designed for temperature and bridge sensors. Zero, span, and linearization errors in the analog signal path can be calibrated via a standard digital serial interface, eliminating manual trimming. Non-volatile external EEPROM stores calibration settings. The all-analog signal path contains an input multiplexer, autozeroed programmable-gain instrumentation amplifier, dual programmable current sources, linearization circuit, voltage reference, sub-regulator, internal oscillator, control logic, and an output current amplifier. Programmable level shifting compensates for sensor DC offsets. Selectable up- and down-scale output indicates out-of-range and burnout per NAMUR NE43. Automatic reset is initiated when supply is lost. Current sources, steered through the multiplexer, can be used to directly excite RTD temperature sensors, pressure bridges, or other transducers. An uncommitted operational amplifier can be used to convert current into a voltage. ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE (2) XTR108 TD Bare die in waffle pack ORDERABLE PART NUMBER PACKAGE QUANTITY XTR108TDD1 130 XTR108TDD2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated XTR108-DIE SBOS615 – JUNE 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION 2 DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 15.5 mils. Silicon with backgrind Floating Ti/AlSiCu/TiN 800 nm Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated XTR108-DIE www.ti.com SBOS615 – JUNE 2012 Table 1. Bond Pad Coordinates in Microns (1) (1) DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX V/I-0 1 643.35 2732.35 741.35 2830.35 V/I-1 2 447.05 2732.35 545.05 2830.35 V/I-2 3 259.85 2732.35 357.85 2830.35 V/I-3 4 7.8 2430.35 105.8 2528.35 V/I-4 5 7.8 2247.2 105.8 2345.2 V/I-5 6 7.8 2045.55 105.8 2143.55 CFILTER 7 7.8 1760.25 105.8 1858.25 RLIN 8 7.8 879.7 105.8 977.7 VO 9 7.8 625.35 105.8 791.85 IIN 10 7.8 327.4 105.8 493.9 IO 11 333.7 7.65 431.7 105.65 IRET 12 516.7 7.65 614.7 105.65 IRET 13 743.5 7.65 841.5 105.65 IRET 14 971.7 7.65 1069.7 105.65 VS 15 1154.7 7.65 1252.7 105.65 VS 16 1382.9 7.65 1480.9 105.65 VGATE 17 1565.9 7.65 1663.9 105.65 CS2 18 1835.6 281 1933.6 379 SDIO 19 1835.6 547.35 1933.6 645.35 SCLK 20 1835.6 782.9 1933.6 880.9 CS1 21 1835.6 1035 1933.6 1133 RSET 22 1835.6 1543.5 1933.6 1641.5 REFIN 23 1835.6 1749.75 1933.6 1847.75 REFOUT 24 1835.6 1976.25 1933.6 2074.25 OPA OUT 25 1835.6 2457.25 1933.6 2555.25 OPA -IN 26 1451.8 2732.35 1549.8 2830.35 OPA +IN 27 1268.8 2732.35 1366.8 2830.35 Substrate is N/C. Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 3 PACKAGE OPTION ADDENDUM www.ti.com 7-Apr-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) XTR108TDD1 PREVIEW 0 130 TBD Call TI N / A for Pkg Type XTR108TDD2 PREVIEW 0 10 TBD Call TI N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. 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