RI-I11-112A-03, RI-I11-112B-03 www.ti.com SCBS824A – DECEMBER 2002 – REVISED APRIL 2010 Tag-it™ HF-I PLUS TRANSPONDER INLAYS SQUARE Check for Samples: RI-I11-112A-03, RI-I11-112B-03 FEATURES 1 • 2 • • • • • • ISO/IEC 15693-2, -3; ISO/IEC 18000-3 Compliant 13.56-MHz Operating Frequency 2048-Bit User Memory in 64-Bit × 32-Bit Blocks User and Factory Lock Per Block Application Family Identifier (AFI) Data Storage Format Identifier (DSFID) Combined Inventory Read Block APPLICATIONS • • • • • Product Authentication Library Supply-Chain Management Asset Management Ticketing/Stored Value DESCRIPTION Texas Instruments Tag-it™ HF-I plus transponder inlays consist of 13.56-MHz high-frequency (HF) transponders that are compliant with the ISO/IEC 15693 and ISO/IEC 18000-3 global open standards. These products offer a user-accessible memory of 2048 bits, organized in 64 blocks, and an extensive command set available in six different antenna shapes, with frequency offset for integration into paper, PVC, or other substrates. The Tag-it HF-I plus transponder inlays are manufactured with TI’s patented laser tuning process to provide consistent read performance. Prior to delivery, the transponders undergo complete functional and parametric testing in order to provide the high quality that customers have come to expect from TI. The Tag-it HF-I plus transponder inlays are well suited for a variety of applications including, but not limited to, product authentication, library, supply-chain management, asset management, and ticketing/stored value applications. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Tag-it is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2002–2010, Texas Instruments Incorporated RI-I11-112A-03, RI-I11-112B-03 SCBS824A – DECEMBER 2002 – REVISED APRIL 2010 www.ti.com Table 1. SPECIFICATIONS (1) PART NUMBER RI-I11-112A-03 Supported standard RI-I11-112B-03 ISO/IEC 15693-2, -3; ISO/IEC 18000-3 Recommended operating frequency 13.56 MHz 13.86 MHz ± 200 kHz (includes frequency offset to compensate further integration into paper) 14.4 MHz ± 200 kHz (includes frequency offset to compensate PVC lamination) Typical required activation field strength to read (at 25°C) 98 dBmA/m (2) 98 dBmA/m (3) Typical required activation field strength to write (at 25°C) 101 dBmA/m (2) 101 dBmA/m (3) Passive resonance frequency (at 25°C) Factory-programmed read-only number Memory (user programmable) 64 bits 2k bits organized in 64-bit × 32-bit blocks Typical programming cycles (at 25°C) Data retention time (at 55°C) Simultaneous identification of tags Antenna size 100,000 >10 years Up to 50 tags per second (reader/antenna dependent) 45 mm × 45 mm (~1.77 in × ~1.77 in) Foil width 48 mm ± 0.5 mm (1.89 in ± 0.02 in) Foil pitch 50.8 mm +0.1 mm/–0.4 mm (2 in) Thickness Chip area: 0.34 mm ±0.02 Antenna area (Al both sides): 0.085 mm ±0.01 Antenna area (Al one side): 0.075 mm ±0.008 Base material Smallest bending radius allowed Operating temperature Storage temperature (single inlay) Storage temperature (on reel) Delivery Substrate: PET (polyethylenetherephtalate); Antenna: aluminum 18 mm (~0.71 in) –25°C to 70°C –40°C to 85°C (warpage may occur at upper temperature range) –40°C to 40°C Single-row tape wound on cardboard reel with 500-mm diameter Reel outer width: approximately 60 mm (~2.36 in) Reel inner width: approximately 50 mm (~1.97 in) Hub diameter: 76.2 mm (3 in) Typical quantity of good units per reel (1) (2) (3) 2 5,000 For highest possible read-out coverage, operate readers at a modulation depth of 20% or higher. After integration into paper After PVC lamination Submit Documentation Feedback Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): RI-I11-112A-03 RI-I11-112B-03 RI-I11-112A-03, RI-I11-112B-03 www.ti.com SCBS824A – DECEMBER 2002 – REVISED APRIL 2010 Table 2. SUPPORTED COMMAND SET REQUEST MODE (1) REQUEST REQUEST CODE ADDRESSED NONADDRESSED SELECT AFI OPT. FLAG ü – – – ü 0 INVENTORY ISO 15693 Mandatory and Optional Commands Inventory 0x01 Stay Quiet 0x02 – ü – – – 0 Read_Single_Block 0x20 ü ü ü ü ü 0/1 Write_Single_Block 0x21 – ü ü ü – 1 Lock_Block 0x22 – ü ü ü – 1 Read_Multi_Blocks 0x23 ü ü ü ü ü 0/1 Select Tag 0x25 – ü – – – 0 Reset to Ready 0x26 – ü ü ü – 0 Write_AFI 0x27 – ü ü ü – 1 Lock_AFI 0x28 – ü ü ü – 1 Write DSFID 0x29 – ü ü ü – 1 Lock DSFID 0x2A – ü ü ü – 1 Get_System_info 0x2B ü ü ü ü ü 0 Get_M_BLK_Sec_St 0x2C ü ü ü ü ü 0 Write_2_Blocks 0xA2 – ü ü ü – 1 Lock_2_Blocks 0xA3 – ü ü ü – 1 TI Custom Commands (1) ü = Implemented, – = Not applicable MEMORY ORGANIZATION 32 bits Lock Bits F = Factory Lock, U = User Lock F U Block # 1 2 3 User data (2048 bits) 62 63 64 X DSFID UID Number (64 bits) Application Configuration AFI IC Version Factory programmed Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): RI-I11-112A-03 RI-I11-112B-03 Submit Documentation Feedback 3 PACKAGE OPTION ADDENDUM www.ti.com 2-Apr-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty 5000 RI-I11-112A-03 ACTIVE RFIDN TFB 0 RI-I11-112A-30 OBSOLETE RFIDN TFB 0 RI-I11-112B-03 ACTIVE RFIDN TFB 0 5000 Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) Pb-Free (RoHS) Call TI N / A for Pkg Type TBD Call TI Call TI Pb-Free (RoHS) Call TI N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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