RF-HDT-DVBE SCBS858C – FEBRUARY 2007 – REVISED SEPTEMBER 2011 www.ti.com 13.56-MHz ENCAPSULATED STANDARD TRANSPONDER Check for Samples: RF-HDT-DVBE FEATURES APPLICATIONS • • • • • • • • • • 1 ISO/IEC 15693-2,-3; ISO/IEC 18000-3 Compliant 13.56-MHz Operating Frequency 256-Bit User Memory in 8 × 32-Bit Blocks User and Factory Lock Per Block Application Family Identifier (AFI) Fast Simultaneous Identification (Anti-Collision) Laundry Process Automation Product Authentication Asset Management DESCRIPTION Texas Instruments’ 13.56-MHz encapsulated standard transponder is compliant with the ISO/IEC 15693 and ISO/IEC 18000-3 global open standards. This product offers a user accessible memory of 256 bits, organized in 8 blocks, and an optimized command set. Designed for harsh environments, such as garment tracking in laundries, each transponder has a 64-bit factory programmed Read Only Number, which is also laser engraved on the transponder housing. Prior to delivery, transponders undergo complete functional and parametric testing to provide the high quality that customers have come to expect from TI. The 13.56-MHz encapsulated standard transponders are well suited for a variety of applications including, but not limited to, laundry garment tracking, process automation, product authentication, and asset management. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007–2011, Texas Instruments Incorporated RF-HDT-DVBE SCBS858C – FEBRUARY 2007 – REVISED SEPTEMBER 2011 www.ti.com Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) UNIT Operating temperature –25 to 90 °C Storage temperature –40 to 120 (130°C for total 50 hours, 220°C for total 30 s) °C Operating Characteristics over operating free-air temperature range (unless otherwise noted) RF-HDT-DVBE (1) PARAMETER Supported standard ISO/IEC 15693-2,-3; ISO/IEC 18000-3 Resonance frequency (at 25°C) 13.56 MHz ± 300 kHz UNIT Typ. required activation field strength to read (at 25°C) 112 dBμA/m Typ. required activation field strength to write (at 25°C) 115 dBμA/m Factory programmed read only number 64 Memory (user programmable) 256 bits organized in 8 × 32-bit blocks Typical programming cycles (at 25°C) 100,000 Data retention time (at 25°C) > 10 years Simultaneous identification of tags Up to 50 tags per second (reader/antenna dependent) Dimensions ø 22 ± 0.2 mm × 3 ± 0.2 mm Weight 2.1 ± 0.2 Case material PPS, black Protection class IP 68 Vibration ISO/IEC 68.2.6 (10 g, 10 to 2000 Hz, 3 axis, 2.5 h) Mechanical shock ISO/IEC 68.2.27 (100 g, 6 ms, 6 axis, 20 times per axis) Mechanical stability Axial compression strength: 1000N (10 s, static) Radial compression strength: 500N (10 s, static) Isostatic water pressure: 45 bar (10 h) Chemical resistance Typical chemicals used in laundry and dry-cleaning processes Delivery 1000 units in bulk (1) bits grams For highest possible read-out coverage, TI recommends operating readers at a modulation depth of 20% or higher. Supported Command Set REQUEST MODE (1) REQUEST (2) ADDRESSED NONADDRESSED AFI OPTIONAL FLAG ✓ - - ✓ 0/- - ✓ - - 0/- 0x20 - ✓ ✓ - -/1 Write_Single_Block 0x21 - ✓ ✓ - -/1 Lock_Block 0x22 - ✓ ✓ - -/1 REQUEST CODE INVENTORY Inventory 0x01 Stay Quiet 0x02 Read_Single_Block ISO 15693 Mandatory and Optional Commands (1) (2) 2 ✓: Implemented -: Not applicable Submit Documentation Feedback Copyright © 2007–2011, Texas Instruments Incorporated Product Folder Link(s): RF-HDT-DVBE RF-HDT-DVBE SCBS858C – FEBRUARY 2007 – REVISED SEPTEMBER 2011 www.ti.com Memory Organization Block Addr 0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 32 bits Lock Bits U U = User Lock User data (256 bits) 0x08 0x09 UID Number (64 bits) 0x0A AFI Submit Documentation Feedback Copyright © 2007–2011, Texas Instruments Incorporated Product Folder Link(s): RF-HDT-DVBE 3 PACKAGE OPTION ADDENDUM www.ti.com 7-Sep-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins RF-HDT-DVBE-N0 OBSOLETE RFIDP TEC 0 RF-HDT-DVBE-N2 ACTIVE RFIDP TEC 0 Package Qty 1000 Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TBD Call TI Call TI Pb-Free (RoHS) Call TI N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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