WINSEMI WFU730

U730
WF
WFU
Silicon N-Channel MOSFET
Features
■5.5A,400V, RDS(on)(Max 1.0Ω)@VGS=10V
■ Ultra-low Gate Charge(Typical 32nC)
■ Fast Switching Capability
■ 100%Avalanche Tested
■ Maximum Junction Temperature Range(150℃)
General Description
This Power MOSFET is produced using Winsemi ’s advanced
planar stripe, DMOS technology. This latest technology has been
especially designed to minimize on-state resistance, have a high
rugged avalanche characteristics. This devices is specially well
suited for high efficiency switch model power supplies, power factor
correction and half bridge and full bridge resonant topology line a
IPAK
electronic lamp ballast.
Absolute Maximum Ratings
Symbol
VDSS
Value
Units
Drain Source Voltage
Parameter
400
V
Continuous Drain Current(@Tc=25℃)
5.5
A
Continuous Drain Current(@Tc=100℃)
2.9
A
22
A
±30
V
330
mJ
ID
IDM
Drain Current Pulsed
(Note1)
VGS
Gate to Source Voltage
EAS
Single Pulsed Avalanche Energy
EAR
Repetitive Avalanche Energy
(Note 1)
7.4
mJ
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
4
V/ns
48
W
0.38
W/℃
-55~150
℃
300
℃
(Note 2)
Total Power Dissipation(@Tc=25℃)
PD
Derating Factor above 25℃
TJ, Tstg
TL
Junction and Storage Temperature
Channel Temperature
Thermal Characteristics
Symbol
Parameter
Value
Min
Typ
Max
Units
RQJC
Thermal Resistance, Junction-to-Case
-
-
2.6
℃/W
RQJA
Thermal Resistance, Junction-to-Ambient*
-
-
50
℃/W
RQJA
Thermal Resistance, Junction-to-Ambient
-
-
110
℃/W
*When mounted on the minimum pad size recommended(PCB Mount)
Rev.A Nov.2010
Copyright@Winsemi Microelectronics Co., Ltd., All right reserved.
U730
WF
WFU
Electrical Characteristics (Tc = 25°C)
Characteristics
Gate leakage current
Gate−source breakdown voltage
Drain cut−off current
Drain−source
Symbol
Test Condition
Min
Type
Max
Unit
IGSS
VGS = ±30 V, VDS = 0 V
-
-
±100
nA
V(BR)GSS
IG = ±10 μA, VDS = 0 V
±30
-
-
V
IDSS
VDS = 400 V, VGS = 0 V
-
-
1
μA
400
-
-
V
-
0.4
-
V/℃
breakdown
ID = 250 μA, VGS = 0 V
V(BR)DSS
voltage
Break Voltage Temperature
Coefficient
ΔBVDSS/
ΔTJ
ID=250μA,
Referenced
to
25℃
Gate threshold voltage
VGS(th)
VDS = 10 V, ID =250 μA
2
-
4
V
Drain−source ON resistance
RDS(ON)
VGS = 10 V, ID = 2.75A
-
0.83
1
Ω
Forward Transconductance
gfs
VDS = 50 V, ID = 2.75A
-
4.5
-
S
Input capacitance
Ciss
VDS = 25 V,
-
550
720
Reverse transfer capacitance
Crss
VGS = 0 V,
-
23
30
Output capacitance
Coss
f = 1 MHz
-
85
110
VDD =200 V,
-
15
40
ton
ID =5.5A
-
55
120
tf
RG=25Ω
-
85
180
-
50
110
-
32
38
-
4.3
5.7
-
14
22
Rise time
Turn−on time
tr
Switching time
pF
ns
Fall time
Turn−off time
(Note4,5)
toff
Total gate charge (gate−source
VDD = 320 V,
Qg
plus gate−drain)
VGS = 10 V,
nC
Gate−source charge
Qgs
Gate−drain (“miller”) Charge
Qgd
ID =5.5 A
(Note4,5)
Source−Drain Ratings and Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Type
Max
Unit
Continuous drain reverse current
IDR
-
-
-
5.5
A
Pulse drain reverse current
IDRP
-
-
-
22
A
Forward voltage (diode)
VDSF
IDR = 5.5 A, VGS = 0 V
-
1.4
1.5
V
Reverse recovery time
trr
IDR = 5.5 A, VGS = 0 V,
-
265
530
ns
Reverse recovery charge
Qrr
dIDR / dt = 100 A / μs
-
2.32
-
μC
Note 1.Repeativity rating :pulse width limited by junction temperature
2.L=18.5mH,IAS=5.5A,VDD=50V,RG=25Ω,Starting TJ=25℃
3.ISD≤5.5A,di/dt≤300A/us, VDD<BVDSS,STARTING TJ=25℃
4.Pulse Test: Pulse Width≤300us,Duty Cycle≤2%
5.Essentially independent of operating temperature.
This transistor is an electrostatic sensitive device
Please handle with caution
2/7
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U730
WF
WFU
3/7
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U730
WF
WFU
4/7
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U730
WF
WFU
Fig.10 Gate Test Circuit & Waveform
Fig.11 Resistive Switching Test Circuit & Waveform
Fig.12 Unclamped Inductive Switching Test Circuit & Waveform
5/7
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U730
WF
WFU
Fig.13 Peak Diode Recovery dv/dt Test Circuit & Waveform
6/7
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U730
WF
WFU
51 Package Dimension
TO-2
TO-251
Unit: mm
7/7
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