PRELIMINARY W219B Frequency Generator for Integrated Core Logic with 133-MHz FSB Features Table 1. Frequency Selections PCI APIC SS 113.0 75.3 37.6 18.8 OFF 95.0 95.0 63.3 31.6 15.8 –0.6% 129.0 129.0 86.0 43.0 21.5 OFF 150.0 113.0 75.3 37.6 18.8 OFF 0 150.0 150.0 75.0 37.5 18.7 OFF 0 1 110.0 110.0 73.0 36.6 18.3 OFF 1 1 0 140.0 140.0 70.0 35.0 17.5 OFF 0 1 1 1 144.0 108.0 72.0 36.0 18.0 OFF 0 1 0 0 0 68.3 102.5 68.3 34.1 17.0 OFF 0 1 0 0 1 105.0 105.0 70.0 35.0 17.5 OFF 0 1 0 1 0 138.0 138.0 69.0 34.5 17.0 OFF 0 1 0 1 1 140.0 105.0 70.0 35.0 17.5 OFF 0 1 1 0 0 66.8 100.2 66.8 33.4 16.7 ±0.45% 0 1 1 0 1 100.2 100.2 66.8 33.4 16.7 ±0.45% 0 1 1 1 0 133.6 133.6 66.8 33.4 16.7 ±0.45% 0 1 1 1 1 133.6 100.2 66.8 33.4 16.7 ±0.45% 1 0 0 0 0 157.3 118.0 78.6 39.3 19.6 OFF Key Specifications 1 0 0 0 1 160.0 120.0 80.0 40.0 20.0 OFF 1 0 0 1 0 146.6 110.0 73.3 36.6 18.3 OFF CPU, SDRAM Outputs Cycle-to-Cycle Jitter: ............. 250 ps 1 0 0 1 1 122.0 91.5 61.0 30.5 15.2 –0.6% 1 0 1 0 0 127.0 127.0 84.6 42.3 21.1 OFF 1 0 1 0 1 122.0 122.0 81.3 40.6 20.3 –0.6% • Maximized EMI suppression using Cypress’s Spread Spectrum technology • Low jitter and tightly controlled clock skew • Highly integrated device providing clocks required for CPU, core logic, and SDRAM • Two copies of CPU clock • Nine copies of SDRAM clock • Seven copies of PCI clock • One copy of synchronous APIC clock • Three copies of 66-MHz outputs • Two copies of 48-MHz outputs • One copy of selectable 24- or 48-MHz clock • One copy of double strength 14.31818-MHz reference clock • Power-down control • SMBus interface for turning off unused clocks APIC, 48-MHz, 3V66, PCI Outputs Cycle-to-Cycle Jitter:................................................... 500 ps FS4 FS3 FS2 FS1 FS0 0 0 0 0 0 0 0 0 0 1 0 0 0 1 0 0 0 0 1 1 0 0 1 0 0 0 1 0 0 0 CPU SDRAM 3V66 75.3 1 0 1 1 0 117.0 117.0 78.0 39.0 19.5 OFF CPU, 3V66 Output Skew: ........................................... 175 ps 1 0 1 1 1 114.0 114.0 76.0 38.0 19.0 OFF SDRAM, APIC, 48-MHz Output Skew: ....................... 250 ps 1 1 0 0 0 80.0 120.0 80.0 40.0 20.0 OFF 1 1 0 0 1 78.0 117.0 78.0 39.0 19.5 OFF 1 1 0 1 0 166.0 124.5 83.0 41.5 20.7 OFF CPU to SDRAM Skew (@ 133 MHz) ....................... ± 0.5 ns 1 1 0 1 1 133.6 133.6 89.0 44.5 22.2 OFF CPU to SDRAM Skew (@ 100 MHz) ................. 4.5 to 5.5 ns 1 1 1 0 0 66.6 100.0 66.6 33.3 16.6 –0.6% 1 1 1 0 1 100.0 100.0 66.6 33.3 16.6 –0.6% 1 1 1 1 0 133.3 133.3 66.6 33.3 16.6 –0.6% 1 1 1 1 1 133.3 100.0 66.6 33.3 16.6 –0.6% PCI Output Skew: ....................................................... 500 ps CPU to 3V66 Skew (@ 66 MHz)........................ 7.0 to 8.0 ns 3V66 to PCI Skew (3V66 lead) .......................... 1.5 to 3.5 ns PCI to APIC Skew..................................................... ± 0.5 ns VDDQ3 Block Diagram X1 X2 REF2X/FS3* XTAL OSC PLL REF FREQ VDDQ2 SDATA SCLK SMBus Logic 2 APIC VDDQ3 2 PLL 1 3V66_0:2 PCI0/FS0* PCI1/FS1* PCI2/FS2* 5 PCI3:6 SDRAM0:8 PWR_DWN# 9 VDDQ3 48MHz_0 PLL2 48MHz_1/FS4* SI0/24_48#MHz* /2 Cypress Semiconductor Corporation Document #: 38-07220 Rev. *A • 3901 North First Street REF2x/FS3* VDDQ3 X1 X2 GND VDDQ3 3V66_0 3V66_1 3V66_2 GND FS0*/PCI0 FS1*/PCI1 FS2*/PCI2 GND PCI3 PCI4 VDDQ3 PCI5 PCI6 GND 48MHz_0 FS4*/48MHz_1 SI0/24_48#MHz* VDDQ3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 W219B (FS0:4*) CPU0:1 Divider, Delay, and Phase Control Logic Pin Configuration [1] 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VDDQ2 APIC VDDQ2 CPU0 CPU1 GND VDDQ3 SDRAM0 SDRAM1 SDRAM2 GND SDRAM3 SDRAM4 SDRAM5 VDDQ3 SDRAM6 SDRAM7 SDRAM8 GND PWR_DWN#^ SCLK VDDQ3 GND SDATA Note: 1. Internal 250K pull-down or pull up resistors present on inputs marked with * or ^ respectively. Design should not rely solely on internal pull-up or pull down resistor to set I/O pins HIGH or LOW respectively. • San Jose • CA 95134 • 408-943-2600 Revised December 21,2002 PRELIMINARY W219B I Pin Definitions Pin No. Pin Type REF2x/FS3 1 I/O Reference Clock with 2x Drive/Frequency Select 3: 3.3V 14.318-MHz clock output. This pin also serves as the select strap to determine device operating frequency as described in Table 1. X1 3 I Crystal Input: This pin has dual functions. It can be used as an external 14.318MHz crystal connection or as an external reference frequency input. X2 4 I Crystal Output: An input connection for an external 14.318-MHz crystal connection. If using an external reference, this pin must be left unconnected. PCI0/FS0 11 I/O PCI Clock 0/Frequency Selection 0: 3.3V 33-MHz PCI clock outputs. This pin also serves as the select strap to determine device operating frequency as described in Table 1. PCI1/FS1 12 I/O PCI Clock 1/Frequency Selection 1: 3.3V 33-MHz PCI clock outputs. This pin also serves as the select strap to determine device operating frequency as described in Table 1. PCI2/FS2 13 I/O PCI Clock 2/Frequency Selection 2: 3.3V 33-MHz PCI clock outputs. This pin also serves as the select strap to determine device operating frequency as described in Table 1. 15, 16, 18, 19 O PCI Clock 3 through 6: 3.3V 33-MHz PCI clock outputs. PCI0:6 can be individually turned off via SMBus interface. 3V66_0:2 7, 8, 9 O 66-MHz Clock Output: 3.3V output clocks. The operating frequency is controlled by FS0:4 (see Table 1). 48MHz_0 21 O 48-MHz Clock Output: 3.3V fixed 48-MHz, non-spread spectrum clock output. 48MHz_1/ FS4 22 I/O 48-MHz Clock Output/Frequency Selection 4: 3.3V fixed 48-MHz, non-spread spectrum clock output. This pin also serves as the select strap to determine device operating frequency as described in Table 1. SIO/ 24_48#MHz 23 I/O Clock Output for Super I/O: This is the input clock for a Super I/O (SIO) device. During power-up, it also serves as a selection strap. If it is sampled HIGH, the output frequency for SIO is 24 MHz. If the input is sampled LOW, the output is 48 MHz. PWR_DWN# 29 I Power Down Control: LVTTL-compatible input that places the device in powerdown mode when held LOW. 45, 44 O CPU Clock Outputs: Clock outputs for the host bus interface. Output frequencies depending on the configuration of FS0:4. Voltage swing is set by VDDQ2. 41, 40, 39, 37, 36, 35, 33, 32, 31 O SDRAM Clock Outputs: 3.3V outputs for SDRAM. The operating frequency is controlled by FS0:4 (see Table 1). APIC 47 O Synchronous APIC Clock Outputs: Clock outputs running synchronous with the PCI clock outputs. Voltage swing set by VDDQ2. SDATA 25 I/O Data pin for SMBus circuitry. SCLK 28 I Clock pin for SMBus circuitry. VDDQ3 2, 6, 17, 24, 27, 34, 42 P 3.3V Power Connection: Power supply for SDRAM output buffers, PCI output buffers, reference output buffers and 48-MHz output buffers. Connect to 3.3V. VDDQ2 46, 48 P 2.5V Power Connection: Power supply for IOAPIC and CPU output buffers. Connect to 2.5V or 3.3V. 5, 10, 14, 20, 26, 30, 38, 43, G Ground Connections: Connect all ground pins to the common system ground plane. Pin Name PCI3:6 CPU0:1 SDRAM0:8 GND Document #: 38-07220 Rev. *A Pin Description Page 2 of 15 PRELIMINARY W219B Output Strapping Resistor Series Termination Resistor Clock Load W219B Power-on Reset Timer Output Buffer Hold Output Low Output Three-state Q 10kΩ D Data Latch Figure 1. Input Logic Selection Through Resistor Load Option Overview The W219B is a highly integrated frequency timing generator, supplying all the required clock sources for an Intel® architecture platform using graphics integrated core logic. Functional Description Offsets Among Clock Signal Groups I/O Pin Operation Pin # 1, 11, 12, 13, 22, and 23 are dual-purpose l/O pins. Upon power-up the pin acts as a logic input. An external 10-kΩ strapping resistor should be used. Figure 1 shows a suggested method for strapping resistor connections. After 2 ms, the pin becomes an output. Assuming the power supply has stabilized by then, the specified output frequency 10 ns 0 ns 20 ns Figure 2 and Figure 3 represent the phase relationship among the different groups of clock outputs from W219B when it is providing a 66-MHz CPU clock and a 100-MHz CPU clock, respectively. It should be noted that when CPU clock is operating at 100 MHz, CPU clock output is 180 degrees out of phase with SDRAM clock outputs. 30 ns 40 ns CPU 66 Period CPU 66-MHz SDRAM 100-MHz 3V66 66-MHz is delivered on the pins. If the power supply has not yet reached full value, output frequency initially may be below target but will increase to target once supply voltage has stabilized. In either case, a short output clock cycle may be produced from the CPU clock outputs when the outputs are enabled. SDRAM 100 Period Hub-PC PCI 33-MHz REF 14.318-MHz USB 48-MHz APIC Figure 2. Group Offset Waveforms (66.8 CPU Clock, 100.2 SDRAM Clock) Document #: 38-07220 Rev. *A Page 3 of 15 PRELIMINARY 0 ns 10 ns W219B 20 ns 30 ns 40 ns CPU 100 Period CPU 100-MHz SDRAM 100 Period SDRAM 100-MHz 3V66 66-MHz Hub-PC PCI 33-MHz REF 14.318-MHz USB 48-MHz APIC Figure 3. Group Offset Waveforms (100.2 CPU Clock, 100.2 SDRAM Clock) Power-Down Control W219B provides one PWRDWN# signal to place the device in low-power mode. In low-power mode, the PLLs are turned off and all clock outputs are driven LOW. 0 ns 25 ns 50 ns 75 ns Center 1 2 VCO Internal CPU 100MHz 3V66 66MHz APIC 33MHz PCI 33MHz PwrDwn SDRAM 100MHz REF 14.318MHz USB 48MHz Figure 4. PWRDWN# Timing Diagram[2, 3, 4, 5] Notes: 2. Once the PWRDWN# signal is sampled LOW for two consecutive rising edges of CPU, clocks of interest will be held LOW on the next HIGH-to-LOW transition. 3. PWRDWN# is an asynchronous input and metastable conditions could exist. This signal is synchronized inside W219B. 4. The shaded sections on the SDRAM, REF, and USB clocks indicate “Don’t Care” states. 5. Diagrams shown with respect to 100 MHz. Similar operation when CPU is 66 MHz. Document #: 38-07220 Rev. *A Page 4 of 15 PRELIMINARY W219B Spread Spectrum Frequency Timing Generator Where P is the percentage of deviation and F is the frequency in MHz where the reduction is measured. The device generates a clock that is frequency modulated in order to increase the bandwidth that it occupies. By increasing the bandwidth of the fundamental and its harmonics, the amplitudes of the radiated electromagnetic emissions are reduced. This effect is depicted in Figure 5. The output clock is modulated with a waveform depicted in Figure 6. This waveform, as discussed in “Spread Spectrum Clock Generation for the Reduction of Radiated Emissions” by Bush, Fessler, and Hardin produces the maximum reduction in the amplitude of radiated electromagnetic emissions. The deviation selected for this chip is ±0.45% or –0.6% of the selected frequency. Figure 6 details the Cypress spreading pattern. Cypress does offer options with more spread and greater EMI reduction. Contact your local Sales representative for details on these devices. As shown in Figure 5, a harmonic of a modulated clock has a much lower amplitude than that of an unmodulated signal. The reduction in amplitude is dependent on the harmonic number and the frequency deviation or spread. The equation for the reduction is: dB = 6.5 + 9*log10(P) + 9*log10(F) SSFTG EMI Reduction Amplitude (dB) Amplitude (dB) Typical Clock Spread Spectrum Enabled NonSpread Spectrum Frequency Span (MHz) Center Spread Frequency Span (MHz) Down Spread Figure 5. Clock Harmonic with and without SSCG Modulation Frequency Domain Representation 100% 90% 80% 70% 60% 50% 40% 30% 20% 10% 100% 90% 80% 70% 60% 50% 40% 30% 20% 10% FREQUENCY MAX. MIN. Figure 6. Typical Modulation Profile Document #: 38-07220 Rev. *A Page 5 of 15 PRELIMINARY W219B 1 bit 7 bits 1 1 8 bits 1 Start bit Slave Address R/W Ack Command Code Ack Ack Data Byte 1 Ack Data Byte 2 Ack 1 bit 8 bits 1 8 bits 1 ... Byte Count = N Data Byte N Ack Stop 8 bits 1 1 Figure 7. An Example of a Block Write[6] Serial Data Interface The W219B features a two-pin, serial data interface that can be used to configure internal register settings that control particular device functions. Data Protocol The clock driver serial protocol accepts only block writes from the controller. The bytes must be accessed in sequential order from lowest to highest byte with the ability to stop after any complete byte has been transferred. Indexed bytes are not allowed. A block write begins with a slave address and a write condition. After the command code the core logic issues a byte count which describes how many more bytes will follow in the message. If the host had 20 bytes to send, the first byte would be the number 20 (14h), followed by the 20 bytes of data. The byte count may not be 0. A block write command is allowed to transfer a maximum of 32 data bytes. The slave receiver address for W219B is 11010010. Figure 7 shows an example of a block write. The command code and the byte count bytes are required as the first two bytes of any transfer. W219B expects a command code of 0000 0000. The byte count byte is the number of additional bytes required for the transfer, not counting the command code and byte count bytes. Additionally, the byte count byte is required to be a minimum of 1 byte and a maximum of 32 bytes to satisfy the above requirement. Table 2 shows an example of a possible byte count value. A transfer is considered valid after the acknowledge bit corresponding to the byte count is read by the controller. The command code and byte count bytes are ignored by the W219B. However, these bytes must be included in the data write sequence to maintain proper byte allocation. Table 2. Example of Possible Byte Count Value Byte Count Byte Notes MSB LSB 0000 0000 Not allowed. Must have at least one byte. 0000 0001 Data for functional and frequency select register (currently byte 0 in spec) 0000 0010 Reads first two bytes of data. (byte 0 then byte1) 0000 0011 Reads first three bytes (byte 0, 1, 2 in order) 0000 0100 Reads first four bytes (byte 0, 1, 2, 3 in order) 0000 0101 Reads first five bytes (byte 0, 1, 2, 3, 4 in order)[7] 0000 0110 Reads first six bytes (byte 0, 1, 2, 3, 4, 5 in order)[7] 0000 0111 Reads first seven bytes (byte 0, 1, 2, 3, 4, 5, 6 in order) 0010 0000 Max. byte count supported = 32 Table 3. Serial Data Interface Control Functions Summary Control Function Description Common Application Output Disable Any individual clock output(s) can be disabled. Disabled outputs are actively held LOW. Unused outputs are disabled to reduce EMI and system power. Examples are clock outputs to unused PCI slots. (Reserved) Reserved function for future device revision or pro- No user application. Register bit must be written as 0. duction device testing. Notes: 6. The acknowledgment bit is returned by the slave/receiver (W219B). 7. Bytes 6 and 7 are not defined for W219B. Document #: 38-07220 Rev. *A Page 6 of 15 PRELIMINARY W219B Serial Configuration Map 2. All unused register bits (reserved and N/A) should be written to a “0” level. 1. The serial bits will be read by the clock driver in the following order: 3. All register bits labeled “Initialize to 0" must be written to zero during initialization. Failure to do so may result in higher than normal operating current. The controller will read back the written value. Byte 0 - Bits 7, 6, 5, 4, 3, 2, 1, 0 Byte 1 - Bits 7, 6, 5, 4, 3, 2, 1, 0 Byte N - Bits 7, 6, 5, 4, 3, 2, 1, 0 Byte 0: Control Register (1 = Enable, 0 = Disable)[8] Bit Pin# Name Default Pin Function Bit 7 - Reserved 0 Reserved Bit 6 - Reserved 0 Reserved Bit 5 - Reserved 0 Reserved Bit 4 - Reserved 0 Reserved Bit 3 - Reserved 0 Reserved Bit 2 23 24/48 MHz 1 (Active/Inactive) Bit 1 21, 22 48 MHz 1 (Active/Inactive) Bit 0 - Reserved 0 Reserved Byte 1: Control Register (1 = Enable, 0 = Disable)[8] Bit Pin# Name Default Pin Description Bit 7 32 SDRAM7 1 (Active/Inactive) Bit 6 33 SDRAM6 1 (Active/Inactive) Bit 5 35 SDRAM5 1 (Active/Inactive) Bit 4 36 SDRAM4 1 (Active/Inactive) Bit 3 37 SDRAM3 1 (Active/Inactive) Bit 2 39 SDRAM2 1 (Active/Inactive) Bit 1 40 SDRAM1 1 (Active/Inactive) Bit 0 41 SDRAM0 1 (Active/Inactive) Byte 2: Control Register (1 = Enable, 0 = Disable)[8] Bit Pin# Name Default Pin Description Bit 7 -- Reserved 0 Reserved Bit 6 19 PCI6 1 (Active/Inactive) Bit 5 18 PCI5 1 (Active/Inactive) Bit 4 16 PCI4 1 (Active/Inactive) Bit 3 15 PCI3 1 (Active/Inactive) Bit 2 13 PCI2 1 (Active/Inactive) Bit 1 12 PCI1 1 (Active/Inactive) Bit 0 11 PCI0 1 (Active/Inactive) Note: 8. Inactive means outputs are held LOW and are disabled from switching. These outputs are designed to be configured at power-on and are not expected to be configured during the normal modes of operation. Document #: 38-07220 Rev. *A Page 7 of 15 PRELIMINARY W219B Byte 3: Reserved Register (1 = Enable, 0 = Disable) Bit Pin# Name Default Pin Description Bit 7 31 SDRAM8 1 (Active/Inactive) Bit 6 - Reserved 0 Reserved Bit 5 - Reserved 0 Reserved Bit 4 - Reserved 0 Reserved Bit 3 47 APIC 1 (Active/Inactive) Bit 2 - Reserved 0 Reserved Bit 1 - Reserved 1 Reserved Bit 0 - Reserved 0 Reserved Byte 4: Reserved Register (1 = Enable, 0 = Disable) Bit Pin# Name Default Pin Function Bit 7 - SEL3 0 See Table 4 Bit 6 - SEL2 0 See Table 4 Bit 5 - SEL1 0 See Table 4 Bit 4 - SEL0 0 See Table 4 Bit 3 - FS(0:4) Override 0 0 = Select operating frequency by FS(0:4) strapping 1 = Select operating frequency by SEL(0:4) bit settings Bit 2 - SEL4 0 See Table 4 Bit 1 - Reserved 0 Reserved Bit 0 - Test Mode 0 0 = All output enable 1 = All output three-stated Byte 5: Reserved Register (1 = Enable, 0 = Disable) Bit Pin# Name Default Pin Description Bit 7 - Reserved 0 Reserved Bit 6 - Reserved 0 Reserved Bit 5 - Reserved 0 Reserved Bit 4 - Reserved 0 Reserved Bit 3 - Reserved 0 Reserved Bit 2 - Reserved 0 Reserved Bit 1 - Reserved 0 Reserved Bit 0 - Reserved 0 Reserved Byte 6: Reserved Register (1 = Enable, 0 = Disable) Bit Pin# Name Default Pin Description Bit 7 - Reserved 0 Reserved Bit 6 - Reserved 0 Reserved Bit 5 - Reserved 0 Reserved Bit 4 - Reserved 0 Reserved Bit 3 - Reserved 0 Reserved Bit 2 - Reserved 1 Reserved Bit 1 - Reserved 1 Reserved Bit 0 - Reserved 0 Reserved Document #: 38-07220 Rev. *A Page 8 of 15 PRELIMINARY W219B Table 4. Additional Frequency Selections through Serial Data Interface Data Bytes Input Conditions Output Frequency Data Byte 4, Bit 3 = 1 Bit 2 SEL_4 Bit 7 SEL_3 Bit 6 SEL_2 Bit 5 SEL_1 Bit 4 SEL_0 CPU SDRAM 3V66 PCI APIC 0 0 0 0 0 75.3 113.0 75.3 37.6 18.8 OFF 0 0 0 0 1 95.0 95.0 63.3 31.6 15.8 –0.6% 0 0 0 1 0 129.0 129.0 86.0 43.0 21.5 OFF 0 0 0 1 1 150.0 113.0 75.3 37.6 18.8 OFF 0 0 1 0 0 150.0 150.0 75.0 37.5 18.7 OFF 0 0 1 0 1 110.0 110.0 73.0 36.6 18.3 OFF 0 0 1 1 0 140.0 140.0 70.0 35.0 17.5 OFF 0 0 1 1 1 144.0 108.0 72.0 36.0 18.0 OFF 0 1 0 0 0 68.3 102.5 68.3 34.1 17.0 OFF 0 1 0 0 1 105.0 105.0 70.0 35.0 17.5 OFF 0 1 0 1 0 138.0 138.0 69.0 34.5 17.0 OFF 0 1 0 1 1 140.0 105.0 70.0 35.0 17.5 OFF 0 1 1 0 0 66.8 100.2 66.8 33.4 16.7 ±0.45% 0 1 1 0 1 100.2 100.2 66.8 33.4 16.7 ±0.45% 0 1 1 1 0 133.6 133.6 66.8 33.4 16.7 ±0.45% 0 1 1 1 1 133.6 100.2 66.8 33.4 16.7 ±0.45% 1 0 0 0 0 157.3 118.0 78.6 39.3 19.6 OFF 1 0 0 0 1 160.0 120.0 80.0 40.0 20.0 OFF 1 0 0 1 0 146.6 110.0 73.3 36.6 18.3 OFF 1 0 0 1 1 122.0 91.5 61.0 30.5 15.2 –0.6% 1 0 1 0 0 127.0 127.0 84.6 42.3 21.1 OFF 1 0 1 0 1 122.0 122.0 81.3 40.6 20.3 –0.6% 1 0 1 1 0 117.0 117.0 78.0 39.0 19.5 OFF 1 0 1 1 1 114.0 114.0 76.0 38.0 19.0 OFF 1 1 0 0 0 80.0 120.0 80.0 40.0 20.0 OFF 1 1 0 0 1 78.0 117.0 78.0 39.0 19.5 OFF 1 1 0 1 0 166.0 124.5 83.0 41.5 20.7 OFF 1 1 0 1 1 133.6 133.6 89.0 44.5 22.2 OFF 1 1 1 0 0 66.6 100.0 66.6 33.3 16.6 –0.6% 1 1 1 0 1 100.0 100.0 66.6 33.3 16.6 –0.6% 1 1 1 1 0 133.3 133.3 66.6 33.3 16.6 –0.6% 1 1 1 1 1 133.3 100.0 66.6 33.3 16.6 –0.6% Document #: 38-07220 Rev. *A Spread Spectrum Page 9 of 15 PRELIMINARY W219B DC Electrical Characteristics[9] DC parameters must be sustainable under steady state (DC) conditions. Absolute Maximum DC Power Supply Parameter Description Min. Max. Unit VDDQ3 3.3V Core Supply Voltage –0.5 4.6 V VDDQ2 2.5V I/O Supply Voltage –0.5 3.6 V TS Storage Temperature –65 150 °C Min. Max. Unit Absolute Maximum DC I/O Parameter Description Vi/o3 3.3V Core Supply Voltage –0.5 4.6 V Vi/o3 2.5V I/O Supply Voltage –0.5 3.6 V ESD prot. Input ESD Protection 2000 V DC Operating Requirements Parameter Description Condition Min. Max. Unit VDD3 3.3V Core Supply Voltage 3.3V±5% 3.135 3.465 V VDDQ3 3.3V I/O Supply Voltage 3.3V±5% 3.135 3.465 V VDDQ2 2.5V I/O Supply Voltage 2.5V±5% 2.375 2.625 V Vih3 3.3V Input High Voltage VDD3 Vil3 3.3V Input Low Voltage VDD3 = 3.3V±5% Iil Input Leakage Current [10] 2.0 VDD + 0.3 V GND – 0.3 0.8 V 0<Vin<VDDQ3 –5 +5 µA 2.0 VDDQ2 = 2.5V±5% Voh2 2.5V Output High Voltage Ioh=(–1 mA) Vol2 2.5V Output Low Voltage Iol=(1 mA) Voh3 3.3V Output High Voltage Ioh=(–1 mA) Vol3 3.3V Output Low Voltage Iol=(1 mA) V 0.4 V VDDQ3 = 3.3V±5% 2.4 V 0.4 V VDDQ3 = 3.3V±5% Vpoh3 PCI Bus Output High Voltage Ioh=(–1 mA) Vpol3 PCI Bus Output Low Voltage Iol=(1 mA) Cin Input Pin Capacitance Cxtal Xtal Pin Capacitance Cout Output Pin Capacitance Lpin Pin Inductance Ta Ambient Temperature 2.4 0.55 V 5 pF 22.5 pF 6 pF 0 7 nH 0 70 °C 13.5 No Airflow V Note: 9. Multiple Supplies: The voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required. 10. Input Leakage Current does not include inputs with pull-up or pull-down resistors. Document #: 38-07220 Rev. *A Page 10 of 15 PRELIMINARY W219B AC Electrical Characteristics[9] TA = 0°C to +70°C, VDDQ3 = 3.3V±5%, VDDQ2= 2.5V±5% fXTL = 14.31818 MHz Parameter Description 66.6-MHz Host 100-MHz Host 133-MHz Host Min. Max. Min. Max. Min. Max. Unit Notes TPeriod Host/CPUCLK Period 15.0 15.5 10.0 10.5 7.5 8.0 ns 11 THIGH Host/CPUCLK High Time 5.2 N/A 3.0 N/A 1.87 N/A ns 14 TLOW Host/CPUCLK Low Time 5.0 N/A 2.8 N/A 1.67 N/A ns TRISE Host/CPUCLK Rise Time 0.4 1.6 0.4 1.6 0.4 1.6 ns 15 TFALL Host/CPUCLK Fall Time 0.4 1.6 0.4 1.6 0.4 1.6 ns 15 TPeriod SDRAM CLK Period 10.0 10.5 10.0 10.5 10.0 10.5 ns 11 THIGH SDRAM CLK High Time 3.0 N/A 3.0 N/A 3.0 N/A ns 14 TLOW SDRAM CLK Low Time 2.8 N/A 2.8 N/A 2.8 N/A ns TRISE SDRAM CLK Rise Time 0.4 1.6 0.4 1.6 0.4 1.6 ns 15 TFALL SDRAM CLK Fall Time 0.4 1.6 0.4 1.6 0.4 1.6 ns 15 TPeriod APIC CLK Period 60.0 64.0 60.0 N/A 60.0 64.0 ns 11 THIGH APIC CLK High Time 25.5 N/A 25.5 N/A 25.5 N/A ns 14 TLOW APIC CLK Low Time 25.3 N/A 25.30 N/A 25.30 N/A ns TRISE APIC CLK Rise Time 0.4 1.6 0.4 1.6 0.4 1.6 ns 15 TFALL APIC CLK Fall Time 0.4 1.6 0.4 1.6 0.4 1.6 ns 15 TPeriod 3V66 CLK Period 30.0 N/A 30.0 N/A 30.0 N/A ns 11, 13 THIGH 3V66 CLK High Time 12.0 N/A 12.0 N/A 12.0 N/A ns 14 TLOW 3V66 CLK Low Time 12.0 N/A 12.0 N/A 12.0 N/A ns TRISE 3V66 CLK Rise Time 0.4 1.6 0.4 1.6 0.4 1.6 ns 15 TFALL 3V66 CLK Fall Time 0.4 1.6 0.4 1.6 0.4 1.6 ns 15 TPeriod PCI CLK Period 15.0 16.0 15.0 16.0 15.0 16.0 ns 11, 12 THIGH PCI CLK High Time 5.25 N/A 5.25 N/A 5.25 N/A ns 14 TLOW PCI CLK Low Time 5.05 N/A 5.05 N/A 5.05 N/A ns TRISE PCI CLK Rise Time 0.5 2.0 0.5 2.0 0.5 2.0 ns 15 TFALL PCI CLK Fall Time 0.5 2.0 0.5 2.0 0.5 2.0 ns 15 tpZL, tpZH Output Enable Delay (All outputs) 30.0 N/A 30.0 N/A 30.0 N/A ns tpLZ, tpZH Output Disable Delay (All outputs) 12.0 N/A 12.0 N/A 12.0 N/A ns 15 tstable All Clock Stabilization from Power-Up 12.0 N/A 12.0 N/A 12.0 N/A ms 15 Notes: 11. Period, jitter, offset, and skew measured on rising edge at 1.25 for 2.5V clocks and at 1.5V for 3.3V clocks. 12. THIGH is measured at 2.0V for 2.5V outputs, 2.4V for 3.3V outputs. 13. TLOW is measured at 0.4V for all outputs. 14. The time specified is measured from when VDDQ3 achieves its nominal operating level (typical condition VDDQ3 = 3.3V) until the frequency output is stable and operating within specification. 15. TRISE and TFALL are measured as a transition through the threshold region Vol = 0.4V and Voh = 2.0V (1 mA) JEDEC specification for 2.5V outputs, and Vol = 0.4V and Voh = 2.4V for 3.3V. Document #: 38-07220 Rev. *A Page 11 of 15 PRELIMINARY W219B Group Skew and Jitter Limits Output Group Pin-Pin Skew Max. Cycle-Cycle Jitter Duty Cycle Nom Vdd Skew, Jitter Measure Point CPU 175 ps 250 ps 45/55 2.5V 1.25V SDRAM 250 ps 250 ps 45/55 3.3V 1.5V APIC 250 ps 500 ps 45/55 2.5V 1.25V 48MHz 250 ps 500 ps 45/55 3.3V 1.5V 3V66 175 ps 500 ps 45/55 3.3V 1.5V PCI 500 ps 500 ps 45/55 3.3V 1.5V REF N/A 1000 ps 45/55 3.3V 1.5V Output Buffer Test Point Test Load Clock Output Wave TPERIOD Duty Cycle THIGH 2.0 2.5V Clocking Interface 1.25 0.4 TLOW TRISE TFALL TPERIOD Duty Cycle THIGH 2.4 3.3V Clocking Interface 1.5 0.4 TLOW TRISE TFALL Figure 8. Output Buffer Ordering Information Ordering Code W219B Package Name H Package Type 48-pin SSOP (300 mils) Intel is a registered trademark of Intel Corporation. Document #: 38-07220 Rev. *A Page 12 of 15 PRELIMINARY W219B Layout Example +2.5V Supply +3.3V Supply FB FB VDDQ2 VDDQ3 C4 0.005 µF G G G 3.3V 5Ω C5 G 0.1µF 10 µF C2 G G 0.005 µF 48 G 47 V 46 G 45 44 G 43 V 42 G 41 40 G 39 38 G 37 36 G 35 V 34 G 33 32 31 G 30 29 G 28 VDDQ3 V 27 (Core) G 26 G 25 G V G G G G W219B G C1 C3 1 G 2 V 3 G 4 5 G 6 VG 7 8 G 9 10 11 G 12 13 14 G 15 G 16 17V 18 G 19 20 G 21 22 23 24 G G 20µF 10 µF G G G C6 FB = Dale ILB1206 - 300 (300Ω @ 100 MHz) or TDK ACB2012L-120 Ceramic Caps C1 & C3, C5 = 10 – 22 µF C2 & C4 = 0.005 µF G = VIA to GND plane layer C6 = 0.1 µF V =VIA to respective supply plane trace Note: Each supply plane or strip should have a ferrite bead and capacitors All VDD by pass capacitors = 0.1 µF Document #: 38-07220 Rev. *A Page 13 of 15 PRELIMINARY W219B Package Diagram 48-Pin Shrink Small Outline Package (SSOP, 300 mils) Document #: 38-07220 Rev. *A Page 14 of 15 © Cypress Semiconductor Corporation, 2001. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges. PRELIMINARY W219B Document Title: W219B Frequency Generator for Integrated Core Logic with 133-MHz FSB Document Number: 38-07220 REV. ECN NO. Issue Date Orig. of Change Description of Change ** 110485 10/21/01 SZV Change from Spec number: 38-00884 to 38-07220 *A 122837 12/21/02 RBI Add Power up Requirements to Electrical Characteristics Information Document #: 38-07220 Rev. *A Page 15 of 15