3
PRELIMINARY
W230-03
Spread Spectrum FTG for VIA K7 Chipset
Features
• Maximized EMI Suppression using Cypress’s Spread
Spectrum technology
• Single-chip system frequency synthesizer for VIA K7
chipset
• Two copies of CPU output
• Six copies of PCI output
• One 48-MHz output for USB
• One 24-MHz or 48-MHz output for SIO
• Two buffered reference outputs
• Thirteen SDRAM outputs provide support for 3 DIMMs
• Supports frequencies up to 200 MHz
• I2C™ interface for programming
• Power management control inputs
• Available in 48-pin SSOP
Key Specifications
CPU to CPU Output Skew: ......................................... 175 ps
PCI to PCI Output Skew: ............................................ 500 ps
VDDQ3: .................................................................... 3.3V±5%
SDRAMIN to SDRAM0:12 Delay: ..........................3.7 ns typ.
Table 1. Mode Input Table
Mode
Pin 2
0
CPU_STOP#
1
REF0
Table 2. Pin Selectable Frequency
Input Address
CPU_CS
CPUT0
FS3 FS2 FS1 FS0
(MHz)
1
1
1
1
100.0
1
1
1
0
100.0
1
1
0
1
100.0
1
1
0
0
95.0
1
0
1
1
133.3
1
0
1
0
133.3
1
0
0
1
133.3
1
0
0
0
102.0
0
1
1
1
104.0
0
1
1
0
106.0
0
1
0
1
107.0
0
1
0
0
108.0
0
0
1
1
109.0
0
0
1
0
110.0
0
0
0
1
111.0
0
0
0
0
112.0
PCI 0:5
(MHz)
33.3
33.3
33.3
31.7
33.3
33.3
33.3
34.0
34.6
35.3
35.6
36.0
36.3
36.6
37.0
37.3
Spread
Spectrum
–0.5%
OFF
±0.5%
OFF
–0.5%
OFF
±0.5%
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
Pin Configuration[1]
Block Diagram
VDDQ3
REF0/(CPU_STOP#)
X1
X2
PLL Ref Freq
I/O Pin
Control
PWRDWN#
CPU_CS
Stop
Clock
Control
PLL 1
÷2,3,4
CPUT0
CPUC0
VDDQ3
PCI0/MODE
PCI1/FS1
PCI2
PCI3
PCI4
SDATA
SCLK
I2C
Logic
{
PCI5
VDDQ3
48MHz/FS2
PLL2
÷2
SDRAMIN
I2C
13
24_48MHz/FS3
VDDQ3
SDRAM0:12
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
W230-03
VDDQ3
REF0/(CPU_STOP#)
GND
X1
X2
VDDQ3
PCI0/MODE
PCI1/FS1*
GND
PCI2
PCI3
PCI4
PCI5
VDDQ3
SDRAMIN
GND
SDRAM11
SDRAM10
VDDQ3
SDRAM9
SDRAM8
GND
2
SDATA
I C
SCLK
REF1/FS0
XTAL
OSC
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
REF1/FS0*
GND
CPU_CS
GND
CPUC0
CPUT0
VDDQ3
PWRDWN#*
SDRAM12
GND
SDRAM0
SDRAM1
VDDQ3
SDRAM2
SDRAM3
GND
SDRAM4
SDRAM5
VDDQ3
SDRAM6
SDRAM7
VDDQ3
48MHz/FS2*
24_48MHz/FS3^
Note:
1. Internal pull-up resistors should not be relied upon for setting I/O
pins HIGH. Pin function with parentheses determined by MODE pin
resistor strapping. Unlike other I/O pins, input FS3 has an internal
pull-down resistor.
is a trademark of Phillips Corporation.
Cypress Semiconductor Corporation
Document #: 38-07357 Rev. *A
•
3901 North First Street
•
San Jose
•
CA 95134 • 408-943-2600
Revised December 26, 2002
PRELIMINARY
W230-03
Pin Definitions
Pin Name
Pin No.
Pin Type
Pin Description
CPUT0,
CPUC0,
43, 44
CPU_CS
46
O
CPU Clock Output for Chipset: CPU_CS is the push-pull clock output for the
chipset. It has the same phase relationship as CPUT0.
10, 11, 12, 13
O
PCI Clock Outputs 2 through 5: These four PCI clock outputs are controlled by
the PWRDWN# control pin. Frequency is set by FS0:3 inputs or through serial
input interface, see Tables 2 and 6 for details. Output voltage swing is controlled
by voltage applied to VDDQ3.
PCI1/FS1
8
I/O
Fixed PCI Clock Output/Frequency Select 1: As an output, frequency is set by
FS0:3 inputs or through serial input interface. This output is controlled by the
PWRDWN# input. This pin also serves as a power-on strap option to determine
device operating frequency as described in Table 2.
PCI0/MODE
7
I/O
Fixed PCI Clock Output/Mode: As an output, frequency is set by the FS0:3 inputs
or through serial input interface, see Tables 2 and 6. This output is controlled by
the PWRDWN# input. This pin also serves as a power-on strap option to determine
the function of pin 2, see Table 1 for details.
PWRDWN#
41
I
PWRDWN# Input: LVTTL-compatible input that places the device in power-down
mode when held LOW. In power-down mode, CPUC0 will be three-stated and all
the other output clocks will be driven LOW.
48MHz/FS2
26
I/O
48-MHz Output/Frequency Select 2: 48 MHz is provided in normal operation. In
standard PC systems, this output can be used as the reference for the Universal
Serial Bus host controller. This pin also serves as a power on strap option to
determine device operating frequency as described in Table 2.
24_48MHz/
FS3
25
I/O
24_48-MHz Output/Frequency Select 3: In standard PC systems, this output can
be used as the clock input for a Super I/O chip. The output frequency is controlled
by Configuration Byte 3 bit[6]. The default output frequency is 48 MHz. This pin
also serves as a power-on strap option to determine device operating frequency
as described in Table 2.
REF1/FS0
48
I/O
Reference Clock Output 1/Frequency Select 2: 3.3V 14.318-MHz output clock.
This pin also serves as a power-on strap option to determine device operating
frequency as described in Table 2. Upon power-up, FS0 input will be latched which
will set clock frequencies as described in Table 2.
REF0/
CPU_STOP
#
2
I/O
Reference Clock Output 0 or CPU_STOP# Input Pin: Function is determined
by the MODE pin. When CPU_STOP# input is asserted LOW, it will drive CPUT0
and CPU_CS to logic 0, and it will three-state CPUC0. When this pin is configured
as an output, this pin becomes a 3.3V 14.318-MHz output clock.
SDRAMIN
15
I
Buffered Input Pin: The signal provided to this input pin is buffered to 13 outputs
(SDRAM0:12).
38, 37, 35,
34, 32, 31,
29, 28, 21,
20, 18, 17, 40
O
Buffered Outputs: These thirteen dedicated outputs provide copies of the signal
provided at the SDRAMIN input. The swing is set by VDDQ3, and they are deactivated when PWRDWN# input is set LOW.
SCLK
24
I
Clock pin for I2C circuitry.
SDATA
23
I/O
Data pin for I2C circuitry.
X1
4
I
Crystal Connection or External Reference Frequency Input: This pin has dual
functions. It can be used as an external 14.318-MHz crystal connection or as an
external reference frequency input.
X2
5
I
Crystal Connection: An input connection for an external 14.318-MHz crystal. If
using an external reference, this pin must be left unconnected.
VDDQ3
1, 6, 14, 19,
27, 30, 36, 42
P
Power Connection: Power supply for core logic, PLL circuitry, SDRAM outputs,
PCI outputs, reference outputs, 48-MHz output, and 24_48-MHz output. Connect
to 3.3V supply
GND
3, 9, 16, 22,
33, 39, 45, 47
G
Ground Connections: Connect all ground pins to the common system ground
plane.
PCI2:5
SDRAM0:12
O
CPU Clock Output 0: CPUT0 and CPUC0 are the differential CPU clock outputs
(open-drain) for the K7 processor.
Document #: 38-07357 Rev. *A
Page 2 of 15
PRELIMINARY
Overview
The W230-03 was developed as a single-chip device to meet
the clocking needs of VIA K7 core logic chip sets. In addition
to the typical outputs provided by a standard FTG, the W23003 adds a thirteenth output buffer, supporting SDRAM DIMM
modules in conjunction with the chipset.
Cypress’s proprietary spread spectrum frequency synthesis
technique is a feature of the CPU and PCI outputs. When enabled, this feature reduces the peak EMI measurements of not
only the output signals and their harmonics, but also of any
other clock signals that are properly synchronized to them.
Functional Description
I/O Pin Operation
Pins 7, 8, 25, 26, and 48 are dual-purpose l/O pins. Upon
power-up these pins act as logic inputs, allowing the determination of assigned device functions. A short time after powerup, the logic state of each pin is latched and the pins become
clock outputs. This feature reduces device pin count by combining clock outputs with input select pins.
An external 10-kΩ “strapping” resistor is connected between
the l/O pin and ground or VDD. Connection to ground sets a
latch to “0,” connection to VDD sets a latch to “1.” Figure 1 and
Figure 2 show two suggested methods for strapping resistor
connections.
W230-03
Upon W230-03 power-up, the first 2 ms of operation is used
for input logic selection. During this period, the five I/O pins (7,
8, 25, 26, 48) are three-stated, allowing the output strapping
resistor on the l/O pins to pull the pins and their associated
capacitive clock load to either a logic HIGH or LOW state. At
the end of the 2-ms period, the established logic “0” or “1”
condition of the l/O pin is latched. Next the output buffer is
enabled converting the l/O pins into operating clock outputs.
The 2-ms timer starts when VDD reaches 2.0V. The input bits
can only be reset by turning VDD off and then back on again.
It should be noted that the strapping resistors have no significant effect on clock output signal integrity. The drive impedance of clock outputs is <40Ω (nominal), which is minimally
affected by the 10-kΩ strap to ground or VDD. As with the series termination resistor, the output strapping resistor should
be placed as close to the l/O pin as possible in order to keep
the interconnecting trace short. The trace from the resistor to
ground or VDD should be kept less than two inches in length
to prevent system noise coupling during input logic sampling.
When the clock outputs are enabled following the 2-ms input
period, the specified output frequency is delivered on the pin,
assuming that VDD has stabilized. If VDD has not yet reached
full value, output frequency initially may be below target but will
increase to target once VDD voltage has stabilized. In either
case, a short output clock cycle may be produced from the
CPU clock outputs when the outputs are enabled.
VDD
Output Strapping Resistor
Series Termination Resistor
10 kΩ
(Load Option 1)
W230-03
Power-on
Reset
Timer
Hold
Output
Low
Output Three-state
Q
Clock Load
R
Output
Buffer
10 kΩ
(Load Option 0)
D
Data
Latch
Figure 1. Input Logic Selection Through Resistor Load Option
Jumper Options
Output Strapping Resistor
VDD
Series Termination Resistor
10 kΩ
W230-03
R
Output
Buffer
Power-on
Reset
Timer
Hold
Output
Low
Output Three-state
Q
Clock Load
Resistor Value R
D
Data
Latch
Figure 2. Input Logic Selection Through Jumper Option
Document #: 38-07357 Rev. *A
Page 3 of 15
PRELIMINARY
W230-03
Spread Spectrum Frequency Timing Generator
Where P is the percentage of deviation and F is the frequency
in MHz where the reduction is measured.
The device generates a clock that is frequency modulated in
order to increase the bandwidth that it occupies. By increasing
the bandwidth of the fundamental and its harmonics, the amplitudes of the radiated electromagnetic emissions are reduced. This effect is depicted in Figure 3.
The output clock is modulated with a waveform depicted in
Figure 4. This waveform, as discussed in “Spread Spectrum
Clock Generation for the Reduction of Radiated Emissions” by
Bush, Fessler, and Hardin produces the maximum reduction
in the amplitude of radiated electromagnetic emissions. The
deviation selected for this chip is specified in Table 6. Figure 4
details the Cypress spreading pattern. Cypress does offer options with more spread and greater EMI reduction. Contact
your local Sales representative for details on these devices.
As shown in Figure 3, a harmonic of a modulated clock has a
much lower amplitude than that of an unmodulated signal. The
reduction in amplitude is dependent on the harmonic number
and the frequency deviation or spread. The equation for the
reduction is:
dB = 6.5 + 9*log10(P) + 9*log10(F)
Spread Spectrum clocking is activated or deactivated by selecting the appropriate values for bits 1–0 in data byte 0 of the
I2C data stream. Refer to Table 6 for more details.
EMI Reduction
Typical Clock
Amplitude (dB)
Amplitude (dB)
SSFTG
Spread
Spectrum
Enabled
NonSpread
Speactrum
Frequency Span (MHz)
Down Spread
Frequency Span (MHz)
Center Spread
Figure 3. Clock Harmonic with and without SSCG Modulation Frequency Domain Representation
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
FREQUENCY
MAX (0%)
MIN (–0.5%)
Figure 4. Typical Modulation Profile
Document #: 38-07357 Rev. *A
Page 4 of 15
PRELIMINARY
Serial Data Interface
The W230-03 features a two-pin, serial data interface that can
be used to configure internal register settings that control particular device functions. Upon power-up, the W230-03 initializes with default register settings, therefore the use of this serial data interface is optional. The serial interface is write-only
(to the clock chip) and is the dedicated function of device pins
SDATA and SCLOCK. In motherboard applications, SDATA
and SCLOCK are typically driven by two logic outputs of the
W230-03
chipset. Clock device register changes are normally made
upon system initialization, if any are required. The interface
can also be used during system operation for power management functions. Table 3 summarizes the control functions of
the serial data interface.
Operation
Data is written to the W230-03 in eleven bytes of eight bits
each. Bytes are written in the order shown in Table 4.
Table 3. Serial Data Interface Control Functions Summary
Control Function
Description
Common Application
Clock Output Disable
Any individual clock output(s) can be disabled. Dis- Unused outputs are disabled to reduce EMI
abled outputs are actively held LOW.
and system power. Examples are clock outputs to unused PCI slots.
CPU Clock Frequency
Selection
Provides CPU/PCI frequency selections through
software. Frequency is changed in a smooth and
controlled fashion.
For alternate microprocessors and power
management options. Smooth frequency transition allows CPU frequency change under
normal system operation.
Spread Spectrum
Enabling
Enables or disables spread spectrum clocking.
For EMI reduction.
Output Three-state
Puts clock output into a high impedance state.
Production PCB testing.
(Reserved)
Reserved function for future device revision or pro- No user application. Register bit must be writduction device testing.
ten as 0.
Table 4. Byte Writing Sequence
Byte Sequence
Byte Name
1
Slave Address
11010010
Commands the W230-03 to accept the bits in Data Bytes 0–6 for internal
register configuration. Since other devices may exist on the same common serial data bus, it is necessary to have a specific slave address for
each potential receiver. The slave receiver address for the W230-03 is
11010010. Register setting will not be made if the Slave Address is not
correct (or is for an alternate slave receiver).
2
Command
Code
Don’t Care
Unused by the W230-03, therefore bit values are ignored (“don’t care”).
This byte must be included in the data write sequence to maintain proper
byte allocation. The Command Code Byte is part of the standard serial
communication protocol and may be used when writing to another addressed slave receiver on the serial data bus.
3
Byte Count
Don’t Care
Unused by the W230-03, therefore bit values are ignored (“don’t care”).
This byte must be included in the data write sequence to maintain proper
byte allocation. The Byte Count Byte is part of the standard serial communication protocol and may be used when writing to another addressed slave receiver on the serial data bus.
4
Data Byte 0
Refer to Table 5
5
Data Byte 1
6
Data Byte 2
7
Data Byte 3
The data bits in Data Bytes 0–7 set internal W230-03 registers that
control device operation. The data bits are only accepted when the Address Byte bit sequence is 11010010, as noted above. For description
of bit control functions, refer to Table 5, Data Byte Serial Configuration
Map.
8
Data Byte 4
9
Data Byte 5
10
Data Byte 6
11
Data Byte 7
Document #: 38-07357 Rev. *A
Bit Sequence
Byte Description
Page 5 of 15
PRELIMINARY
Writing Data Bytes
Each bit in the data bytes controls a particular device function
except for the “reserved” bits, which must be written as a logic
0. Bits are written MSB (most significant bit) first, which is bit
W230-03
7. Table 5 gives the bit formats for registers located in Data
Bytes 0–7.
Table 6 details additional frequency selections that are available through the serial data interface.
Table 5. Data Bytes 0–7 Serial Configuration Map
Affected Pin
Bit(s)
Pin No.
Bit Control
Pin Name
Control Function
0
1
Default
--
--
0
Data Byte 0
7
--
--
(Reserved)
6
--
--
SEL_2
See Table 6
0
5
--
--
SEL_1
See Table 6
0
4
--
--
SEL_0
3
--
--
Hardware/Software Frequency
Select
2
--
--
SEL_4
See Table 6
1
1
--
--
SEL_3
See Table 6
0
0
--
--
7
--
--
6
--
--
5
--
4
--
See Table 6
Hardware
0
Software
0
Normal
Three-stated
0
(Reserved)
--
--
0
(Reserved)
--
--
0
--
(Reserved)
--
--
0
--
(Reserved)
--
--
0
Data Byte 1
3
--
--
(Reserved) Write to ‘1’
--
--
1
2
--
--
(Reserved) Write to ‘1’
--
--
1
1
--
--
(Reserved) Write to ‘1’
--
--
1
0
--
--
(Reserved) Write to ‘1’
--
--
1
7
--
--
(Reserved)
--
--
0
6
7
PCI0
Low
Active
1
5
--
--
--
--
0
4
13
PCI5
Clock Output Disable
Low
Active
1
3
12
PCI4
Clock Output Disable
Low
Active
1
2
11
PCI3
Clock Output Disable
Low
Active
1
1
10
PCI2
Clock Output Disable
Low
Active
1
0
8
PCI1
Clock Output Disable
Low
Active
1
7
--
--
--
--
0
6
--
24-MHz
48-MHz
0
5
26
48MHz
Clock Output Disable
Low
Active
1
4
25
24_48MHz
Clock Output Disable
Low
Active
1
--
--
0
Low
Active
1
Data Byte 2
Clock Output Disable
(Reserved)
Data Byte 3
(Reserved)
SEL_48MHz SEL 48MHz as the output frequency for 24_48MHz
3
--
--
2
21, 20,
18, 17
SDRAM8:11
Document #: 38-07357 Rev. *A
(Reserved)
Clock Output Disable
Page 6 of 15
PRELIMINARY
W230-03
Table 5. Data Bytes 0–7 Serial Configuration Map (continued)
Affected Pin
Bit(s)
Pin No.
Pin Name
1
32, 31,
29, 28
SDRAM4:7
0
38, 37,
35, 34
SDRAM0:3
Bit Control
Control Function
0
1
Default
Clock Output Disable
Low
Active
1
Clock Output Disable
Low
Active
1
Data Byte 4
7
--
--
(Reserved)
--
--
0
6
--
--
(Reserved)
--
--
0
5
--
--
(Reserved)
--
--
0
4
--
--
(Reserved)
--
--
0
3
--
--
(Reserved)
--
--
0
2
--
--
(Reserved)
--
--
0
1
--
--
(Reserved)
--
--
0
0
--
--
(Reserved)
--
--
0
7
--
--
(Reserved)
--
--
0
6
--
--
(Reserved)
--
--
0
5
--
--
(Reserved)
--
--
0
4
--
--
(Reserved)
--
--
1
3
--
--
(Reserved)
--
--
0
(Reserved)
Data Byte 5
2
--
--
--
--
0
1
48
REF1
Clock Output Disable
Low
Active
1
0
2
REF0
Clock Output Disable
Low
Active
1
7
--
--
(Reserved)
--
--
0
6
--
--
(Reserved)
--
--
0
5
--
--
(Reserved)
--
--
0
4
--
--
(Reserved)
--
--
0
3
--
--
(Reserved)
--
--
0
2
--
--
(Reserved)
--
--
0
1
--
--
(Reserved)
--
--
0
0
--
--
(Reserved)
--
--
0
7
--
--
(Reserved)
--
--
0
6
--
--
(Reserved)
--
--
0
5
--
--
(Reserved)
--
--
0
4
--
--
(Reserved)
--
--
0
3
--
--
(Reserved)
--
--
0
2
--
--
(Reserved)
--
--
0
1
--
--
(Reserved)
--
--
0
0
--
--
(Reserved)
--
--
0
Data Byte 6
Data Byte 7
Document #: 38-07357 Rev. *A
Page 7 of 15
PRELIMINARY
W230-03
Table 6. Additional Frequency Selections through Serial Data Interface Data Bytes
Input Conditions
Output Frequency
Data Byte 0, Bit 3 = 1
Bit 2
SEL_4
Bit 1
SEL_3
Bit 6
SEL_2
Bit 5
SEL_1
Bit 4
SEL_0
CPU
PCI
Spread Spectrum
1
1
1
1
1
100.0
33.3
–0.5%
1
1
1
1
0
100.0
33.3
OFF
1
1
1
0
1
100.0
33.3
±0.5%
1
1
1
0
0
95.0
31.7
OFF
1
1
0
1
1
133.3
33.3
–0.5%
1
1
0
1
0
133.3
33.3
OFF
1
1
0
0
1
133.3
33.3
±0.5%
1
1
0
0
0
102.0
34.0
OFF
1
0
1
1
1
104.0
34.6
OFF
1
0
1
1
0
106.0
35.3
OFF
1
0
1
0
1
107.0
35.6
OFF
1
0
1
0
0
108.0
36.0
OFF
1
0
0
1
1
109.0
36.3
OFF
1
0
0
1
0
110.0
36.6
OFF
1
0
0
0
1
111.0
37.0
OFF
1
0
0
0
0
112.0
37.3
OFF
0
1
1
1
1
113.0
37.6
OFF
0
1
1
1
0
114.0
38.0
OFF
0
1
1
0
1
115.0
38.3
OFF
0
1
1
0
0
116.0
38.6
OFF
0
1
0
1
1
118.0
39.3
OFF
0
1
0
1
0
120.0
40.0
OFF
0
1
0
0
1
124.0
31.0
OFF
0
1
0
0
0
127.0
31.7
OFF
0
0
1
1
1
130.0
32.5
OFF
0
0
1
1
0
136.0
34.0
OFF
0
0
1
0
1
140.0
35.0
OFF
0
0
1
0
0
145.0
36.2
OFF
0
0
0
1
1
150.0
37.5
OFF
0
0
0
1
0
155.0
38.7
OFF
0
0
0
0
1
160.0
40
OFF
0
0
0
0
0
166.0
41.6
OFF
Document #: 38-07357 Rev. *A
Page 8 of 15
PRELIMINARY
W230-03
Absolute Maximum Ratings[2]
Stresses greater than those listed in this table may cause permanent damage to the device. These represent a stress rating
only. Operation of the device at these or any other conditions
above those specified in the operating sections of this specification is not implied. Maximum conditions for extended periods may affect reliability.
.
Parameter
Description
Rating
Unit
VDD, VIN
Voltage on any pin with respect to GND
–0.5 to +7.0
V
TSTG
Storage Temperature
–65 to +150
°C
TB
Ambient Temperature under Bias
–55 to +125
°C
TA
Operating Temperature
0 to +70
°C
TC
Case Temperature
115
°C
ESDPROT
Input ESD Protection
2 (min.)
kV
DC Electrical Characteristics: TA = 0°C to +70°C, VDDQ3 = 3.3V±5%
Parameter
Description
Test Condition
Min.
Typ.
Max.
Unit
Supply Current
IDD
3.3V Supply Current
CPUT0, CPUC0,
CPU_CS =100 MHz
Outputs Loaded[3]
260
mA
IDD
2.5V Supply Current
CPUT0, CPUC0,
CPU_CS =100 MHz
Outputs Loaded[3]
25
mA
Logic Inputs
VIL
Input Low Voltage
GND – 0.3
0.8
V
VIH
Input High Voltage
2.0
VDD + 0.3
V
[4]
–25
µA
[4]
10
µA
50
mV
IIL
IIH
Input Low Current
Input High Current
Clock Outputs
VOL
Output Low Voltage
IOL = 1 mA
VOH
Output High Voltage
IOH = –1 mA
VOL
Output Low Voltage
CPU_CS,
CPUT0, CPUC0
Termination to V pull-up
(external)
0
0.3
V
VOH
Output High Voltage
CPU_CS,
CPUT0, CPUC0
Termination to V pull-up
(external)
1.0
1.2
V
IOL
Output Low Current
PCI0:5
VOL = 1.5V
70
110
135
mA
REF0:1
VOL = 1.5V
50
70
100
mA
48 MHz
VOL = 1.5V
50
70
100
mA
24 MHz
VOL = 1.5V
50
70
100
mA
SDRAM0:12
VOL = 1.5V
70
110
135
mA
PCI0:5
VOH = 1.5V
70
110
135
mA
REF0:1
VOH = 1.5V
50
70
100
mA
48 MHz
VOH = 1.5V
50
70
100
mA
24 MHz
VOH = 1.5V
50
70
100
mA
SDRAM0:12
VOH = 1.5V
70
110
135
mA
IOH
Output High Current
3.1
V
Notes:
2. Multiple Supplies: The Voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required.
3. All clock outputs loaded with 6" 60Ω transmission lines with 20-pF capacitors.
4. W230-03 logic inputs (except FS3) have internal pull-up devices (pull-ups not full CMOS level). Logic input FS3 has an internal pull-down device.
Document #: 38-07357 Rev. *A
Page 9 of 15
PRELIMINARY
W230-03
DC Electrical Characteristics: TA = 0°C to +70°C, VDDQ3 = 3.3V±5% (continued)
Parameter
Description
Test Condition
Min.
Typ.
Max.
Unit
Crystal Oscillator
VTH
X1 Input Threshold Voltage[5]
CLOAD
Load Capacitance, Imposed on
External Crystal[6]
CIN,X1
X1 Input Capacitance[7]
VDDQ3 = 3.3V
Pin X2 unconnected
1.65
V
14
pF
28
pF
Pin Capacitance/Inductance
CIN
Input Pin Capacitance
Except X1 and X2
5
pF
COUT
Output Pin Capacitance
6
pF
LIN
Input Pin Inductance
7
nH
AC Electrical Characteristics
TA = 0°C to +70°C, VDDQ3 = 3.3V±5%, fXTL = 14.31818 MHz
AC clock parameters are tested and guaranteed over stated operating conditions using the stated lump capacitive load at the
clock output; Spread Spectrum is disabled.
CPU Clock Outputs (CPUT0, CPUC0, CPU_CS)[8]
CPU = 100 MHz
Parameter
Description
Test Condition/Comments
Min.
Typ. Max.
CPU = 133 MHz
Min.
Typ.
Max.
Unit
tR
Output Rise Edge Rate
1.0
1.0
V/ns
tF
Output Fall Edge Rate
1.0
1.0
V/ns
tD
Duty Cycle
50
50
%
tJC
Jitter, Cycle to Cycle
250
250
ps
fST
Frequency Stabilization Assumes full supply voltage reached
from Power-up (cold
within 1 ms from power-up. Short
start)
cycles exist prior to frequency
stabilization.
3
3
ms
Zo
AC Output Impedance
50
50
Ω
Measured at 50% point
VO = VX
Notes:
5. X1 input threshold voltage (typical) is VDD/2.
6. The W230-03 contains an internal crystal load capacitor between pin X1 and ground and another between pin X2 and ground. Total load placed on crystal is
14 pF; this includes typical stray capacitance of short PCB traces to crystal.
7. X1 input capacitance is applicable when driving X1 with an external clock source (X2 is left unconnected).
8. Refer to Figure 5 for K7 operation clock driver test circuit.
Document #: 38-07357 Rev. *A
Page 10 of 15
PRELIMINARY
W230-03
PCI Clock Outputs, PCI0:5 (Lump Capacitance Test Load = 30 pF
Parameter
Description
Test Condition/Comments
Min.
Typ.
Max.
Unit
tP
Period
Measured on rising edge at 1.5V
30
ns
tH
High Time
Duration of clock cycle above 2.4V
12
ns
tL
Low Time
Duration of clock cycle below 0.4V
12
ns
tR
Output Rise Edge Rate
Measured from 0.4V to 2.4V
1
tF
Output Fall Edge Rate
Measured from 2.4V to 0.4V
tD
Duty Cycle
Measured on rising and falling edge at 1.5V
tJC
Jitter, Cycle-to-Cycle
tSK
4
V/ns
1
4
V/ns
45
55
%
Measured on rising edge at 1.5V. Maximum
difference of cycle time between two adjacent cycles.
250
ps
Output Skew
Measured on rising edge at 1.5V
500
ps
tO
CPU to PCI Clock Skew
Covers all CPU/PCI outputs. Measured on rising
edge at 1.5V. CPU leads PCI output.
4
ns
fST
Frequency Stabilization
from Power-up (cold
start)
Assumes full supply voltage reached within 1 ms
from power-up. Short cycles exist prior to frequency
stabilization.
3
ms
Zo
AC Output Impedance
Average value during switching transition. Used for
determining series termination value.
1.5
Ω
30
REF0:1 Clock Outputs (Lump Capacitance Test Load = 20 pF)
Parameter
Description
f
Frequency, Actual
Test Condition/Comments
Min.
Frequency generated by crystal oscillator
Typ.
Max.
14.318
Unit
MHz
tR
Output Rise Edge Rate
Measured from 0.4V to 2.4V
0.5
2
V/ns
tF
Output Fall Edge Rate
Measured from 2.4V to 0.4V
0.5
2
V/ns
tD
Duty Cycle
Measured on rising and falling edge at 1.5V
45
55
%
fST
Frequency Stabilization from
Power-up (cold start)
Assumes full supply voltage reached within
1 ms from power-up. Short cycles exist prior to
frequency stabilization.
3
ms
Zo
AC Output Impedance
Average value during switching transition. Used
for determining series termination value.
Ω
40
48-MHz Clock Output (Lump Capacitance Test Load = 20 pF)
Parameter
Description
Test Condition/Comments
f
Frequency, Actual
Determined by PLL divider ratio (see m/n below)
fD
Deviation from 48 MHz
(48.008 – 48)/48
Min.
Typ.
Max.
Unit
48.008
MHz
+167
ppm
m/n
PLL Ratio
(14.31818 MHz x 57/17 = 48.008 MHz)
tR
Output Rise Edge Rate
Measured from 0.4V to 2.4V
0.5
2
V/ns
tF
Output Fall Edge Rate
Measured from 2.4V to 0.4V
0.5
2
V/ns
tD
Duty Cycle
Measured on rising and falling edge at 1.5V
45
55
%
fST
Frequency Stabilization
from Power-up (cold start)
Assumes full supply voltage reached within 1 ms
from power-up. Short cycles exist prior to frequency stabilization.
3
ms
Zo
AC Output Impedance
Average value during switching transition. Used
for determining series termination value.
Document #: 38-07357 Rev. *A
57/17
40
Ω
Page 11 of 15
PRELIMINARY
W230-03
24-MHz Clock Output (Lump Capacitance Test Load = 20 pF)
Parameter
Description
Test Condition/Comments
Min.
f
Frequency, Actual
Determined by PLL divider ratio (see m/n below)
fD
Deviation from 24 MHz
(24.004 – 24)/24
Typ.
Max.
Unit
24.004
MHz
+167
ppm
m/n
PLL Ratio
(14.31818 MHz x 57/34 = 24.004 MHz)
tR
Output Rise Edge Rate
Measured from 0.4V to 2.4V
0.5
57/34
2
V/ns
tF
Output Fall Edge Rate
Measured from 2.4V to 0.4V
0.5
2
V/ns
tD
Duty Cycle
Measured on rising and falling edge at 1.5V
45
55
%
fST
Frequency Stabilization
from Power-up (cold start)
Assumes full supply voltage reached within 1 ms
from power-up. Short cycles exist prior to frequency stabilization.
3
ms
Zo
AC Output Impedance
Average value during switching transition. Used
for determining series termination value.
40
Ω
VDD
+ V1
1.5V
3.3
Z0 = 52Ω
Length = 5”
T1
R1
68
Z0 = 52Ω
Length = 3”
T2
R8
CPUCLK_T
47
20p
1.5V
Clock Chip
CPUDriver
R3
68
Z0 = 52Ω
Length = 5”
T4
Z0 = 52Ω
Length = 3”
T5
R9
CPUCLK_C
47
20p
Figure 5. K7 Open Drain Clock Driver Test Circuit
Ordering Information
Ordering Code
Package
Name
W230-03
Document #: 38-07357 Rev. *A
H
Package Type
48-pin SSOP (300 mils)
Page 12 of 15
PRELIMINARY
W230-03
Layout Diagram
+3.3V Supply
FB
VDDQ3
C4
G
G
G
G
10 µF
G
G
C3
V
1 VCore
G
2
3 G
4
5 G
6 V
7 G
8
9 G
10 G
11
12
13 G
14 V
15 G
16
17
18 G
19 V
20 G
21
22 G
23
24 G
DDQ3
48
47
46
G 45
44
G 43
V 42
G
41
40
G 39
38
37
V
36
G
35
34
G 33
32
G 31
V 30
G
29
G
28
V
27
G
26
25
G
W230-03
G
0.005 µF
G
G
G
G
FB = Dale ILB1206 - 300 (300Ω @ 100 MHz)
C3 = 10–22 µF
Ceramic C4 = 0.005 µF
G = VIA to GND plane layer
C6 = 0.01 µF
V =VIA to respective supply plane layer
Note: Each supply plane or strip should have a ferrite bead and capacitors
Document #: 38-07357 Rev. *A
Page 13 of 15
PRELIMINARY
W230-03
Package Diagram
48-Pin Small Shrink Outline Package (SSOP, 300 mils)
Summary of nominal dimensions in inches:
Body Width: 0.296
Lead Pitch: 0.025
Body Length: 0.625
Body Height: 0.102
Document #: 38-07357 Rev. *A
Page 14 of 15
© Cypress Semiconductor Corporation, 2002. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
PRELIMINARY
W230-03
Document Title: W230-03 Spread Spectrum FTG for VIA K7 Chipset
Document Number: 38-07357
REV.
ECN NO.
Issue
Date
Orig. of
Change
**
112252
02/13/02
DSG
Change from Spec number: 38-01035 to 38-07357
*A
122905
12/26/02
RBI
Add power up requirements to maximum ratings requirements.
Document #: 38-07357 Rev. *A
Description of Change
Page 15 of 15