Not Recommended For New Designs www.ti.com bq4015/Y/LY SLUS125B – MAY 1999 – REVISED JANUARY 2010 512 k × 8 NONVOLATILE SRAM (5 V, 3.3 V) Check for Samples: bq4015/Y/LY FEATURES 1 • • • • • • Data Retention for at least 10 Years Without Power Automatic Write-Protection During Power-up/Power-Down Cycles Conventional SRAM Operation, Including Unlimited Write Cycles Internal Isolation of Battery before Power Application 5-V or 3.3-V Operation Industry Standard 32-Pin DIP Package GENERAL DESCRIPTION The CMOS bq4015/Y/LY is a nonvolatile 4,194,304-bit static RAM organized as 524,288 words by 8 bits. The integral control circuitry and lithium energy source provide reliable nonvolatility coupled with the unlimited write cycles of standard SRAM. The control circuitry constantly monitors the single supply for an out-of-tolerance condition. When VCC falls out of tolerance, the SRAM is unconditionally write-protected to prevent an inadvertent write operation. At this time the integral energy source is switched on to sustain the memory until after VCC returns valid. The bq4015/Y/LY uses extremely low standby current CMOS SRAMs, coupled with small lithium coin cells to provide nonvolatility without long write-cycle times and the write-cycle limitations associated with EEPROM. The bq4015/Y/LY requires no external circuitry and is compatible with the industry-standard 4-Mb SRAM pinout. PIN CONNECTIONS 32−Pin DIP Module (TOP VIEW) A18 A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 DQ0 DQ1 DQ2 VSS 1 32 2 31 3 30 4 29 5 28 6 27 7 26 8 25 9 24 10 23 11 22 12 21 13 20 14 19 15 18 16 17 VCC A15 A17 WE A13 A8 A9 A11 OE A10 CE DQ7 DQ6 DQ5 DQ4 DQ3 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2010, Texas Instruments Incorporated bq4015/Y/LY Not Recommended For New Designs SLUS125B – MAY 1999 – REVISED JANUARY 2010 www.ti.com DEVICE INFORMATION Table 1. TERMINAL FUNCTIONS TERMINAL NAME NUMBER I/O DESCRIPTION A0 12 I A1 11 I A2 10 I A3 9 I A4 8 I A5 7 I A6 6 I A7 5 I A8 27 I A9 26 I A10 23 I A11 25 I A12 4 I A13 28 I A14 3 I A15 31 I A16 2 I A17 30 I A18 1 I CE 22 I DQ0 13 I/O DQ1 14 I/O DQ2 15 I/O DQ3 17 I/O DQ4 18 I/O DQ5 19 I/O DQ6 20 I/O DQ7 21 I/O OE 24 I Output enable input VCC 32 I Supply voltage input VSS 16 - Ground WE 29 I Write enable input Address inputs Chip-enable input Data input/output FUNCTIONAL DESCRIPTION When power is valid, the bq4015/Y/LY operates as a standard CMOS SRAM. During power-down and power-up cycles, the bq4015/Y/LY acts as a nonvolatile memory, automatically protecting and preserving the memory contents. Power-down/power-up control circuitry constantly monitors the VCC supply for a power-fail-detect threshold VPFD. The bq4015 monitors for VPFD = 4.62 V typical for use in 5-V systems with 5% supply tolerance. The bq4015Y monitors for VPFD = 4.37 V typical for use in 5-V systems with 10% supply tolerance. The bq4015LY monitors for VPFD = 2.90 V (typ) for use in 3.3-V systems. 2 Submit Documentation Feedback Copyright © 1999–2010, Texas Instruments Incorporated Product Folder Link(s): bq4015/Y/LY bq4015/Y/LY Not Recommended For New Designs www.ti.com SLUS125B – MAY 1999 – REVISED JANUARY 2010 When VCC falls below the VPFD threshold, the SRAM automatically write-protects the data. All outputs become high impedance, and all inputs are treated as don't care. If a valid access is in process at the time of power-fail detection, the memory cycle continues to completion. If the memory cycle fails to terminate within time tWPT, write-protection takes place. As VCC falls past VPFD and approaches VSO, the control circuitry switches to the internal lithium backup supply, which provides data retention until valid VCC is applied. When VCC returns to a level above the internal backup cell voltage, the supply is switched back to VCC. After VCC ramps above the VPFD threshold, write-protection continues for a time tCER (120 ms maximumin 5-V system, 85 ms maximum in 3.3-V system) to allow for processor stabilization. Normal memory operation may resume after this time. The internal coin cells used by the bq4015/Y/LY have an extremely long shelf life and provide data retention for more than 10 years in the absence of system power. As shipped from TI, the integral lithium cells of the MT-type module are electrically isolated from the memory. (Self-discharge in this condition is approximately 0.5% per year.) Following the first application of VCC, this isolation is broken, and the lithium backup provides data retention on subsequent power-downs. BLOCK DIAGRAM DIP MODULE bq4015/Y/LY MA PACKAGE OE A0 - A18 512 k × 8 SRAM Block WE Power CE DQ0 - DQ7 CECON Power-Fail Control + VCC Lithium Cell UDG-06075 Table 2. TRUTH TABLE MODE CE WE OE I/O OPERATION POWER Not selected H X X High-Z Standby Output disable L H H High-Z Active Read L H L DOUT Active Write L L X DIN Active Submit Documentation Feedback Copyright © 1999–2010, Texas Instruments Incorporated Product Folder Link(s): bq4015/Y/LY 3 bq4015/Y/LY Not Recommended For New Designs SLUS125B – MAY 1999 – REVISED JANUARY 2010 www.ti.com ORDERING INFORMATION For the most current package and ordering information, see the Package Option Addendum at the end of the datasheet, or see the TI website at www.ti.com. Table 3. SELECTION GUIDE MAXIMUM ACCESS TIME (ns) DEVICE NUMBER bq4015MA-70 70 bq4015MA-85 85 bq4015YMA-70 70 bq4015YMA-85 85 bq4015LYMA-70N 70 NEGATIVE SUPPLY TOLERANCE (%) NOMINAL INPUT VOLTAGE VCC (V) TEMPERATURE (°C) 5 -40 to 85 -5 -10 3.3 Table 4. PART NUMBERING PRODUCT LINE MEMORY DENSITY INPUT VOLTAGE (V) NEGATIVE SUPPLY TOLERANCE PACKAGE SPEED (ns) bq40 15 L Y MA 70 10 = 8 k × 8 Blank = 5 Blank = 5% MA = DIP 11 = 32 k × 8 L= 3.3 Y = 10% 70 TEMPERATURE (°C) -40 to 85 85 13 = 128 k × 8 100 14 = 256 k × 8 120 15 = 512 k × 8 150 16 = 1024 k × 8 200 17 = 2048 k × 8 4 Submit Documentation Feedback Copyright © 1999–2010, Texas Instruments Incorporated Product Folder Link(s): bq4015/Y/LY bq4015/Y/LY Not Recommended For New Designs www.ti.com SLUS125B – MAY 1999 – REVISED JANUARY 2010 ABSOLUTE MAXIMUM RATINGS (1) PARAMETER VCC CONDITION VALUE –0.3 to 7.0 bq4015 –0.3 to 7.0 DC voltage applied on VCC relative to VSS bq4015LY –0.3 to 6.0 bq4015Y –0.3 to 7.0 bq4015 –0.3 to 7.0 VT DC voltage applied on any pin excluding VVT ≤ VVCC +0.3 V VCC relative to VSS TOPR Operating temperature –40 to 85 TSTG Storage temperature –40 to 85 TBIAS Temperature under bias –40 to 85 TSOLDER Soldering temperature bq4015LY (1) UNIT bq4015Y V V –0.3 to (VCC + 0.3) For 10 seconds °C 260 Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Exposure to conditions beyond the operational limits for extended periods of time may affect device reliability. RECOMMENDED OPERATING CONDITIONS (TA = TOPR) VCC MIN TYP (1) MAX bq4015Y 4.50 5.00 5.50 bq4015 4.75 5.00 5.50 bq4015LY 3.00 3.30 3.60 0 0 0 Supply voltage VSS Supply voltage VIL Low-level input voltage –0.3 0.8 VIH High-level Input voltage 2.2 VCC + 0.3 (1) UNIT V Typical values indicate operation at TA = 25°C. DC ELECTRICAL CHARACTERISTICS TA = TOPR, VCC(min) ≤ VCC ≤ VCC(max) PARAMETER TEST CONDITIONS MIN TYP (1) MAX ILI Input leakage current VIN = VSS to VCC ±1 ILO Output leakage current CE = VIH or OE = VIH or WE = VIL ±1 VOH Output high voltage IOH = –1.0 mA VOL Output low voltage IOL = 2.1 mA ISB1 Standby supply current CE = VIH ISB2 Standby supply current CE ≥ VCC – 0.2 V, 0V ≤ VIN ≤ 0.2 V, or VIN ≥ VCC –0.2 ICC Operating supply current 2.4 0.4 Power-fail-detect voltage μA 0.1 1 mA 50 Minimum cycle, duty = 100%, CE = VIL, II/O = 0 mA VSO (1) Supply switch-over voltage mA 50 bq4015 4.55 4.62 4.75 bq4015Y 4.30 4.37 4.50 bq4015LY 2.85 2.90 2.95 bq4015 V 2 bq4015LY VPFD μA 1 bq4015 bq4015Y UNIT 3 bq4015Y 3 bq4015LY 2.9 V Typical values indicate operation at TA = 25°C, VCC = 5.0 V or VCC = 3.3 V. Submit Documentation Feedback Copyright © 1999–2010, Texas Instruments Incorporated Product Folder Link(s): bq4015/Y/LY 5 bq4015/Y/LY Not Recommended For New Designs SLUS125B – MAY 1999 – REVISED JANUARY 2010 www.ti.com CAPACITANCE (TA = 25°C, f = 1 MHz, VCC = 5.0 V or VCC = 3.3 V) PARAMETER (1) TEST CONDITIONS CI/O Input/output capacitance Output voltage = 0 V CIN Input capacitance Input voltage = 0 V (1) MIN TYP MAX 8 10 UNIT pF Ensured by design. Not production tested. AC TEST CONDITIONS TEST CONDITIONS PARAMETER Input pulse levels Input rise and fall times Input and output timing reference levels 5V 3.3 V 0 V to 3.0 V 0 V to VCC 5 ns 5 ns 1.5 V (unless otherwise specified) 50 % See Figure 1 and Figure 2 See Figure 3 and Figure 4 Output load (including scope and jig) +5V +5V 1.9 kW DOUT 1.9 kW DOUT 1 kW 100 pF Figure 1. 5-V Output Load A 1 kW Figure 2. 5-V Output Load B + 3.3 V + 3.3 V 1.2 kW DOUT 1.2 kW DOUT 1.4 kW 30 pF Figure 3. 3.3-V Output Load A 6 5 pF 1.4 kW 5 pF Figure 4. 3.3-V Output Load B Submit Documentation Feedback Copyright © 1999–2010, Texas Instruments Incorporated Product Folder Link(s): bq4015/Y/LY bq4015/Y/LY Not Recommended For New Designs www.ti.com SLUS125B – MAY 1999 – REVISED JANUARY 2010 Table 5. READ CYCLE (TA = TOPR, VCC(min) ≤ VCC ≤ VCC(max)) PARAMETER TEST CONDITIONS -70 MIN -85 MAX MIN tRC Read cycle time tAA Address access time 70 tACE Chip enable access time tOE Output enable to output valid tCLZ Chip enable to output in low Z 5 5 tOLZ Output enable to output in low Z 0 0 tCHZ Chip disable to output in high Z tOHZ Output disable to output in high Z tOH Output hold from address change MAX 85 Output load A 70 85 70 85 35 Output load B Output load A UNIT 45 ns 0 25 0 35 0 25 0 25 10 10 tRC Address tAA tOH DOUT Previous Data Valid (1) WE is held high for a read cycle. (2) Device is continuously selected: CE = OE = VIL. Data Valid Figure 5. Read Cycle No. 1 (Address Access) tRC CE tACE tCHZ tCLZ DOUT High−Z High−Z (1) WE is held high for a read cycle. (2) Device is continuously selected: CE = OE = VIL. (3) Address is valid prior to or coincident with CE transition low. Figure 6. Read Cycle No. 2 (CE Access) Submit Documentation Feedback Copyright © 1999–2010, Texas Instruments Incorporated Product Folder Link(s): bq4015/Y/LY 7 bq4015/Y/LY Not Recommended For New Designs SLUS125B – MAY 1999 – REVISED JANUARY 2010 www.ti.com tRC Address tAA OE tOHZ tOE tOLZ DOUT Data Valid High−Z High−Z (1) WE is held high for a read cycle. (2) Device is continuously selected: CE = VIL. Figure 7. Read Cycle No. 3 (OE Access) 8 Submit Documentation Feedback Copyright © 1999–2010, Texas Instruments Incorporated Product Folder Link(s): bq4015/Y/LY bq4015/Y/LY Not Recommended For New Designs www.ti.com SLUS125B – MAY 1999 – REVISED JANUARY 2010 Table 6. WRITE CYCLE (TA = TOPR, VCC(min) ≤ VCC ≤ VCC(max)) PARAMETER -70 TEST CONDITIONS -85 MIN MAX MIN tWC Write cycle time 70 85 tCW Chip enable to end of write See (1) 65 75 tAW Address valid to end of write See (1) 65 75 tAS Address setup time Measured from address valid to beginning of write. (2) 0 0 tWP Write pulse width 55 65 tWR1 Write recovery time (write cycle 1) Measured from WE going high to end of write cycle. (3) 5 5 tWR2 Write recovery time (write cycle 2) Measured from CE going high to end of write cycle.(3) 15 15 tDW Data valid to end of write Measured to first low-to- high transition of either CE or WE. 30 35 tDH1 Data hold time (write cycle 1) Measured from WE going high to end of write cycle. (4) 0 0 tDH2 Data hold time (write cycle 2) Measured from CE going high to end of write cycle.(4) 10 10 Measured from beginning of write to end of write. (1) (5) 0 5 tWZ Write enbled to output in high Z I/O pins are in output state. tOW Output active from end of write I/O pins are in output state. (5) (1) (2) (3) (4) (5) 25 0 MAX UNIT ns 30 0 A write ends at the earlier transition of CE going high and WE going high. A write occurs during the overlap of a low CE and a low WE. A write begins at the later transition of CE going low and WE going low. Either tWR1 or tWR2 must be met. Either tDH1 or tDH2 must be met. If CE goes low simultaneously with WE going low or after WE going low, the outputs remain in high-impedance state. tWC Address tAW tWR1 tCW CE tAS tWP WE tDW tDH1 Data−In Valid DIN tWZ DOUT tOW Data Undefined (1) High−Z (1) CE or WE must be high during address transition. (2) Because I/O may be active (OE low) during this period, data input signals of opposite polarity to the outputs must not be applied. (3) If OE is high, the I/O pins remain in a state of high impedance. Figure 8. Write Cycle No. 1 (WE-Controlled) Submit Documentation Feedback Copyright © 1999–2010, Texas Instruments Incorporated Product Folder Link(s): bq4015/Y/LY 9 bq4015/Y/LY Not Recommended For New Designs SLUS125B – MAY 1999 – REVISED JANUARY 2010 www.ti.com tWC Address tAW tAS tWR2 tCW CE tWP WE tDW DIN tDH2 Data−in Valid tWZ DOUT Data Undefined (1) High−Z (1) CE or WE must be high during address transition. (2) Because I/O may be active (OE low) during this period, data input signals of opposite polarity to the outputs must not be applied. (3) If OE is high, the I/O pins remain in a state of high impedance. (4) Either tWR1 or tWR2 must be met. (5) Either tDH1 or tDH2 must be met. Figure 9. Write Cycle No. 2 (CE-Controlled) 10 Submit Documentation Feedback Copyright © 1999–2010, Texas Instruments Incorporated Product Folder Link(s): bq4015/Y/LY bq4015/Y/LY Not Recommended For New Designs www.ti.com SLUS125B – MAY 1999 – REVISED JANUARY 2010 Table 7. 5-V POWER-DOWN/POWER-UP (TA = TOPR) PARAMETER tPF VCC slew, 4.75 to 4.25 V tFS VCC slew, 4.25 to VSO tPU VCC slew, VSO to VPFD (max.) tCER tWPT (1) (2) μs μs 0 μs 40 TA = 25°C Write-protect time Delay after VCC slews down past VPFD before SRAM is writeprotected. UNIT 10 (2) Data-retention time in absence of VCC MAX 300 Time during which SRAM is write-protected after VCC passes VPFD on power-up. Chip enable recovery time tDR MIN TYP (1) TEST CONDITIONS 80 120 10 40 ms years 100 150 μs Typical values indicate operation at TA = 25°C, VCC = 5V. Batteries are disconnected from circuit until after VCC is applied for the first time. tDR is the accumulated time in absence of power beginning when power is first applied to the device. tPF VCC 4.75 V VPFD VPFD 4.25 V VSO VSO tFS tDR tPU tCER tWPT CE Figure 10. 5-V Power-Down/Power-Up Timing Submit Documentation Feedback Copyright © 1999–2010, Texas Instruments Incorporated Product Folder Link(s): bq4015/Y/LY 11 bq4015/Y/LY Not Recommended For New Designs SLUS125B – MAY 1999 – REVISED JANUARY 2010 www.ti.com Table 8. 3.3-V POWER-DOWN/POWER-UP (TA = TOPR) PARAMETER MIN TYP (1) TEST CONDITIONS tF VCC slew, 3 V to 0 V 300 tR VCC slew, VSO to VPFD (max) 100 tCER Chip enable recovery time Time during which SRAM is write-protected after VCC passes VPFD on power-up. 10 tDR Data-retention time in absence of VCC TA = 25°C (2) 10 (1) (2) MAX UNIT μs 85 ms years Typical values indicate operation at TA = 25°C, VCC = 3.3 V. Batteries are disconnected from circuit until after VCC is applied for the first time. Data retention time (tDR) is the accumulated time in absence of power beginning when power is first applied to the device. VCC 3.0 V VPFD(max) VPFD VSO VSO tR tDR tCER tF CE Figure 11. 3.3-V Power-Down/Power-Up Timing Negative undershoots below the absolute maximum rating of -0.3 V in battery-backup mode may affect data integrity. 12 Submit Documentation Feedback Copyright © 1999–2010, Texas Instruments Incorporated Product Folder Link(s): bq4015/Y/LY PACKAGE OPTION ADDENDUM www.ti.com 6-Jun-2013 PACKAGING INFORMATION Orderable Device Status (1) BQ4015LYMA-70 Package Type Package Pins Package Drawing Qty Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) (3) MA 32 TBD Call TI Call TI MA 32 12 Pb-Free (RoHS) Call TI N / A for Pkg Type -40 to 85 BQ4015MA-70 LIFEBUY DIP MODULE MA 32 12 Pb-Free (RoHS) Call TI N / A for Pkg Type 0 to 70 BQ4015YMA-70 LIFEBUY DIP MODULE MA 32 12 Pb-Free (RoHS) Call TI N / A for Pkg Type 0 to 70 BQ4015YMA-85 LIFEBUY DIP MODULE MA 32 12 Pb-Free (RoHS) Call TI N / A for Pkg Type 0 to 70 NRND Device Marking (4/5) DIP MODULE BQ4015LYMA-70N LIFEBUY DIP MODULE Eco Plan (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 6-Jun-2013 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MPDI061 – MAY 2001 MA (R-PDIP-T**) PLASTIC DUAL-IN-LINE 28 PINS SHOWN Millimeters Inches D Dimension Min. Max. Min. Max. A 0.365 0.375 9.27 A1 0.015 – 0.38 9.53 – B 0.017 0.023 0.43 0.58 C 0.008 0.013 0.20 0.33 D/12 PIN 0.710 0.740 18.03 18.80 D/28 PIN 1.470 1.500 37.34 38.10 D/32 PIN 1.670 1.700 42.42 43.18 D/40 PIN 2.070 2.100 52.58 53.34 E 0.710 0.740 18.03 18.80 e G 0.590 0.630 14.99 16.00 0.090 0.110 2.29 2.79 L 0.120 0.150 3.05 3.81 S/12 PIN 0.105 0.130 2.67 3.30 S 0.075 0.110 1.91 2.79 E A L A1 C B e S G 4201975/A 03/01 NOTES: A. All linear dimensions are in inches (mm). B. 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