BF721T1G PNP Silicon Transistor Features These Devices are Pb--Free, Halogen Free/BFR Free and are RoHS Compliant http://onsemi.com MAXIMUM RATINGS Rating Symbol Value Unit Collector -- Emitter Voltage VCEO --300 Vdc Collector -- Base Voltage VCBO --300 Vdc Collector -- Emitter Voltage VCER --300 Vdc Emitter -- Base Voltage VEBO --5.0 Vdc Collector Current IC --50 mAdc Total Power Dissipation up to TA = 25C (Note 1) PD 1.5 W Storage Temperature Range Tstg --65 to +150 C Junction Temperature TJ 150 C Symbol Max Unit RθJA 83.3 C/W PNP SILICON TRANSISTOR SURFACE MOUNT COLLECTOR 2,4 BASE 1 EMITTER 3 THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction--to--Ambient (Note 1) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 in2. MARKING DIAGRAM 1 AYW DF G G SOT--223 (TO--261) CASE 318E STYLE 1 1 A = Assembly Location Y = Year W = Work Week DF = Device Code G = Pb--Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device BF721T1G Package Shipping† SOT--223 (Pb--Free) 1000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 2010 September, 2010 -- Rev. 9 1 Publication Order Number: BF721T1/D BF721T1G ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Characteristic Symbol Min Max Unit Collector-Emitter Breakdown Voltage (IC = --1.0 mAdc, IB = 0) V(BR)CEO -- 300 -- Vdc Collector-Base Breakdown Voltage (IC = --100 mAdc, IE = 0) V(BR)CBO --300 -- Vdc Collector-Emitter Breakdown Voltage (IC = --100 mAdc, RBE = 2.7 kΩ) V(BR)CER --300 -- Vdc Emitter-Base Breakdown Voltage (IE = --10 mAdc, IC = 0) V(BR)EBO -- 5.0 -- Vdc Collector-Base Cutoff Current (VCB = -- 200 Vdc, IE = 0) ICBO -- --10 nAdc Collector--Emitter Cutoff Current (VCE = -- 250 Vdc, RBE = 2.7 kΩ) (VCE = -- 200 Vdc, RBE = 2.7 kΩ TJ = 150C) ICER --- --50 --10 nAdc mAdc OFF CHARACTERISTICS ON CHARACTERISTICS DC Current Gain (IC = --25 mAdc, VCE = --20 Vdc) hFE 50 -- -- Collector-Emitter Saturation Voltage (IC = -- 30 mAdc, IB = -- 5.0 mAdc) VCE(sat) -- -- 0.8 Vdc fT 60 -- MHz Cre -- 1.6 pF DYNAMIC CHARACTERISTICS Current-Gain -- Bandwidth Product (VCE = -- 10 Vdc, IC = --10 mAdc, f = 35 MHz) Feedback Capacitance (VCE = -- 30 Vdc, IC = 0, f = 1.0 MHz) http://onsemi.com 2 BF721T1G 300 hFE , DC CURRENT GAIN VCE = 10 Vdc TJ = +125C 250 200 25C 150 --55C 100 50 0 0.1 1.0 10 100 IC, COLLECTOR CURRENT (mA) Figure 1. DC Current Gain Cib @ 1MHz f T, CURRENT--GAIN — BANDWIDTH (MHz) C, CAPACITANCE (pF) 100 10 Ccb @ 1MHz 1.0 0.1 0.1 1.0 10 100 VR, REVERSE VOLTAGE (VOLTS) 150 130 110 90 70 50 30 10 1000 TJ = 25C VCE = 20 Vdc F = 20 MHz 1 Figure 2. Capacitance 3 5 11 13 15 7 9 IC, COLLECTOR CURRENT (mA) 17 19 21 Figure 3. Current--Gain — Bandwidth 1.4 V, VOLTAGE (VOLTS) 1.2 VCE(sat) @ 25C, IC/IB = 10 VCE(sat) @ 125C, IC/IB = 10 VCE(sat) @ --55C, IC/IB = 10 VBE(sat) @ 25C, IC/IB = 10 1.0 0.8 VBE(sat) @ 125C, IC/IB = 10 VBE(sat) @ --55C, IC/IB = 10 VBE(on) @ 25C, VCE = 10 V VBE(on) @ 125C, VCE = 10 V VBE(on) @ --55C, VCE = 10 V 0.6 0.4 0.2 0.0 0.1 1.0 10 IC, COLLECTOR CURRENT (mA) 100 Figure 4. “ON” Voltages http://onsemi.com 3 BF721T1G PACKAGE DIMENSIONS SOT--223 (TO--261) CASE 318E--04 ISSUE N D b1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 4 HE 1 2 3 b e1 e A1 C θ A 0.08 (0003) DIM A A1 b b1 c D E e e1 L L1 HE E MIN 1.50 0.02 0.60 2.90 0.24 6.30 3.30 2.20 0.85 0.20 1.50 6.70 0 θ L STYLE 1: PIN 1. 2. 3. 4. L1 MILLIMETERS NOM MAX 1.63 1.75 0.06 0.10 0.75 0.89 3.06 3.20 0.29 0.35 6.50 6.70 3.50 3.70 2.30 2.40 0.94 1.05 ----------1.75 2.00 7.00 7.30 10 -- MIN 0.060 0.001 0.024 0.115 0.009 0.249 0.130 0.087 0.033 0.008 0.060 0.264 0 INCHES NOM 0.064 0.002 0.030 0.121 0.012 0.256 0.138 0.091 0.037 -----0.069 0.276 -- MAX 0.068 0.004 0.035 0.126 0.014 0.263 0.145 0.094 0.041 -----0.078 0.287 10 BASE COLLECTOR EMITTER COLLECTOR SOLDERING FOOTPRINT* 3.8 0.15 2.0 0.079 2.3 0.091 2.3 0.091 6.3 0.248 2.0 0.079 1.5 0.059 SCALE 6:1 mm inches *For additional information on our Pb--Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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