ONSEMI CM1454-08CP

Data Port EMI Filter Array
with ESD Protection
CM1454
Features
•
•
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•
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Optiguard™ coated for improved reliability
Eight channels of EMI filtering
Three C-L-C filters with ESD protection for stereo
speaker port
Five C-R-C filters with ESD protection for
microphone and data ports
+15kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
+30kV ESD protection on each channel (HBM)
Chip Scale Package (CSP) features extremely
low parasitic inductance for optimum filter and
ESD performance
20 bump, 3.960mm x 1.586mm footprint CSP
RoHS compliant (lead-free)
Applications
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Combination I/O data port that has I/Os for data,
microphone and speaker
I/O port protection for mobile handsets, notebook
computers, PDAs etc
"EMI filtering for data ports in cell phones,
PDAs or notebook computers
Wireless Handsets
Handheld PCs / PDAs
Product Description
The CM1454 is an EMI filter array with ESD
protection in a CSP form factor for the data port of a
mobile handset. The CM1454-08 is configured in an
8 channel format and combines both resistorcapacitor (R-C) and inductor-capacitor (L-C) filters in
the chip. There are five C-R-C filters with component
values of 30pF-100 -30pF which are used for the
microphone and data ports. There are also three CL-C filters with values of 80pF-3nH-80pF which are
designed for the stereo speaker port.
The CM1454's C-RC filters have a cut-off frequency
of 60MHz and an attenuation of better than 35dB
over the 800MHz to 2.7GHz frequency range. The
C-L-C filters have a cut-off frequency of 21MHz with
an attenuation of 40dB at 1Ghz. The parts integrate
ESD protection diodes on every pin that provide a
very high level of protection for sensitive electronic
components against possible electrostatic discharge
(ESD). The ESD protection diodes connected to the
filter ports are designed and characterized to safely
dissipate ESD strikes of ±15kV, which is beyond the
Level 4 requirement of the IEC61000-4-2
international standard. In accordance with MIL-STD883 (Method 3015) specification for Human Body
Model (HBM) ESD, the pins are also protected for
contact discharges at greater than ±30kV.
The CM1454 incorporates OptiGuard™ which results
in improved reliability at assembly. The CM1454 is
available in a space saving, low profile Chip Scale
Package with, RoHS compliant, lead-free finishing.
©2010 SCILLC. All rights reserved.
April 2010 Rev. 2
Publication Order Number:
CM1454/D
CM1454
Electrical Schematic
Figure 1. CM1454 Schematic Diagram of R-C and L-C Filter Arrays with ESD
Rev. 2 | Page 2 of 10 | www.onsemi.com
CM1454
PIN DESCRIPTIONS
PIN
DESCRIPTION
PIN NUMBER
PIN NUMBER
PIN
DESCRIPTION
A1
Filter #1 (Microphone)
B3
GND
A2
Filter #2 (Microphone)
B4
GND
A3
Filter #3 (Stereo Headphone)
C1
Filter #1
A4
Filter #4 (Left Speaker)
C2
Filter #2
A5
Filter #5 (Right Speaker)
C3
Filter #3
A6
Filter #6 (Accessory ID)
C4
Filter #4
A7
Filter #7 (Data)
C5
Filter #5
A8
Filter #8(Data)
C6
Filter #6
B1
GND
C7
Filter #7
B2
GND
C8
Filter #8
Rev. 2 | Page 3 of 10 | www.onsemi.com
CM1454
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish
Bumps
Package
20
CSP
1
Ordering Part Number
Part Marking
CM1454-08CP
N548
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
-65 to +150
°C
DC current per Inductor
30
mA
DC Package Power Rating
0.5
W
RATING
UNITS
-40 to +85
°C
Storage Temperature Range
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
Rev. 2 | Page 4 of 10 | www.onsemi.com
CM1454
ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
80
100
120
Ω
24
30
36
pF
R
Resistance
C1
Capacitance
L
Inductance
3.0
nH
RE
Equivalent Series Resistance of Inductor
0.25
Ω
C2
Capacitance
2.5V dc; 1MHz, 30mV ac
0V dc; 1MHz, 30mV ac;
100
125
150
pF
2.5V dc; 1MHz, 30mV ac;
64
80
96
pF
fRC
Cut-off frequency
ZSOURCE = 50Ω, ZLOAD = 50Ω
60
MHz
fLC
Cut-off frequency
ZSOURCE = 50Ω, ZLOAD = 50Ω
21
MHz
VST
Stand-off Voltage
I = 10μA
6.0
V
ILEAK
Diode Leakage Current
VIN = 3.3V
0.1
1.0
μA
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
ILOAD = -10mA
6.8
-0.8
9.0
-0.4
V
V
VESD
RDYN
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883, Method
3015
b) Contact Discharge per IEC 61000-4-2 Level
4
5.6
-1.5
Notes 2 and 3
Dynamic Resistance
Positive
Negative
±30
kV
±15
kV
2.3
0.9
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Unused pins are left open.
Rev. 2 | Page 5 of 10 | www.onsemi.com
Ω
Ω
CM1454
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 2. Attenuation Curve for CM1454 RC Filters: 1, 2, 6, 7, and 8
Figure 3. Attenuation Curve for CM1454 RC Filters: 3, 4, and 5
Rev. 2 | Page 6 of 10 | www.onsemi.com
CM1454
Diode Characteristics (nominal conditions unless specified otherwise)
Figure 4. Typical Diode Capacitance VS. Input Voltage (normalized to 2.5VDC)
Rev. 2 | Page 7 of 10 | www.onsemi.com
CM1454
Application Information
PARAMETER
VALUE
Pad Size on PCB
0.240mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.290mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
Solder Mask Opening
0.290mm DIA.
Figure 5. Recommended Non-Solder Mask Defined Pad Illustration
Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev. 2 | Page 8 of 10 | www.onsemi.com
260°C
CM1454
Mechanical Specifications
CM1454 devices are packaged in custom Chip Scale Packages (CSP). See Application Note AP-217 for more
information at: http://www.wlcspforum.org/documents/pdf/ap-217.pdf.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
20
Millimeters
Inches
Dim
Min
Nom
Max
Min
Nom
Max
A1
3.915 3.960 4.005 0.1541 0.1559 0.1577
A2
1.541 1.586 1.631 0.0607 0.0624 0.0642
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.180 0.230 0.280 0.0071 0.0091 0.0110
C2
0.308 0.358 0.408 0.0121 0.0141 0.0161
D1
0.574 0.644 0.714 0.0226 0.0254 0.0281
D2
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
Package Dimensions for
CM1454-08CP Chip Scale Package
3500 pieces
Controlling dimension: millimeters
Rev. 2 | Page 9 of 10 | www.onsemi.com
CM1454
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1454-08CP
3.96 X 1.586X 0.640
4.06 X 1.98 X 0.76
12mm
330mm (13")
3500
4mm
4mm
+
+
+
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the
rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or
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Rev. 2 | Page 10 of 10 | www.onsemi.com
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