4-Channel EMI Filter Array with ESD Protection CM1425 Features Product Description • The CM1425 is an EMI filter array with ESD protection, which integrates 4 pi filters (C-R-C). The CM1425 has component values of 20pF-100Ω-20pF. The parts include ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of ±15kV, well beyond the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. • • • • • • • Four channels of EMI filtering with ESD protection Pin compatible with CMD’s CSPRC032A Greater than 30dB attenuation over the 800MHz to 3GHz frequency range ±15kV ESD protection (IEC 61000-4-2, contact discharge) ±30kV ESD protection (HBM) 9-bump, 2.470mm x 0.970mm footprint Chip Scale Package (CSP) Available with OptiGuard™ coating for improved reliability Lead-free versions available Applications • • • • Filtering for antenna and keypad data lines I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. EMI filtering for LCD and chip-to-chip data lines in mobile electronic devices that use flexible PCB interconnections This device is particularly well-suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package and easyto-use pin assignments. In particular, the CM1425 is ideal for EMI filtering and protecting data lines from ESD in wireless handsets. All CM1425 devices are optionally available with OptiGuard™ coating which results in improved reliability at assembly. These devices are also available with standard and lead-free finishing. The CM1425 is housed in a space-saving, low-profile, chip-scale package and is fabricated with the Centurion™ processes. ©2010 SCILLC. All rights reserved. April 2010 Rev. 2 Publication Order Number: CM1425/D CM1425 Block Diagram Rev. 2 | Page 2 of 9 | www.onsemi.com CM1425 PIN DESCRIPTIONS PIN(s) NAME DESCRIPTION PIN(s) NAME DESCRIPTION A1 FILTER+ESD1 Filter Channel 1 B1 FILTER+ESD1 Filter Channel 1 A2 FILTER+ESD2 Filter Channel 2 B2 FILTER+ESD2 Filter Channel 2 A4 FILTER+ESD3 Filter Channel 3 B4 FILTER+ESD3 Filter Channel 3 A5 FILTER+ESD4 Filter Channel 4 B5 FILTER+ESD4 Filter Channel 4 B3 GND Device Ground Ordering Information PART NUMBERING INFORMATION 2 Standard Finish Lead-free Finish OptiGuard™ Coated No Coating OptiGuard™ Coated -No Coating Bumps PKG Ordering Part 1 Number Part Marking Ordering Part 1 Number Part Marking Ordering Part 1 Number Part Marking Ordering Part 1 Number Part Marking 9 CSP CM1425-01CS N251 CM1425-03CS N253 CM1425-01CP N251 CM1425-03CP N253 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C Power Rating per Resistor 100 mW Package Power Rating 300 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Rev. 2 | Page 3 of 9 | www.onsemi.com CM1425 ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS 80 100 120 Ω 16 20 24 pF R Resistance C Capacitance At 2.5V DC, 1MHz, 30mV AC Diode Standoff Voltage IDIODE = 10μA 6.0 ILEAK Diode Leakage Current (reverse bias) VDIODE = + 3.3V 100 300 nA VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA ILOAD = -10mA 6.8 -0.8 9.0 -0.4 V V VDIODE VESD RDYN f C In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-42 Level 4 Note 2 Dynamic Resistance Positive Negative Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω 5.6 -1.5 V ±30 kV ±15 kV 1.5 0.9 Ω Ω 86 MHz R = 100Ω, C = 20pF Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Rev. 2 | Page 4 of 9 | www.onsemi.com CM1425 Performance Information . Figure 1. CM1425 Filter Typical Measured Frequency Response Figure 2. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) Rev. 2 | Page 5 of 9 | www.onsemi.com CM1425 Application Information PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 5. Recommended Non-Solder Mask Defined Pad Illustration Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 2 | Page 6 of 9 | www.onsemi.com 260°C CM1425 Mechanical Details CM1425 devices are packaged in a custom a 9-bump custom Chip Scale Packages (CSP) and available with optional OptiGuardTM coating. Dimensions are presented below. PACKAGE DIMENSIONS Package Custom CSP Bumps 9 Millimeters Inches Dim Min Nom Max A1 0.925 0.970 1.015 0.0364 0.0382 0.0400 A2 2.425 2.470 2.515 0.0955 0.0972 0.0990 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.495 0.500 0.505 0.0195 0.0197 0.0199 C1 0.185 0.235 0.285 0.0073 0.0093 0.0112 C2 0.185 0.235 0.285 0.0073 0.0093 0.0112 D11 0.562 0.606 0.650 0.0221 0.0239 0.0256 D21 0.356 0.381 0.406 0.0140 0.0150 0.0160 D32 0.575 0.644 0.714 0.0226 0.0254 0.0281 D42 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Min Nom Max 3500 pieces Controlling dimension: millimeters Note 1: Applies to uncoated devices only. Note 2: Applies to OptiGuard™ (coated) devices only. Package Dimensions CM1425 9-bump Chip Scale Package Rev. 2 | Page 7 of 9 | www.onsemi.com CM1425 Mechanical Details (cont’d) CSP Tape and Reel Specifications TAPE WIDTH W REEL DIA. QTY PER REEL P0 P1 PART NUMBER PKG. SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 CM1425-01 2.470 X 0.970 X 0.606 2.62 X 1.12 X 0.762 8mm 178mm (7") 3500 4mm 4mm CM1425-03 2.470 X 0.970 X 0.644 2.62 X 1.12 X 0.762 8mm 178mm (7") 3500 4mm 4mm Figure 6. Tape and Reel Mechanical Data Rev. 2 | Page 8 of 9 | www.onsemi.com CM1425 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 Rev. 2 | Page 9 of 9 | www.onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative