6-Channel EMI Filter Array with ESD Protection CSPEMI306A Features Product Description • • The CSPEMI306A is a six channel low-pass filter array that reduces EMI/RFI emissions while at the same time providing ESD protection. It is used on data ports on mobile devices. To reduce EMI/RFI emissions, the CSPEMI306A integrates a pi-style filter (C-R-C) for each of the 6 channels. Each high quality filter provides greater than 30dB attenuation in the 800-2700 MHz range. These pi-style filters also support bidirectional filtering, controlling EMI both to and from a data port connector. • • • • • • Six channels of EMI filtering for data ports Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network Greater than 32dB attenuation at 1GHz +15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +30kV ESD protection on each channel (HBM) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 15-bump, 2.960mm X 1.330mm footprint Chip Scale Package (CSP) Lead-free version available Applications • • • • • • EMI filtering and ESD protection for both data and I/O ports Wireless Handsets Handheld PCs / PDAs MP3 Players Notebooks Desktop PCs In addition, the CSPEMI306A provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins safely dissipate ESD strikes of +15kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MILSTD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +30kV. The CSPEMI306A is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package footprint and low weight. The CSPEMI306A is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. ©2010 SCILLC. All rights reserved. May 2010 Rev. 2 Publication Order Number: CSPEMI306A/D CSPEMI306A Electrical Schematic 1 of 6 EMI/RFI + ESD Channels Lead-free devices are specified by using a "+" character for the top side orientation mark. Rev. 2 | Page 2 of 13 | www.onsemi.com CSPEMI306A PIN DESCRIPTIONS PIN(s) NAME DESCRIPTION A1 FILTER1 Filter Channel 1 A2 FILTER2 Filter Channel 2 A3 FILTER3 Filter Channel 3 A4 FILTER4 Filter Channel 4 A5 FILTER5 Filter Channel 5 A6 FILTER6 Filter Channel 6 B1-B3 GND Device Ground C1 FILTER1 Filter Channel 1 C2 FILTER2 Filter Channel 2 C3 FILTER3 Filter Channel 3 C4 FILTER4 Filter Channel 4 C5 FILTER5 Filter Channel 5 C6 FILTER6 Filter Channel 6 Ordering Information PART NUMBERING INFORMATION Standard Finish Lead-free Finish 2 Bumps Package Ordering Part 1 Number Part Marking Ordering Part 1 Number Part Marking 15 CSP CSPEMI306A 306A CSPEMI306AG 306A Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. Rev. 2 | Page 3 of 13 | www.onsemi.com CSPEMI306A Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 600 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Rev. 2 | Page 4 of 13 | www.onsemi.com CSPEMI306A ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL PARAMETER R Resistance C Capacitance CONDITIONS At 2.5V DC TCR Temperature Coefficient of Resistance TCC Temperature Coefficient of Capacitance At 2.5V DC VDIODE Diode Voltage (reverse bias) IDIODE=10µA ILEAK Diode Leakage Current (reverse bias) VDIODE=3.3V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2 and 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3 and 4 Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω R = 100Ω, C = 30pF VESD VCL fC MIN TYP MAX UNITS 80 100 120 Ω 24 30 36 pF 1200 ppm/°C -300 ppm/°C 5.5 5.6 -0.4 V 6.8 -0.8 100 nA 9.0 -1.5 V V ±30 kV ±15 kV +10 -5 V V 58 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open. Rev. 2 | Page 5 of 13 | www.onsemi.com CSPEMI306A Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B2) Figure 2. Insertion Loss VS. Frequency (A2-C2 to GND B2) Rev. 2 | Page 6 of 13 | www.onsemi.com CSPEMI306A Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss VS. Frequency (A3-C3 to GND B2) Figure 4. Insertion Loss VS. Frequency (A4-C4 to GND B2) Rev. 2 | Page 7 of 13 | www.onsemi.com CSPEMI306A Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 5. Insertion Loss VS. Frequency (A5-C5 to GND B2) Figure 6. Insertion Loss VS. Frequency (A6-C6 to GND B2) Rev. 2 | Page 8 of 13 | www.onsemi.com CSPEMI306A Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 7. Comparison of Filter Response Curves for CSPEMI306A VS. DC Bias Rev. 2 | Page 9 of 13 | www.onsemi.com CSPEMI306A Performance Information (cont’d) Figure 8. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) Figure 9. Resistance vs. Temperature (normalized to resistance at 25°C) Rev. 2 | Page 10 of 13 | www.onsemi.com CSPEMI306A Application Information PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50µm Solder Ball Side Coplanarity +20µm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 8. Recommended Non-Solder Mask Defined Pad Illustration Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 2 | Page 11 of 13 | www.onsemi.com 260°C CSPEMI306A Mechanical Details CSP Mechanical Specifications The CSPEMI306A is offered in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CMD’s chip scale packaging, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Custom CSP Bumps 15 B3 Dim Millimeters Min Nom Max Inches Min Nom Max A1 2.915 2.960 3.005 0.1148 0.1165 0.1183 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.561 0.605 0.649 0.0221 0.0238 0.0256 D2 0.355 0.380 0.405 0.0140 0.0150 0.0160 # per tape and reel 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS Package Dimensions for CSPEMI306A Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 2 | Page 12 of 13 | www.onsemi.com CSPEMI306A CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) CSPEMI306A 2.96 X 1.33 X 0.605 POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 3.10 X 1.45 X 0.74 8mm 178mm (7") 3500 4mm 4mm Figure 13. 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