FAIRCHILD 74ABT646CMSAX

Revised November 1999
74ABT646
Octal Transceivers and Registers with 3-STATE Outputs
General Description
Features
The ABT646 consists of bus transceiver circuits with 3STATE, D-type flip-flops, and control circuitry arranged for
multiplexed transmission of data directly from the input bus
or from the internal registers. Data on the A or B bus will be
clocked into the registers as the appropriate clock pin goes
to a high logic level. Control OE and direction pins are provided to control the transceiver function. In the transceiver
mode, data present at the high impedance port may be
stored in either the A or the B register or in both. The select
controls can multiplex stored and real-time (transparent
mode) data. The direction control determines which bus
will receive data when the enable control OE is Active
LOW. In the isolation mode (control OE HIGH), A data may
be stored in the B register and/or B data may be stored in
the A register.
■ Independent registers for A and B buses
■ Multiplexed real-time and stored data
■ A and B output sink capability of 64 mA, source capability of 32 mA
■ Guaranteed output skew
■ Guaranteed multiple output switching specifications
■ Output switching specified for both 50 pF and 250 pF
loads
■ Guaranteed simultaneous switching noise level and
dynamic threshold performance
■ Guaranteed latchup protection
■ High impedance glitch free bus loading during entire
power up and power down cycle
■ Nondestructive hot insertion capability
Ordering Code:
Order Number
74ABT646CSC
Package Number
M24B
Package Description
24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-153, 4.4mm Wide
74ABT646CMSA
MSA24
24-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
74ABT646CMTC
MTC24
24-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Connection Diagram
Pin Descriptions
Pin Names
A0–A7
© 1999 Fairchild Semiconductor Corporation
DS010978
Description
Data Register A Inputs/3-STATE Outputs
B0–B7
Data Register B Inputs/3-STATE Outputs
CPAB, CPBA
Clock Pulse Inputs
SAB, SBA
Select Inputs
OE
Output Enable Input
DIR
Direction Control Input
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74ABT646 Octal Transceivers and Registers with 3-STATE Outputs
April 1992
74ABT646
Truth Table
Inputs
Data I/O
(Note 1)
OE
DIR
CPAB
CPBA
SAB
SBA
H
X
H or L
X
X
X
H or L
H
X
X
H
X
X
X
X
X
L
H
X
L
X
H
X
L
X
L
H
L
H
X
L
L
L
X
L
L
X
L
L
X
L
L
X
H or L
Function
A0–A7 B0–B7
Isolation
Input
Input
Clock An Data into A Register
Clock Bn Data into B Register
An to Bn—Real Time (Transparent Mode)
Input
Output Clock An Data into A Register
X
H
X
A Register to Bn (Stored Mode)
X
H
X
Clock An Data into A Register and Output to Bn
X
X
L
X
L
X
H
B Register to An (Stored Mode)
X
H
Clock Bn Data into B Register and Output to An
H or L
Bn to An—Real Time (Transparent Mode)
Output
Input
Clock Bn Data into B Register
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
= LOW-to-HIGH Transition
Note 1: The data output functions may be enabled or disabled by various signals at the OE and DIR inputs. Data input functions are always enabled;
i.e., data at the bus pins will be stored on every LOW-to-HIGH transition of the appropriate clock inputs.
Real Time Transfer
A-Bus to B-Bus
Storage from
Bus to Register
FIGURE 1.
FIGURE 3.
Real Time Transfer
B-Bus to A-Bus
Transfer from
Register to Bus
FIGURE 2.
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FIGURE 4.
2
74ABT646
Logic Diagram
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
3
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74ABT646
Absolute Maximum Ratings(Note 2)
Recommended Operating
Conditions
Storage Temperature
−65°C to +150°C
Ambient Temperature under Bias
−55°C to +125°C
Free Air Ambient Temperature
Junction Temperature under Bias
−55°C to +150°C
Supply Voltage
−0.5V to +7.0V
VCC Pin Potential to Ground Pin
Input Voltage (Note 3)
−0.5V to +7.0V
Input Current (Note 3)
−30 mA to +5.0 mA
−40°C to +85°C
+4.5V to +5.5V
Minimum Input Edge Rate (∆V/∆t)
Voltage Applied to Any Output
Data Input
50 mV/ns
Enable Input
20 mV/ns
Clock Input
100 mV/ns
in the Disable or
−0.5V to +5.5V
Power-Off State
−0.5V to VCC
in the HIGH State
Note 2: Absolute maximum ratings are values beyond which the device
may be damaged or have its useful life impaired. Functional operation
under these conditions is not implied.
Current Applied to Output
in LOW State (Max)
twice the rated IOL (mA)
Note 3: Either voltage limit or current limit is sufficient to protect inputs.
−500 mA
DC Latchup Source Current
Over Voltage Latchup (I/O)
10V
DC Electrical Characteristics
Symbol
Parameter
Min
Typ
Max
Input HIGH Voltage
VIL
Input LOW Voltage
0.8
V
VCD
Input Clamp Diode Voltage
−1.2
V
VOH
Output HIGH Voltage
VOL
Output LOW Voltage
VID
Input Leakage Test
IIH
Input HIGH Current
2.0
Units
VIH
VCC
V
Conditions
Recognized HIGH Signal
Recognized LOW Signal
Min
IIN = −18 mA (Non I/O Pins)
2.5
IOH = −3 mA, (An, Bn)
2.0
IOH = −32 mA, (An, Bn)
IOL = 64 mA, (An, Bn)
0.55
4.75
V
0.0
IID = 1.9 µA, (Non-I/O Pins)
All Other Pins Grounded
1
IBVI
Input HIGH Current
Breakdown Test
IBVIT
Input HIGH Current
Breakdown Test (I/O)
IIL
Max
7
µA
Max
V IN = 7.0V (Non-I/O Pins)
100
µA
Max
V IN = 5.5V (An, Bn)
µA
Max
−1
Input LOW Current
−1
IIH + IOZH
Output Leakage Current
IIL + IOZL
Output Leakage Current
IOS
Output Short-Circuit Current
ICEX
IZZ
V IN = 2.7V (Non-I/O Pins) (Note 4)
µA
1
10
V IN = VCC (Non-I/O Pins)
V IN = 0.5V (Non-I/O Pins) (Note 4)
V IN = 0.0V (Non-I/O Pins)
µA
0V–5.5V V OUT = 2.7V (An, Bn); OE = 2.0V
0V–5.5V V OUT = 0.5V (An, Bn); OE = 2.0V
−10
µA
−275
mA
Max
V OUT = 0V (An, Bn)
Output HIGH Leakage Current
50
µA
Max
V OUT = VCC (An, Bn)
Bus Drainage Test
100
µA
0.0V
−100
V OUT = 5.5V (An, Bn);
All Others GND
ICCH
Power Supply Current
250
µA
Max
All Outputs HIGH
ICCL
Power Supply Current
30
mA
Max
All Outputs LOW
ICCZ
Power Supply Current
50
µA
Max
Outputs 3-STATE; All Others GND
ICCT
Additional ICC/Input
2.5
mA
Max
V I = VCC − 2.1V
ICCD
Dynamic ICC
All Other Outputs at VCC or GND
No Load
Outputs OPEN
(Note 4)
0.18
mA/MHz
Max
OE and DIR = GND,
Non-I/O = GND or VCC (Note 5)
One Bit toggling, 50% duty cycle
Note 4: Guaranteed but not tested.
Note 5: For 8-bit toggling, ICCD < 1.4 mA/MHz.
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4
Symbol
Parameter
Min
Typ
Max
0.6
0.8
Units
Conditions
VCC
CL = 50 pF, RL = 500Ω
VOLP
Quiet Output Maximum Dynamic VOL
V
5.0
TA = 25°C (Note 6)
VOLV
Quiet Output Minimum Dynamic VOL
−1.2
−0.9
V
5.0
TA = 25°C (Note 6)
VOHV
Minimum HIGH Level Dynamic Output Voltage
2.5
3.0
V
5.0
TA = 25° (Note 7)
VIHD
Minimum HIGH Level Dynamic Input Voltage
2.2
1.8
V
5.0
TA = 25°C (Note 8)
VILD
Maximum LOW Level Dynamic Input Voltage
V
5.0
TA = 25°C (Note 8)
0.8
0.5
Note 6: Max number of outputs defined as (n). n − 1 data inputs are driven 0V to 3V. One output at LOW. Guaranteed, but not tested.
Note 7: Max number of outputs defined as (n). n − 1 data inputs are driven 0V to 3V. One output HIGH. Guaranteed, but not tested.
Note 8: Max number of data inputs (n) switching. n − 1 inputs switching 0V to 3V. Input-under-test switching: 3V to threshold (VILD), 0V to threshold (VIHD).
Guaranteed, but not tested.
AC Electrical Characteristics
(SOIC and SSOP package)
Symbol
Parameter
Min
TA = +25°C
TA = −55°C to +125°C
TA = −40°C to +85°C
VCC = +5.0V
VCC = 4.5V–5.5V
VCC = 4.5V–5.5V
CL = 50 pF
CL = 50 pF
CL = 50 pF
Typ
Max
Min
Max
200
Min
Units
Max
fMAX
Maximum Clock Frequency
200
200
tPLH
Propagation Delay
1.7
3.0
5.6
2.2
8.8
1.7
5.6
MHz
tPHL
Clock to Bus
1.7
3.4
5.6
1.7
8.8
1.7
5.6
tPLH
Propagation Delay
1.5
2.6
4.8
1.5
7.9
1.5
4.8
tPHL
Bus to Bus
1.5
3.0
4.8
1.5
7.9
1.5
4.8
tPLH
Propagation Delay
1.5
3.0
5.9
1.5
8.1
1.5
5.9
tPHL
SBA or SAB to An to Bn
1.5
3.4
5.9
1.5
8.9
1.5
5.9
tPZH
Enable Time
1.5
3.2
6.3
1.0
7.3
1.5
6.3
tPZL
OE to Anor Bn
1.5
3.5
6.3
1.9
8.8
1.5
6.3
tPHZ
Disable Time
1.5
3.7
6.0
1.5
9.3
1.5
6.0
tPLZ
OE to Anor Bn
1.5
3.2
6.0
1.5
9.3
1.5
6.0
tPZH
Enable Time
1.5
3.4
6.3
1.0
7.7
1.5
6.3
tPZL
DIR to An or B n
1.5
3.7
6.3
2.2
9.5
1.5
6.3
tPHZ
Disable Time
1.5
3.8
6.0
1.5
8.7
1.5
6.0
tPLZ
DIR to An or B n
1.5
3.2
6.0
1.5
9.2
1.5
6.0
ns
ns
ns
ns
ns
ns
ns
AC Operating Requirements
Symbol
Parameter
TA = +25°C
TA = −55°C to +125°C
TA = −40°C to +85°C
VCC = +5.0V
VCC = 4.5V–5.5V
VCC = 4.5V–5.5V
CL = 50 pF
CL = 50 pF
CL = 50 pF
Min
tS(H)
Setup Time, HIGH
tS(L)
or LOW Bus to Clock
tH(H)
Hold Time, HIGH
tH(L)
or LOW Bus to Clock
tW(H)
Pulse Width,
tW(L)
HIGH or LOW
Max
Units
Min
Max
Min
1.5
1.5
3.0
1.5
ns
1.0
1.0
1.0
1.0
ns
3.0
3.0
4.0
3.0
ns
5
Max
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74ABT646
DC Electrical Characteristics
74ABT646
Extended AC Electrical Characteristics
(SOIC Package)
Symbol
TA = −40°C to +85°C
TA = −40°C to +85°C
TA = −40°C to +85°C
VCC = 4.5V–5.5V
VCC = 4.5V–5.5V
VCC = 4.5V–5.5V
CL = 50 pF
CL = 250 pF
CL = 250 pF
8 Outputs Switching
1 Output Switching
8 Outputs Switching
Parameter
(Note 9)
(Note 10)
Units
(Note 11)
Min
Max
Min
Max
Min
Max
tPLH
Propagation Delay
1.5
5.5
2.0
7.5
2.5
10.0
tPHL
Clock to Bus
1.5
5.5
2.0
7.5
2.5
10.0
tPLH
Propagation Delay
1.5
6.0
2.0
7.0
2.5
9.5
tPHL
Bus to Bus
1.5
6.0
2.0
7.0
2.5
9.5
tPLH
Propagation Delay
1.5
6.0
2.0
7.5
2.5
10.0
tPHL
SBA or SAB to An or Bn
1.5
6.0
2.0
7.5
2.5
10.0
tPZH
Output Enable Time
1.5
6.0
2.0
8.0
2.5
10.5
tPZL
OEn or DIR to An or Bn
1.5
6.0
2.0
8.0
2.5
10.5
tPHZ
Output Disable Time
1.5
6.0
tPLZ
OEn or DIR to An or Bn
1.5
6.0
(Note 12)
ns
ns
ns
ns
(Note 12)
ns
Note 9: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase
(i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.).
Note 10: This specification is guaranteed but not tested. The limits represent propagation delay with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load. This specification pertains to single output switching only.
Note 11: This specification is guaranteed but not tested. The limits represent propagation delays for all paths described switching in phase
(i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.) with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load.
Note 12: The 3-STATE delays are dominated by the RC network (500Ω, 250 pF) on the output and has been excluded from the datasheet.
Skew
(SOIC Package)
Symbol
Parameter
TA = −40°C to +85°C
TA = −40°C to +85°C
VCC = 4.5V–5.5V
VCC = 4.5V–5.5V
CL = 50 pF
CL = 250 pF
8 Outputs Switching
8 Outputs Switching
(Note 13)
(Note 14)
Max
Max
Units
tOSHL (Note 15)
Pin to Pin Skew, HL Transitions
1.3
2.5
ns
tOSLH (Note 15)
Pin to Pin Skew, LH Transitions
1.0
2.0
ns
tPS (Note 16)
Duty Cycle, LH–HL Skew
2.0
4.0
ns
tOST (Note 15)
Pin to Pin Skew, LH/HL Transitions
2.0
4.0
ns
tPV (Note 17)
Device to Device Skew, LH/HL Transitions
2.5
4.5
ns
Note 13: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase
(i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.).
Note 14: This specification is guaranteed but not tested. The limits represent propagation delays with 250 pF load capacitors in place of the 50 pF load
capacitors in the standard AC load.
Note 15: Skew is defined as the absolute value of the difference between the actual propagation delays for any two separate outputs of the same device.
The specification applies to any outputs switching HIGH-to-LOW (tOSHL), LOW-to-HIGH (tOSLH), or any combination switching LOW-to-HIGH and/or HIGHto-LOW (tOST). This specification is guaranteed but not tested.
Note 16: This describes the difference between the delay of the LOW-to-HIGH and the HIGH-to-LOW transition on the same pin. It is measured across all
the outputs (drivers) on the same chip, the worst (largest delta) number is the guaranteed specification. This specification is guaranteed but not tested.
Note 17: Propagation delay variation for a given set of conditions (i.e., temperature and VCC) from device to device. This specification is guaranteed but not
tested.
Capacitance
Symbol
Parameter
Typ
Units
Conditions
TA = 25°C
CIN
Input Capacitance
5
pF
VCC = 0V (non I/O pins)
CI/O (Note 18)
Output Capacitance
11
pF
VCC = 5.0V (An, Bn)
Note 18: CI/O is measured at frequency, f = 1 MHz, per MIL-STD-883, Method 3012.
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6
74ABT646
AC Loading
*Includes jig and probe capacitance
FIGURE 6. Test Input Signal Levels
Input Pulse Requirements
FIGURE 5. Standard AC Test Load
Amplitude
Rep. Rate
tW
tr
tf
3.0V
1 MHz
500 ns
2.5 ns
2.5 ns
FIGURE 7. Test Input Signal Requirements
AC Waveforms
FIGURE 8. Propagation Delay Waveforms for Inverting
and Non-Inverting Functions
FIGURE 10. 3-STATE Output HIGH
and LOW Enable and Disable Times
FIGURE 9. Propagation Delay,
Pulse Width Waveforms
FIGURE 11. Setup Time, Hold Time
and Recovery Time Waveforms
7
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74ABT646
Physical Dimensions inches (millimeters) unless otherwise noted
24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide Body
Package Number M24B
24-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
Package Number MSA24
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8
74ABT646 Octal Transceivers and Registers with 3-STATE Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
24-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC24
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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9
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