ETC 74ABT16541CSSCX

Revised November 1999
74ABT16541
16-Bit Buffer/Line Driver with 3-STATE Outputs
General Description
Features
The ABT16541 contains sixteen non-inverting buffers with
3-STATE outputs designed to be employed as a memory
and address driver, clock driver, or bus oriented transmitter/receiver. The device is byte controlled. Individual 3STATE control inputs can be shorted together for 8-bit or
16-bit operation.
■ Separate control logic for each nibble
■ 16-bit version of the ABT541
■ Outputs sink capability of 64 mA, source capability of
32 mA
■ Guaranteed simultaneous switching noise level and
dynamic threshold performance
■ Guaranteed latchup protection
■ High impedance glitch free bus loading during entire
power up and power down cycle
■ Non-destructive hot insertion capability
Ordering Code:
Order Number
Package Number
74ABT16541CSSC
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300” Wide
Package Description
74ABT16541CMTD
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Device also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
Connection Diagram
Pin Descriptions
Pin Names
Description
OE n
Output Enable Inputs (Active Low)
I0–I15
Inputs
O0–O15
Outputs
© 1999 Fairchild Semiconductor Corporation
DS012149
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74ABT16541 16-Bit Buffer/Line Driver with 3-STATE Outputs
July 1996
74ABT16541
Truth Tables
Functional Description
Inputs
The ABT16541 contains sixteen non-inverting buffers with
3-STATE outputs. The device is byte (8 bits) controlled with
each byte functioning identically, but independent of the
other. The control pins can be shorted together to obtain
full 16-bit operation.
Outputs
OE 1
OE 2
I0–I7
L
L
L
L
L
L
H
H
H
X
X
Z
X
H
X
Z
OE 4
OE 3
L
L
L
L
L
L
H
H
H
X
X
Z
X
H
X
Z
Inputs
O0–O7
Logic Diagrams
Outputs
I8–I15
O8–O15
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
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Recommended Operating
Conditions
−65°C to +150°C
Storage Temperature
Ambient Temperature under Bias
−55°C to +125°C
Free Air Ambient Temperature
Junction Temperature under Bias
−55°C to +150°C
Supply Voltage
−0.5V to +7.0V
VCC Pin Potential to Ground Pin
Input Voltage (Note 2)
−0.5V to +7.0V
Input Current (Note 2)
−30 mA to +5.0 mA
−40°C to +85°C
+4.5V to +5.5V
Minimum Input Edge Rate (∆V/∆t)
Data Input
50 mV/ns
Enable Input
20 mV/ns
Voltage Applied to Any Output
in the Disabled or
Power-Off State
−0.5V to 5.5V
in the HIGH State
−0.5V to VCC
Current Applied to Output
in LOW State (Max)
Note 1: Absolute maximum ratings are values beyond which the device
may be damaged or have its useful life impaired. Functional operation
under these conditions is not implied.
twice the rated IOL (mA)
−500 mA
DC Latchup Source Current
Over Voltage Latchup (I/O)
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
10V
DC Electrical Characteristics
Symbol
Parameter
Min
Typ
Max
VCC
V
Conditions
Input HIGH Voltage
VIL
Input LOW Voltage
0.8
V
VCD
Input Clamp Diode Voltage
−1.2
V
Min
IIN = −18 mA
IOH = −3 mA
VOH
2.0
Units
VIH
Output HIGH
2.5
V
Min
2.0
V
Min
IOH = −32 mA
V
Min
IOL = 64 mA
µA
Max
µA
Max
µA
Max
V
0.0
Output LOW Voltage
IIH
Input HIGH Current
0.55
1
1
Input HIGH Current
7
Breakdown Test
IIL
Recognized LOW Signal
Voltage
VOL
IBVI
Recognized HIGH Signal
−1
Input LOW Current
−1
4.75
VIN = 2.7V (Note 3)
VIN = VCC
VIN = 7.0V
VIN = 0.5V (Note 3)
VIN = 0.0V
IID = 1.9 µA
VID
Input Leakage Test
IOZH
Output Leakage Current
10
µA
0–5.5V
VOUT = 2.7V; OEn = 2.0V
IOZL
Output Leakage Current
−10
µA
0–5.5V
VOUT = 0.5V; OEn = 2.0V
IOS
Output Short-Circuit Current
−275
mA
Max
VOUT = 0.0V
ICEX
Output HIGH Leakage Current
50
µA
Max
VOUT = VCC
IZZ
Bus Drainage Test
100
µA
0.0
All Other Pins Grounded
−100
VOUT = 5.5V
All Other Pins GND
ICCH
Power Supply Current
100
µA
Max
All Outputs HIGH
ICCL
Power Supply Current
60
mA
Max
All Outputs LOW
ICCZ
Power Supply Current
100
µA
Max
OEn = VCC
ICCT
Additional ICC/Input
Outputs Enabled
2.5
mA
Outputs 3-STATE
2.5
mA
Outputs 3-STATE
50
µA
Data Input VI = VCC − 2.1V
mA/
Outputs Open, OEn = GND
All Others at VCC or GND
VI = VCC − 2.1V
Max
Enable Input VI = VCC − 2.1V
All Others at VCC or GND
ICCD
Dynamic ICC
No Load
(Note 3)
0.1
MHz
Max
One Bit Toggling,
0.7
V
5.0
TA = 25°C (Note 4)
50% Duty Cycle
VOLP
Quiet Output Maximum Dynamic VOL
0.4
VOLV
Quiet Output Minimum Dynamic VOL
−1.3
−1.0
V
5.0
TA = 25°C (Note 4)
VOHV
Minimum HIGH Level Dynamic Output Voltage
2.7
3.0
V
5.0
TA = 25°C (Note 6)
VIHD
Minimum HIGH Level Dynamic Input Voltage
2.0
1.4
V
5.0
TA = 25°C (Note 5)
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74ABT16541
Absolute Maximum Ratings(Note 1)
74ABT16541
DC Electrical Characteristics
Symbol
VILD
Parameter
(Continued)
Min
Maximum LOW Level Dynamic Input Voltage
Typ
Max
Units
VCC
1.2
0.8
V
5.0
Conditions
TA = 25°C (Note 5)
Note 3: Guaranteed but not tested.
Note 4: Max number of outputs defined as (n). n-1 data inputs are driven 0V to 3V. One output at LOW. Guaranteed, but not tested.
Note 5: Max number of data inputs (n) switching. n-1 inputs switching 0V to 3V. Input-under-test switching: 3V to threshold (V ILD), 0V to threshold (VIHD ).
Guaranteed, but not tested.
Note 6: Max number of outputs defined as (n). n − 1 data inputs are driven 0V to 3V. One output HIGH. Guaranteed, but not tested.
AC Electrical Characteristics
Symbol
Parameter
TA=+25°C
TA = −40°C to +85°C
VCC=+5V
VCC = 4.5V–5.5V
CL = 50 pF
CL = 50 pF
Min
Typ
Max
Min
Max
tPLH
Propagation
1.0
2.3
3.4
1.0
3.4
tPHL
Delay Data to Outputs
1.0
2.7
3.9
1.0
3.9
tPZH
Output Enable
1.5
3.5
5.2
1.5
5.2
tPZL
Time
1.5
3.5
6.0
1.5
6.0
tPHZ
Output Disable
1.0
4.2
5.1
1.0
5.1
tPLZ
Time
1.0
3.2
5.1
1.0
5.1
Units
ns
ns
ns
Extended AC Electrical Characteristics
Symbol
−40°C to +85°C
TA = −40°C to +85°C
TA = −40°C to +85°C
VCC = 4.5V–5.5V
VCC = 4.5V–5.5V
VCC = 4.5V–5.5V
CL = 50 pF
CL = 250 pF
CL = 250 pF
16 Outputs Switching
1 Output Switching
16 Outputs Switching
Parameter
(Note 7)
Min
(Note 8)
Typ
Units
(Note 9)
Max
Min
Max
Min
Max
fTOGGLE
Maximum Toggle Frequency
100
tPLH
Propagation Delay
1.5
5.0
1.5
6.0
2.5
8.0
MHz
tPHL
Data to Outputs
1.5
5.3
1.5
6.0
2.5
8.0
tPZH
Output Enable
1.5
6.5
2.5
7.8
2.5
9.5
tPZL
Time
1.5
6.5
2.5
7.8
2.5
8.5
tPHZ
Output Disable
1.0
6.7
tPLZ
Time
1.0
6.7
(Note 10)
(Note 10)
ns
ns
ns
Note 7: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase
(i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.).
Note 8: This specification is guaranteed but not tested. The limits represent propagation delay with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load. This specification pertains to single output switching only.
Note 9: This specification is guaranteed but not tested. The limits represent propagation delays for all paths described switching in phase
(i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.) with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load.
Note 10: The 3-STATE delay times are dominated by the RC network (500Ω, 250 pF) on the output and have been excluded from the datasheet.
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Symbol
Parameter
tOSHL
Pin to Pin Skew
(Note 13)
HL Transitions
tOSLH
Pin to Pin Skew
(Note 13)
LH Transitions
tPS
Duty Cycle
(Note 14)
LH–HL Skew
tOST
Pin to Pin Skew
(Note 13)
LH/HL Transitions
tPV
Device to Device Skew
(Note 15)
LH/HL Transitions
TA = −40°C to +85°C
TA = −40°C to +85°C
VCC = 4.5V–5.5V
VCC = 4.5V–5.5V
CL = 50 pF
CL = 250 pF
16 Outputs Switching
16 Outputs Switching
(Note 11)
(Note 12)
Max
Max
1.0
1.5
ns
1.0
1.5
ns
1.5
1.5
ns
1.7
2.0
ns
2.0
2.5
ns
Units
Note 11: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase
(i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.)
Note 12: These specifications guaranteed but not tested. The limits represent propagation delays with 250 pF load capacitors in place of the 50 pF load
capacitors in the standard AC load.
Note 13: Skew is defined as the absolute value of the difference between the actual propagation delays for any two separate outputs of the same device.
The specification applies to any outputs switching HIGH-to-LOW (tOSHL), LOW-to-HIGH (tOSLH), or any combination switching LOW-to-HIGH and/or HIGHto-LOW (tOST). The specification is guaranteed but not tested.
Note 14: This describes the difference between the delay of the LOW-to-HIGH and the HIGH-to-LOW transition on the same pin. It is measured across all
the outputs (drivers) on the same chip, the worst (largest delta) number is the guaranteed specification. This specification is guaranteed but not tested.
Note 15: Propagation delay variation for a given set of conditions (i.e., temperature and VCC) from device to device. This specification is guaranteed but not
tested.
Capacitance
Symbol
Parameter
Typ
Units
Conditions
TA = 25°C
CIN
Input Capacitance
5.0
pF
VCC = 5.0V
COUT (Note 16)
Output Capacitance
9.0
pF
VCC = 5.0V
Note 16: COUT is measured at frequency f = 1 MHz; per MIL STD-883, Method 3012.
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74ABT16541
Skew
74ABT16541
AC Loading
* Includes jig and probe capacitance
FIGURE 2. Test Input Pulse Requirements
FIGURE 1. Standard AC Test Load
Amplitude
3.0V
Rep Rate
tW
tr
tf
1 MHz
500 ns
2.5 ns
2.5 ns
FIGURE 3. Test Input Signal Requirements
AC Waveforms
FIGURE 4. Propagation Delay Waveforms for Inverting
and Non-Inverting Functions
FIGURE 6. 3-STATE Output HIGH and LOW Enable and
Disable Times
FIGURE 5. Propagation Delay, Pulse Width Waveforms
FIGURE 7. Setup Time, Hold Time and Recovery Time
Waveforms
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74ABT16541
Physical Dimensions inches (millimeters) unless otherwise noted
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300” Wide
Package Number MS48A
7
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74ABT16541 16-Bit Buffer/Line Driver with 3-STATE Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Package Number MTD48
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
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1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
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to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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