NLAS2066 Ultra-Small Dual Single Pole, Single Throw Analog Switch with Over Voltage Tolerance http://onsemi.com The NLAS2066 is a Dual SPST (Single Pole, Single Throw) Analog Switch high performance version of the popular NLAS323. Packaged in the ultra−small US8 package. It is designed as a general analog/digital switch and can also be used to isolate USB ports. Features • • • • • • • • • • • Same Pinout as the Popular NLAS323 Excellent Performance – Maximum RDSON 15 at 3.0 V Matching Between the Switches "1.5 at 3.0 V 1.65 V to 5.5 V Operating Range Lower Threshold Voltages for LVTTL/CMOS Levels Ultra−Low Charge Injection v 4.8 pC at 3.0 V Low Standby Power – ICC = 1.0 nA (max) @ TA = 25°C CMOS Level Compatibility OVT* (Pins 1, 3, 5, and 7) These Pins may be Subjected to 0 to +7.0 V, Regardless of Operating Voltage Allows a Short from USB Line without Damage to the Device This is a Pb−Free Device* Typical Applications • • • • USB Isolation Cell Phones PDAs MP3s Digital Still Cameras MARKING DIAGRAM 8 US8 US SUFFIX CASE 493 8 1 AH MG G 1 AH = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) NO1 1 8 VCC COM1 2 7 IN1 IN2 3 6 COM2 GND 4 5 NO2 PIN ASSIGNMENT Pin Function OVT 1 NO1 Yes 2 COM1 − • ESD Protection: 3 IN2 Yes 4 GND − • 5 NO2 Yes 6 Important Information Human Body Model; > 1500 V Machine Model; > 200 V Latch−Up Maximum Rating: 200 mA COM2 − 7 IN1 Yes 8 VCC − FUNCTION TABLE *Over Voltage Tolerance (OVT) enables pins to function outside (higher) of their operating voltages, with no damage to the devices or to signal integrity. **For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2010 November, 2010 − Rev. 6 1 On/Off Enable Input State of Analog Switch L H Off On ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. Publication Order Number: NLAS2066/D NLAS2066 MAXIMUM RATINGS Symbol Rating Value Unit *0.5 to )7.0 V *0.5 to )7.0 −0.5 to VCC V *0.5 to )7.0 V VI < GND *50 mA VO < GND *50 mA VCC DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Sink Current $50 mA ICC DC Supply Current per Supply Pin $100 mA IGND DC Ground Current per Ground Pin $100 mA TSTG Storage Temperature Range *65 to )150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature under Bias )150 °C JA Thermal Resistance (Note 1) 250 °C/W PD Power Dissipation in Still Air at 85°C MSL Moisture Sensitivity FR Flammability Rating VESD ESD Withstand Voltage Pins 1, 3, 5, 7 Pins 2, 6 Oxygen Index: 28 to 34 250 mW Level 1 − UL 94 V−0 @ 0.125 in − > 1500 > 200 N/A V Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow 2. Tested to EIA/JESD22−A114−A 3. Tested to EIA/JESD22−A115−A 4. Tested to JESD22−C101−A RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit VCC Positive DC Supply Voltage 1.65 5.5 V VIN Digital Input Voltage (Enable) GND 5.5 V VIO Static or Dynamic Voltage Across an Off Switch GND VCC V VIS Analog Input Voltage GND GND VCC 5.5 V TA Operating Temperature Range, All Package Types −55 +125 °C tr, tf Input Rise or Fall Time (Enable Input) 0 0 100 20 ns/V NO COM VCC = 3.3 V + 0.3 V VCC = 5.0 V + 0.5 V http://onsemi.com 2 NLAS2066 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 TJ = 80°C 117.8 419,300 TJ = 90°C 1,032,200 90 TJ = 100°C 80 TJ = 110°C Time, Years TJ = 120°C Time, Hours FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 130°C Junction Temperature 5C NORMALIZED FAILURE RATE DEVICE JUNCTION TEMPERATURE VS. TIME TO 0.1% BOND FAILURES 1 1 10 100 1000 TIME, YEARS Figure 1. Failure Rate vs. Time Junction Temperature DC CHARACTERISTICS − Digital Section (Voltages Referenced to GND) Guaranteed Max Limit VCC 255C −40 to 855C −55 to <1255C Unit VIH Minimum High− Level Input Voltage, Enable Inputs 2.3 $ 10% 2.7 $ 10% 3.0 $ 10% 5.0 $ 10% VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.55 V VIL Maximum Low− Level Input Voltage, Enable Inputs 2.3 $ 10% 2.7 $ 10% 3.0 $ 10% 5.0 $ 10% VCC x 0.30 VCC x 0.30 VCC x 0.30 VCC x 0.30 VCC x 0.30 VCC x 0.30 VCC x 0.30 VCC x 0.30 VCC x 0.30 VCC x 0.30 VCC x 0.30 VCC x 0.30 V IIN Maximum Input Leakage Current, Enable Inputs VIN = 5.5 V or GND 0 V to 5.5 V +0.1 +1.0 +1.0 A ICC Maximum Quiescent Supply Current (per package) Enable and VIS = VCC or GND 5.5 1.0 1.0 2.0 A Symbol Parameter Condition http://onsemi.com 3 NLAS2066 DC ELECTRICAL CHARACTERISTICS − Analog Section Guaranteed Max Limit Symbol Parameter RON Maximum On Resistance RFLAT(ON) On Resistance Flatness VCC 255C −40 to 855C −55 to <1255C Unit Is = 8 mA Is = 8 mA Is = 24 mA Is = 32 mA 2.3 2.7 3.0 4.5 50 20 15 7 54 24 19 11 54 24 19 11 Is = 8 mA Is = 8 mA Is = 24 mA Is = 32 mA 2.3 2.7 3.0 4.5 60 24 13.5 3.0 60 24 13.5 3.0 60 24 13.5 3.0 Condition VIN = VIH VIS = VCC to GND (Figures 2 and 3) VIN = VIH VIS = 0 to VCC (Figure 5) RON On Resistance Match Between Channels VIS = 1.4 V VIS = 1.6 V VIS = 1.8 V VIS = 2.7 V (Figures 4, 5 and 6) 2.3 2.7 3.0 4.5 1.3 1.4 1.5 2.0 1.3 1.4 1.5 2.0 1.3 1.4 1.5 2.0 INO(OFF) Off Leakage Current VIN = VIL VNO = 1.0 V, VCOM = 4.5 V or VCOM = 1.0 V and VNO 4.5 V 5.5 1.0 10 100 nA ICOM(OFF) Off Leakage Current VIN = VIL VNO = 4.5 V or 1.0 V VCOM = 1.0 V or 4.5 V 5.5 1.0 10 100 nA AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Guaranteed Max Limit VCC Symbol Parameter Condition (V) 255C Min −40 to 855C Typ Max Min Typ Max −55 to <1255C Min Typ Max Unit tON Turn−On Time RL = 300 CL = 35 pF (Figures 7, 14 and 15) 2.3 2.7 3.0 4.5 8 4 3 2 9 5 4 3 10 7 6 5 10 7 6 5 ns tOFF Turn−Off Time RL = 300 CL = 35 pF (Figures 7, 14 and 15) 2.3 2.7 3.0 4.5 8 6 5 4 10 8 7 6 11 9 8 7 11 9 8 7 ns CIN CNO or CNC CCOM(OFF) CCOM(ON) Maximum Input Capacitance, Select Input Analog I/O (Switch Off) Common I/O (Switch Off) Feedthrough (Switch Off) http://onsemi.com 4 Typical @ 255C, VCC = 5.0 V Unit 3.0 10 10 10 pF NLAS2066 ADDITIONAL APPLICATIONS CHARACTERISTICS (Voltage Reference to GND Unless Noted) Symbol Parameter Condition VCC (V) Typical 255C Unit BW Maximum On−Channel −3.0 dB Bandwidth or Minimum Frequency Response VIS = 0 dBm (Figure 8 and 9) 2.3 2.7 3.0 4.5 102 175 180 186 MHz VONL Maximum Feed−Through On Loss VIS = 0 dBm @ 10 kHz (Figure 8 and 9) 2.3 2.7 3.0 4.5 −2.2 −0.9 −0.8 −0.4 dB VISO Off−Channel Isolation f = 100 kHz VIS = 1.0 V RMS (Figure 10 and 11) 2.3 2.7 3.0 4.5 −73 −74 −74 −75 dB Q Charge Injection Enable Input to Common I/O VIS = VCC to GND, FIS = 20 kHz (Figure 12) 3.0 5.5 4.8 7.4 pC THD Total Harmonic Distortion TDH + Noise FIS = 10 Hz to 100 kHz, RL = Rgen = 600 , CL = 50 pF (Figure 13) 3.0 5.5 0.19 0.06 http://onsemi.com 5 % NLAS2066 160 200 −40°C 140 VCC = 2.0 150 100 RON () RON () 120 80 VCC = 2.5 60 40 85°C 100 125°C 50 VCC = 3.0 20 25°C VCC = 4.5 0 0 0 1 2 3 4 5 0 0.5 1.0 1.5 VIS (VOLTS) VIS (VOLTS) Figure 2. RON vs. VCOM and VCC (@255C) Figure 3. RON vs. VCOM and Temperature, VCC = 2.0 V 30 2.0 12 −40°C −40°C 25°C 25 10 85°C 8 15 RON () RON () 20 125°C 10 4 5 2 0 0 1.0 2.0 0 3.0 0 1.0 2.0 125°C 3.0 VIS (VOLTS) Figure 4. RON vs. VCOM and Temperature, VCC = 2.5 V Figure 5. RON vs. VCOM and Temperature, VCC = 3.0 V 4.0 35.0 5 85°C −40°C 25°C 30.0 25.0 TIME (nS) 4 RON () 85°C VIS (VOLTS) 6 3 125°C 2 20.0 15.0 tON 10.0 1 0 25°C 6 5.0 0 1.0 2.0 3.0 4.0 tOFF 0.0 2.0 5.0 3.0 4.5 5.0 5.5 VCC (V) VIS (VOLTS) Figure 6. RON vs. VCOM and Temperature, VCC = 4.5 V Figure 7. Switching Time vs. Supply Voltage, T = 255C http://onsemi.com 6 NLAS2066 BANDWIDTH (dB/Div) Bandwidth (On − Loss) 0 Phase (Degrees) −1 −10 VCC = 3.0 V TA = 25°C 0.001 0.01 0.1 1.0 10 Bandwidth (On − Loss) BANDWIDTH (dB/Div) −1 100 300 0 Phase (Degrees) 0.001 0.01 0.1 −10 OFF ISOLATION (dB/Div) −10 OFF ISOLATION (dB/Div) 0 Off Isolation, Pin 5 and 6 100 300 Crosstalk VCC = 3.0 V TA = 25°C 10 100 300 Off Isolation, Pin 1 and 2 Crosstalk VCC = 5.0 V TA = 25°C 0.01 0.1 FREQUENCY (MHz) 1 10 100 300 FREQUENCY (MHz) Figure 10. Off Isolation and Crosstalk Figure 11. Off Isolation and Crosstalk 10 1.0 8 VCC = 5.0 V VCC = 3.0 V VPP = 3.1 V DISTORTION (%) 6 4 Q (pC) 10 Figure 9. ON Channel Bandwidth and Phase Shift Over Frequency 0 1 1.0 FREQUENCY (MHz) Figure 8. ON Channel Bandwidth and Phase Shift Over Frequency 0.1 −10 VCC = 5.0 V TA = 25°C FREQUENCY (MHz) 0.01 PHASE (Degrees) 0 PHASE (Degrees) 0 2 0 VCC = 3.0 V −2 0.1 VCC = 5.5 V VPP = 5.0 V −4 −6 0 1 2 3 4 0.01 0.01 5 VCOM (V) Figure 12. Charge Injection vs. VCOM 0.1 1.0 FREQUENCY (MHZ) 10 Figure 13. THD vs. Frequency http://onsemi.com 7 100 NLAS2066 TIMING INFORMATION VCC NO VCC DUT Input 50% 50% 0V COM VOUT 0.1 F 300 VOH 35 pF 90% 90% Output VOL Input tON tOFF Figure 14. tON/tOFF VCC VCC Input DUT NO COM 50% 50% 0V 300 VOUT VOH 35 pF Output 10% VOL Input 10% tOFF tON Package Type Shipping† Figure 15. tON/tOFF VCC VMI 2.0 V 1.0 V 3.0 V 1.5 V 4.5 V 1.5 V DEVICE ORDERING INFORMATION Device Nomenclature Circuit Indicator Technology Device Function Package Suffix NLAS2066USG NL AS 2066 US US8 (Pb−Free) 3,000 / Tape & Reel NLAS2066UST3G NL AS 2066 UST3 US8 (Pb−Free) 10,000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 8 NLAS2066 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493−02 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). −X− A 8 J −Y− 5 DETAIL E B L 1 4 R S G P DIM A B C D F G H J K L M N P R S U V U C −T− SEATING PLANE H 0.10 (0.004) T K D N 0.10 (0.004) M R 0.10 TYP T X Y V M MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC F DETAIL E SOLDERING FOOTPRINT* 3.8 0.15 1.8 0.07 0.50 0.0197 0.30 0.012 1.0 0.0394 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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