STMICROELECTRONICS STPS15L30CDJF

STPS15L30CDJF
Low drop power Schottky rectifier
Features
■
Very small conduction losses
■
Negligible switching losses
■
Extremely fast switching
■
Low forward voltage drop
■
Low thermal resistance
■
High avalanche capability specified
A1
K
A2
Description
K
K
Dual center tap Schottky rectifier suited for switch
mode power supply and high frequency DC to DC
converters.
Packaged in PowerFLAT™, this device is
intended for use in low voltage, high frequency
inverters, free-wheeling and polarity protection
applications.
A1
A2
A2
A1
PowerFLAT 5x6
STPS15L30CDJF
Table 1.
Device summary
Symbol
Value
IF(AV)
2 x 7.5 A
VRRM
30 V
Tj (max)
150 °C
VF(typ)
0.34 V
TM: PowerFLAT is a trademark of STMicroelectronics
May 2011
Doc ID 15664 Rev 4
1/7
www.st.com
7
Characteristics
1
STPS15L30CDJF
Characteristics
Table 2.
Absolute ratings (limiting values, per diode)
Symbol
VRRM
Repetitive peak reverse voltage
IF(RMS)
Forward rms current
30
V
10
A
Per device
15
Tc = 140 °C
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
IRRM
Peak repetitive reverse current
tp = 2 µs square F= 1 kHz
PARM
Repetitive peak avalanche power
tp = 1 µs Tj = 25 °C
A
75
Storage temperature range
Maximum operating junction temperature
Unit
7.5
Average forward current δ = 0.5
Tj
Value
Per diode
IF(AV)
Tstg
1.
Parameter
A
1
A
2800
W
-65 to + 175
°C
150
°C
Value
Unit
(1)
1
dPtot <
condition to avoid thermal runaway for a diode on its own heatsink
Rth(j-a)
dTj
Table 3.
Thermal resistance
Symbol
Parameter
Rth(j-c)
Junction to case
Rth(c)
Coupling
Per diode
2.5
Total
1.6
°C/W
0.7
When diodes 1 and 2 are used simultaneously:
Δ Tj(diode 1) = P(diode1) x Rth(j-c)(per diode) + P(diode 2) x Rth(c)
Table 4.
Symbol
IR(1)
VF(1)
Static electrical characteristics (per diode)
Parameter
Reverse leakage
current
Forward voltage drop
Test conditions
Tj = 25 °C
Tj = 125 °C
VR = VRRM
Min.
Typ.
Max.
Unit
-
-
1
mA
-
70
140
mA
Tj = 25 °C
IF = 7.5 A
-
-
0.48
Tj = 125 °C
IF = 7.5 A
-
0.34
0.39
Tj = 25 °C
IF = 15 A
-
-
0.57
Tj = 125 °C
IF = 15 A
-
0.44
0.51
V
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.27 x IF(AV) + 0.016 IF2(RMS)
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Doc ID 15664 Rev 4
STPS15L30CDJF
Figure 1.
4.5
Characteristics
Average forward power dissipation Figure 2.
versus average forward current
(per diode)
PF(AV)(W)
9
3.5
8
7
δ=0.2
3.0
6
δ=0.1
δ=0.05
2.5
IF(AV)(A)
δ=1
δ=0.5
4.0
Average forward current versus
ambient temperature
(δ = 0.5, per diode)
5
2.0
4
1.5
3
T
1.0
0.5
IF(AV)(A)
T
2
δ=tp/T
1
tp
0.0
δ=tp/T
Tamb(°C)
tp
0
0
1
Figure 3.
2
3
4
5
6
7
8
9
10
Normalized avalanche power
derating versus pulse duration
0
25
Figure 4.
PARM(tp)
PARM(1µs)
1
1.2
50
75
100
125
150
Normalized avalanche power
derating versus junction
temperature
PARM (Tj)
PARM(25°C)
1
0.1
0.8
0.6
0.4
0.01
0.2
tp(µs)
0.001
0.01
0.1
Figure 5.
120
1
10
100
1000
Non repetitive surge peak forward
current versus overload duration
(maximum values, per diode)
50
Figure 6.
IM(A)
1.0
110
Tj(°C)
0
25
75
100
125
150
Relative variation of thermal
impedance, junction to case,
versus pulse duration
Zth(j-c)/Rth(j-c)
0.9
100
0.8
90
0.7
80
Tc=25°C
70
60
Tc=75°C
50
Tc=125°C
30
10
0
1.E-03
0.5
0.4
40
20
0.6
0.3
0.2
IM
t
δ =0.5
0.1
t(s)
Single pulse
tp(s)
0.0
1.E-02
1.E-01
1.E+00
1.E-05
Doc ID 15664 Rev 4
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
3/7
Characteristics
Figure 7.
STPS15L30CDJF
Reverse leakage current versus
reverse voltage applied
(typical values, per diode)
Figure 8.
IR(mA)
Junction capacitance versus
reverse voltage applied
(typical values, per diode)
C(pF)
1000
1.E+03
F=1MHz
Vosc=30mVRMS
Tj=25°C
Tj=150°C
1.E+02
Tj=125°C
Tj=100°C
1.E+01
Tj=75°C
1.E+00
Tj=50°C
1.E-01
Tj=25°C
0
5
Figure 9.
20
VR(V)
VR(V)
1.E-02
10
100
15
20
25
1
30
Forward voltage drop versus
forward current (per diode)
10
100
Figure 10. Thermal resistance junction to
ambient versus copper surface
under each lead
I (A)
Rth(j-a)(°C/W)
FM
300
18
Tj = 25 °C
(Maximum values)
16
Epoxy printed board FR4
copper thickness = 35 µm
14
200
12
Tj = 125 °C
(Maximum values)
10
8
Tj = 125 °C
(Typical values)
6
100
4
2
0
0.0
4/7
V (V)
FM
0.1
0.2
0.3
0.4
0.5
0.6
Scu(mm²)
0
0
Doc ID 15664 Rev 4
200
400
600
800
1000
STPS15L30CDJF
Package information
●
Epoxy meets UL94,V0
●
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 5.
PowerFLAT 5x6 dimensions
Dimensions
Ref.
Min.
D2
E2
K
e
b
A2
Inches
Max.
Min.
Typ.
Max.
A
0.80
1.00
0.031
0.039
A1
0.02
0.05
0.001
0.002
b
D
Typ.
A2
L
A
A1
Millimeters
0.25
0.30
0.50
D
D2
0.010
0.012
5.20
4.11
0.020
0.205
4.31
0.162
0.170
e
1.27
0.050
E
6.15
0.242
E
E2
3.50
3.70
0.138
0.146
L
0.50
0.80
0.020
0.031
K
1.275
1.575
0.050
0.062
Figure 11. Footprint (dimensions in mm)
5.35
4.41
3.86
4.33
6.29
2
Package information
0.98
0.95
0.62
1.27
Doc ID 15664 Rev 4
5/7
Ordering information
STPS15L30CDJF
Figure 12. Tape and reel specifications
Dot identifying Pin A1 location
2.0
Ø 1.55
1.75
4.0
0.30
0.20
5.30
12.0
5.5
Ø 1.5
R 0.50
6.30
8.0
1.20
All dimensions are typical values in mm
3
Ordering information
Table 6.
4
Ordering information
Order code
Marking
Package
STPS15L30CDJFTR
PS15 L30C
PowerFLAT 5x6
Weight Base qty
0.095 g
3000
Delivery mode
Tape and reel
Revision history
Table 7.
6/7
User direction of unreeling
Document revision history
Date
Revision
Changes
13-May-2009
1
First issue.
09-Nov-2009
2
Updated Table 1.
30-Jul-2010
3
Replace Power QFN with PowerFLAT. Updated Figure 9.
18-May-2011
4
Added reference E in Table 5. Updated package graphics.
Removed dash from order code and updated marking in Table 6.
Added Figure 12.
Doc ID 15664 Rev 4
STPS15L30CDJF
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Doc ID 15664 Rev 4
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