STPS6M100DEE High voltage power Schottky rectifier Datasheet production data Features NC ■ Negligible switching losses ■ Extremely fast switching ■ Low thermal resistance ■ High junction temperature capability ■ ECOPACK®2 compliant component A K A A A A A A NC A A NC Description This Schottky rectifier is designed for switch mode power supply and high frequency DC to DC converters. Packaged in PowerFLAT™, this device is intended for use in low voltage, high frequency, inverters, free-wheeling, by-pass diode and polarity protection applications.Its low profile was especially designed to be used in applications with space-saving constraints. K K PowerFLAT (3.3 x 3.3) STPS6M100DEE-TR Table 1. Device summary Symbol Value IF(AV) 6A VRRM 100 V Tj (max) 150 °C VF (typ) 0.64 V TM: PowerFLAT is a trademark of STMicroelectronics September 2012 This is information on a product in full production. Doc ID 023259 Rev 1 1/8 www.st.com 8 Characteristics 1 STPS6M100DEE Characteristics Table 2. Absolute ratings (limiting values Tamb = 25 °C unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 100 V IF(RMS) Forward rms current 15 A 6 A = 0.5 IF(AV) Average forward current IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 100 A Repetitive peak avalanche power 480 W -65 to +150 °C 150 °C PARM(1) Tstg Tj Tc = 130 °C tp = 10 µs Tj = 125 °C Storage temperature range Maximum operating junction temperature 1. For pulse time duration deratings, please refer to Figure 3. More details regarding the avalanche energy measurements and diode validation in the avalanche are provided in the STMicroelectronics Application notes AN1768, “Admissible avalanche power of Schottky diodes” and AN2025, “Converter improvement using Schottky rectifier avalanche specification”. Table 3. Thermal resistance Symbol Rth(j-c) Table 4. Parameter Junction to case Parameter IR(1) Reverse leakage current Forward voltage drop Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. VR = VRRM IF = 6A 1. Pulse test: tp = 5 ms, < 2% 2. Pulse test: tp = 380 µs, < 2% To evaluate the conduction losses use the following equation: P = 0.56 x IF(AV) + 0.0133 x IF2(RMS) 2/8 Unit 4 °C/W Static electrical characteristics Symbol VF(2) Value Doc ID 023259 Rev 1 Typ. - 5 Max. Unit 30 µA 15 mA 0.78 - 0.58 0.64 V STPS6M100DEE Figure 1. Characteristics Average forward power dissipation Figure 2. versus average forward current IF(AV)(A) PF(AV)(W) 6 Average forward current versus ambient temperature( = 0.5) δ = 0.1 δ = 0.05 7 δ = 0.2 δ = 0.5 Rth(j-a)=Rth(j-c) 6 5 5 4 δ=1 4 3 3 2 T T 2 1 1 IF(AV)(A) δ =tp/T tp δ =tp/T 0 Tamb(°C) tp 0 0 1 2 Figure 3. 3 4 5 6 7 8 Normalized avalanche power derating versus pulse duration 25 Figure 4. 50 75 100 125 150 Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) PARM (t p ) PARM (10 µs) 1 0 1.0 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.01 0.3 0.2 t p(µs) 0.1 0.001 1 10 Figure 5. 100 1000 Reverse leakage current versus reverse voltage applied (typical values) tp(s) Single pulse 0.0 1.E-05 Figure 6. 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Junction capacitance versus reverse voltage applied (typical values) C(pF) IR(mA) 1000 1.E+02 F=1 MHz VOSC=30 mVRMS Tj =25 °C Tj = 150 °C 1.E+01 Tj = 125 °C 1.E+00 Tj = 100 °C Tj = 75 °C 1.E-01 100 Tj = 50 °C 1.E-02 Tj = 25 °C 1.E-03 VR(V) VR(V) 1.E-04 10 0 10 20 30 40 50 60 70 80 90 100 1 Doc ID 023259 Rev 1 10 100 3/8 Characteristics Figure 7. 100.0 STPS6M100DEE Forward voltage drop versus forward current Figure 8. IFM(A) Thermal resistance junction to ambient versus copper surface under tab Rth(j-a)(°C/W) 250 Tj=125 °C (Maximum values) PowerFLAT (3.3x3.3) epoxy printed board FR4, copper thickness=35µm 200 Tj=125 °C (Typical values) 10.0 150 Tj=25 °C (Maximum values) 100 1.0 50 VFM(V) SCu(cm²) 0 0.1 0.0 4/8 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 1 Doc ID 023259 Rev 1 2 3 4 5 6 7 8 9 10 STPS6M100DEE Package information ● Epoxy meets UL94,V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 9. PowerFLAT-3.3x3.3-8L dimensions (definitions) Exposed pad L1 b L E E2 nc nc e/2 D/2 D D2 D3 e E/2 A3 a k a k L2 A Index area (D/2 x E/2) A4 2 Package information Table 5. Projection PowerFLAT-8L dimensions (values) Dimensions Ref. A Millimeters Inches Min. Typ. Max. Min. Typ. Max. 0.95 1.00 1.05 0.037 0.039 0.041 A3 0.20 0.0079 A4 0.20 0.0079 b 0.30 0.37 0.44 0.012 0.015 0.017 D 3.20 3.30 3.40 0.126 0.130 0.134 D2 2.24 2.31 2.38 0.088 0.091 0.094 D3 1.60 1.67 1.74 0.063 0.066 0.069 e 0.65 0.026 E 3.20 3.30 3.40 0.126 0.130 0.134 E2 1.68 1.75 1.82 0.066 0.069 0.072 L 0.31 0.38 0.45 0.012 0.015 0.018 L1 0.55 0.62 0.69 0.22 0.024 0.027 L2 0.86 0.93 1.00 0.034 0.037 0.039 Doc ID 023259 Rev 1 5/8 Package information STPS6M100DEE Figure 10. Footprint (dimensions in mm) 3.50 0.80 0.42 3.50 2.28 1.75 1.75 1.25 1.79 6/8 Doc ID 023259 Rev 1 0.21 0.52 STPS6M100DEE 3 Ordering information Ordering information Table 6. 4 Ordering information Order code Marking STPS6M100DEE-TR S6M100 Package PowerFLAT (3.3 x 3.3) Weight Base qty Delivery mode 34 mg 3000 Tape and reel 13” reel Revision history Table 7. Document revision history Date Revision 09-Sep-2012 1 Changes First issue. 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