STPS30L45C Low drop power Schottky rectifier Features ■ A1 K low forward voltage drop meaning very small conduction losses ■ low switching losses allowing high frequency operation ■ low thermal resistance ■ avalanche rated ■ insulated package TO-220FPAB: – insulating voltage = 2000 V DC – capacitance = 45 pF ■ avalanche capability specified A2 K K A2 A2 A1 A1 I2PAK STPS30L45CR D2PAK STPS30L45CG Description A2 A2 Dual center tap Schottky rectifier suited for switched mode power supplies and high frequency DC to DC converters. A1 K K TO-220AB STPS30L45CT A1 TO-247 STPS30L45CW Packaged in TO-247, TO-220AB, TO-220FPAB, D2PAK and I2PAK this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. A2 K A1 TO-220FPAB STPS30L45CFP Table 1. October 2010 Doc ID 8002 Rev 4 Device summary IF(AV) 2 x 15 A VRRM 45 V Tj (max) 150 °C VF(max) 0.5 V 1/12 www.st.com 12 Characteristics STPS30L45C 1 Characteristics Table 2. Absolute Ratings (limiting values, per diode) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 45 V IF(RMS) Forward rms current 30 A 15 30 A 220 A Tc =110 °C, δ = 0.5 TO-220FPAB IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal IRRM Repetitive peak reverse current tp = 2 µs square F = 1 kHz 1 A IRSM Non repetitive peak reverse current tp = 100 µs square 3 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 6000 W -65 to + 150 °C 150 °C 10000 V/µs Tstg Maximum operating junction temperature dV/dt dPtot --------------dTj TO-220AB, TO-247, I2PAK, D2PAK Tc = 135 °C, δ = 0.5 Storage temperature range Tj 1. Per diode Per device IF(AV) Average forward current (1) Critical rate of rise of reverse voltage < Table 3. 1 -------------------------Rth ( j – a ) condition to avoid thermal runaway for a diode on its own heatsink Thermal resistances Symbol Rth(j-c) Rth(c) Parameter Value TO-220FPAB Per diode Total 4 3.2 TO-220AB, TO-247, I2PAK, D2PAK Per diode Total 1.60 0.85 Junction to case Coupling °C/W TO-220FPAB 2.5 TO-220AB, TO-247, I2PAK, D2PAK 0.10 When the diodes 1 and 2 are used simultaneously: ΔTj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) 2/12 Unit Doc ID 8002 Rev 4 °C/W STPS30L45C Table 4. Characteristics Static electrical characteristics (per diode) Symbol IR(1) Parameter Test Conditions Tj = 25 °C Reverse leakage current Forward voltage drop Typ. VR = VRRM Tj = 125 °C VF(1) Min. Tj = 25 °C IF = 15 A Tj = 125 °C IF = 15 A Tj = 25 °C IF = 30 A Tj = 125 °C IF = 30 A 100 Max. Unit 0.4 mA 200 mA 0.55 0.42 0.50 V 0.74 0.59 0.67 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.330 x IF(AV) + 0.011 IF2(RMS) Figure 1. Average forward power dissipation Figure 2. versus average forward current (per diode) PF(av)(W) IF(av)(A) 12 δ = 0.05 10 δ = 0.1 δ = 0.2 δ = 0.5 8 δ=1 6 4 T 2 IF(av) (A) 0 0 2 Figure 3. Average forward current versus ambient temperature (δ = 0.5, per diode) 4 6 8 10 δ=tp/T 12 14 16 tp 18 20 Normalized avalanche power derating versus pulse duration 18 16 14 12 10 8 6 4 2 0 TO-220FPAB Rth(j-a)=15°C/W T δ=tp/T 0 Figure 4. PARM(tp) PARM(1 µs) TO-220AB/TO-247/I²PAK/D²PAK Rth(j-a)=Rth(j-c) Tamb(°C) tp 25 50 75 100 125 150 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 °C) 1 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 0.001 0.01 Tj(°C) tp(µs) 0.1 1 0 10 100 1000 25 Doc ID 8002 Rev 4 50 75 100 125 150 3/12 Characteristics Figure 5. IM(A) 200 180 160 140 120 100 80 60 40 IM 20 0 1E-3 STPS30L45C Non repetitive surge peak forward current versus overload duration Figure 6. 140 maximum values, per diode maximum values, per diode 100 Tc=25°C 80 Tc=75°C Tc=125°C IM 20 t(s) δ=0.5 Tc=75°C 40 Tc=125°C t Tc=25°C 60 t(s) t δ=0.5 1E-2 1E-1 0 1E-3 1E+0 Relative variation of thermal Figure 8. impedance junction to case versus pulse duration 1E-2 1E-1 1E+0 Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAB) Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 0.8 0.8 0.4 IM(A) 120 Figure 7. 0.6 Non repetitive surge peak forward current versus overload duration (TO-220FPAB only) δ = 0.5 0.6 δ = 0.5 0.4 δ = 0.2 δ = 0.2 T δ = 0.1 0.2 0.2 tp(s) Single pulse 0.0 1E-4 1E-3 Figure 9. δ=tp/T 1E-2 tp 1E-1 T δ = 0.1 tp(s) Single pulse 1E+0 Reverse leakage current versus reverse voltage applied (typical values, per diode) 0.0 1E-3 1E-2 δ=tp/T 1E-1 tp 1E+0 1E+1 Figure 10. Junction capacitance versus reverse voltage applied (typical values, per diode) IR(mA) C(pF) 5E+2 2000 F=1MHz Tj=25°C Tj=150°C 1E+2 1000 Tj=125°C 1E+1 Tj=100°C 500 1E+0 Tj=75°C 1E-1 Tj=25°C 200 VR(V) VR(V) 1E-2 4/12 0 5 10 15 20 25 30 35 40 45 100 1 Doc ID 8002 Rev 4 2 5 10 20 50 STPS30L45C Characteristics Figure 11. Forward voltage drop versus forward current (maximum values, per diode) Figure 12. Thermal resistance junction to ambient versus copper surface under tab for D2PAK IFM(A) Rth(j-a) (°C/W) 200 80 100 70 Epoxy printed circuit board FP4, copper thickness = 35 µm 60 Typical values Tj=150°C 50 40 10 30 Tj=125°C 20 Tj=25°C VFM(V) 10 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 S(cm²) 0 Doc ID 8002 Rev 4 5 10 15 20 25 30 35 40 5/12 Package Information 2 STPS30L45C Package Information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque (TO-220AB, TO-220FPAB): 0.4 to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. TO-220AB package dimensions Dimensions Ref Dia Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 C L5 L7 L6 L2 F2 F1 D L9 L4 F L2 M G1 E G 16.4 typ. 0.645 typ. L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Dia. 6/12 Inches Min. A H2 Millimeters Doc ID 8002 Rev 4 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 STPS30L45C Package Information Mounting (soldering) the I2PAK metal slug (heatsink) with alloy, like a surface mount device, IS NOT PERMITTED. A standard through-hole mounting is mandatory. I2PAK dimensions Table 6. Dimensions Ref. A E c2 L2 D L1 A1 b1 L b c e e1 Doc ID 8002 Rev 4 Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 E 10 10.40 0.394 0.409 L 13 14 0.512 0.551 L1 3.50 3.93 0.138 0.155 L2 1.27 1.40 0.050 0.055 7/12 Package Information Table 7. STPS30L45C TO-220FPAB package dimensions Dimensions Ref Max. Min. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 F2 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 A Dia L6 L2 L7 Inches Min. B H Millimeters L3 L5 F1 L4 D F2 L2 F G1 E 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 G 8/12 Doc ID 8002 Rev 4 STPS30L45C Package Information Table 8. D2PAK package dimensions Dimensions Ref E C2 Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 A L2 Millimeters D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm R 0.40 typ. V2 0° 0.016 typ. 8° 0° 8° Figure 13. D2PAK footprint dimensions (in millimeters) 16.90 10.30 5.08 1.30 8.90 Doc ID 8002 Rev 4 3.70 9/12 Package Information STPS30L45C Table 9. TO-247 dimensions Dimensions Ref. Heat-sink plane A E ∅P S Millimeters Inches Min. Max. Min. Max. A 4.85 5.15 0.191 0.203 A1 2.20 2.60 0.086 0.102 b 1.00 1.40 0.039 0.055 b1 2.00 2.40 0.078 0.094 b2 3.00 3.40 0.118 0.133 c 0.40 0.80 0.015 0.031 D(1) 19.85 20.15 0.781 0.793 E 15.45 15.75 0.608 0.620 ∅R D L2 L1 b1 L e b2 1 2 3 b c A1 3 2 1 BACK VIEW e 14.20 14.80 0.559 0.582 L1 3.70 4.30 0.145 0.169 (2) ∅P ∅R S 1. Dimension D plus gate protrusion does not exceed 20.5 mm 2. Resin thickness around the mounting hole is not less than 0.9 mm Doc ID 8002 Rev 4 0.215 typ. L L2 10/12 5.45 typ. 18.50 typ. 0.728 typ. 3.55 3.65 0.139 0.143 4.50 5.50 0.177 0.217 5.50 typ. 0.216 typ. STPS30L45C 3 Ordering Information Ordering Information Table 10. Ordering information Order code Marking Package Weight Base qty Delivery mode STPS30L45CT STPS30L45CT TO-220AB STPS30L45CG 4 STPS30L45CG 2g 50 Tube 2 1.8g 50 Tube 2 D PAK STPS30L45CG-TR STPS30L45CG D PAK 1.8g 500 Tape and reel STPS30L45CW STPS30L45CW TO-247 4.4g 30 Tube 2 STPS30L45CR STPS30L45CR I PAK 1.4g 50 Tube STPS30L45CFP STPS30L45CFP TO-220FPAB 1.9 g 50 Tube Revision history Table 11. Document revision history Date Revision Jul-2003 3B 13-Oct-2010 4 Changes Previous issue Added paragraph above Table 6 and updated I2PAK dimensions in Table 6. Updated TO-247 dimensions in Table 9. Doc ID 8002 Rev 4 11/12 STPS30L45C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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