Formosa MS Small Signal Schottky Diode RB520G/RB521G List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date DS-221694 2008/02/10 2010/12/29 Revision C Page. 7 Formosa MS Small Signal Schottky Diode RB520G/RB521G 100mA Surface Mount Small Signal Schottky Diode- 30V Package outline Features 0.026(0.65) 0.022(0.55) • Ultra Small mold type • Low IR • High Reliability • Lead-free parts meet exceeds environmental 0.012(0.30) 0.009(0.24) SOD-723FL 0.041(1.05) 0.037(0.95) standards of MIL-STD-19500 /228 • Suffix "-H" indicates Halogen-free part, ex.RB520G-H. 0.006(0.16) 0.004(0.10) 0.022(0.55) 0.018(0.45) Mechanical data • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, SOD-723FL • Terminals : Solder plated, solderable per 0.057(1.45) 0.053(1.35) MIL-STD-750, Method 2026 Dimensions in inches and (millimeters) • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.0008 gram Maximum ratings (AT T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Symbol MIN. TYP. MAX. UNIT DC Reverse Voltage VR 30 V Average rectified forward current IO 100 mA I FSM 500 mA Junction temperature TJ 125 o C Storage temperature T STG +125 o C Peak Forward Surge Current 60Hz for 1cycle -40 Electrical characteristics (AT T =25 C unless otherwise noted) o A PARAMETER Forward voltage Reverse current Diode capacitance http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 CONDITIONS I F = 10 mA Symbol RB520G RB521G RB520G RB521G V R = 10 V MIN. Page 2 MAX. UNIT VF 0.45 0.35 V IR 0.5 10.0 µA 4.0 CT V R = 10 V, f = 1MHz TYP. Document ID Issued Date Revised Date DS-221694 2008/02/10 2010/12/29 pF Revision C Page. 7 Rating and characteristic curves (RB520G/RB521G) FIG.2 - TYPICAL REVERSE CHARACTERISTICS RB520G REVERSE CURRENT, (nA) FORWARD CURRENT,(mA) FIG.1-TYPICAL FORWARD CHARACTERISTICS RB520G REVERSE VOLTAGE,(V) FIG.1-TYPICAL FORWARD CHARACTERISTICS RB521G FIG.3-TYPICAL TERMINALS CAPACITANCE RB520G FORWARD CURRENT,(mA) CAPACITANCE BETWEEN TERMINALS ,(pF) FORWARD VOLTAGE,(mV) REVERSE VOLTAGE,(V) FORWARD VOLTAGE,(mV) REVERSE CURRENT, (uA) CAPACITANCE BETWEEN TERMINALS ,(pF) FIG.2 - TYPICAL REVERSE CHARACTERISTICS RB521G REVERSE VOLTAGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 FIG.3-TYPICAL TERMINALS CAPACITANCE RB521G REVERSE VOLTAGE,(V) Page 3 Document ID Issued Date Revised Date DS-221694 2008/02/10 2010/12/29 Revision C Page. 7 Formosa MS Small Signal Schottky Diode RB520G/RB521G Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code RB520G RB521G E F Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SOD-723FL 0.018 (0.45) 0.020 (0.50) 0.035 (0.90) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date DS-221694 2008/02/10 2010/12/29 Revision C Page. 7 Formosa MS Small Signal Schottky Diode RB520G/RB521G Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Symbol Tolerance Carrier width Carrier length Carrier depth Sprocket hole A B C d 0.1 0.1 0.1 0.1 0.68 1.71 0.59 1.50 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width D D1 D2 E F P P0 P1 T W W1 2.0 min 0.2 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 178.00 50.00 13.0 1.75 3.50 2.00 4.00 2.00 0.23 8.00 11.4 Item SOD-723FL Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date DS-221694 2008/02/10 2010/12/29 Revision C Page. 7 Formosa MS Small Signal Schottky Diode RB520G/RB521G Reel packing PACKAGE SOD-723FL REEL SIZE REEL (pcs) COMPONENT SPACING (m/m) 7" 4,000 4.0 BOX (pcs) INNER BOX (m/m) 40,000 183*183*123 REEL DIA, (m/m) CARTON SIZE (m/m) CARTON (pcs) APPROX. GROSS WEIGHT (kg) 178 382*262*387 320,000 9.5 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date DS-221694 2008/02/10 2010/12/29 Revision C Page. 7 Formosa MS Small Signal Schottky Diode RB520G/RB521G Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=125 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker JESD22-A102 15P SIG at T A=121 OC for 4 hrs. MIL-STD-750D METHOD-1051 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-1056 9. Forward Surge 60Hz for 1cycle MIL-STD-750D METHOD-4066-2 10. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 11. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date Revised Date DS-221694 2008/02/10 2010/12/29 Revision C Page. 7