Formosa MS SMD Small Signal Schottky Barrier Diode RB421D / RB425D List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date Revision Page. DS-22163E 2009/08/10 2011/01/21 B 7 Formosa MS SMD Small Signal Schottky Barrier Diode RB421D / RB425D 100mA Surface Mount Small Signal Schottky Diodes- 40V Package outline SC-59 (B) 0.013 (0.35) 0.034 (0.85) 0.020 (0.50) .091(2.30) standards of MIL-STD-19500 /228 Suffix "-H" indicates Halogen-free part, ex.RB421D-H .068(1.70) • 0.122 (3.10) • Small surface mounting type • High reliability • Low forward voltage drop • Lead-free parts for green partner, exceeds environmental 0.106 (2.70) 0.042 (1.05) Features (C) (A) 0.068 (1.70) 0.028 (0.70) 0.020 (0.50) 0.052 (1.30) 0.118 (3.00) 0.052 (1.30) 0.003 (0.10) R 0.05 (0.002) 0.011 (0.26) 0.090 (2.25) Mechanical data 0.040 (1.00) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, SC-59 • Terminals : Solder plated, solderable per Dimensions in inches and (millimeters) MIL-STD-750, Method 2026 • Mounting Position : Any • Weight : Approximated 0.008 gram Maximum ratings (AT T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Maximum recurrent peak reverse voltage Maximum DCblocking voltage Maximum average forward rectified current Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load(JEDEC method) Symbol MAX. UNIT V RRM 40 V VR 40 V IO 100 mA I FSM 1.00 A MIN. TYP. Junction temperature TJ -55 +125 o Storage temperature T STG -65 +175 o Maximum instantaneous forward voltage at I F = 100m A C 0.55 VF at I F = 10m A Maximum DC reverse current V R = 10V IR Capacitance between terminals V R = 10V, f = 1MHz CT http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 C Page 2 V 0.34 30 uA 6.0 pF Document ID Issued Date Revised Date Revision Page. DS-22163E 2009/08/10 2011/01/21 B 7 Rating and characteristic curves for each diode (RB421D / RB425D) Fig2. Typical Reverse Characteristics 1 10m 100m 1m O 10m 5 Reverse Current, IR(A) Ta=125OC C 12 = Ta Ta =7 5O C Ta =2 5O C Ta =25 O C Instantaneous Forward Current, IO(A) Fig1. Typical Forward Characteristics 1m 100u 10u 100u Ta=75OC 10u Ta=25OC 1u 0.1u 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0 5 Forward Voltage, VF (V) 15 20 25 30 35 Reverse Voltage, VR (V) Fig3. Typical Capacitance Between Terminals Characteristics Fig4. Typical Derating Curve(mounting on glass epoxy PCBs) 100 100 10 IO Currcnt(%) Capacitance Between Terminals, CT(pF) 10 1 80 60 40 20 0.1 0 0 5 10 15 20 25 0 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 25 50 75 100 125 150 Ambient Temperature, TA (OC) Reverse Voltage, VR(V) Page 3 Document ID Issued Date Revised Date Revision Page. DS-22163E 2009/08/10 2011/01/21 B 7 Formosa MS SMD Small Signal Schottky Barrier Diode RB421D / RB425D Pinning information Type number Symbol Marking code A RB421D B LV3 C A RB425D B KL3 C Suggested solder pad layout SC-59 0.037(0.95) 0.037(0.95) 0.095(2.4) 0.039(1.00) 0.031(0.80) Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date Revision Page. DS-22163E 2009/08/10 2011/01/21 B 7 Formosa MS SMD Small Signal Schottky Barrier Diode RB421D / RB425D Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SC-59 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 3.15 2.77 1.22 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date Revision Page. DS-22163E 2009/08/10 2011/01/21 B 7 Formosa MS SMD Small Signal Schottky Barrier Diode RB421D / RB425D Reel packing PACKAGE SC-59 REEL SIZE 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) 3000 4.0 30,000 REEL DIA, (m/m) INNER BOX (m/m) 183*183*123 CARTON SIZE (m/m) 178 382*262*387 CARTON (pcs) APPROX. GROSS WEIGHT (kg) 240,000 9.5 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date Revision Page. DS-22163E 2009/08/10 2011/01/21 B 7 Formosa MS SMD Small Signal Schottky Barrier Diode RB421D / RB425D High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=125 OC for 168 hrs. MIL-STD-750D METHOD-1026 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker JESD22-A102 15P SIG at T A=121 OC for 4 hrs. MIL-STD-750D METHOD-1051 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. 9. Forward Surge 8.3ms single half sine-wave superimposed on rated load, one surge. 10. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1038 11. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 MIL-STD-750D METHOD-1056 MIL-STD-750D METHOD-4066-2 Document ID Issued Date Revised Date Revision Page. DS-22163E 2009/08/10 2011/01/21 B 7