Formosa MS Chip Schottky Barrier Diode FM501V-NL List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities...........................................................7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 1 DS-12161D Issued Date 2008/02/10 Revised Date Revision Page. 2009/02/10 B 7 Formosa MS Chip Schottky Barrier Diode FM501V-NL 100mA Surface Mount Small Signal Schottky Diode-40V Package Outline 0.053(1.35) 0.045(1.15) • Low current rectification and high speed switching. • Extremely small surface mount type. • Up to 100mA current capability. • Low forward voltage drop (VF = 0.45V typ. @10.0mA) • Silicon epitaxial planar chip, metal silicon junction. • Lead-free parts for green partner, exceeds environmental 0.016(0.40) 0.010(0.25) SOD-323F Features 0.071(1.80) 0.063(1.60) standards of MIL-STD-19500 /228 0.003(0.08) 0.016(0.40) 0.039(1.00) 0.031(0.80) Mechanical data 0.106(2.70) 0.091(2.30) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, SOD-323F • Terminals : Solder plated, solderable per Dimensions in inches and (millimeters) MIL-STD-750, Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.005 gram Maximum ratings (AT T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Symbol MIN. TYP. MAX. UNIT Repetitive peak reverse voltage V RM 40 V Continuous reverse voltage VR 40 V Mean rectifying current IO 100 mA 1000 mA Forward surge current 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) I FSM Capacitance between terminals f=1MHz and applied 10V DC reverse voltage CT Storage temperature TJ Operating temperature T STG 20 -55 -65 pF +125 o C +175 o C Forward voltage I F = 100 mA DC VF 0.55 V Reverse current V R = 10 V DC IR 30 µA http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 2 DS-12161D Issued Date 2008/02/10 Revised Date Revision Page. 2009/02/10 B 7 Rating and characteristic curves (FM501V-NL) Fig. 1 Forward characteristics Fig. 2 Reverse characteristics 10m 1000 REVERSE CURRENT : (uA) 100 1 0 0.1 C C O 25 75 O C O 1m O 75 C 100 10 O 25 C 1 25 5C 10 O 12 FORWARD CURRENT : (mA) O 125 C 0.2 0.3 0.4 0.5 0.1 0 0.6 10 20 30 40 REVERSE VOLTAGE : (V) FORWARD VOLTAGE : (V) Fig. 4 Derating curve FIG.3-TYPICAL TERMINALS CAPACITANCE 100 100 Io CURRENT (%) CAPACITANCE BETWEEN TERMINALS : (pF) (mounting on glass epoxy PCBs) 10 1 0 5 10 15 20 25 30 80 60 40 20 35 REVERSE VOLTAGE : V 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE : T A http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 3 DS-12161D Issued Date 2008/02/10 Revised Date Revision Page. 2009/02/10 B 7 Formosa MS Chip Schottky Barrier Diode FM501V-NL Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code FM501V-NL JV Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SOD-323F 0.059 (1.50) 0.039 (1.00) 0.051 (1.30) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 4 DS-12161D Issued Date 2008/02/10 Revised Date Revision Page. 2009/02/10 B 7 Formosa MS Chip Schottky Barrier Diode FM501V-NL Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOD-323F Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 1.46 2.95 1.25 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 5 DS-12161D Issued Date 2008/02/10 Revised Date Revision Page. 2009/02/10 B 7 Formosa MS Chip Schottky Barrier Diode FM501V-NL Reel packing PACKAGE REEL SIZE SOD-323F 7" REEL (pcs) COMPONENT SPACING (m/m) 3000 4.0 30,000 REEL DIA, (m/m) INNER BOX (m/m) BOX (pcs) 183*183*123 178 CARTON SIZE (m/m) CARTON (pcs) APPROX. GROSS WEIGHT (kg) 460*400*420 240,000 8.0 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=10 oC~35 oC Humidity=65%±15% 2.Reflow soldering of surface-mount devices Critical Zone T L to T P tP TP Ramp-up TL tL Temperature T smax T smin TS ts Preheat 25 Ramp-down t25 oC to Peak Wave Soldering IR Reflow Time 3.Flow (wave)soldering (solder dipping) Profile Feature Soldering Condition Average ramp-up rate(T L to TP ) <3oC/sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 100oC 150oC 60~120sec Tsmax to TL -Ramp-upRate <3oC/sec Time maintained above: -Temperature(TL ) -Time(tL ) 183oC 60~150sec 255oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(tP ) 10~30sec Ramp-down Rate <6 oC/sec Time 25oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 6 DS-12161D Issued Date 2008/02/10 Revised Date Revision Page. 2009/02/10 B 7 Formosa MS Chip Schottky Barrier Diode FM501V-NL High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260±5 C for 10±2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T A=125 OC for 168 hrs. MIL-STD-750D METHOD-1026 4. Forward Operation Life Rated average rectifier current at T=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker 15P SIG at TA=121 OC for 4 hrs. 7. Temperature Cycling -55 OC to +125OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 9. Forward Surge 10. Humidity 11. High Temperature Storage Life 12. Solvent Resistance http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-1051 MIL-STD-750D METHOD-1056 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-4066-2 8.3ms single half sine-wave superimposed on rated load, one surge. at TA=65 OC, RH=98% for 1000hrs. MIL-STD-750D METHOD-1038 at 175OC for 1000 hrs. MIL-STD-750D METHOD-1031 Dip into Freon at 25OC for 1 min. MIL-STD-202F METHOD-215 Document ID Page 7 DS-12161D Issued Date 2008/02/10 Revised Date Revision Page. 2009/02/10 B 7