Inductors for Standard Circuits Multilayer/STD • magnetic shielded MLF series Type: MLF1005L MLF1608 MLF2012 1005[0402 inch]* 1608[0603 inch] 2012[0805 inch] * Dimensions Code JIS[EIA] Issue date: November 2011 • All specifications are subject to change without notice. • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. (1/9) Inductors for Standard Circuits Multilayer/STD • Magnetic Shielded Conformity to RoHS Directive MLF Series MLF1005L Various digital devices are required to be further downsized yet remain highly functional, and to excel in low power consumption, and parts mounted on the devices are also required to have lower resistance. The MLF1005L type is a new line of inductors that have been developed to meet such requirements: their resistance has been lowered by up to 35% in comparison with that of the existing MLF1005 type. In addition, the new inductors use similar magnetic shielding, which enables their high-density mounting. PRODUCT IDENTIFICATION MLF 1005 L R10 K T (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions L×W 1005 1.0×0.5×0.5 (3) Type name L FEATURES • The resistance of the MLF1005L type has been lowered by up to 35% in comparison with that of the existing MLF1005 type. • Magnetically shielded configuration allowing for high-density mounting. • Does not contain lead and is compatible with lead-free soldering. • It is a product conforming to RoHS directive. (7) Low-resistance type (4) Inductance R10 1R0 0.1µH 1.0µH (5) Tolerance K ±10% (6) Packaging style APPLICATIONS Signal processing modules such as cellular phones and tuners T Taping [reel] (7) TDK internal code SPECIFICATIONS Operating temperature range Storage temperature range –40 to +85°C –40 to +85°C(After mount) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING 10s max. 250 to 260˚C Natural cooling 230˚C 180˚C 150˚C Preheating 60 to 120s Soldering 30 to 60s Time(s) PACKAGING STYLE AND QUANTITIES Packaging style Taping Quantity 10000 pieces/reel HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • The inductance value may change due to magnetic saturation if the current exceeds the rated maximum. • Do not expose the inductors to stray magnetic fields. • Avoid static electricity discharge during handling. • When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. • Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) • All specifications are subject to change without notice. 001-05 / 20111129 / e511_mlf_02 (2/9) SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN 0.5 0.5±0.05 1.0±0.05 0.5 0.4 0.5 0.1min. 0.5±0.05 0.1min. Weight : 1.2mg Dimensions in mm ELECTRICAL CHARACTERISTICS Inductance (µH) Inductance tolerance 0.1 0.12 0.15 0.18 0.22 0.27 0.33 0.39 0.47 0.56 0.68 0.82 1.0 1.2 1.5 1.8 2.2 ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% Test frequency L, Q (MHz) 25 25 25 25 25 25 25 10 10 10 10 10 10 10 10 10 10 Test current L, Q (mA) 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Q min. 10 10 10 10 10 10 10 25 25 25 25 25 25 25 25 25 25 TYPICAL ELECTRICAL CHARACTERISTICS INDUCTANCE vs. FREQUENCY CHARACTERISTICS DC resistance (Ω )max. Rated current (mA)max. Part No. 0.51 0.59 0.63 0.76 0.79 0.91 1.05 0.41 0.42 0.47 0.55 0.59 0.64 0.79 0.95 1.05 1.15 150 140 130 120 110 100 90 50 50 45 40 35 35 35 30 20 15 MLF1005LR10KT MLF1005LR12KT MLF1005LR15KT MLF1005LR18KT MLF1005LR22KT MLF1005LR27KT MLF1005LR33KT MLF1005LR39KT MLF1005LR47KT MLF1005LR56KT MLF1005LR68KT MLF1005LR82KT MLF1005L1R0KT MLF1005L1R2KT MLF1005L1R5KT MLF1005L1R8KT MLF1005L2R2KT IMPEDANCE vs. FREQUENCY CHARACTERISTICS 10 10000 1000 1 Impedance (Ω) 2.2µH Inductance (µH) Self-resonant frequency (MHz)min. 450 400 350 320 290 260 230 210 190 170 150 130 120 110 100 90 80 1.0µH 0.33µH 0.1 0.1µH 2.2µH 1.0µH 0.1µH 100 0.33µH 10 0.01 1 10 100 1000 Frequency (MHz) 1 1 10 100 1000 Frequency (MHz) Q vs. FREQUENCY CHARACTERISTICS 70 2.2µH 60 50 1.0µH 0.1µH Q 40 0.33µH 30 20 10 0 1 10 100 1000 Frequency (MHz) • All specifications are subject to change without notice. 001-05 / 20111129 / e511_mlf_02 (3/9) PACKAGING STYLES REEL DIMENSIONS ø60min. 1.0 2.0±0.5 8.4 +2.0 –0.0 ø13±0.2 14.4max. ø21±0.8 ø180±2.0 Dimensions in mm Cavity 3.5±0.05 1.5 +0.1 –0.0 0.8max. 0.65±0.1 4.0±0.1 2.0±0.05 160min. Taping 2.0±0.05 1.15±0.1 8.0±0.3 Sprocket hole 1.75±0.1 TAPE DIMENSIONS 200min. Drawing direction 300min. Dimensions in mm • All specifications are subject to change without notice. 001-05 / 20111129 / e511_mlf_02 (4/9) Inductors for Standard Circuits Multilayer/STD • Magnetic Shielded Conformity to RoHS Directive MLF Series MLF1608 FEATURES • High-reliability monolithic structure. • Ferrite core and magnetic shielding enables the design of compact circuits with high density mounting. • Excellent solderability and high heat resistance permits either flow or reflow soldering. • The products contain no lead and also support lead-free soldering. • It is a product conforming to RoHS directive. PRODUCT IDENTIFICATION MLF 1608 A 1R0 K T (1) (2) (3) (4) (5) (6) (7) (1) Series name (2) Dimensions L×W 1608 1.6×0.8mm (3) Type name APPLICATIONS Digital cellular phone, tuner, personal computers, audio, or various electronic appliances SPECIFICATIONS Operating temperature range Storage temperature range –40 to +85°C –40 to +85°C(After mount) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING (4) Inductance 47N R15 1R0 47nH[0.047µH] 0.15µH 1µH (5) Tolerance K M ±10% ±20% (6) Packaging style T Taping [reel] 10s max. 250 to 260˚C Natural cooling 230˚C (7) TDK internal code PACKAGING STYLE AND QUANTITIES Packaging style Taping 180˚C Quantity 4000 pieces/reel 150˚C Preheating 60 to 120s Soldering 30 to 60s Time(s) HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • The inductance value may change due to magnetic saturation if the current exceeds the rated maximum. • Do not expose the inductors to stray magnetic fields. • Avoid static electricity discharge during handling. • When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. • Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) • All specifications are subject to change without notice. 001-05 / 20111129 / e511_mlf_02 (5/9) SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN 0.8 0.8±0.15 1.6±0.15 0.6 0.8±0.15 0.3±0.2 Weight: 4mg 0.8 0.6 Dimensions in mm ELECTRICAL CHARACTERISTICS Inductance (µH) Inductance tolerance 0.047 0.068 0.082 0.1 0.12 0.15 0.18 0.22 0.27 0.33 0.39 0.47 0.56 0.68 0.82 1 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 ±20% ±20% ±20% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% Q min. 10 10 10 15 15 15 15 15 15 15 15 15 15 15 15 35 35 35 35 35 35 35 35 35 35 35 35 30 30 20 20 20 20 20 typ. 20 20 20 25 25 25 25 25 25 25 25 30 30 30 30 50 50 55 55 55 55 60 60 60 60 60 60 55 55 40 40 40 40 40 Test frequency L, Q (MHz) 50 50 50 25 25 25 25 25 25 25 25 25 25 25 25 10 10 10 10 10 10 10 10 10 4 4 4 2 2 1 1 1 1 1 Test current L, Q (mA) 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 Self-resonant frequency (MHz) min. typ. 600 900 550 700 500 650 450 600 400 550 350 500 320 450 290 400 260 350 230 320 210 290 190 260 170 230 150 210 130 190 120 170 110 150 100 140 90 130 80 120 70 110 65 100 60 90 55 80 45 70 40 60 35 55 30 50 25 45 22 42 20 40 18 38 15 35 10 30 DC resistance (Ω ) max. typ. 0.20 0.10 0.30 0.15 0.30 0.15 0.35 0.20 0.40 0.20 0.45 0.25 0.50 0.25 0.55 0.30 0.60 0.35 0.75 0.40 0.85 0.45 0.95 0.50 1.05 0.55 1.25 0.65 1.40 0.75 0.50 0.25 0.65 0.25 0.70 0.30 0.85 0.35 1.00 0.45 1.15 0.50 1.30 0.55 1.45 0.65 1.60 0.75 1.10 0.55 1.30 0.65 1.50 0.80 1.70 1.00 1.80 1.20 1.50 0.80 1.60 0.85 1.70 0.90 1.80 1.20 2.20 1.40 Rated current (mA)max. Part No. 200 200 200 200 200 200 150 150 150 100 100 100 100 70 70 50 50 50 50 30 30 30 30 30 15 15 10 10 10 2 2 2 2 2 MLF1608D47N∗MT MLF1608D68NMT MLF1608D82NMT MLF1608DR10KT MLF1608DR12KT MLF1608DR15KT MLF1608DR18KT MLF1608DR22KT MLF1608DR27KT MLF1608DR33KT MLF1608DR39KT MLF1608DR47KT MLF1608DR56KT MLF1608DR68KT MLF1608DR82KT MLF1608A1R0KT MLF1608A1R2KT MLF1608A1R5KT MLF1608A1R8KT MLF1608A2R2KT MLF1608A2R7KT MLF1608A3R3KT MLF1608A3R9KT MLF1608A4R7KT MLF1608E5R6KT MLF1608E6R8KT MLF1608E8R2KT MLF1608E100KT MLF1608E120KT MLF1608C150KT MLF1608C180KT MLF1608C220KT MLF1608C270KT MLF1608C330KT ∗ 47N means for 47nH (0.047µH). • Test equipment Inductance, Q: Ag4294A-16034G • All specifications are subject to change without notice. 001-05 / 20111129 / e511_mlf_02 (6/9) TYPICAL ELECTRICAL CHARACTERISTICS INDUCTANCE CHANGE vs. DC SUPERPOSITION CHARACTERISTICS IMPEDANCE vs. FREQUENCY CHARACTERISTICS 100 100 22µH 8.2µH 10 Impedance (kΩ) Inductance (µH) 10 1µH 1 1 22µH 1µH 8.2µH 0.1 0.01 0.1 0.068µH 1 5 0.68µH 10 50 100 DC current (mA) 0.01 500 1000 INDUCTANCE CHANGE vs. TEMPERATURE CHARACTERISTICS 1 5 10 50 100 Frequency (MHz) 500 1000 Q vs. FREQUENCY CHARACTERISTICS 0 5 60 8.2µH 1µH 0 25 50 85 –5 Temperature (˚C) –10 40 22µH 0.68µH 20 0 PACKAGING STYLES REEL DIMENSIONS 0.1 0.5 1 5 10 50 100 Frequency (MHz) 5001000 TAPE DIMENSIONS Sprocket hole 1.5 +0.1 –0.0 Cavity 1.1max. 1.1±0.2 4.0±0.1 4.0±0.1 2.0±0.05 2.0±0.5 8.4 +2.0 –0.0 ø13±0.2 14.4max. 160min. Taping 1.9±0.2 ø60min. 8.0±0.3 1.0 3.5±0.05 –25 1µH 8.2µH 0.68µH 22µH 1.75±0.1 10 Q ∆L /L(%) 80 22µH 0.68µH 8.2µH 1µH 200min. ø21±0.8 ø180±2.0 Dimensions in mm Drawing direction 300min. Dimensions in mm • All specifications are subject to change without notice. 001-05 / 20111129 / e511_mlf_02 (7/9) Inductors for Standard Circuits Multilayer/STD • Magnetic Shielded Conformity to RoHS Directive MLF Series MLF2012 FEATURES • High-reliability monolithic structure. • Ferrite core and magnetic shielding enables the design of compact circuits with high density mounting. • Excellent solderability and high heat resistance permits either flow or reflow soldering. • The products contain no lead and also support lead-free soldering. • It is a product conforming to RoHS directive. PRODUCT IDENTIFICATION MLF 2012 A 1R0 K T (1) (2) (3) (4) (5) (6) (7) (1) Series name (2) Dimensions L×W 2012 2.0×1.25mm (3) Type name APPLICATIONS Digital cellular phone, car audio, TV, personal computers, or various electronic appliances SPECIFICATIONS Operating temperature range Storage temperature range –40 to +85°C –40 to +85°C(After mount) (4) Inductance 47N R15 1R0 100 47nH[0.047µH] 0.15µH 1µH 10µH (5) Tolerance RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING K M ±10% ±20% (6) Packaging style 10s max. T Taping [reel] 250 to 260˚C Natural cooling 230˚C (7) TDK internal code PACKAGING STYLE AND QUANTITIES 180˚C Packaging style Taping 150˚C Preheating 60 to 120s Soldering 30 to 60s Time(s) Product’s thickness 0.85mm 1.25mm Quantity 4000 pieces/reel 2000 pieces/reel HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • The inductance value may change due to magnetic saturation if the current exceeds the rated maximum. • Do not expose the inductors to stray magnetic fields. • Avoid static electricity discharge during handling. • When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. • Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) • All specifications are subject to change without notice. 001-05 / 20111129 / e511_mlf_02 (8/9) SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN 1.2 1.25±0.2 2.0±0.2 0.8 1 0.8 0.5±0.3 T T(Thickness) 0.85±0.2 1.25±0.2 Weight(mg) 10 14 Dimensions in mm ELECTRICAL CHARACTERISTICS Inductance (µH) Inductance tolerance 0.047 0.068 0.082 0.1 0.12 0.15 0.18 0.22 0.27 0.33 0.39 0.47 0.56 0.68 0.82 1 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 ±20% ±20% ±20% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% Q min. 15 15 15 20 20 20 20 20 20 20 25 25 25 25 25 45 45 45 45 45 45 45 45 45 50 50 50 50 50 30 30 30 30 30 35 35 35 25 25 25 typ. 25 25 25 30 30 30 30 30 30 30 35 35 35 35 35 55 55 60 60 60 70 70 70 70 75 75 75 75 75 45 45 45 45 45 55 55 55 45 45 45 Test frequency L, Q (MHz) 50 50 50 25 25 25 25 25 25 25 25 25 25 25 25 10 10 10 10 10 10 10 10 10 4 4 4 2 2 1 1 1 1 0.4 2 2 2 1 1 1 Test current L, Q (mA) 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 Self-resonant frequency (MHz) min. typ. 550 700 500 600 450 550 400 500 360 450 320 410 280 370 250 330 220 300 200 270 180 250 160 230 150 210 140 190 130 170 120 160 110 150 100 140 90 130 80 120 70 100 60 90 55 80 50 70 45 65 40 60 35 55 30 50 25 45 22 40 20 38 18 35 17 33 15 28 13 23 11 20 10 18 9 16 8 14 7 12 DC resistance (Ω ) max. typ. 0.10 0.05 0.15 0.08 0.15 0.08 0.15 0.10 0.20 0.12 0.20 0.13 0.25 0.15 0.30 0.16 0.35 0.18 0.40 0.23 0.45 0.25 0.50 0.25 0.55 0.30 0.60 0.35 0.65 0.40 0.30 0.15 0.35 0.15 0.40 0.18 0.45 0.20 0.50 0.22 0.55 0.25 0.60 0.28 0.65 0.30 0.70 0.35 0.60 0.30 0.65 0.32 0.70 0.35 0.80 0.40 0.90 0.50 0.70 0.35 0.80 0.38 0.90 0.45 1.00 0.50 1.10 0.55 2.40 1.30 2.70 1.60 2.80 1.80 2.90 2.00 3.00 2.40 3.10 2.50 Rated current (mA)max. 300 300 300 300 300 300 300 250 250 250 200 200 150 150 150 80 80 80 80 50 50 50 30 30 15 15 15 15 15 5 5 5 5 5 4 4 4 2 2 2 Thickness T (mm) 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 1.25 1.25 1.25 1.25 0.85 0.85 0.85 0.85 0.85 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 Part No. MLF2012D47N∗MT MLF2012D68NMT MLF2012D82NMT MLF2012DR10KT MLF2012DR12KT MLF2012DR15KT MLF2012DR18KT MLF2012DR22KT MLF2012DR27KT MLF2012DR33KT MLF2012DR39KT MLF2012DR47KT MLF2012DR56KT MLF2012DR68KT MLF2012DR82KT MLF2012A1R0KT MLF2012A1R2KT MLF2012A1R5KT MLF2012A1R8KT MLF2012A2R2KT MLF2012A2R7KT MLF2012A3R3KT MLF2012A3R9KT MLF2012A4R7KT MLF2012E5R6KT MLF2012E6R8KT MLF2012E8R2KT MLF2012E100KT MLF2012E120KT MLF2012C150KT MLF2012C180KT MLF2012C220KT MLF2012C270KT MLF2012C330KT MLF2012K390KT MLF2012K470KT MLF2012K560KT MLF2012C680KT MLF2012C820KT MLF2012C101KT ∗ 47N means for 47nH (0.047µH). • Test equipment Inductance, Q: Ag4294A-16034G • All specifications are subject to change without notice. 001-05 / 20111129 / e511_mlf_02 (9/9) TYPICAL ELECTRICAL CHARACTERISTICS INDUCTANCE CHANGE vs. DC SUPERPOSITION CHARACTERISTICS IMPEDANCE vs. FREQUENCY CHARACTERISTICS 100 100 22µH 10µH 10 Impedance (kΩ) Inductance (µH) 10 1µH 1 1 22µH 10µH 0.1µH 0.1 0.01 1 5 10 50 100 DC current (mA) 0.01 500 1000 INDUCTANCE CHANGE vs. TEMPERATURE CHARACTERISTICS ∆L /L(%) 5 10 50 100 Frequency (MHz) 500 1000 80 1µH 10µH 0.1µH 8 4 10µH 60 22µH 0 25 50 85 – 4 Temperature (˚C) –8 1µH Q 0 1 0.1µH Q vs. FREQUENCY CHARACTERISTICS 12 –25 22µH 0.1µH 1µH 10µH 1µH 0.1 0.1µH 40 22µH 20 –12 –16 0 PACKAGING STYLES REEL DIMENSIONS 0.1 0.5 1 5 10 50 100 Frequency (MHz) 5001000 TAPE DIMENSIONS 1.5 +0.1 –0.0 1.1max. 1.5±0.2 4.0±0.1 4.0±0.1 2.0±0.05 ø13±0.2 14.4max. ø21±0.8 1.5max. Sprocket hole 1.5 +0.1 –0.0 0.5min. Cavity 8.0±0.3 Dimensions in mm 0.3max. 1.5±0.2 4.0±0.1 4.0±0.1 2.0±0.05 160min. Drawing direction Taping 2.3±0.2 ø180±2.0 t=1.25mm 3.5±0.05 8.4 +2.0 –0.0 1.75±0.1 2.0±0.5 2.3±0.2 8.0±0.3 ø60min. Cavity 3.5±0.05 Sprocket hole 1.0 1.75±0.1 t=0.85mm 200min. 300min. Dimensions in mm • All specifications are subject to change without notice. 001-05 / 20111129 / e511_mlf_02