Chip Beads For power line MPZ series Type: MPZ0603 MPZ1005 MPZ1608 MPZ2012 [0201 inch]* [0402 inch] [0603 inch] [0805 inch] * Dimensions Code [EIA] Issue date: September 2011 • All specifications are subject to change without notice. • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. (1/10) Chip Beads For Power Line Conformity to RoHS Directive MPZ Series MPZ0603 APPLICATIONS Removal of power line noises of cellular phones, PCs, note PCs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game machines, digital photo frames, etc. PRODUCT IDENTIFICATION MPZ 0603 S 220 C T (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions L×W (3) Material code (4) Nominal impedance [at 100MHz] (5) Characteristic type (6) Packaging style T:Taping(reel) HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • Do not expose the inductors to stray magnetic fields. • Avoid static electricity discharge during handling. • When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN 0.30 0.3±0.03 0.6±0.03 0.25 0.1min. 0.30 0.25 0.3±0.03 FEATURES • This chip bead implements a 0603 shape in its capacity as an EMC countermeasure component, and it supports compact devices that need smaller spaces. • This product can cope with a high current due to its low DC resistance. It is also most suitable for lower power consumption. • Because of its low DC resistance, it is useful for audio lines. • No cross talk with closed magnetic circuit structural design. • It is a product conforming to RoHS directive. Weight: 0.3mg Dimensions in mm TEMPERATURE RANGES Operating/storage –55 to +125°C PACKAGING STYLE AND QUANTITIES Packaging style Taping Quantity 15000 pieces/reel RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING 10s max. 250 to 260˚C Natural cooling 230˚C 180˚C 150˚C Preheating 60 to 120s Soldering 30 to 60s Time(s) ELECTRICAL CHARACTERISTICS Part No. MPZ0603S220C MPZ0603S330C MPZ0603S470C ∗ Impedance (Ω )[100MHz]∗ 22±25% 33±25% 47±25% DC resistance (Ω )max. 0.065 0.090 0.120 Rated current (mA)max. 1000 750 500 Test equipment: E4991A or equivalent Test tool: 16197 or equivalent Test temperature: 25±10°C • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. • Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) • All specifications are subject to change without notice. 001-05 / 20110928 / e9413_mpz (2/10) TYPICAL ELECTRICAL CHARACTERISTICS Z FREQUENCY CHARACTERISTICS MPZ0603S SERIES MPZ0603S470C Impedance (Ω) MPZ0603S330C MPZ0603S220C 10 100 1000 Frequency (MHz) 10000 Z, X, R vs. FREQUENCY CHARACTERISTICS MPZ0603S220C MPZ0603S330C 45 70 90 40 60 80 25 Impedance(Ω) Z 30 R 20 15 10 0 1 10 100 1000 Frequency (MHz) Z 40 R 30 20 Z 60 50 R 40 30 20 X 5 70 50 Impedance(Ω) 35 Impedance(Ω) MPZ0603S470C 10 0 10000 X 1 10 100 1000 Frequency (MHz) PACKAGING STYLES REEL DIMENSIONS X 10 0 10000 1 10 100 1000 Frequency (MHz) 10000 TAPE DIMENSIONS Sprocket hole 1.5 +0.1 –0.0 Cavity 0.5max. 0.38±0.05 4.0±0.1 2.0±0.05 2.0±0.5 8.4 +2.0 –0.0 ø13±0.2 14.4max. 160min. Taping 2.0±0.05 0.68±0.05 ø60min. 8.0±0.3 1.0 3.5±0.05 1 1.75±0.1 100 90 80 70 60 50 40 30 20 10 0 200min. ø21±0.8 ø180±2.0 Dimensions in mm Drawing direction 300min. Dimensions in mm • All specifications are subject to change without notice. 001-05 / 20110928 / e9413_mpz (3/10) Chip Beads For Power Line Conformity to RoHS Directive MPZ Series MPZ1005 SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN 1±0.05 0.5 0.5±0.05 FEATURES • TDK has manufactured MPZ1005 type as EMI countermeasure product for power line. • This type is the best for energy-saving in the low DC resistance. • No cross talk with closed magnetic circuit structural design. • It is a product conforming to RoHS directive. 0.5 0.4 0.5 0.5±0.05 0.1min. APPLICATIONS Removal of power line noises of cellular phones, PCs, note PCs, TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game machines, digital photo frames, car navigation system, PNDs, etc. Weight: 1mg Dimensions in mm TEMPERATURE RANGES PRODUCT IDENTIFICATION MPZ 1005 S 121 C T (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions L×W (3) Material code (4) Nominal impedance [at 100MHz] (5) Characteristic type (6) Packaging style T:Taping(reel) Operating/storage –40 to +85°C PACKAGING STYLE AND QUANTITIES Packaging style Taping Quantity 10000 pieces/reel RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING 10s max. 250 to 260˚C HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • Do not expose the inductors to stray magnetic fields. • Avoid static electricity discharge during handling. • When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. Natural cooling 230˚C 180˚C 150˚C Preheating 60 to 120s Soldering 30 to 60s Time(s) ELECTRICAL CHARACTERISTICS Part No. MPZ1005S100C MPZ1005S300C MPZ1005S600C MPZ1005S121C MPZ1005Y900C ∗ Impedance (Ω )[100MHz]∗ 10±5Ω 30±10Ω 60±25% 120±25% 90±25% DC resistance (Ω )max. 0.045 0.050 0.075 0.090 0.100 Rated current (A)max. 2.0 1.7 1.5 1.2 1.2 Test equipment: E4991A or equivalent Test tool: 16192A or equivalent Test temperature: 25±10°C • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. • Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) • All specifications are subject to change without notice. 001-05 / 20110928 / e9413_mpz (4/10) TYPICAL ELECTRICAL CHARACTERISTICS Z FREQUENCY CHARACTERISTICS MPZ1005S/MPZ1005Y SERIES 250 MPZ1005Y900C MPZ1005S121C Impedance (Ω) 200 MPZ1005S600C 150 MPZ1005S300C MPZ1005S100C 100 50 0 1 10 100 1000 Frequency (MHz) 10000 Z, X, R vs. FREQUENCY CHARACTERISTICS MPZ1005S100C MPZ1005S300C MPZ1005S600C 50 18 100 16 40 12 10 R 8 6 4 0 1 10 100 1000 Frequency (MHz) 30 R 20 0 10000 MPZ1005S121C 1 10 60 R Z 40 20 100 1000 Frequency (MHz) 0 10000 X 1 10 100 1000 Frequency (MHz) 10000 MPZ1005Y900C 250 200 200 150 Impedance (Ω) Impedance (Ω) X 10 X 2 80 Z Impedance (Ω) Z Impedance (Ω) Impedance (Ω) 14 Z R 100 X 50 Z 150 R 100 50 X 10 100 1000 Frequency (MHz) 10000 1 10 100 1000 Frequency (MHz) PACKAGING STYLES REEL DIMENSIONS 10000 TAPE DIMENSIONS Sprocket hole 1.5 +0.1 –0.0 Cavity 0.8max. 0.65±0.1 4.0±0.1 2.0±0.05 2.0±0.5 8.4 +2.0 –0.0 ø13±0.2 14.4max. 160min. Taping 2.0±0.05 1.15±0.1 ø60min. 8.0±0.3 1.0 3.5±0.05 1 0 1.75±0.1 0 200min. ø21±0.8 ø180±2.0 Dimensions in mm Drawing direction 300min. Dimensions in mm • All specifications are subject to change without notice. 001-05 / 20110928 / e9413_mpz (5/10) Chip Beads For Power Line Conformity to RoHS Directive MPZ Series MPZ1608 APPLICATIONS Removal of power line noises of cellular phones, PCs, note PCs, TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game machines, digital photo frames, car navigation system, PNDs, etc. PRODUCT IDENTIFICATION MPZ 1608 S 221 A T (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions L×W (3) Material code (4) Nominal impedance 221: 220Ω at 100MHz (5) Characteristic type (6) Packaging style T: Taping HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • Do not expose the inductors to stray magnetic fields. • Avoid static electricity discharge during handling. • When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. MATERIAL CHARACTERISTICS B material: This type is perfectly suited for fast digital signals. By equalizing R components and X components that beads possess at a frequency of 5MHz, it is able to suppress overshooting, undershooting and ringing of fast digital signals. R material: For wide frequency applications calling for broad impedance characteristics. For digital signal line applications calling requiring good waveform integrity. Impedance values selected for effectiveness at 10 to 200MHz. S material: Standard type that features impedance characteristics similar to those of a typical ferrite core. For signal line applications in which the blocking region is near 100MHz. Impedance values selected for effectiveness at 40 to 300MHz. Y material: High frequency range type intended for the 100MHz region and above. For signal line applications in which the signal frequency is far from the cutoff frequency. Impedance values selected for effectiveness at 80 to 400MHz. D material: For applications calling for low insertion loss at low frequencies and sharply increasing impedance at high frequencies. Designed for high impedance at high frequencies (300MHz to 1GHz) for signal line applications. TYPICAL MATERIAL CHARACTERISTICS 2500 D 2000 Y Impedance(Ω) FEATURES • This type is the best for energy-saving in the low DC resistance. • The products contain no lead and also support lead-free soldering. • It is a product conforming to RoHS directive. 1500 1000 R S 500 B 0 10 100 Frequency(MHz) 1000 • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. • Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) • All specifications are subject to change without notice. 001-05 / 20110928 / e9413_mpz (6/10) SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN 1.6±0.15 0.8 0.6 0.8 0.8±0.15 0.6 0.3±0.2 T 0.3±0.2 Dimensions in mm Thickness(T) 0.6±0.15mm 0.8±0.15mm Weight 3mg 4mg TEMPERATURE RANGES Operating/storage –55 to +125°C PACKAGING STYLE AND QUANTITIES Packaging style Taping Quantity 4000 pieces/reel RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING 10s max. ELECTRICAL CHARACTERISTICS Part No. MPZ1608B471A MPZ1608S300A MPZ1608S600A MPZ1608S101A MPZ1608S121A MPZ1608S181A MPZ1608S221A MPZ1608S331A MPZ1608R391A MPZ1608S471A MPZ1608S601A MPZ1608S102A MPZ1608Y600B MPZ1608Y101B MPZ1608Y151B MPZ1608Y221B MPZ1608D300B MPZ1608D600B MPZ1608D101B DC resistance (Ω )max. 0.150 0.010 0.020 0.030 0.045 0.050 0.050 0.080 0.120 0.150 0.150 0.300 0.030 0.040 0.050 0.100 0.060 0.100 0.150 Rated current∗2 (A)max. 1.0 5.0 3.5 3.0 2.0 2.0 2.2 1.7 1.2 1.0 1.0 0.8 2.3 2.0 1.8 1.5 1.8 1.2 1.0 Thickness T(mm) 0.8 0.6 0.6 0.6 0.6 0.6 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 ∗1 Test equipment: E4991A or equivalent Test tool: 16192A or equivalent Test temperature: 25±10°C ∗2 Please refer to the graph of RATED CURRENT vs. TEMPERATURE CHARACTERISTICS(DERATING) about the rating current at 85°C or more in temperature of the product. RATED CURRENT vs. TEMPERATURE CHARACTERISTICS (DERATING) 250 to 260˚C Natural cooling 230˚C Impedance (Ω)[100MHz]∗1 470±25% 30±10Ω 60±25% 100±25% 120±25% 180±25% 220±25% 330±25% 390±25% 470±25% 600±25% 1000±25% 60±25% 100±25% 150±25% 220±25% 30±10Ω 60±25% 100±25% 6 150˚C Preheating 60 to 120s Soldering 30 to 60s Rated current(A) 5 180˚C 4 3 2 Time(s) 1 0 –55 –35 –15 5 25 45 65 Temperature(˚C) 85 105 125 S300A S600A S101A Y600B S221A S121A,S181A,Y101B Y151B,D300B S331A Y221B R391A,D600B B471A,S471A,S601A,D101B S102A • All specifications are subject to change without notice. 001-05 / 20110928 / e9413_mpz (7/10) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MPZ1608B471A MPZ1608S300A MPZ1608S600A 100 40 500 35 Z 300 R 200 25 R 20 Z 15 10 X 100 80 30 Impedance(Ω) Impedance(Ω) Impedance(Ω) 400 X 60 Z R 40 X 20 5 0 1 10 100 1000 Frequency (MHz) 0 10000 MPZ1608S101A 1 10 100 1000 Frequency (MHz) 0 10000 MPZ1608S121A Z 80 R 60 40 R 100 1 10 100 1000 Frequency (MHz) 0 10000 MPZ1608S221A 1 10 100 1000 Frequency (MHz) 10 100 1000 Frequency (MHz) 10000 400 400 200 Z 150 R 100 X 300 Z 250 Impedance(Ω) Impedance(Ω) R 200 150 X 100 50 Z 300 R 200 X 100 50 1 10 100 1000 Frequency (MHz) 0 10000 MPZ1608S471A 1 100 1000 Frequency (MHz) 800 600 700 Impedance(Ω) 500 Z R 300 200 100 10 100 1000 Frequency (MHz) 10 100 1000 Frequency (MHz) 10000 MPZ1608S102A 1000 600 500 Z R 400 300 X 10000 0 800 Z 600 1 10 100 1000 Frequency (MHz) 10000 R 400 X 200 100 1 1 1200 200 X 0 10000 MPZ1608S601A 700 400 10 Impedance(Ω) Impedance(Ω) 1 500 350 Impedance(Ω) X MPZ1608R391A 450 250 0 100 0 10000 MPZ1608S331A 300 0 R 150 50 X 20 0 Z 200 50 X 10000 250 Z 150 Impedance(Ω) Impedance(Ω) Impedance(Ω) 100 100 1000 Frequency (MHz) 300 140 120 10 MPZ1608S181A 200 160 1 0 1 10 100 1000 Frequency (MHz) 10000 • All specifications are subject to change without notice. 001-05 / 20110928 / e9413_mpz (8/10) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MPZ1608Y600B MPZ1608Y101B MPZ1608Y151B 300 200 140 250 Z 80 R 60 40 Z 100 1 10 R X 50 X 20 0 150 Impedance(Ω) 100 Impedance(Ω) Impedance(Ω) 120 200 Z 150 R 100 X 50 100 1000 Frequency (MHz) 0 10000 1 10 100 1000 Frequency (MHz) 0 10000 1 10 100 1000 Frequency (MHz) 10000 MPZ1608Y221B 350 250 Z 200 R 150 100 X 0 1 10 100 1000 Frequency (MHz) 10000 MPZ1608D300B MPZ1608D600B MPZ1608D101B 350 250 600 300 500 Z R 100 150 100 0 10 100 1000 Frequency (MHz) 10000 400 Z R 300 200 X X 100 50 X 1 R 200 50 0 Z 250 Impedance(Ω) 150 Impedance(Ω) Impedance(Ω) 200 1 10 PACKAGING STYLES REEL DIMENSIONS 100 1000 Frequency (MHz) 0 10000 1 10 100 1000 Frequency (MHz) 10000 TAPE DIMENSIONS Sprocket hole 1.5 +0.1 –0.0 Cavity 1.1max. 1.1±0.2 4.0±0.1 4.0±0.1 2.0±0.05 2.0±0.5 8.4 +2.0 –0.0 ø13±0.2 14.4max. 160min. Taping 1.9±0.2 ø60min. 8.0±0.3 1.0 3.5±0.05 50 1.75±0.1 Impedance(Ω) 300 200min. ø21±0.8 ø180±2.0 Dimensions in mm Drawing direction 300min. Dimensions in mm • All specifications are subject to change without notice. 001-05 / 20110928 / e9413_mpz (9/10) Chip Beads For Power Line Conformity to RoHS Directive MPZ Series MPZ2012 APPLICATIONS Removal of power line noises of cellular phones, PCs, note PCs, TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game machines, digital photo frames, car navigation system, PNDs, etc. PRODUCT IDENTIFICATION SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN 1.2 1.25±0.2 2.0±0.2 0.8 0.5±0.3 1 0.8 0.85±0.2 FEATURES • The MPZ series are multilayer chip impeders for power supply line applications. • High miniaturized, these parts nonetheless exhibit low DC resistance and high current handling capability. • The products contain no lead and also support lead-free soldering. • It is a product conforming to RoHS directive. Weight: 8mg Dimensions in mm TEMPERATURE RANGES Operating/storage –55 to +125°C PACKAGING STYLE AND QUANTITIES MPZ 2012 S 331 A T (1) (2) (3) (4) (5) (6) Packaging style Taping (1)Series name (2)Dimensions L×W (3)Material code (4)Nominal impedance 331: 330Ω at 100MHz (5)Characteristic type (6)Packaging style T: Taping RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING Quantity 4000 pieces/reel 10s max. 250 to 260˚C Natural cooling 230˚C 180˚C HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • Do not expose the inductors to stray magnetic fields. • Avoid static electricity discharge during handling. • When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. 150˚C Preheating 60 to 120s Soldering 30 to 60s Time(s) • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. • Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) • All specifications are subject to change without notice. 001-05 / 20110928 / e9413_mpz (10/10) ELECTRICAL CHARACTERISTICS 7 6 ∗1 Test equipment: E4991A or equivalent Test tool: 16192A or equivalent Test temperature: 25±10°C ∗2 Please refer to the graph of RATED CURRENT vs. TEMPERATURE CHARACTERISTICS(DERATING) about the rating current at 85°C or more in temperature of the product. S300A 5 4 3 2 S101A S221A S331A S601A S102A 1 0 –55 –35 –15 5 25 45 65 Temperature(˚C) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MPZ2012S300A MPZ2012S101A 30 Impedance(Ω) Impedance(Ω) 40 Z R 20 X 10 140 300 120 250 100 Z 80 R 1 10 100 1000 Frequency (MHz) 60 40 Z 0 100 X 50 10 100 1000 Frequency (MHz) 0 10000 MPZ2012S601A 1 700 1200 350 600 1000 250 Z R 200 150 X 100 Z 400 R 300 200 400 X 200 0 0 0 100 1000 Frequency (MHz) 10000 R 600 100 10 10000 800 50 1 100 1000 Frequency (MHz) Z 500 Impedance(Ω) 300 10 MPZ2012S102A 400 Impedance(Ω) Impedance(Ω) MPZ2012S331A 1 R 150 X 10000 125 200 20 0 105 MPZ2012S221A Impedance(Ω) 50 85 1 10 100 1000 Frequency (MHz) PACKAGING STYLES REEL DIMENSIONS 10000 X 1 10 100 1000 Frequency (MHz) 10000 TAPE DIMENSIONS Sprocket hole 1.5 +0.1 –0.0 Cavity 1.1max. 1.5±0.2 4.0±0.1 4.0±0.1 2.0±0.05 2.0±0.5 8.4 +2.0 –0.0 ø13±0.2 14.4max. 160min. Taping 2.3±0.2 ø60min. 8.0±0.3 1.0 3.5±0.05 MPZ2012S300A MPZ2012S101A MPZ2012S221A MPZ2012S331A MPZ2012S601A MPZ2012S102A 1.75±0.1 Part No. RATED CURRENT vs. TEMPERATURE CHARACTERISTICS (DERATING) Rated current∗2 (A)max. 6 4 3 2.5 2 1.5 DC resistance (Ω )max. 0.010 0.020 0.040 0.050 0.100 0.150 Rated current(A) Impedance (Ω )[100MHz]∗1 30±10Ω 100±25% 220±25% 330±25% 600±25% 1000±25% 200min. ø21±0.8 ø180±2.0 Dimensions in mm Drawing direction 300min. Dimensions in mm • All specifications are subject to change without notice. 001-05 / 20110928 / e9413_mpz