TDK MZA1608S241C

(1/2)
Chip Beads(SMD Array)
For General Signal Line
Conformity to RoHS Directive
MZA Series MZA1608 Type
APPLICATIONS
High-frequency noise countermeasure in computers, printers,
VCRs, televisions, portable telephones, and other equipment.
1.6±0.1
0.4
0.2
0.5
1.1 to 1.4
Terminal
electrode
0.15
0.8±0.1
Ferrite
0.4
0.2
Dimensions in mm
CIRCUIT DIAGRAM
• No polarity
TEMPERATURE RANGES
PRODUCT IDENTIFICATION
Operating/storage
MZA 1608 S 121 C T
(1)
(2) (3) (4) (5) (6)
–55 to +125°C
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
(1) Series name
(2) Dimensions L× W
(3) Material code
(4) Nominal impedance
121:120Ω at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
Natural
cooling
230˚C
180˚C
150˚C
Preheating
60 to 120s
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
0.5±0.1
FEATURES
• A single MZA series chip provides noise attenuation for four
lines, making it ideal for use with I/O lines of various highly
miniaturized.
• Electronic equipment, such as portable products, which
comprise high density circuitry.
• Low crosstalk between adjacent circuits.
• Internal electrodes feature low DC resistance, minimizing
wasteful power consumption.
• Electroplated terminal electrodes accommodate reflow
soldering.
• Monolithic structure ensures high reliability.
• It is a product conforming to RoHS directive.
Quantity
5000 pieces/reel
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• This product does not apply to flow soldering construction
method.
Soldering
30 to 60s
Time(s)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
001-01 / 20070723 / e9421_mza1608.fm
(2/2)
ELECTRICAL CHARACTERISTICS
Impedance
(Ω)[100MHz]∗
80±25%
120±25%
240±25%
Part No.
MZA1608S800C
MZA1608S121C
MZA1608S241C
Test equipment: E4991A or equivalent
Test tool: 16192A or equivalent
Test temperature: 25±10°C
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MZA1608S800C
MZA1608S121C
250
160
Z
80
R
60
40
Z
150
100
R
50
X
X
20
10
100
1000
Frequency (MHz)
0
1
10000
10
PACKAGING STYLES
REEL DIMENSIONS
300
Z
250
R
200
150
100
X
50
100
1000
Frequency (MHz)
0
1
10000
10
100
1000
Frequency (MHz)
10000
TAPE DIMENSIONS
Sprocket hole
1.5 +0.1
–0.0
Cavity
0.8max.
1.3±0.2
4.0±0.1
4.0±0.1
2.0±0.05
2.0±0.5
ø13±0.5
2.3±0.2
ø60±2.0
8.0±0.3
1.0
3.5±0.05
100
Impedance(Ω)
200
120
Impedance(Ω)
Impedance(Ω)
400
350
140
0
1
MZA1608S241C
1.75±0.1
∗
Rated current
(mA)max.
150
150
150
DC resistance
(Ω)max.
0.35
0.4
0.5
9.0±0.3
13.0±1.4
160min.
Taping
200min.
ø21±0.8
ø178±2.0
Dimensions in mm
Drawing direction
300min.
Dimensions in mm
• All specifications are subject to change without notice.
001-01 / 20070723 / e9421_mza1608.fm