IRF IRSF3011LTR

Data Sheet No.PD 60133-H
IRSF3011
(NOTE: For new designs, we
recommend IR’s new products IPS021 and IPS021L)
FULLY PROTECTED POWER MOSFET SWITCH
Features
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Product Summary
Extremely rugged for harsh operating environments
Over-temperature protection
Over-current protection
Active drain-to-source clamp
ESD protection
Lead compatible with standard Power MOSFET
Low operating input current
Monolithic construction
Description
The IRSF3011 is a three-terminal monolithic Smart Power
MOSFET with built-in short circuit, over-temperature, ESD
and over-voltage protections.
The on-chip protection circuit latches off the Power MOSFET
in case the drain current exceeds 7A (typical) or the junction
temperature exceeds 165°C (typical) and keeps it off until the
input is driven low. The drain to source voltage is actively
clamped at 55V (typical), prior to the avalanche of Power
MOSFET, thus improving its performance during turn-off with
inductive loads.
Vds(clamp)
Rds(on)
200mW
Ids(sd)
7A
Tj(sd)
165oC
EAS
200mJ
Applications
· Solenoid Driver
· DC Motor Driver
Available Packages
The input current requirements are very low (300µA) which
makes the IRSF3011 compatible with most existing designs
based on standard Power MOSFETs.
Block Diagram
50V
3 Lead
SOT223
3 Lead
TO220AB
DRAIN
INPUT
SOURCE
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1
IRSF3011
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur.
(TC = 25oC unless otherwise specified.)
Symbol Parameter
Vds, max Continuous drain to source voltage
Vin, max Continuous input voltage
Min.
Max.
Units
—
50
V
-0.3
10
Ids
Continuous drain current
—
self limited
Pd
Power dissipation
—
30
—
3
EAS
Unclamped single pulse inductive energyÁ
—
200
mJ
Vesd1
Electrostatic discharge voltage (Human Body Model)
—
4000
V
Vesd2
Electrostatic discharge voltage (Machine Model)
—
1000
TJop
Operating junction temperature range
-55
150
TStg
Storage temperature range
-55
150
TL
Lead temperature (soldering, 10 seconds)
—
300
Test Conditions
A
W
£ 25oC, TO220
Tc £ 25oC, SOT223
Tc
100pF, 1.5kW
200pF, 0W
o
C
Static Electrical Characteristics
(TC = 25oC unless otherwise specified.)
Symbol Parameter
V ds,clamp Drain to source clamp voltage
Rds(on)
Idss
Drain to source on resistance
Drain to source leakage current
Vth
Ii,on
Input threshold voltage
Input supply current (normal operation)
Ii, off
Input supply current (protection mode)
Vin, clamp Input clamp voltage
Vsd
Body-drain diode forward drop➂
Min.
Typ.
50
—
—
—
—
—
—
—
1.5
—
—
—
—
10
—
54
56
155
200
115
—
—
10
2.0
0.25
0.35
0.5
0.6
10.8
1.2
Min.
Typ.
—
—
—
—
—
—
—
—
Max. Units Test Conditions
—
62
200
—
—
10
100
250
2.5
0.6
0.85
1.0
1.2
—
1.5
V
mW
mA
V
mA
V
Ids = 10mA
Ids = 6A, tp = 700 ms
Vin = 5V, Ids = 2A
Vin = 4V, Ids = 2A
Vin = 10V, Ids = 2A
Vds = 12V, Vin = 0V
Vds = 50V, Vin = 0V
Vds=40V,Vin=0V,Tc=150oC
Vds = 5V, Ids = 10mA
Vin = 5V
Vin = 10V
Vin = 5V
Vin = 10V
Iin = 10mA
Ids = -9A, Rin = 1kW
Thermal Characteristics
Symbol Parameter
Rthjc
Rthja
Rthjc
Rthja
2
Junction
Junction
Junction
Junction
to case
to ambient
to case
to PCB ➀
Max. Units Test Conditions
4
60
40
60
TO-220AB
o
C/W
SOT-223
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IRSF3011
Switching ElectricalCharacteristics
(VCC = 14V, resistive load (RL) = 5W , TC= 25°C.) Please refer to figure 3 for switching time definitions.
Symbol Parameter
tdon
Turn-on delay time
tr
Rise time
tdoff
Turn-off delay time
tf
Fall time
Min.
Typ. Max. Units Test Conditions
—
—
—
—
—
—
—
—
160
90
650
250
250
300
180
170
Min.
Typ.
5
155
—
—
—
—
—
—
—
7
165
3
4
4
16
1.3
8
12
250
—
1200
—
350
—
350
—
nS
Vin = 5V
Vin = 10V
Vin = 5V
Vin = 10V
Vin = 5V
Vin = 10V
Vin = 5V
Vin = 10V
Protection Characteristics
(TC= 25oC unless otherwise specified.)
Symbol Parameter
Ids(sd)
Tj(sd)
Vprotect
tIresp
tIblank
Ipeak
Vreset
treset
tTresp
Over-current shutdown threshold
Over temperature shutdown threshold
Min. input voltage for over-temp function
Over current response time
Over current blanking time
Peak short circuit current
Protection reset voltage
Protection reset time
Over-temperature response time
Max. Units Test Conditions
10
—
—
—
—
—
—
—
—
A
C
V
Vin = 5V
Vin = 5V, Ids = 2A
mS
See Figure 4 for definition
See Figure 4 for definition
See Figure 4 for definition
o
A
V
mS
See Figure 5 for definition
See Figure 6 for definition
Temperature Coefficients of Electrical Characteristics
(Please see Figures 7 through 18 for more data on thermal characteristics of other electrical parameters.
Symbol Parameter
Vds,clamp
Vth
Vin,clamp
Ids(sd)
Drain-to-source clamp voltage T.C.
Input threshold voltage T.C.
Input clamp voltage T.C.
Over-current shutdown threshold T.C.
Min.
Typ.
—
—
—
—
18.2
-2.7
7.0
-9.8
Max. Units Test Conditions
—
—
—
—
Ids = 10mA
mV/oC Vds = 5V, Ids = 10mA
Iin = 10mA
mA/oC Vin = 5V
NOTES:
① When mounted on a 1" square PCB (FR-4 or G10 material). For recommended footprint and soldering techniques,
refer to International Rectifier Application Note AN-994.
② EAS is tested with a constant current source of 6A applied for 700mS with Vin = 0V and starting Tj = 25oC.
③ Input current must be limited to less than 5mA with a 1kW resistor in series with the input when the Body-Drain Diode
is forward biased.
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IRSF3011
Lead Assignments
2 (D)
(2) D
1
In
2
D
3
S
1 2 3
In D S
3 Lead - SOT223
3 Lead - TO220
IRSF3011L
IRSF3011
Part Number
Case Outline 3 Lead - TO220
2
NOTES:
2X
4
IRGB 01-3026 01
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IRSF3011
Case Outline 3 Lead - SOT-223
IRGB X01-3032 00
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5
IRSF3011
Tape & Reel - SOT223
01-0028 05 / 01-0008 02
V in
V in
RL = 0
Vcc = 14V
5V
50%
t
t
Vds
I ds
90%
I peak
10%
t
tdon tr
tdoff tf
Figure 3 Definition of Switching Times
6
t Iblank
t Iresp
Short applied
before turn-on
Short applied
after turn-on
t
Figure 4 Definition of I peak , t Iblank , t Iresp
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IRSF3011
V in
V in
5V
5V
t
I ds
t
t > t reset
t < t reset
I ds
I ds(sd)
t
R L = 1 mH
t
t Tresp
Vcc = 14V
R L = 10 Ω
Figure 5 Definition of treset
Vcc = 14V
T J = TJSD + 5°C
Figure 6 Definition of tTresp
250
300
T = 25°C
Ids = 4A
225
200
Rds(on) (mOhm)
Rds(on) (mOhm)
250
Vin = 4V
175
Vin = 5V
150
Vin = 8V
Vin = 5V
200
150
Vin = 10V
100
125
Vin = 10V
100
50
1
2
3
4
5
6
7
8
Ids (A)
Figure 7 On Resistance vs. Drain-to-Source Current
-50
-25
0
25
50
75
100
125
150
Temperature (°C)
Figure 8 On Resistance vs. Temperature
Fig. 4 - On Resistance vs. Temperature
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IRSF3011
8
9
Vin = 5V
Shut Down Current (A)
Shut Down Current (A)
T = 25°C
7.5
7
6.5
6
8
7
6
5
4
4
5
6
7
8
9
10
-50
-25
0
Input Voltage (Volts)
25
50
75
Figure 9 Over-Current Shutdown Threshold
vs. Input Voltage
150
0.6
T=25°C
Vin = 5V
1.4
Iin,off
0.5
1.2
Input Current (mA)
Input Current (mA)
125
Figure 10 Over-Current Shutdown Threshold
vs.Temperature
1.6
1
0.8
Iin,off
0.6
0.4
0.4
0.3
0.2
Iin,on
0.1
0.2
Iin,on
0
0
0
1
2
3
4
5
6
7
8
9
10 11
Input Voltage (Volts)
Figure 11 Input Current vs. Input Voltage
8
100
Temperature (°C)
-50
-25
0
25
50
75
100
125
150
Temperature (°C)
Figure 12 Input Current vs.Temperature
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IRSF3011
0.9
0.9
T = 25°C
0.7
0.6
0.5
Rise Time
0.4
0.3
0.2
0.1
Rise Time
0.8
Rise Time, On Delay (µS)
Rise Time, On Delay (µS)
0.8
0.7
0.6
0.5
Vin = 5V
0.4
0.3
On Delay
0.2
0.1
On Delay
0
0
3
4
5
6
7
8
9
10
11
-50
-25
0
Input Voltage (Volts)
50
75
100 125 150
Temperature (°C)
Figure 13 Turn-On Characteristics vs. Input Voltage
Figure 14 Turn-On Characteristics vs. Temperature
0.4
0.4
T = 25°C
Vin = 5V
0.35
0.35
Off Delay
Fall Time, Off Delay (µS))
Fall Time, Off Delay (µS)
25
0.3
0.25
0.2
0.15
Fall Time
0.1
Off Delay
0.3
0.25
0.2
0.15
Fall Time
0.1
0.05
0.05
0
0
3
4
5
6
7
8
9
10
Input Voltage (Volts)
Figure 15 Turn-Off Characteristics
vs. Input Voltage
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-50
-25
0
25
50
75
100 125 150
Temperature (°C)
Figure 16 Turn-Off Characteristics vs. Temperature
9
IRSF3011
10
Single Pulse Energy to Failure (mJ)
Reverse Drain Current (A)
2000
T = 150°C
T = 25°C
1
Vdd=25V
1750
Ids = 4A
1500
1250
1000
750
500
250
0
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
Source to Drain Voltage (Volts)
Figure 17 Source-Drain Diode Forward Voltage
0
25
50
75
100
125
150
Starting Junction Temperature (°C)
Figure 18 Unclamped Single Pulse Inductive Energy to
Failure vs. Starting Junction Temperature
Application Information
Introduction
Protected monolithic POWER MOSFETs offer simple,
cost effective solutions in applications where extreme operating conditions can occur. The margin
between the operating conditions and the absolute
maximum values can be narrowed, resulting in
better utilization of the device and lower cost. ESD
protection also reduces the off-circuit failures during
handling and assembly.
General Description
The IRSF3011 is a fully protected monolithic Nchannel logic level POWER MOSFET with 200mW
(max) on-resistance. The built-in protections include
over-current, over-temperature, ESD and over-voltage.
The over-current and over-temperature protections
make the IRSF3011 / IRSF3012 indestructible under
any load conditions in switching or in linear applications. The built-in ESD protection minimizes the risk
of ESD damage when the device is off-circuit. The
IRSF3011 / IRSF3012 is fully characterized for
avalanche operation and can be used for fast deenergization of inductive loads.
10
The TO-220 packaged IRSF3011 / IRSF3012 offers
an easy upgrade with direct pin-to-pin replacement
from non-protected devices.
Block Diagram
As illustrated in figure A1, a zener diode between the
input and the source provides the ESD protection for
the input and also limits the voltage applied to the
input to 10V.
The R-S flip-flop memorizes the occurrence of an
error condition and controls the Q2 and Q3 switches.
The flip-flop can be cleared by holding the input low
for the specified minimum duration.
COMP1 and COMP2 comparators are used to compare the over-current and over-temperature signals
with the built-in reference. Either comparator can
reset the fault flip-flop and turn Q1 off. During fault
condition, Q2 disconnects the gate of Q1 from the
input, and Q3 shorts the gate and source of Q1,
resulting in rapid turn-off of Q1. The zener diode
between the gate and drain of Q1 turns Q1 on when
the drain to source voltage exceeds 55V.
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IRSF3011
Switching Characteristics
In the IRSF3011, the control logic and the protection
circuits are powered from the input pin. When positive
voltage appears at the input pin, the R-S flip-flop turns
Q2 on and connects the gate of the main device to the
input.
The turn-on speed is limited by the channel resistance
of Q2 and the gate charge requirements of Q1. The
typical switching waveforms at 5V input voltage are
shown in Figure A2. Using higher input voltage will
improve the turn-on time but it will not affect the turnoff switching speed.
Input voltage 5V/div.
Drain voltage 5V/div.
Drain Current: 1A/div.
Time: 1msV/div.
Figure A3. Switching waveforms with 7V Input
voltage
Figure A1. Block Diagram
Input voltage 5V/div.
Drain voltage 5V/div.
The typical waveforms at 7V input voltage are shown
in Figure A3. In typical switching applications (below
60kHz) the difference in switching losses between
the IRSF3011 / IRSF3012 and the same size standard
MOSFET is negligible.
Over-Current Protection
When the drain current exceeds the preset limit, the
protection circuit resets the internal flip-flop and turns
Q1 off. Normal operation can be restored by holding
the input voltage below the specified threshold level
(approx. 1.3V) for the specified minimum treset time.
The typical waveforms at over-current shut-down are
shown in Figure A4. After turn-on, the current in the
inductor at the drain starts ramping up. At about 7A,
the over-current protection shuts down the device.
Drain Current: 1A/div.
Time: 1msV/div.
Figure A2. Waveforms switching clamped inductive
load using 5V input voltage
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Over-Temperature Protection
Figure A5 illustrates the operation of the over-temperature protection. The IRSF3011 / IRSF3012
switches a 2W resistive load to a 10V power supply.
When the thermal balance is established, the junction temperature is limited on a pulse-by-pulse basis.
11
IRSF3011
Input voltage 5V/div.
Input voltage 10V/div.
Drain voltage 5V/div.
Drain voltage 5V/div.
Drain Current: 2A/div.
Time: 10msV/div.
Figure A4. Waveforms at over-current shut-down
Drain Current: 2A/div.
Time: 10msV/div.
Figure A5. Over-temperature shut-down
Over-Voltage Protection
When the drain-to-source voltage exceeds 55V, the zener diode between gate and drain turns the IRSF3011
/ IRSF3012 on before the breakdown voltage of the drain-source diode is reached. This greatly enhances the
energy the device can safely withstand during inductive load turn-offs compared to avalanche breakdown. Thus
the device can be used for fast de-energization of inductive loads. The absorbed energy is limited only by
the maximum junction temperature.
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Data and specifications subject to change without notice.
9/98
12
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Note: For the most current drawings please refer to the IR website at:
http://www.irf.com/package/