HLMP-S100, HLMP-S201, HLMP-S301, HLMP-S400, HLMP-S401, HLMP-S501, HLMP-S600 2 mm x 5 mm Rectangular LED Lamps Data Sheet Description Features The HLMP-S100, -S201, -5301, -S400, -S401, -S501, -S600 are epoxy encapsulated lamps in rectangular packages which are easily stacked in arrays or used for discrete front panel indicators. Contrast and light uniformity are enhanced by a special epoxy diffusion and tinting process. • Rectangular light emitting surface The HLMP-S100 uses double heterojunction (DH) absorbing substrate (AS) aluminum gallium arsenide (AlGaAs) LEDs to produce outstanding light output over a wide range of drive currents. • Excellent for flush mounting on panels • Choice of five bright colors • Long life: solid state reliability • Excellent uniformity of light output Package Dimensions 5.46 (0.215) 4.95 (0.195) 5.18 (0.204) 4.93 (0.194) 0.46 (0.018) SQ. NOMINAL CATHODE LEAD 2.54 (0.100) NOMINAL 25.40 (1.00) MIN. BOTTOM VIEW 8.00 (0.315) 7.37 (0.290) 2.23 (0.088) 1.98 (0.078) 1.27 (0.50) NOMINAL 2.41 (0.100) 2.03 (0.085) SIDE VIEW NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. AN EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS. 3. THERE IS A MXIMUM 1 TAPER FROM BASE TO THE TOP OF LAMP. Selection Guide Color Part Number Min. Luminous Intensity Iv (mcd) at 20 mA Typ. AlGaAs Red HLMP-S100 3.4 7.5 HER HLMP-S201 HLMP-S201-D00xx 2.1 3.5 – HLMP-S201-E00xx 3.4 7.5 – HLMP-S201-EF0xx 3.4 7.5 10.8 Orange HLMP-S400 2.1 3.5 – HLMP-S401 3.4 7.5 – Yellow HLMP-S301 HLMP-S301-B00xx 1.4 2.1 – HLMP-S301-C00xx 2.2 4.0 – HLMP-S301-CDBxx 2.2 4.0 7.2 Green HLMP-S501 HLMP-S501-C00xx 2.6 4.0 – HLMP-S501-D00xx 4.2 8.0 – HLMP-S501-DE0xx 4.2 8.0 13.4 Emerald Green[1] HLMP-S600-A00xx 1.0 3.0 – Max. – Note: 1. Please refer to Application Note 1061 for information comparing standard green and emerald green light output degradation. Part Numbering System HLMP - S x xx - x x x xx Mechanical Option 00: Bulk 02: Tape & Reel, Straight Leads DG: Ammo Pack Color Bin Options 0: Full Color Bin Distribution B: Color Bins 2 & 3 only Maximum Iv Bin Options 0: Open (no max. limit) Others: Please refer to the Iv Bin Table Minimum Iv Bin Options Please refer to the Iv Bin Table Brightness Level 00: Less Brightness 01: Higher Brightness Color Options 1: AlGaAs Red 2: GaP HER 3: GaP Yellow 4: GaP Orange 5: GaP Green 6: GaP Emerald Green Electrical/Optical Characteristics at TA = 25°C Sym. Description 2q1/2 Included Angle Between Half All 110 Deg. Luminous Intensity Points Device HLMP- Min. Typ. Max. Units Test Conditions IF = 20 mA See Note 1 lPEAK Peak Wavelength AlGaAs Red High Efficiency Red Orange Yellow Green Emerald Green 645 nm 635 600 583 565 558 Measurement at Peak ld Dominant Wavelength AlGaAs Red High Efficiency Red Orange Yellow Green Emerald Green 637 nm 626 602 585 569 560 See Note 2 Time const, e-t/ts ts Speed of Response AlGaAs Red High Efficiency Red Orange Yellow Green Emerald Green 30 90 280 90 500 3100 ns C Capacitance AlGaAs Red High Efficiency Red Orange Yellow Green Emerald Green 30 11 4 15 18 35 pF VF = 0; f = 1 MHz RqJ-PIN Thermal Resistance All 260 °C/W Junction to Cathode Lead at Seating Plane VF Forward Voltage AlGaAs Red HER/Orange Yellow Green/Emerald Green 1.6 1.5 1.5 1.5 V IF = 20 mA VR All 5.0 V IR = 100 mA lumens/ watt See Note 3 Reverse Breakdown Voltage hV Luminous Efficacy AlGaAs Red High Efficiency Red Orange Yellow Green Emerald Green 1.8 1.9 2.1 2.2 2.2 2.6 2.6 3.0 80 145 380 500 595 656 Notes: 1. q1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt. 4. Please refer to Application Note 1061 for information comparing standard green and emerald green light output degradation. Absolute Maximum Ratings at TA = 25°C Parameter AlGaAs Red High Efficiency Red/ Orange Green/ Yellow Emerald Green Units Peak Forward Current 300 90 60 90 mA Average Forward Current[1] 20 25 20 25 mA DC Current[2] 30 30 20 30 mA Transient Forward Current[3] (10 µsec Pulse) 500 500 500 500 mA LED Junction Temperature 110 110 110 110 °C Operating Temperature Range -20 to +100 -40 to +100 -40 to +100 -20 to +100 °C Storage Temperature Range -40 to +100 -40 to +100 -40 to +100 -40 to +100 °C Notes: 1. See Figure 5 to establish pulsed operating conditions. 2. For AlGaAs Red, Red, Orange, and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.34 mA/°C. 3. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wire bond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum Ratings. RELATIVE INTENSITY 1.0 ORANGE EMERALD GREEN HIGH PERFORMANCE GREEN HIGH EFFICIENCY RED 0.5 YELLOW 0 500 550 600 650 WAVELENGTH – nm Figure 1. Relative intensity vs. wavelength. TA = 25 C AlGaAs RED 700 750 70 60 RED 50 YELLOW 40 30 20 GREEN/EMERALD GREEN 10 0 1.0 2.0 1.3 3.0 4.0 2.0 HER, YELLOW, EMERALD GREEN 1.5 1.0 AlGaAs RED 0.5 5.0 0 5 10 1 1 10 RATIO OF MAXIMUM PEAK CURRENT TO TEMPERATURE DERATED MAXIMUM DC CURRENT 1.0 0.8 0.6 0.4 0.2 20 30 40 50 Figure 6. Relative luminous intensity vs. angular displacement. 1000 tp – PULSE DURATION – s AlGaAs RED 0 10 100 z IPEAK MAX. IDC MAX. 2 60 70 80 90 100 300 H IPEAK MAX. IDC MAX. Hz 3 1 KHz 10,000 100 1000 4 z 90 0 10 20 30 40 50 60 70 80 Figure 4. Relative efficiency (luminous intensity per unit current) vs. LED peak current. hv (300 mA) for AlGaAs Red = 0.7. 3 KHz 80 0.4 30 5 60 70 0.6 IPEAK – PEAK SEGMENT CURRENT – mA 10 KH 50 25 10 9 8 7 6 Figure 5. Maximum tolerable peak current vs. peak duration. (IPEAK MAX determined from temperature derated IDC MAX). 40 AlGaAs RED 0.7 ATE – RATIO OF MAXIMUM TOLERABLE PEAK CURRENT TO MAXIMUM TOLERABLE DC CURRENT 20 tP – PULSE DURATION – s HER, ORANGE, YELLOW, and GREEN 30 0.8 SH R 1.5 10 RED/ORANGE 0.9 EFRE z z 100 H z 300 H 1 KHz 3 KHz z 10 KH Hz 30 KH 100 K 2.0 20 GREEN f–R 3.0 100 15 Figure 3. Relative luminous intensity vs. DC forward current. 4.0 10 1.0 IDC – DC CURRENT PER LED – mA Figure 2. Forward current vs. forward voltage characteristics. VF (300 mA) for AlGaAs Red = 2.6 volts typical. 1 YELLOW 1.1 0.5 0 VF – FORWARD VOLTAGE – V 1.0 EMERALD GREEN 1.2 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF – FORWARD CURRENT – mA 2.5 AlGaAs RED 80 ηPEAK – RELATIVE EFFICIENCY (NORMALIZED AT 20 mA) 90 10000 90 Intensity Bin Limits Color Bin Intensity Range (mcd) Min. Max. D 2.4 3.8 E 3.8 6.1 F 6.1 9.7 G 9.7 15.5 H 15.5 24.8 I 24.8 J 39.6 K Intensity Bin Limits, continued Color Bin Intensity Range (mcd) Min. Max. A 1.1 1.8 B 1.8 2.9 C 2.9 4.7 D 4.7 7.6 39.6 E 7.6 12.0 63.4 F 12.0 19.1 63.4 101.5 G 19.1 30.7 L 101.5 162.4 H 30.7 49.1 M 162.4 234.6 I 49.1 78.5 N 234.6 340.0 J 78.5 125.7 Red/Orange O 340.0 540.0 Green/ K 125.7 201.1 P 540.0 850.0 Emerald Green L 201.1 289.0 Q 850.0 1200.0 M 289.0 417.0 R 1200.0 1700.0 N 417.0 680.0 S 1700.0 2400.0 O 680.0 1100.0 T 2400.0 3400.0 P 1100.0 1800.0 U 3400.0 4900.0 Q 1800.0 2700.0 V 4900.0 7100.0 R 2700.0 4300.0 W 7100.0 10200.0 S 4300.0 6800.0 X 10200.0 14800.0 T 6800.0 10800.0 Y 14800.0 21400.0 U 10800.0 16000.0 Z 21400.0 30900.0 V 16000.0 25000.0 B 1.6 2.5 W 25000.0 40000.0 C 2.5 4.0 Maximum tolerance for each bin limit is ±18%. D 4.0 6.5 E 6.5 10.3 F 10.3 16.6 G 16.6 26.5 H 26.5 42.3 I 42.3 67.7 J 67.7 108.2 K 108.2 173.2 Yellow L 173.2 250.0 M 250.0 360.0 N 360.0 510.0 O 510.0 800.0 P 800.0 1250.0 Q 1250.0 1800.0 R 1800.0 2900.0 S 2900.0 4700.0 T 4700.0 7200.0 U 7200.0 11700.0 V 11700.0 18000.0 W 18000.0 27000.0 Color Categories Lambda (nm) Color Category # Min. Max. 9 552.5 555.5 Emerald Green 8 555.5 558.5 7 558.5 561.5 6 561.5 564.5 6 561.5 564.5 5 564.5 567.5 Green 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 1 582.0 584.5 3 584.5 587.0 Yellow 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 1 597.0 599.5 2 599.5 602.0 3 602.0 604.5 Orange 4 604.5 607.5 5 607.5 610.5 6 610.5 613.5 7 613.5 616.5 8 616.5 619.5 Tolerance for each bin limit is ±0.5 nm. Mechanical Option Matrix Mechanical Option Code Definition 00 Bulk Packaging, minimum increment 500 pcs/bag 02 Tape & Reel, straight leads, minimum increment 1300 pcs/bag DG Ammo Pack, straight leads with minimum increment 2K/pack Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago representative for further clarification/information. Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended PC board plated through hole sizes for LED component leads: • Recommended soldering conditions: LED Component Lead Size Diagonal Plated Through Hole Diameter Wave Soldering Manual Solder Dipping 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) Pre-heat Temperature 105°C Max. – Pre-heat Time 30 sec Max. – 0.508 x 0.508 mm (0.020 x 0.020 inch) 0.718 mm (0.028 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Peak Temperature 250°C Max. 260°C Max. Dwell Time 3 sec Max. 5 sec Max. Note: Refer to application note AN1027 for more information on soldering LED components. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD TEMPERATURE – C 200 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 390C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA 150 FLUXING 100 50 30 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 0 10 20 30 40 50 60 70 80 90 100 TIME – SECONDS Figure 7. Recommended wave soldering profile. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4266EN AV02-1563EN - October 13, 2008