Agilent HLMA-SH05 2 mm x 5 mm Rectangular AlInGaP Lamps Data Sheet Features • Rectangular light emitting surface • Excellent for flush mounting on panels • Long life: solid state reliability • Excellent uniformity of light output Description The HLMA-SH05 is an epoxy encapsulated lamp in rectangular package which are easily stacked in arrays or used for discrete front panel indicators. Contrast and light uniformity are enhanced by a special epoxy diffusion and tinting process. Technology This 2x5 rectangular solid state lamp utilizes the newly developed Aluminum Indium Gallium Phosphide (AlInGaP) LED technology. This material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. Package Dimensions 5.18 (0.204) 4.93 (0.194) 5.46 (0.215) 4.95 (0.195) CATHODE LEAD 26.40 (1.00) MIN. 1.27 (0.060) NOMINAL 8.00 (0.315) 7.37 (0.290) Device Selection Guide Package Description Rectangular, 2mm x 5 mm, Tinted, Diffused Viewing Angle 2q1/2 110 Dominant Wavelength 615 nm 2.41 (0.095) 2.03 (0.085) 2.23 (0.088) 1.98 (0.078) SIDE VIEW 0.46 (0.018) SQ. NOMINAL 2.54 (0.100) NOMINAL BOTTOM VIEW NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. AN EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS. 3. THERE IS A MAXIMUM 1° TAPER FROM BASE TO THE TOP OF LAMP. Absolute Maximum Ratings DC Forward Current[1] Peak Forward Current[2] Average Forward Current (at IPEAK = 200 mA, f ≥ 1 KHz)[2] Transient Forward Current[3] (10 µs Pulse) Reverse Voltage (IR = 100 µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range 50 mA 200 mA 45 mA 500 mA 5V 110°C -40 to +100°C -55 to +100°C Notes: 1. Derate linearly as shown in Figure 4. 2. Refer to Figure 5 to establish pulsed operating conditions. 3. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and wire bonds. 200 1.0 REDDISH ORANGE IF – FORWARD CURRENT – mA RELATIVE INTENSITY AMBER 0.5 100 50 20 10 5 2 1 0.5 0 550 594 600 621 630 650 700 0 0.5 Figure 1. Relative intensity vs. wavelength. 2.0 1.5 1.0 0.5 0 10 20 30 40 Figure 3. Relative luminous intensity vs. foward current. 50 50 45 40 35 RθJA = 618 °C/W 30 25 20 RθJA = 412 °C/W 15 10 5 0 0 10 20 30 40 50 60 70 80 90 100 TA – AMBIENT TEMPERATURE – °C Figure 4. Maximum forward current vs. ambient temperature. Derating based on T Max = 110°C. IAVG – AVERAGE CURRENT – mA IF – FORWARD CURRENT – mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 2.0 2.5 3.0 3.5 60 IF – DC FORWARD CURRENT – mA 2 1.5 Figure 2. Forward current vs. forward voltage. 2.5 0 1.0 VF – FORWARD VOLTAGE – V WAVELENGTH – nm f > 1 KHz 50 40 f > 300 Hz 30 f > 100 Hz 20 10 0 50 100 150 200 IPEAK – PEAK FORWARD CURRENT – mA Figure 5. Maximum average current vs. peak foward current. Optical Characteristics at TA = 25°C Part Number HLMASH05 Luminous Intensity IV (mcd) @ 20 mA Min. Typ. 8 20 Peak Wavelength lpeak (nm) Typ. 621 Color, Dominant Wavelength ld[1] (nm) Typ. 615 Viewing Angle 2q1/2 Degrees[2] Typ. 110 Luminous Efficacy hv (lm/w) 263 Notes: 1. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the color of the device. 2. q1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristics at TA = 25°C Reverse Forward Voltage Breakdown VR (Volts) Part VF (Volts) Number @ IF = 20 mA @ IR = 100 µA HLMAMin. Typ. Min. Typ. SH05 1.9 2.4 5 20 Capacitance C (pF) VF = 0, f = 1 MHz Typ. 40 1.0 NORMALIZED INTENSITY 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 100°90° 80° 70° 60° 50° 40° 30° 20° 10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90° 100° ANGULAR DISPLACEMENT – DEGREES Figure 6. 3 Thermal Resistance RqJ-PIN (°C/W) 260 Speed of Response ts (ns) Time Constant e-t/ts Typ. 13 Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended soldering conditions: Pre-heat Temperature Pre-heat Time Peak Temperature Dwell Time TEMPERATURE – °C Manual Solder Dipping – – 260 °C Max. 5 sec Max. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40° SOLDER: SN63; FLUX: RMA 150 FLUXING 100 0 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 10 20 30 40 50 60 70 80 TIME – SECONDS Figure 7. Recommended wave soldering profile. 90 100 Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. 200 50 30 4 • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Recommended PC board plated through hole sizes for LED component leads: • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. Wave Soldering 105 °C Max. 30 sec Max. 250 °C Max. 3 sec Max. • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2002-2005 Agilent Technologies, Inc. Obsoletes 5989-3269EN November 14, 2005 5989-4267EN