Agilent T-13/4 Super Ultra-Bright LED Lamps Data Sheet HLMP-C115, HLMP-C117, HLMP-C123, HLMP-C215, HLMP-C223, HLMP-C315, HLMP-C323, HLMP-C415, HLMP-C423, HLMP-C515, HLMP-C523, HLMP-C615, HLMP-C623 Description These non-diffused lamps are designed to produce a bright light source and smooth radiation pattern. A slight tint is added to the lens for easy color identification. This lamp has been designed with a 20 mil lead frame, enhanced flange, and tight meniscus controls, making it compatible with radial lead automated insertion equipment. Features • Very high intensity • Exceptional uniformity • Microtint lens for color identification • Consistent viewability All colors: AlGaAs Red High Efficiency Red Yellow Orange Green Emerald Green • 15° and 25° family • Tape and reel options available • Binned for color and intensity Applications • Ideal for backlighting front panels* • Used for lighting switches • Adapted for indoor and outdoor signs Selection Guide Color DH AS AlGaAs Red Yellow Orange Green Emerald Green 2 2θ θ1/2[1] 15 Standoff Leads No 25 Yes No 15 No 25 No 15 No 25 No 15 No 25 No 15 No 25 No 15 No 25 No Part Number HLMPC115 C115-O00xx C115-OP0xx C117-OP0xx C123 C123-L00xx C215 C215-M00xx C215-MN0xx C223 C223-L00xx C223-MN0xx C315 C315-L00xx C315-LM0xx C323 C323-K00xx C323-KL0xx C415 C415-M00xx C415-M0D0xx C415-MN0xx C423 C423-L00xx C423-LM0xx C515 C515-L00xx C515-LM0xx C523 C523-J00xx C523-KL0xx C615 C615-G00xx C623 C623-E00xx Luminous Intensity Iv (mcd) Min. Max. 290.0 – 290.0 – 290.0 1000.0 290.0 1000.0 90.2 – 90.2 – 138.0 – 138.0 – 138.0 400.0 90.2 – 90.2 – 138.0 400.0 147.0 – 147.0 – 147.0 424.0 96.2 – 96.2 – 96.2 294.0 138.0 – 138.0 – 138.0 – 138.0 400.0 90.2 – 90.2 – 90.2 276.0 170.0 – 170.0 170.0 490.0 69.8 – 69.8 – 111.7 340.0 17.0 – 17.0 – 6.7 – 6.7 – Part Numbering System HLMP - C x xx - x x x xx Mechanical Options 00: Bulk 01: Tape & Reel, Crimped Leads 02: Tape & Reel, Straight Leads B2: Right Angle Housing, Even Leads UQ: Ammo Pack, Horizontal Leads Color Bin Options 0: Full Color Bin Distribution D: Color Bins 4 & 5 only Maximum Iv Bin Options 0: Open (No Maximum Limit) Others: Please refer to the Iv Bin Table Minimum Iv Bin Options Please refer to the Iv Bin Table Viewing Angle & Standoffs Options 15: 15 Degree, without Standoffs 17: 15 Degree, with Standoffs 23: 25 Degree, without Standoffs Color Options 1. AS AlGaAs Red 2. High Efficiency Red 3. Yellow 4. Orange 5. Green 6. Emerald Green Package Options C: T-1 3/4 (5 mm) 3 Package Dimensions 5.00 ± 0.20 (0.197 ± 0.008) 5.00 ± 0.20 (NOTE 1) (0.197 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008) 1.14 ± 0.20 (0.045 ± 0.008) 12.60 ± 0.18 (0.496 ± 0.007) 8.71 ± 0.20 (0.343 ± 0.008) 1.14 ± 0.20 (0.045 ± 0.008) 1.85 (0.073) MAX. 31.60 MIN. (1.244) 0.70 (0.028) MAX. 31.60 MIN. (1.244) 1.50 ± 0.15 (0.059 ± 0.006) 0.70 (0.028) MAX. CATHODE LEAD CATHODE LEAD 1.00 MIN. (0.039) 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 1.00 MIN. (0.039) 5.80 ± 0.20 (0.228 ± 0.008) 5.80 ± 0.20 (0.228 ± 0.008) CATHODE FLAT 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) CATHODE FLAT 2.54 ± 0.38 (0.100 ± 0.015) 2.54 ± 0.38 (0.100 ± 0.015) NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. LEADS ARE MILD STEEL, SOLDER DIPPED. 3. AN EPOXY MENISCUS MAY EXTEND ABOUT 0.5 mm (0.020 in.) DOWN THE LEADS. HLMP-Cx15 and HLMP-Cx23 HLMP-Cx17 Absolute Maximum Ratings at TA = 25°C Parameter DC Forward Current[1] Transient Forward Current[2] (10 µsec Pulse) Reverse Voltage (Ir = 100 µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range DH AS AlGaAs Red 30 500 5 110 –20 to +100 High Efficiency Red and Orange 30 500 Yellow 20 500 5 110 5 110 –55 to +100 –55 to +100 High Performance Green and Emerald Green 30 500 5 110 –20 to +100 Notes: 1. See Figure 5 for maximum current derating vs. ambient temperature. 2. The transient current is the maximum nonrecurring peak current the device can withstand without damaging the LED die and wire bond. 4 Units mA mA V °C °C °C Electrical Characteristics at TA = 25°C Part Number HLMP-C115 HLMP-C117 HLMP-C123 HLMP-C215 HLMP-C223 HLMP-C315 HLMP-C323 HLMP-C415 HLMP-C423 HLMP-C515 HLMP-C523 HLMP-C615 HLMP-C623 Forward Voltage Vf (Volts) @ If = 20 mA Typ. Max. 1.8 2.2 Reverse Breakdown Vr (Volts) @ Ir = 100 µA Min. 5 Capacitance C (pF) Vf = 0 f = 1 MHz Typ. 30 Thermal Resistance θJ-PIN Rθ (°C/W) 210 Speed of Response τs (ns) Time Constant e-t/ττs Typ. 30 1.9 2.6 5 11 210 90 2.1 2.6 5 15 210 90 1.9 2.6 5 4 210 280 2.2 3.0 5 18 210 260 2.2 3.0 5 18 210 260 Optical Characteristics at TA = 25°C Part Number HLMP-C115 HLMP-C117 HLMP-C123 HLMP-C215 HLMP-C315 HLMP-C415 HLMP-C515 HLMP-C615 Luminous Intensity Iv (mcd) @ 20 mA[1] Min. Typ. 290 600 90 138 90 146 96 138 90 170 69 17 6 200 300 170 300 170 300 170 300 170 45 27 Peak Wavelength λpeak (nm) Typ. 645 Color, Dominant Wavelength λd[2] (nm) Typ. 637 635 626 583 585 600 602 568 570 558 560 Viewing Angle θ1/2 2θ (Degrees)[3] Typ. 11 26 17 23 17 25 17 23 20 28 20 28 Luminous Efficacy ηv (lm/w) 80 145 500 380 595 656 Notes: 1. The luminous intensity, Iv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the device. 3. 2θ1/2 is the off-axis angle where the luminous intensity is 1/2 the on-axis intensity. 5 1.0 ORANGE RELATIVE INTENSITY EMERALD GREEN TA = 25° C TS AlGaAs RED DH As AlGaAs RED HIGH PERFORMANCE GREEN HIGH EFFICIENCY RED 0.5 YELLOW 0 500 550 600 650 700 750 WAVELENGTH – nm Figure 1. Relative intensity vs. wavelength. HIGH EFFICIENCY RED, ORANGE, YELLOW, AND HIGH PERFORMANCE GREEN, EMERALD GREEN 100 TS AlGaAs RED 50.0 20.0 10.0 5.0 2.0 1.0 0.5 0.2 0.1 HIGH PERFORMANCE GREEN, EMERALD GREEN DH As AlGaAs RED 100.0 IF – FORWARD CURRENT – mA IF – FORWARD CURRENT – mA 300.0 200.0 0 0.5 1.0 1.5 2.0 2.5 3.0 80 YELLOW 40 20 0 3.5 HIGH EFFICIENCY RED/ORANGE 60 1.0 0 2.0 3.0 4.0 5.0 VF – FORWARD VOLTAGE – V VF – FORWARD VOLTAGE – V Figure 2. Forward current vs. forward voltage (non-resistor lamp). 5.0 1.6 2.0 1.4 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) HER, ORANGE, YELLOW, AND HIGH PERFORMANCE GREEN, EMERALD GREEN DH As AlGaAs RED 1.0 0.5 TS AlGaAs RED 0.2 0.1 0.05 0.02 0.01 0.1 0.2 1.0 0.8 0.6 0.4 0.2 0 0.5 1 2 5 10 20 30 50 IF – DC FORWARD CURRENT – mA Figure 3. Relative luminous intensity vs. forward current. 6 1.2 0 5 10 15 20 25 IDC – DC CURRENT PER LED – mA 30 HER, ORANGE, YELLOW, HIGH PERFORMANCE GREEN, EMERALD GREEN DH As AlGaAs RED 1.3 1.2 YELLOW EMERALD GREEN 1.2 ηPEAK – RELATIVE EFFICIENCY (NORMALIZED AT 20 mA) RELATIVE EFFICIENCY (NORMALIZED AT 20 mA) 1.0 0.8 0.6 0.4 0.2 0 1.1 HIGH EFFICIENCY RED/ORANGE 1.0 0.9 HIGH PERFORMANCE GREEN 0.8 0.7 0.6 0.5 0.4 10 0 50 20 200 300 100 0 10 20 30 40 50 70 60 80 90 IPEAK – PEAK FORWARD CURRENT – mA IPEAK – PEAK FORWARD CURRENT – mA Figure 4. Relative efficiency (luminous intensity per unit current) vs. peak current. HER, ORANGE, YELLOW, AND HIGH PERFORMANCE GREEN, EMERALD GREEN 40 35 35 IF – FORWARD CURRENT – mA IF – FORWARD CURRENT – mA DH As AlGaAs RED 40 30 25 RθJA = 559° C/W 20 RθJA = 689° C/W 15 10 5 0 20 0 60 40 30 TA – AMBIENT TEMPERATURE – °C RθJA = 470° C/W 25 RθJA = 300° C/W 20 YELLOW 15 10 RθJA = 705° C/W 5 0 100 80 HER, ORANGE, GREEN, EMERALD GREEN 0 20 40 60 80 100 TA – AMBIENT TEMPERATURE – °C Figure 5. Maximum forward dc current vs. ambient temperature. Derating based on TjMAX = 110°C. NORMALIZED LUMINOUS INTENSITY 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 45 40 35 30 25 20 15 10 5 0 -5 -10 -15 -20 -25 -30 -35 -40 -45 ANGULAR DISPLACEMENT – DEGREES Figure 6. Relative luminous intensity vs. angular displacement. 15 degree family. 7 NORMALIZED LUMINOUS INTENSITY 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 45 40 35 30 25 20 15 10 5 0 -5 -10 -15 -20 -25 -30 -35 -40 -45 ANGULAR DISPLACEMENT – DEGREES Figure 7. Relative luminous intensity vs. angular displacement. 25 degree family. Intensity Bin Limits Color Red/Orange Yellow 8 Bin L M N O P Q R S T U V W X Y Z L M N O P Q R S T U V W Intensity Range (mcd) Min. Max. 101.5 162.4 162.4 234.6 234.6 340.0 340.0 540.0 540.0 850.0 850.0 1200.0 1200.0 1700.0 1700.0 2400.0 2400.0 3400.0 3400.0 4900.0 4900.0 7100.0 7100.0 10200.0 10200.0 14800.0 14800.0 21400.0 21400.0 30900.0 173.2 250.0 250.0 360.0 360.0 510.0 510.0 800.0 800.0 1250.0 1250.0 1800.0 1800.0 2900.0 2900.0 4700.0 4700.0 7200.0 7200.0 11700.0 11700.0 18000.0 18000.0 27000.0 Intensity Bin Limits, continued Color Green/ Emerald Green Bin E F G H I J K L M N O P Q R S T U V W Intensity Range (mcd) Min. Max. 7.6 12.0 12.0 19.1 19.1 30.7 30.7 49.1 49.1 78.5 78.5 125.7 125.7 201.1 201.1 289.0 289.0 417.0 417.0 680.0 680.0 1100.0 1100.0 1800.0 1800.0 2700.0 2700.0 4300.0 4300.0 6800.0 6800.0 10800.0 10800.0 16000.0 16000.0 25000.0 25000.0 40000.0 Maximum tolerance for each bin limit is ± 18%. Color Categories Color Green Yellow Orange Category # 6 5 4 3 2 1 3 2 4 5 1 2 3 4 5 6 7 8 Tolerance for each bin limit is ± 0.5 nm. 9 Lambda (nm) Min. 561.5 564.5 567.5 570.5 573.5 582.0 584.5 587.0 589.5 592.0 597.0 599.5 602.0 604.5 607.5 610.5 613.5 616.5 Max. 564.5 567.5 570.5 573.5 576.5 584.5 587.0 589.5 592.0 593.0 599.5 602.0 604.5 607.5 610.5 613.5 616.5 619.5 Mechanical Option Matrix Mechanical Option Code 00 01 02 B2 UQ Definition Bulk Packaging, minimum increment 500 pcs/bag Tape & Reel, crimped leads, minimum increment 1300 pcs/bag Tape & Reel, straight leads, minimum increment 1300 pcs/bag Right Angle Housing, even leads, minimum increment 500 pcs/bag Ammo Pack, horizontal leads, in 1K minimum increment Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information. 10 Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • Recommended soldering conditions: Pre-heat Temperature Pre-heat Time Peak Temperature Dwell Time TEMPERATURE – °C Manual Solder Dipping – – 260 °C Max. 5 sec Max. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) BOTTOM SIDE OF PC BOARD 200 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40° SOLDER: SN63; FLUX: RMA 150 FLUXING 100 0 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 10 20 30 40 50 60 70 80 TIME – SECONDS Figure 8. Recommended wave soldering profile. 90 100 Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. TOP SIDE OF PC BOARD 50 30 11 • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Recommended PC board plated through hole sizes for LED component leads: • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. Wave Soldering 105 °C Max. 30 sec Max. 250 °C Max. 3 sec Max. • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2004-2005 Agilent Technologies, Inc. Obsoletes 5988-2149EN November 12, 2005 5989-4251EN