SGZS007B − JUNE 1996 − REVISED JUNE 2000 D Processed to MIL-PRF-38535 D Fast Instruction Cycle Time of 30 ns and 40 ns D Source-Code Compatible With all ’C1x and D D D D D ’C2x Devices RAM-Based Operation − 9K-Word × 16-Bit Dual-Access On-Chip Program/ Data RAM − 1 056-Word × 16-Bit Dual-Access On-Chip Data RAM 2K-Word × 16-Bit On-Chip Boot ROM 224K-Word × 16-Bit Maximum Addressable External Memory Space (64K-Word Program, 64K-Word Data, 64K-Word I / O, and 32K-Word Global) 32-Bit Arithmetic Logic Unit (ALU) − 32-Bit Accumulator (ACC) − 32-Bit Accumulator Buffer (ACCB) 16-Bit Parallel Logic Unit (PLU) D D D D D D D D D D D D 16 × 16-Bit Multiplier, 32-Bit Product Eleven Context Switch Registers Two Buffers for Circular Addressing Full-Duplex Synchronous Serial Port Time-Division Multiplexed (TDM) Serial Port Timer With Control and Counter Registers Sixteen Software-Programmable Wait-State Generators Divide-By-1 Clock Option IEEE Standard 1149.1† (JTAG) Test-Access Port Operations are Fully Static Fabricated Using the Texas Instruments (TI) Enhanced Performance Implanted CMOS (EPIC) 0.64-µm Technology Military Operating Temperature Range −55°C to 125°C description The SMJ320C50KGD digital signal processor (DSP) is a high-performance, 16-bit, fixed-point processor manufactured in 0.64-µm double-level metal CMOS technology. The SMJ320C50 KGD employs the hot-chuck-probe process. This process uses standard probed product that is tested again, this time at full data sheet specifications, in wafer form at speed and elevated temperature (125°C). Each individual die is then sawed, inspected, and packaged for shipment. A number of enhancements to the basic ’C2x architecture give the ’C50 a minimum 2x performance over the previous generation. A four-deep instruction pipeline, which incorporates delayed branching, delayed call to a subroutine, and delayed return from a subroutine, allows the ’C50 to perform instructions in fewer cycles. The addition of a PLU gives the ’C50 a method of manipulating bits in data memory without using the ACC and the ALU. The ’C50 has additional shifting and scaling capabilities for proper alignment of multiplicands or for storage of values to data memory. With the addition of the IDLE2 instruction, the ’C50 achieves low-power consumption. IDLE2 removes the functional clock from the internal hardware of the ’C50 that puts it into a total-sleep mode using only 5 µA. A low-logic level on an external interrupt with a chip duration of at least five clock cycles ends the IDLE2 mode. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. † IEEE Standard 1149.1−1990, IEEE Standard Test-Access Port and Boundary-Scan Architecture EPIC is a trademark of Texas Instruments. Copyright 2000, Texas Instruments Incorporated !"# $"%&! '#( '"! ! $#!! $# )# # #* "# '' +,( '"! $!#- '# #!#&, !&"'# #- && $##( POST OFFICE BOX 1443 $'"! !$& ./.01 && $## # ##' "&# )#+# #'( && )# $'"!1 $'"! $!#- '# #!#&, !&"'# #- && $##( • HOUSTON, TEXAS 77251−1443 1 SGZS007B − JUNE 1996 − REVISED JUNE 2000 description (continued) SMJ MIL-TEMP PRODUCT FLOW Multiprobe 25°C or hot chuck probe @ 125°C Test conditions Per military data sheet DC test Hot chuck probe @ 125°C AC test Hot chuck probe @ 125°C @ Speed Visual 100x Warranty Data sheet upon shipment, 1 year Certificate of Compliance Yes Change of notification Yes For electrical and timing specifications, see the SMJ320C50/SMQ320C50 Digital Signal Processors data sheet (literature number SGUS020). SPECIFIC DIE-RELATED INFORMATION 2 Die Size (approximate) 358 mils × 338 mils Die Thickness 11 mils ± 1 mil Backside Surface Finish SIO2 Die Backside Potential Floating Max Allowable Die Junction Operating Temperature 125°C Glassivation Material and Thickness 3KAOX / 9KACN Recommended Packing GEL PACK Die Attach Information SILVER GLASS Suggested Bond Wire Size 1.25 AL Suggested Bonding Method WEDGE ESD Sensitivity Class II Max Allowable Process Temperature for Die Attach 450°C POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 SGZS007B − JUNE 1996 − REVISED JUNE 2000 SMJ320C50 Pad Information† PAD TOP LEFT XCENTER YCENTER PAD NAME PAD XCENTER YCENTER PAD NAME 1 4626.18 8373.066 IAQ 41 83.85 1537.224 CLKR 2 4465.266 8373.066 TRST 42 83.85 1164.852 3 4245.852 8373.066 43 83.85 1047.852 4 4128.852 8373.066 VSS1 VSS2 VDD5 VDD6 44 1303.38 83.85 5 3955.38 8373.066 MP/MC 45 1420.38 83.85 VSS7 VSS8 6 3579.108 8373.066 D15 46 1836.276 83.85 A0 7 3329.508 8373.066 D14 47 2074.566 83.85 A1 8 3038.334 8373.066 D13 48 2277.366 83.85 A2 9 2827.734 8373.066 D12 49 2515.656 83.85 A3 10 2613.234 8373.066 D11 50 2706.756 83.85 A4 11 2398.734 8373.066 D10 51 2945.046 83.85 A5 12 2089.932 8373.066 D9 52 3136.146 83.85 A6 13 1830.036 8373.066 D8 53 3374.436 83.85 A7 14 1467.336 8373.066 3565.536 83.85 A8 1350.336 8373.066 VDD1 VDD2 54 15 55 3803.826 83.85 A9 16 83.85 7404.15 3952.026 83.85 83.85 7287.15 VSS3 VSS4 56 17 57 4069.026 83.85 VDD7 VDD8 18 83.85 6803.55 D7 58 4235.556 83.85 TDI 19 83.85 6592.95 D6 59 4602.234 83.85 20 83.85 6336.876 D5 60 4719.234 83.85 VSS9 VSS10 21 83.85 6141.876 D4 61 4884.906 83.85 CLKMD1 22 83.85 5946.876 D3 62 5093.478 83.85 A10 23 83.85 5751.876 D2 63 5331.768 83.85 A11 24 83.85 5472.402 D1 64 5648.76 83.85 A12 25 83.85 5277.402 D0 65 5887.05 83.85 A13 26 83.85 5034.588 TMS 66 6089.85 83.85 A14 27 83.85 4756.674 6328.14 83.85 A15 83.85 4639.674 VDD3 VDD4 67 28 68 7100.34 83.85 29 83.85 4274.946 TCK 69 7217.34 83.85 VDD9 VDD10 30 83.85 4120.818 MTESTEN 70 7487.532 83.85 RD 31 83.85 3979.404 71 7961.148 83.85 WE 32 83.85 3862.404 VSS5 VSS6 72 8896.134 1078.35 33 83.85 3493.932 INT1 73 8896.134 1195.35 34 83.85 3275.688 INT2 74 8896.134 1640.106 35 83.85 3057.444 INT3 75 8896.134 1930.11 36 83.85 2766.27 INT4 76 8896.134 2179.866 PS 37 83.85 2548.026 NMI 77 8896.134 2489.994 R/W 38 83.85 2329.782 DR 78 8896.134 2738.034 STRB 39 83.85 2111.538 TDR 79 8896.134 2908.074 BR 40 83.85 1755.468 FSR 80 8896.134 3133.962 NC BOTTOM RIGHT VSS11 VSS12 DS IS † Measured from corner of active area. POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 3 SGZS007B − JUNE 1996 − REVISED JUNE 2000 SMJ320C50 Pad Information† (Continued) PAD TOP-R XCENTER YCENTER PAD NAME 81 8896.134 3281.148 82 8896.134 3415.62 X2/CLKIN 83 8896.134 3568.11 X1 84 8896.134 3715.14 NC 85 8896.134 3856.554 86 8896.134 3973.554 VDD11 VDD12 87 8896.134 4122.846 TDO 88 8896.134 4398.81 89 8896.134 4515.81 90 8896.134 4650.282 CLKMD2 91 8896.134 4827.186 FSX 92 8896.134 5075.694 TFSX/TFRM 93 8896.134 5266.95 94 8896.134 5520.294 95 8896.134 5711.55 96 8896.134 5902.806 97 8896.134 6214.65 98 8896.134 6542.406 IACK VDD13 VDD14 CLKIN2 VSS13 VSS14 DX TDX HOLDA XF CLKOUT1 99 8896.134 7002.606 100 8896.134 7119.606 101 8896.134 7552.818 102 8896.134 7669.818 VDD31 VDD32 103 7966.296 8373.066 EMU0 104 7615.452 8373.066 EMU1/OFF 105 7393.152 8373.066 106 7276.152 8373.066 VSS15 VSS16 107 6862.596 8373.066 TOUT 108 6656.364 8373.066 TCLKX 109 6454.032 8373.066 CLKX 110 6174.324 8373.066 TFSR/TADD 111 6020.352 8373.066 TCLKR 112 5860.608 8373.066 RS 113 5700.864 8373.066 READY 114 5541.12 8373.066 HOLD 115 5206.344 8373.066 BIO 116 5001.672 8373.066 117 4884.672 8373.066 VDD15 VDD16 † Measured from corner of active area. 4 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 SGZS007B − JUNE 1996 − REVISED JUNE 2000 MECHANICAL DATA MOUNT AND BOND ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ Pad #1 TMS320C50DU POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 5 PACKAGE OPTION ADDENDUM www.ti.com 7-May-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) SMJ320C50KGDM50C PREVIEW XCEPT KGD 0 TBD Call TI Call TI SMJ320C50KGDM66C PREVIEW XCEPT KGD 0 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. 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