SEME-LAB SML05SC06D3B

SiC SCHOTTKY DIODE
SML05SC06D3A / SML05SC06D3B
•
VR(max) = 600V
•
IF(avg) = 5A
•
VF(typ) = 1.5V
•
DLCC3 Hermetic Ceramic Surface Mount Package Designed as a
Drop In Replacement for “D-5B”/ “E-MELF” Package †
No Reverse Recovery
No Forward Recovery
High Reliability Screening Options Available
•
•
•
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise stated)
VRRM
VRSM
IF(AVG)
IFSM
PD
Peak Repetitive Reverse Voltage
Surge Peak Reverse Voltage
Average Forward Current (1)
Non-Repetitive Peak Forward Surge Current (3,4)
Total Power Dissipation at TA = 25°C
Derate Above TA = 25°C
TJ
Tstg
Junction Temperature Range
Storage Temperature Range
600V
600V
5A
60A
2.96 (2)
14.8mW/°C (2)
-55 to +225°C
-55 to +225°C
THERMAL PROPERTIES
Symbols
Parameters
RθJSP(IN)
Thermal Resistance, Junction To Solder Pads TSP = 25°C
Max.
Units
29
°C/W
RθJA(PCB)(2)
Thermal Resistance, Junction To Ambient, On PCB
67.5
°C/W
RθJA(PCB)
Thermal Resistance, Junction To Ambient, On PCB
123
°C/W
(3)
Notes
(1) IO1 is rated at 1.75A @ TA = 25°C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where
TJ(Max) does not exceed 175°C; This equates to RθJA(PCB) ≤ 68°C/W.
(2)
PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (25.4mm x 25.4mm) , horizontal in still air.
(3)
PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.070” x 0.155”)‡, (1.78mm x 3.94mm) ‡, horizontal in still air.
IO1 is rated at 1.0A @ TA = 25°C for PC boards where RθJA(PCB) ≤ 125°C/W. Derate at 7.33mA/°C above TA = 25°C in this case.
(4)
MIL-STD-750 Method 4066.4 Condition A1. IO = 1A, VRWM = 600V, VRSM = 600V, ten surges of 8.3mS each at 1 minute intervals, TA = 25°C.
‡ Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5A device.
Semelab ltd reserves the right to change test conditions, parameter limits and package dimensions without notice.
Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However
Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to
verify that datasheets are current before placing an order.
Semelab ltd
Telephone +44 (0) 1455 556565
Email: [email protected]
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website: http://www.semelab-tt.com
Document Number 9166
Issue 2
Page 1 of 6
SiC SCHOTTKY DIODE
SML05SC06D3A / SML05SC06D3B
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise stated)
Symbol
VF
(1)
IR
Parameters
Test Conditions
Diode Forward Voltage
Leakage Current
Min.
Typ.
Max.
IF = 5A
TJ = 25°C
1.5
1.8
IF = 5A
TJ = 175°C
2.0
2.4
VR = 600V
TJ = 25°C
50
200
VR = 600V
TJ = 175°C
100
1000
VR = 600V
IF = 5A
di/dt = 500A/µs
TJ = 25°C
VR = 0V
TJ = 25°C
550
VR = 200V
TJ = 25°C
65
VR = 400V
TJ = 25°C
50
Unit
V
µA
DYNAMIC CHARACTERISTICS
QC
Total Capacitive Charge
CT
Junction Capacitance
(f = 1.0MHz)
28
nC
pF
Notes
(1) Pulse Width ≤ 300us, δ ≤ 2%
Semelab ltd
Telephone +44 (0) 1455 556565
Email: [email protected]
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website: http://www.semelab-tt.com
Document Number 9166
Issue 2
Page 2 of 6
SiC SCHOTTKY DIODE
SML05SC06D3A / SML05SC06D3B
Typical Performance Over Temperature Range
The Forward Characteristics of 600V D3A Diodes
12.0
If - Forward Current (A)
10.0
8.0
6.0
4.0
2.0
0.0
0
0.5
1
-55
1.5
V f - For wa r125
d V ol t a ge ( V150
)
100
25
2
175
2.5
225
Reverse Leakage characteristics of 600V D3A Diodes
18.0E-6
16.0E-6
Reverse Current (A)
14.0E-6
12.0E-6
10.0E-6
8.0E-6
6.0E-6
4.0E-6
2.0E-6
000.0E+0
0
100
200
300
400
500
600
700
800
V R R ev er s e V ol t age ( V ol t s)
-55
Semelab ltd
Telephone +44 (0) 1455 556565
Email: [email protected]
25
100
125
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website: http://www.semelab-tt.com
150
175
225
Document Number 9166
Issue 2
Page 3 of 6
SiC SCHOTTKY DIODE
SML05SC06D3A / SML05SC06D3B
SiC Schottky Diode, no minority
SML05SC06D3
carrier recombination thus zero
reverse recovery. Recovery time
Equivalent Reverse Recovery Time Device
show n is due to a small junction
IF=500mA, IR = 1A, IRR=250mA
capacitance charge and is
independent of junction
temperature
C u rre n t(A )
1.000
0.500
0.000
-0.500
-1.000
-1 8
-1 6
-1 4
-1 2
-1 0
-8
-6
-4
-2
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
-1.500
Time (nS)
-55°C
Semelab ltd
Telephone +44 (0) 1455 556565
Email: [email protected]
0°C
25°C
50°C
100°C
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website: http://www.semelab-tt.com
150°C
200°C
225°C
Document Number 9166
Issue 2
Page 4 of 6
SiC SCHOTTKY DIODE
SML05SC06D3A / SML05SC06D3B
MECHANICAL DATA
A
DLCC3 Variant A (D3A)
D
PAD 1
PAD 2
B
SML
D3A
C
C
1
2
DIMENSION
A
B
C
D
A
D
C
C
1
2
mm
7.00 ±0.10
3.75 ±0.10
1.60 ±0.10
1.76 ±0.10
Inches
0.275 ±0.004
0.143 ±0.004
0.063 ±0.004
0.069 ±0.004
DLCC3 Variant B (D3B)
PAD 1
PAD 2
PAD 3
B
SML
D3B
ANODE
CATHODE
DIMENSION
A
B
C
D
ANODE
CATHODE
LID CONTACT TO CATHODE*
mm
7.00 ±0.10
3.75 ±0.10
1.60 ±0.10
1.76 ±0.10
Inches
0.275 ±0.004
0.143 ±0.004
0.063 ±0.004
0.069 ±0.004
3
* The additional contact provides a connection to the lid in the application. Connecting the metal lid to a known electrical potential stops deep
dielectric discharge in space applications; see the Space Weather link www.semelab.co.uk/dlcc3.html on the Semelab web site. Package variant
to be specified at order.
† The DLCC3 package design takes full advantage of the proven high reliability pedigree of the HTCC surface mount packaging technology,
which is easily integrated for automated assembly. Semelab has taken the existing standards for ceramic surface mount package manufacture
and added additional design features to enhance thermal performance, to present a competitive alternative for high reliability applications.
SOLDER PAD LAYOUT
C
A
B
A
B
C
mm
7.32
1.78
3.94
Inches
0.288
0.070
0.155
Soldering temperature should be 260°C for a
maximum of 10 seconds.
The physical dimensions for the DLCC3 ceramic package are designed
to be different from the published dimensions for the “D-5B” and “EMELF” outlines. The DLCC3 design fully utilises the recommended
solder footprint for the “D-5B” / “E-MELF” Package, and as such
presents a drop in replacement for existing board designs.
PACKAGE MASS
Gold Plated Solder Pad Finish = 150mg
Semelab ltd
Telephone +44 (0) 1455 556565
Email: [email protected]
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website: http://www.semelab-tt.com
Document Number 9166
Issue 2
Page 5 of 6
SiC SCHOTTKY DIODE
SML05SC06D3A / SML05SC06D3B
SCREENING OPTIONS
ORDERING INFORMATION
Space Level (JQRS/ESA) and High Reliability options are
available in accordance with the High Reliability and
Screening Options Handbook available for download from
the from the TT electronics Semelab web site.
Part numbers are built up from Type, Package Variant, and
screening level. The part numbers are extended to include
the additional options as shown below.
ESA Quality Level Products are based on the testing
procedures specified in the generic ESCC 5000 and in the
corresponding part detail specifications.
Type – See Electrical Stability Characteristics Table
Package Variant – See Mechanical Data
Screening Level – See Screening Options (ESA / JQRS)
Additional Options:
Semelab’s QR216 and QR217 processing specifications
(JQRS), in conjunction with the companies ISO 9001:2000
approval present a viable alternative to the American MILPRF-19500 space level processing.
QR217 (Space Level Quality Conformance) is based on the
quality conformance inspection requirements of MIL-PRF19500 groups A (table V), B (table VIa), C (table VII) and
also ESA / ESCC 5000 (chart F4) lot validation tests.
QR216 (Space Level Screening) is based on the screening
requirements of MIL-PRF-19500 (table IV) and also ESA
/ESCC 5000 (chart F3).
JQRS parts are processed to the device data sheet and
screened to QR216 with conformance testing to Q217
groups A and B in accordance with MIL-STD-750 methods
and procedures.
Additional conformance options are available, for example
Pre-Cap Visual Inspection, Buy-Off Visit or Data Packs.
These are chargeable and must be specified at the order
stage (See Ordering Information). Minimum order
quantities may apply.
Alternative or additional customer specific conformance or
screening requirements would be considered. Contact
Semelab sales with enquires.
MARKING DETAILS
Parts can be laser marked with approximately 7 characters
on two lines and always includes cathode identification.
Typical marking would include part or specification number,
week of seal or serial number subject to available space and
legibility.
Customer specific marking requirements can be arranged at
the time of order.
Example Marking:
Customer Pre-Cap Visual Inspection
Customer Buy-Off visit
Data Pack
Solderability Samples
Scanning Electron Microscopy
Radiography (X-ray)
Total Dose Radiation Test
.CVP
.CVB
.DA
.SS
.SEM
.XRAY
.RAD
MIL-PRF-19500 (QR217)
Group B charge
Group B destructive mechanical samples
Group C charge
Group C destructive electrical samples
Group C destructive mechanical samples
.GRPB
.GBDM (12 pieces)
.GRPC
.GCDE (12 pieces)
.GCDM (6 pieces)
ESA/ESCC
Lot Validation Testing (subgroup 1) charge
LVT1 destructive samples (environmental)
LVT1 destructive samples (mechanical)
Lot Validation Testing (subgroup 2) charge
LVT2 endurance samples (electrical)
Lot Validation Testing (subgroup 3) charge
LVT3 destructive samples (mechanical)
.LVT1
.L1DE (15 pieces)
.L1DM (15 pieces)
.LVT2
.L2D (15 pieces)
.LVT3
.L3D (5 pieces)
Additional Option Notes:
1) All ‘Additional Options’ are chargeable and must be
specified at order stage.
2) When Group B,C or LVT is required, additional electrical
and mechanical destructive samples must be ordered
3) All destructive samples are marked the same as other
production parts unless otherwise requested.
Example ordering information:
The following example is for the SML05SC06D3A /
SML05SC06D3B part with package variant B, JQRS
screening, additional Group C conformance testing and a
Data pack.
Part Numbers:
SML05SC06D3B-JQRS (Include quantity for flight parts)
SML05SC06D3B.GRPC (chargeable conformance option)
SML05SC06D3B.GCDE (charge for destructive parts)
SML05SC06D3B.GCDM (charge for destructive parts)
SML05SC06D3B.DA (charge for Data pack)
Customers with any specific requirements (e.g. marking or
screening) may be supplied with a similar alternative part
number (there is maximum 20 character limit to part
numbers). Contact Semelab sales with enquiries.
High Reliability and Screening Options Handbook link: http://www.semelab.co.uk/pdf/misc/documents/hirel_and_screening_options.pdf
Semelab Limited
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Telephone +44 (0) 1455 556565
Fax +44 (0) 1455 552612
Email: [email protected]
Website: http://www.semelab-tt.com
Document Number 9166
Issue 2
Page 6 of 6