RI-I15-112B-02 www.ti.com SCBS825 – JULY 2004 – REVISED DECEMBER 2005 Tag-it™ HF-I PLUS TRANSPONDER INLAYS MEDIUM RECTANGLE FEATURES APPLICATIONS • • • • • • • • • • • • ISO/IEC 15693-2, -3; ISO/IEC 18000-3 Compliant 13.56-MHz Operating Frequency 2048-Bit User Memory in 64-Bit × 32-Bit Blocks User and Factory Lock Per Block Application Family Identifier (AFI) Data Storage Format Identifier (DSFID) Combined Inventory Read Block Product Authentication Library Supply-Chain Management Asset Management Ticketing/Stored Value DESCRIPTION Texas Instruments Tag-it™ HF-I plus transponder inlays consist of 13.56-MHz high-frequency (HF) transponders that are compliant with the ISO/IEC 15693 and ISO/IEC 18000-3 global open standards. These products offer a user-accessible memory of 2048 bits, organized in 64 blocks, and an extensive command set available in six different antenna shapes, with frequency offset for integration into paper, PVC, or other substrates. The Tag-it HF-I plus transponder inlays are manufactured with TI’s patented laser tuning process to provide consistent read performance. Prior to delivery, the transponders undergo complete functional and parametric testing, in order to provide the high quality that customers have come to expect from TI. The Tag-it HF-I plus transponder inlays are well suited for a variety of applications including, but not limited to, product authentication, library, supply-chain management, asset management, and ticketing/stored value applications. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Tag-it is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2004–2005, Texas Instruments Incorporated RI-I15-112B-02 www.ti.com SCBS825 – JULY 2004 – REVISED DECEMBER 2005 SPECIFICATIONS (1) PART NUMBER RI-I15-112B-02 Supported standard ISO/IEC 15693-2, -3; ISO/IEC 18000-3 Recommended operating frequency 13.56 MHz Passive resonance frequency (at 25°C) 14.1 MHz ± 200 kHz (includes frequency offset to compensate PVC lamination) Typical required activation field strength to read (at 25°C) 98 dBµA/m (2) Typical required activation field strength to write (at 25°C) 101 dBµA/m (2) Factory programmed read-only number 64 bits Memory (user programmable) 2k bits organized in 64-bit × 32-bit blocks Typical programming cycles (at 25°C) 100,000 Data retention time (at 55°C) >10 years Simultaneous identification of tags Up to 50 tags per second (reader/antenna dependent) Antenna size 34 mm × 65 mm (~1.34 in × ~2.56 in) Foil width 48 mm ± 0.5 mm (1.89 in ± 0.02 in) Foil pitch 101.6 mm +0.1 mm/–0.4 mm (4 in) Thickness Chip area: 0.355 mm (~0.014 in) Antenna area: 0.085 mm (~0.0033 in) Base material Substrate: PET (polyethylenetherephtalate); Antenna: aluminum Smallest bending radius allowed 18 mm (~0.71 in) Operating temperature –25°C to 70°C Storage temperature (single inlay) –40°C to 85°C (warpage may occur at upper temperature range) Storage temperature (on reel) –40°C to 40°C Delivery Single-row tape wound on cardboard reel with 500-mm diameter Reel outer width: approximately 60 mm (~2.36 in) Reel inner width: approximately 50 mm (~1.97 in) Hub diameter: 76.2 mm (3 in) Typical quantity of good units per reel 5,000 (1) (2) For highest possible read-out coverage, operate readers at a modulation depth of 20% or higher. After integration into paper SUPPORTED COMMAND SET REQUEST REQUEST MODE (1) REQUEST CODE INVENTORY ADDRESSED NON-ADDRESSED SELECT AFI ü – – – ü ISO 15693 Mandatory and Optional Commands Inventory 0x01 Stay Quiet 0x02 – ü – – – Read_Single_Block 0x20 ü ü ü ü ü Write_Single_Block 0x21 – ü ü ü – Lock_Block 0x22 – ü ü ü – Read_Multi_Blocks 0x23 ü ü ü ü ü Write_Multi_Blocks 0x24 – – – – – Select Tag 0x25 – ü – – – Reset to Ready 0x26 – ü ü ü – Write_AFI 0x27 – ü ü ü – Lock_AFI 0x28 – ü ü ü – Write DSFID 0x29 – ü ü ü – (1) 2 ü = Implemented, – = Not applicable Submit Documentation Feedback RI-I15-112B-02 www.ti.com SCBS825 – JULY 2004 – REVISED DECEMBER 2005 SUPPORTED COMMAND SET (continued) REQUEST MODE (1) REQUEST REQUEST CODE INVENTORY ADDRESSED NON-ADDRESSED SELECT AFI 0x2A – ü ü ü – Get_System_info 0x2B ü ü ü ü ü Get_M_BLK_Sec_St 0x2C ü ü ü ü ü Write_2_Blocks 0xA2 – ü ü ü – Lock_2_Blocks 0xA3 – ü ü ü – ISO 15693 Mandatory and Optional Commands Lock DSFID TI Custom Commands MEMORY ORGANIZATION 32 bits Block # 1 2 3 62 63 Submit Documentation Feedback 3 PACKAGE OPTION ADDENDUM www.ti.com 2-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing RI-I15-112B-02 OBSOLETE RFIDN TFG Pins Package Eco Plan (2) Qty 0 TBD Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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