NL27WZ02 Dual 2−Input NOR Gate The NL27WZ02 is a high performance dual 2−input NOR Gate operating from a 1.65 V to 5.5 V supply. • • • • • • • • • Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5.0 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs LVTTL Compatible − Interface Capability With 5.0 V TTL Logic with VCC = 3.0 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Replacement for NC7WZ02 Chip Complexity: FET = 112 http://onsemi.com MARKING DIAGRAM 8 8 L3 D 1 US8 US SUFFIX CASE 493 1 D = Date Code A1 8 1 VCC ORDERING INFORMATION B1 2 7 Y1 Y2 3 6 B2 See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. A1 1 B1 GND 5 4 A2 Y1 A2 Y2 B2 Figure 1. Pinout Figure 2. Logic Symbol PIN ASSIGNMENT FUNCTION TABLE Pin Function Input 1 A1 2 B1 A B Y 3 Y2 L L H 4 GND L H L 5 A2 H L L 6 B2 H H L 7 Y1 8 VCC Semiconductor Components Industries, LLC, 2004 March, 2004 − Rev. 6 Output Y=A+B 1 Publication Order Number: NL27WZ02/D NL27WZ02 MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage 0.5 to 7.0 V VI DC Input Voltage 0.5 to 7.0 V VO DC Output Voltage 0.5 to 7.0 V IIK DC Input Diode Current VI < GND 50 mA IOK DC Output Diode Current VO < GND 50 mA IO DC Output Sink Current 50 mA ICC DC Supply Current per Supply Pin 100 mA IGND DC Ground Current per Ground Pin 100 mA TSTG Storage Temperature Range 65 to 150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature under Bias 150 °C JA Thermal Resistance 250 °C/W PD Power Dissipation in Still Air at 85°C 250 mW MSL Moisture Sensitivity FR Flammability Rating VESD ESD Withstand Voltage (Note 1) Level 1 Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 N/A V Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum−rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VI Input Voltage VO Output Voltage TA Operating Free−Air Temperature t/V Input Transition Rise or Fall Rate Operating Data Retention Only Min Max Unit 1.65 1.5 5.5 5.5 V (Note 5) 0 5.5 V (HIGH or LOW State) 0 VCC V 40 85 °C 0 0 0 0 20 20 10 5 ns/V VCC = 1.8 V 0.15 V VCC = 2.5 V 0.2 V VCC = 3.0 V 0.3 V VCC = 5.0 V 0.5 V 5. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level. http://onsemi.com 2 NL27WZ02 DC ELECTRICAL CHARACTERISTICS Symbol Parameter Condition 40C TA 85C TA = 25C VCC (V) Min 0.75 VCC 0.7 VCC VIH High−Level Input Voltage 1.65 2.3 to 5.5 VIL Low−Level Input Voltage 1.65 2.3 to 5.5 VOH High−Level Output Voltage VIN = VIL or VIH IOH = −100 A IOH = −4 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 VOL Low−Level Output Voltage VIN = VIH or VOH IOL = 100 A IOL = 4 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 IIN Input Leakage Current VIN = VCC or GND ICC Quiescent Supply Current VIN = VCC or GND Typ Max Min 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 Max VCC 1.5 2.1 2.4 2.7 2.5 4.0 0.0 0.08 0.20 0.22 0.28 0.38 0.42 Unit V 0.25 VCC 0.3 VCC VCC − 0.1 1.29 1.90 2.20 2.40 2.30 3.80 V V 0.1 0.24 0.3 0.4 0.4 0.55 0.55 0.1 0.24 0.3 0.4 0.4 0.55 0.55 V 0 to 5.5 0.1 1.0 A 5.5 1.0 10 A AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns Symbol tPLH tPHL Condition (V) Min Typ Max Min Max Unit RL = 1 M CL = 15 pF 1.8 0.15 2.0 7.4 9.5 2.0 9.7 ns 2.5 0.20 1.2 3.3 5.4 1.2 5.8 RL = 1 M CL = 15 pF F RL = 500 CL = 50 pF 3.3 0.30 0.8 1.2 2.6 3.2 3.9 4.8 0.8 1.2 4.3 5.2 RL = 1 M CL = 15 pF F RL = 500 CL = 50 pF 5.0 0.50 0.5 0.8 1.9 2.5 3.1 3.7 0.5 0.8 3.3 4.0 Parameter Propagation Delay (Figure 3 and 4) 40C TA 85C TA = 25C VCC CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 2.5 pF CPD Power Dissipation Capacitance (Note 6) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 9.0 11.0 pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 NL27WZ02 tf = 3 ns tf = 3 ns 90% INPUT A and B VCC 90% 50% 50% INPUT 10% 10% tPHL OUTPUT GND RL tPLH CL VOH OUTPUT Y 50% 50% A 1−MHz square input wave is recommended for propagation delay tests. VOL Figure 3. Switching Waveform Figure 4. Test Circuit DEVICE ORDERING INFORMATION Device Nomenclature Device Order Number NL27WZ02US Logic Circuit Indicator No. of Gates per Package Temp Range Identifier Technology Device Function Package Suffix Package Type Tape and Reel Size NL 2 7 WZ 02 US US8 178 mm, 3000 Unit http://onsemi.com 4 NL27WZ02 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493−02 ISSUE A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). −X− A 8 J −Y− 5 DETAIL E B L 1 4 R S G P U C −T− SEATING PLANE K D H 0.10 (0.004) T N R 0.10 TYP 0.10 (0.004) M T X Y V M F DETAIL E SOLDERING FOOTPRINT* 3.8 0.5 TYP ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 1.8 TYP ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 1.0 0.3 TYP (mm) *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 DIM A B C D F G H J K L M N P R S U V MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0 6 5 10 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0 6 5 10 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC NL27WZ02 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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