TQP3M6005 Mid Band Dual LNA (1700-2000 MHz) Applications Base Station receivers Tower-mounted amplifiers 16-pin 4x4mm leadless SMT package Product Features Functional Block Diagram 0.36 dB Noise Figure (single channel) 1700-2000 MHz 17.9 dB Gain (single channel) +13.4 dBm IIP3 (single channel) Compact 4 x 4 mm package RoHS compliant, Pb-free General Description Pin Configuration The TQP3M6005 is a low noise dual pHEMT discrete device operating from 1700 - 2000 MHz. Noise figure is typically 0.36 dB per channel and 0.54 dB when used in a balanced configuration with a balun. The TQP3M6005 consists of a single monolithic GaAs die mounted in a compact 4 x 4 QFN package. This device is a dual discrete LNA intended to be used as a balanced pair in wireless networks applications. The TQP3M6005 is packaged in a Pb-free / RoHS-compliant, compact 4x4 mm surface-mount leadless package. Pin # Symbol 1, 2, 3, 4, 9, 10, 11, 12 NC (No Connect) 6, 7, 14, 15 GND (Ground) 5 16 V GA V GB V DB V DA Backside Paddle RF/DC Ground 8 13 The TQP3M6005 is useful in a number of different applications, and is particularly well suited for cellular or WiMAX base station or tower-mounted amplifier products. Ordering Information Part No. TQP3M6005 Description Mid Band Dual LNA Standard T/R size = 2500 pieces on a 7” reel. Datasheet: Rev C 04-29-11 © 2011 TriQuint Semiconductor, Inc. - 1 of 7 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TQP3M6005 Mid Band Dual LNA (1700-2000 MHz) Specifications Recommended Operating Conditions Absolute Maximum Ratings Parameter Rating Parameter Storage Temperature -65 to 150 °C Drain Voltage +5 V Gate Voltage -1.0 to +0.5 V Drain Current (per channel) 330 mA Gate Current (per channel) 5 mA RF Input Power (balanced) +10 dBm Power Dissipation 1.1 W Operating Channel Temperature 150°C Mounting Temperature (10 seconds) 260°C Min Vd Id (per channel) Operating Temp. Range Typ Max Units 4.5 50 -35 V mA ° C +85 Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Operation of this device outside the parameter ranges given above may cause permanent damage. Electrical Specifications Test conditions unless otherwise noted: Vd=4.5 V, Freq.= 1850 MHz, Id=50 mA per channel, TA=25°C Parameter Operational Frequency Range Drain Voltage(1), Vd Gain dual channel(2) Noise Figure dual channel(2) Noise Figure per channel Reverse Isolation Output P1dB dual channel(2) Input IP3 dual channel(2,3) Input IP3 dual channel(2,3) Input IP3 per channel(3) Input IP3 per channel(3) Isolation between Gate 1 and Gate 2 Isolation between Drain 1 and Drain 2 Thermal Resistance (jnc. to case) jc Conditions Min 1700 2 16.0 20 F=1700 MHz F=1850 MHz F=1700 MHz F=1850 MHz 12 Typical 4.5 17.7 0.54 0.36 22 21.6 14 15 9.5 13.4 26 24 Max Units 2000 5 MHz V dB dB dB dB dBm dBm dBm dBm dBm dB dB ° C/W 0.72 0.50 146 Notes: 1. Vd is set based on a 1.5 ohm resistor in the drain path. See test diagram or schematic. 2. Balanced pair, with baluns 3. Pin/tone = -13 dBm, 8 MHz tone spacing Datasheet: Rev C 04-29-11 © 2011 TriQuint Semiconductor, Inc. - 2 of 7 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TQP3M6005 Mid Band Dual LNA (1700-2000 MHz) Reference Design 1700-2000 MHz Notes: 1. See PC Board Layout, page 4 for more information. 2. Zero ohm jumpers may be replaced with copper traces in the target application layout. 3. Though not shown on reference design, grounding recommended on pins 6, 7, 14 & 15 for optimal isolation between amp A and B. Bill of Material Ref Des Value Description Manufacturer Part Number U1 C1, C10 C2, C12 C3, C13 C4, C14 C5, C15 C6, C16 C7, C17 C8, C18 C9, C19 R1, R2, R11, R12 R3, R13 R4, R14 R5, R15 L1, L11 L2, L12 L3, L13 L4, L14 N/A 2.4 pF 10 pF 22 pF 1.2 pF 12 pF 2.2 pF 1 uF 10 uF 0.01 uF 0 Ohm 8.2 Ohm 1.5 Ohm 50 Ohm 10 nH 3.6 nH 2.2 nH 33 nH 1.2 nH Mid Band Dual LNA Capacitor, 0603, +/-0.1 pF NPO Capacitor, 0603, 5%, NPO Capacitor, 0603, 5%, NPO Capacitor, 0603, +/-0.1 pF NPO Capacitor, 0603, 5%, NPO Capacitor, 0603, +/-0.1 pF NPO Capacitor, 0603, 10%, X5R Capacitor, 0603, 20%, X5R Capacitor, 0603, 10%, X7R Resistor, 0603, 5%, 1/16W Resistor, 0603, 5%, 1/16W Resistor, 0603, 5%, 1/16W Resistor, 0603, 5%, 1/16W Inductor, 0603, 5% Inductor, 0603, 5% Inductor, 0603, 5% Inductor, 0603, 5% TriQuint Various Various Various Various Various Various Various Various Various Various Various Various Various Coilcraft Coilcraft Coilcraft Coilcraft Coilcraft TQP3M6005 0402CS‐1N2XJLW Inductor, 0402, 5% L5, L15 L6 L16 43 nH Datasheet: Rev C 04-29-11 © 2011 TriQuint Semiconductor, Inc. Inductor 0603 5% - 3 of 7 - 0603CS-10NXJLW 0603CS-3N6XJLW 0603CS-2N2XJLW 0603CS-33NXJLW Coilcraft 0603CS 43NXJLW Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TQP3M6005 Mid Band Dual LNA (1700-2000 MHz) Typical Performance 1700-2000 MHz (Balanced Configuration) Test conditions unless otherwise noted: Vd=4.5 V, Id=50 mA per channel, TA=25ºC Frequency MHz 1700 1850 2000 Gain Input Return Loss Output Return Loss Output P1dB Input IP3 at -13 dBm Pin/tone, 8 MHz tone spacing Noise Figure dB dB dB dBm dBm dB 18.7 -18 -23 +21.5 +14 0.5 17.7 -20 -26 +21.6 +15 0.54 16.8 -18 -38 +21.7 +15.9 0.58 Gain vs. Frequency 20 Return Loss vs. Frequency 0 Temp. = +25C Temp. = +25C -10 Return Loss (dB) Gain (dB) 19 18 17 16 15 1.70 Input Return Loss -20 -30 Output Return Loss -40 1.75 1.80 1.85 1.90 1.95 -50 1.70 2.00 1.75 Frequency (GHz) 1.0 1.80 1.85 1.90 1.95 2.00 Frequency (GHz) Noise Figure vs. Frequency 0.7 +100°C 0.8 Noise Figure vs. Frequency 0.6 0.6 NF (dB) NF (dB) +85°C 0.4 +22°C −35°C 0.2 0.0 1.70 1.75 1.80 1.85 1.90 1.95 0.5 Vd=4.5 V Vd=3.5 V 0.4 0.3 0.2 1.70 2.00 1.75 Frequency (GHz) 1.85 1.90 1.95 2.00 Frequency (GHz) IIP3 vs. Frequency 20 1.80 23 Output P1dB vs. Frequency 8 MHz Tone Spacing Pin/Tone = -13 dBm +22°C −35°C 16 +100°C +85°C 14 12 1.70 Output P1dB (dBm) IIP3 (dBm) 18 1.75 1.80 1.85 1.90 1.95 2.00 22 20 1.70 © 2011 TriQuint Semiconductor, Inc. 1.75 1.80 1.85 1.90 1.95 2.00 Frequency (GHz) Frequency (GHz) Datasheet: Rev C 04-29-11 +100°C +85°C +22°C −35°C 21 - 4 of 7 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TQP3M6005 Mid Band Dual LNA (1700-2000 MHz) Pin Description Pin # Symbol Description 1, 2, 3, 4, 9, 10, 11, 12 NC (No Connect) 6, 7, 14, 15 GND (Ground) No electrical connection. Land pads should be provided for PCB mounting integrity. Grounding recommended for optimal isolation between amp A and B 5 V GA RF Input – Channel A 8 V GB RF Input – Channel B 13 V DB RF Output – Channel B 16 V DA Backside Paddle RF/DC Ground RF Output – Channel A RF/DC ground. Provide recommended via pattern and ensure good solder attach for best thermal and electrical performance. Applications Information PC Board Layout PCB Material (stackup) Single-layer, 20 mil thick Rogers RO4350B 2.8 mil copper top and bottom The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. Datasheet: Rev C 04-29-11 © 2011 TriQuint Semiconductor, Inc. - 5 of 7 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TQP3M6005 Mid Band Dual LNA (1700-2000 MHz) Mechanical Information Package Information and Dimensions Material: Lead-free/Green/RoHS-compliant. Contact plating: ENIG Package Marking: Part number – 6005 Assembly code - XXXX Year, week - YYWW 6005 XXXX YYWW Mounting Configuration Datasheet: Rev C 04-29-11 © 2011 TriQuint Semiconductor, Inc. - 6 of 7 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TQP3M6005 Mid Band Dual LNA (1700-2000 MHz) Product Compliance Information ESD Information Solderability Compatible with both J-STD-020 lead-free (maximum 260 °C reflow temperature) and lead (maximum 245 °C reflow temperature) soldering processes. ESD Rating: Value: Test: Standard: Class 1A >250V to <500V Human Body Model (HBM) JEDEC Standard JESD22-A114 ESD Rating: Value: Test: Standard: Class III >500V to <1000V Charged Device Model (CDM) JEDEC Standard JESD22-C101 This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). This product also has the following attributes: Lead Free Halogen Free (Chlorine, Bromine) Antimony Free TBBP-A (C15H12Br402) Free PFOS Free SVHC Free MSL Rating Level 3 at +260 °C convection reflow per JEDEC standard IPC/JEDEC J-STD-020. Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: [email protected] Tel: Fax: +1.503.615.9000 +1.503.615.8902 For technical questions and application information: Email: [email protected] Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contain herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Datasheet: Rev C 04-29-11 © 2011 TriQuint Semiconductor, Inc. - 7 of 7 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network®