TRIQUINT TQP3M6005

TQP3M6005
Mid Band Dual LNA (1700-2000 MHz)
Applications


Base Station receivers
Tower-mounted amplifiers
16-pin 4x4mm leadless SMT package
Product Features






Functional Block Diagram
0.36 dB Noise Figure (single channel)
1700-2000 MHz
17.9 dB Gain (single channel)
+13.4 dBm IIP3 (single channel)
Compact 4 x 4 mm package
RoHS compliant, Pb-free
General Description
Pin Configuration
The TQP3M6005 is a low noise dual pHEMT discrete
device operating from 1700 - 2000 MHz. Noise figure is
typically 0.36 dB per channel and 0.54 dB when used in a
balanced configuration with a balun.
The TQP3M6005 consists of a single monolithic GaAs die
mounted in a compact 4 x 4 QFN package. This device is a
dual discrete LNA intended to be used as a balanced pair in
wireless networks applications. The TQP3M6005 is
packaged in a Pb-free / RoHS-compliant, compact 4x4 mm
surface-mount leadless package.
Pin #
Symbol
1, 2, 3, 4, 9, 10, 11, 12
NC (No Connect)
6, 7, 14, 15
GND (Ground)
5
16
V GA
V GB
V DB
V DA
Backside Paddle
RF/DC Ground
8
13
The TQP3M6005 is useful in a number of different
applications, and is particularly well suited for cellular or
WiMAX base station or tower-mounted amplifier products.
Ordering Information
Part No.
TQP3M6005
Description
Mid Band Dual LNA
Standard T/R size = 2500 pieces on a 7” reel.
Datasheet: Rev C 04-29-11
© 2011 TriQuint Semiconductor, Inc.
- 1 of 7 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
TQP3M6005
Mid Band Dual LNA (1700-2000 MHz)
Specifications
Recommended Operating Conditions
Absolute Maximum Ratings
Parameter
Rating
Parameter
Storage Temperature
-65 to 150 °C
Drain Voltage
+5 V
Gate Voltage
-1.0 to +0.5 V
Drain Current (per channel)
330 mA
Gate Current (per channel)
5 mA
RF Input Power (balanced)
+10 dBm
Power Dissipation
1.1 W
Operating Channel Temperature
150°C
Mounting Temperature (10 seconds) 260°C
Min
Vd
Id (per channel)
Operating Temp. Range
Typ
Max Units
4.5
50
-35
V
mA
°
C
+85
Electrical specifications are measured at specified test conditions.
Specifications are not guaranteed over all recommended operating
conditions.
Operation of this device outside the parameter ranges given
above may cause permanent damage.
Electrical Specifications
Test conditions unless otherwise noted: Vd=4.5 V, Freq.= 1850 MHz, Id=50 mA per channel, TA=25°C
Parameter
Operational Frequency Range
Drain Voltage(1), Vd
Gain dual channel(2)
Noise Figure dual channel(2)
Noise Figure per channel
Reverse Isolation
Output P1dB dual channel(2)
Input IP3 dual channel(2,3)
Input IP3 dual channel(2,3)
Input IP3 per channel(3)
Input IP3 per channel(3)
Isolation between Gate 1 and Gate 2
Isolation between Drain 1 and Drain 2
Thermal Resistance (jnc. to case) jc
Conditions
Min
1700
2
16.0
20
F=1700 MHz
F=1850 MHz
F=1700 MHz
F=1850 MHz
12
Typical
4.5
17.7
0.54
0.36
22
21.6
14
15
9.5
13.4
26
24
Max
Units
2000
5
MHz
V
dB
dB
dB
dB
dBm
dBm
dBm
dBm
dBm
dB
dB
°
C/W
0.72
0.50
146
Notes:
1. Vd is set based on a 1.5 ohm resistor in the drain path. See test diagram or schematic.
2. Balanced pair, with baluns
3. Pin/tone = -13 dBm, 8 MHz tone spacing
Datasheet: Rev C 04-29-11
© 2011 TriQuint Semiconductor, Inc.
- 2 of 7 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
TQP3M6005
Mid Band Dual LNA (1700-2000 MHz)
Reference Design 1700-2000 MHz
Notes:
1. See PC Board Layout, page 4 for more information.
2. Zero ohm jumpers may be replaced with copper traces in the target application layout.
3. Though not shown on reference design, grounding recommended on pins 6, 7, 14 & 15 for optimal isolation between amp A and B.
Bill of Material
Ref Des
Value
Description
Manufacturer
Part Number
U1
C1, C10
C2, C12
C3, C13
C4, C14
C5, C15
C6, C16
C7, C17
C8, C18
C9, C19
R1, R2, R11, R12
R3, R13
R4, R14
R5, R15
L1, L11
L2, L12
L3, L13
L4, L14
N/A
2.4 pF
10 pF
22 pF
1.2 pF
12 pF
2.2 pF
1 uF
10 uF
0.01 uF
0 Ohm
8.2 Ohm
1.5 Ohm
50 Ohm
10 nH
3.6 nH
2.2 nH
33 nH
1.2 nH
Mid Band Dual LNA
Capacitor, 0603, +/-0.1 pF NPO
Capacitor, 0603, 5%, NPO
Capacitor, 0603, 5%, NPO
Capacitor, 0603, +/-0.1 pF NPO
Capacitor, 0603, 5%, NPO
Capacitor, 0603, +/-0.1 pF NPO
Capacitor, 0603, 10%, X5R
Capacitor, 0603, 20%, X5R
Capacitor, 0603, 10%, X7R
Resistor, 0603, 5%, 1/16W
Resistor, 0603, 5%, 1/16W
Resistor, 0603, 5%, 1/16W
Resistor, 0603, 5%, 1/16W
Inductor, 0603, 5%
Inductor, 0603, 5%
Inductor, 0603, 5%
Inductor, 0603, 5%
TriQuint
Various
Various
Various
Various
Various
Various
Various
Various
Various
Various
Various
Various
Various
Coilcraft
Coilcraft
Coilcraft
Coilcraft
Coilcraft
TQP3M6005
0402CS‐1N2XJLW
Inductor, 0402, 5%
L5, L15
L6 L16
43 nH
Datasheet: Rev C 04-29-11
© 2011 TriQuint Semiconductor, Inc.
Inductor 0603 5%
- 3 of 7 -
0603CS-10NXJLW
0603CS-3N6XJLW
0603CS-2N2XJLW
0603CS-33NXJLW
Coilcraft
0603CS 43NXJLW
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
TQP3M6005
Mid Band Dual LNA (1700-2000 MHz)
Typical Performance 1700-2000 MHz (Balanced Configuration)
Test conditions unless otherwise noted: Vd=4.5 V, Id=50 mA per channel, TA=25ºC
Frequency
MHz
1700
1850
2000
Gain
Input Return Loss
Output Return Loss
Output P1dB
Input IP3 at -13 dBm Pin/tone, 8 MHz tone spacing
Noise Figure
dB
dB
dB
dBm
dBm
dB
18.7
-18
-23
+21.5
+14
0.5
17.7
-20
-26
+21.6
+15
0.54
16.8
-18
-38
+21.7
+15.9
0.58
Gain vs. Frequency
20
Return Loss vs. Frequency
0
Temp. = +25C
Temp. = +25C
-10
Return Loss (dB)
Gain (dB)
19
18
17
16
15
1.70
Input Return Loss
-20
-30
Output Return Loss
-40
1.75
1.80
1.85
1.90
1.95
-50
1.70
2.00
1.75
Frequency (GHz)
1.0
1.80
1.85
1.90
1.95
2.00
Frequency (GHz)
Noise Figure vs. Frequency
0.7
+100°C
0.8
Noise Figure vs. Frequency
0.6
0.6
NF (dB)
NF (dB)
+85°C
0.4
+22°C
−35°C
0.2
0.0
1.70
1.75
1.80
1.85
1.90
1.95
0.5
Vd=4.5 V
Vd=3.5 V
0.4
0.3
0.2
1.70
2.00
1.75
Frequency (GHz)
1.85
1.90
1.95
2.00
Frequency (GHz)
IIP3 vs. Frequency
20
1.80
23
Output P1dB vs. Frequency
8 MHz Tone Spacing
Pin/Tone = -13 dBm
+22°C
−35°C
16
+100°C
+85°C
14
12
1.70
Output P1dB (dBm)
IIP3 (dBm)
18
1.75
1.80
1.85
1.90
1.95
2.00
22
20
1.70
© 2011 TriQuint Semiconductor, Inc.
1.75
1.80
1.85
1.90
1.95
2.00
Frequency (GHz)
Frequency (GHz)
Datasheet: Rev C 04-29-11
+100°C
+85°C
+22°C
−35°C
21
- 4 of 7 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
TQP3M6005
Mid Band Dual LNA (1700-2000 MHz)
Pin Description
Pin #
Symbol
Description
1, 2, 3, 4, 9, 10, 11, 12
NC (No Connect)
6, 7, 14, 15
GND (Ground)
No electrical connection. Land pads should be provided for PCB mounting
integrity.
Grounding recommended for optimal isolation between amp A and B
5
V GA
RF Input – Channel A
8
V GB
RF Input – Channel B
13
V DB
RF Output – Channel B
16
V DA
Backside Paddle
RF/DC Ground
RF Output – Channel A
RF/DC ground. Provide recommended via pattern and ensure good solder
attach for best thermal and electrical performance.
Applications Information
PC Board Layout
PCB Material (stackup)
Single-layer, 20 mil thick Rogers RO4350B
2.8 mil copper top and bottom
The pad pattern shown has been developed and tested
for optimized assembly at TriQuint Semiconductor. The
PCB land pattern has been developed to accommodate
lead and package tolerances. Since surface mount
processes vary from company to company, careful
process development is recommended.
Datasheet: Rev C 04-29-11
© 2011 TriQuint Semiconductor, Inc.
- 5 of 7 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
TQP3M6005
Mid Band Dual LNA (1700-2000 MHz)
Mechanical Information
Package Information and Dimensions
Material:
Lead-free/Green/RoHS-compliant.
Contact plating: ENIG
Package Marking:
Part number – 6005
Assembly code - XXXX
Year, week - YYWW
6005
XXXX
YYWW
Mounting Configuration
Datasheet: Rev C 04-29-11
© 2011 TriQuint Semiconductor, Inc.
- 6 of 7 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
TQP3M6005
Mid Band Dual LNA (1700-2000 MHz)
Product Compliance Information
ESD Information
Solderability
Compatible with both J-STD-020 lead-free (maximum
260 °C reflow temperature) and lead (maximum 245
°C reflow temperature) soldering processes.
ESD Rating:
Value:
Test:
Standard:
Class 1A
>250V to <500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating:
Value:
Test:
Standard:
Class III
>500V to <1000V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain Hazardous
Substances in Electrical and Electronic Equipment).
This product also has the following attributes:
 Lead Free
 Halogen Free (Chlorine, Bromine)
 Antimony Free
 TBBP-A (C15H12Br402) Free
 PFOS Free
 SVHC Free
MSL Rating
Level 3 at +260 °C convection reflow per JEDEC standard
IPC/JEDEC J-STD-020.
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations, and information about
TriQuint:
Web: www.triquint.com
Email: [email protected]
Tel:
Fax:
+1.503.615.9000
+1.503.615.8902
For technical questions and application information:
Email: [email protected]
Important Notice
The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contain
herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint
assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained
herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with
the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest
relevant information before placing orders for TriQuint products. The information contained herein or any use of such
information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property
rights, whether with regard to such information itself or anything described by such information.
TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining
applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death.
Datasheet: Rev C 04-29-11
© 2011 TriQuint Semiconductor, Inc.
- 7 of 7 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®