TRIQUINT TQP369185-PCB

TQP369185
DC-6 GHz Gain Block
Applications





Mobile Infrastructure
LTE / WCDMA / CDMA
CATV
Point to Point
General Purpose Wireless
Product Features









SOT-89 Package
Functional Block Diagram
GND
Cascadable Gain Block
DC – 6000 MHz
19 dB Gain at 1.9 GHz
4.7 dB Noise Figure at 1.9 GHz
+31.7 dBm Output IP3
+19.6 dBm P1dB
Internally matched to 50 Ohms
Internal active bias
Robust Class 2 (>2000V) HBM ESD Rating
4
1
2
3
RF IN
GND
RF OUT
General Description
Pin Configuration
The TQP369185 is a general-purpose buffer amplifier
that offers high dynamic range in a low-cost surfacemount package. At 1.9 GHz, the amplifier typically
provides 19 dB gain, +31.7 dBm OIP3, and 4.6 dB Noise
Figure while drawing 75 mA current. The device
combines dependable performance with consistent quality
to maintain MTTF values exceeding 100 years at
mounting temperatures of +85°C. The device is housed
in a lead-free/green/RoHS-compliant industry-standard
SOT-89 package.
Pin #
Symbol
1
3
RF IN
RF OUT
2, 4
GND
The TQP369185 consists of a Darlington-pair amplifier
using TriQuint’s high reliability InGaP/GaAs HBT
process technology.
Internal active bias enables
operation with only DC-blocking capacitors and an RF
choke on the DC bias feed. This broadband MMIC
amplifier can be directly applied to various current and
next generation wireless technologies such as CDMA, WCDMA, and LTE. In addition, the TQP369185 will work
for other various applications within the DC to 6 GHz
frequency range.
Ordering Information
Part No.
Description
TQP369185
TQP369185-PCB
InGaP/GaAs HBT Gain Block
0.5-4 GHz Evaluation Board
Standard T/R size = 2500 pieces on a 13” reel
Data Sheet: Rev D 05/15/12
© 2012 TriQuint Semiconductor, Inc.
- 1 of 8 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TQP369185
DC-6 GHz Gain Block
Specifications
Absolute Maximum Ratings
Recommended Operating Conditions
Parameter
Rating
Parameter
Min
Typ
Storage Temperature
-55 to 150 oC
25dBm
+4.75
-40
+5
RF Input Power,CW,50 Ω,T=25ºC
Device Voltage, VCC
7.0V
VCC
Tcase
Tj (for>106 hours MTTF)
Max Units
+5.25
+85
+170
V
o
C
o
C
Electrical specifications are measured at specified test conditions.
Specifications are not guaranteed over all recommended operating
conditions.
Operation of this device outside the parameter ranges given
above may cause permanent damage.
Electrical Specifications
Test conditions unless otherwise noted: +25ºC, Vcc=+5V, 50 Ω system
Parameter
Conditions
Operational Frequency Range
Min
Typical
DC
Test Frequency
Max
Units
6000
MHz
1900
Gain
17.5
19
MHz
20.5
dB
Input Return Loss
-13.5
dB
Output Return Loss
-9.6
dB
Output P1dB
Output IP3
See Note 1.
+28
Noise Figure
Device Voltage, VCC
55
Device Current, ICC
Thermal Resistance (jnc to case) θjc
+19.6
dBm
+31.7
dBm
4.6
dB
5
V
75
92
mA
82
o
C/W
Notes:
1. OIP3 is measured with two tones at an output power of -3 dBm / tone separated by 1 MHz. The suppression on the largest IM3 product
is used to calculate the OIP3 using 2:1 rule. 2:1 rule gives relative value with respect to fundamental tone.
Data Sheet: Rev D 05/15/12
© 2012 TriQuint Semiconductor, Inc.
- 2 of 8 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TQP369185
DC-6 GHz Gain Block
Device Characterization Data
S-Parameter Data
°
VCC = 5.0 V, ICC = 72 mA, Tcase = +25 C, unmatched 50 ohm system, calibrated to device leads
Freq (MHz)
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
10
-19.3
-178.5
21.3
179.4
-26.2
0.5
-14.3
3.2
20
-19.0
-177.3
21.4
178.6
-26.1
0.5
-14.0
1.0
50
-18.6
-175.6
21.4
177.6
-26.0
-0.4
-14.3
-2.7
100
-18.4
-176.9
21.3
174.5
-26.1
-0.3
-14.4
-8.5
200
-17.9
-170.6
21.3
169.7
-26.1
-0.6
-14.0
-16.2
500
-16.9
-169.8
21.0
155.4
-26.0
-2.7
-13.4
-43.7
1000
-14.3
-173.6
20.5
132.9
-25.6
-6.1
-12.0
-83.8
1500
-12.3
178.7
20.0
110.6
-25.1
-10.7
-10.4
-119.2
2000
-10.7
163.5
19.3
89.1
-24.5
-18.4
-8.9
-149.9
2500
-9.1
148.7
18.5
68.1
-24.2
-26.3
-7.9
-177.8
3000
-7.8
136.2
17.7
49.2
-23.8
-34.8
-7.0
160.8
3500
-6.9
125.7
16.8
30.8
-23.5
-44.4
-6.3
141.0
4000
-6.5
115.7
15.8
12.5
-23.5
-53.7
-5.3
122.0
4500
-6.7
101.4
14.7
-4.6
-23.7
-62.5
-5.0
104.1
5000
-5.8
89.6
13.7
-19.6
-23.5
-69.4
-4.7
90.3
5500
-4.8
80.2
13.1
-36.1
-23.5
-79.2
-4.1
78.6
6000
-4.3
69.8
12.1
-52.3
-23.7
-89.4
-4.0
66.0
Data Sheet: Rev D 05/15/12
© 2012 TriQuint Semiconductor, Inc.
- 3 of 8 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TQP369185
DC-6 GHz Gain Block
Application Circuit Configuration
J3
J4
J3 Vcc
J4 GND
R1
C1
C1
0.018 uF
L1
39 nH
C3
L1
Q1
C2
C3
C2
J1
1
RF
Input
3
Q1
2,4
56 pF
56 pF
J2
RF
Output
Notes:
1. See PC Board Layout, under Application Information section, for more information.
2. All components are of 0603 size unless otherwise stated.
3. Zero Ohm resistor R1 is used to bridge a trace gap on PCB 1075825 and is not required in end user applications.
Bill of Material: TQP369185-PCB
Reference Des. Value
Description
Manufacturer
Part Number
Q1
n/a
Gain Block
TriQuint
TQP369185
C1
0.018 uF
Cap, Chip, 0603, 16V, X7R, 10%
various
C2, C3
56 pF
Cap, Chip, 0603, 50V, NPO, 5%
various
L1
39 nH
Inductor, 0603, 5%, CS Series
Coilcraft
R1
0 Ohm
Res, Chip, 603, 1/10W, 5%
various
Component Values for Specific Frequencies
Use the component values in this table for optimal operation at specific frequencies.
Reference
Designator
50
500
L1
C2, C3
820 nH
.018 uF
220 nH
1000 pF
Data Sheet: Rev D 05/15/12
© 2012 TriQuint Semiconductor, Inc.
Frequency (MHz)
900
1900
2200
68 nH
100 pF
27 nH
68 pF
- 4 of 8 -
22 nH
68 pF
2500
3500
18 nH
56 pF
15 nH
39 pF
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TQP369185
DC-6 GHz Gain Block
Typical Performance
°
Test conditions unless otherwise noted: VCC = 5 V, ICC = 75 mA, Tcase = +25 C
Frequency
1900 2100 2600 3500 4000 5000 6000
MHz
500
900
dB
dB
dB
20.5
11.7
17.8
20.4
12.4
15.9
19.0
12.3
10
18.6
13.3
9.3
Output P1dB
dBm
20.9
+19.8
+19.6
+19.5
+19
16.8
-6.9
-6.3
+17.5
OIP3 [1]
dBm
+33.3
+32.3
+31.7
+31.7
+30.6
+28.6
+27.1
+24.4
+23.4
dB
4.5
4.7
4.6
4.7
4.8
4.9
5.1
5.6
6.3
Gain
Input Return Loss
Output Return Loss
Noise Figure
18.0
13.7
8.7
15.8
-6.5
-5.3
+15.8
13.7
-5.8
-4.7
+13.9
12.1
-4.3
-4
+12.3
Notes:
1. OIP3 measured with two tones at an output power of -3 dBm / tone separated by 1 MHz. The suppression on the largest IM3 product is
used to calculate the OIP3 using 2:1 rule.
2. Measured on TQP369185-PCB
Performance Plots
Test conditions unless otherwise noted: VCC = 5 V, ICC = 75 mA, TQP369185-PCB
+85°C
+25°C
40°C
16
14
-5
-10
+85°C
-15
+25°C
12
40°C
10
-20
0
1
2
3
4
5
6
OIP3 vs. Output Power/Tone
1
40°C
2
3
4
5
6
0
OIP3 (dBm)
1
2
3
4
5
6
+85°C
+25°C
−40°C
32
31
6
P1dB vs. Frequency
20
15
10
0
-2
-1
0
1
2
3
4
5
6
0
7
1000
2000
OIP3 vs. Frequency
1 MHz tone spacing
Pout=0 dBm.per tone
3000
4000
5000
6000
Frequency (MHz)
Output Power/Tone (dBm)
Output Power/Tone (dBm)
40
5
5
-3
7
4
Temp.=+25°C
29
29
3
25
30
30
0
2
30
33
31
-1
1
Frequency (GHz)
Freq. =1900 MHz
1 MHz Tone Spacing
32
-2
+25°C
-15
OIP3 vs. Output Power/Tone
34
+85°C
+25°C
−40°C
33
-3
+85°C
-10
Frequency (GHz)
Freq. =900 MHz
1 MHz Tone Spacing
OIP3 (dBm)
-5
-20
0
Frequency (GHz)
34
Output Return Loss vs. Frequency
0
P1dB (dBm)
Gain (dB)
Input Return Loss (dB)
20
18
Input Return Loss vs. Frequency
0
Output Return Loss (dB)
Gain vs. Frequency
22
NF vs. Frequency
8
Temp.=+25°C
Temp.=+25°C
35
30
NF (dB)
OIP3 (dBm)
6
25
4
20
2
15
10
0
0
1000
2000
3000
4000
5000
6000
Frequency (MHz)
Data Sheet: Rev D 05/15/12
© 2012 TriQuint Semiconductor, Inc.
0
1000
2000
3000
4000
5000
6000
Frequency (MHz)
- 5 of 8 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TQP369185
DC-6 GHz Gain Block
Pin Description
GND
4
1
2
3
RF IN
GND
RF OUT
Pin
Symbol
Description
1
RF IN
3
RF OUT
2, 4
GND Paddle
RF input, matched to 50 ohms. External DC Block is required.
RF output / DC supply, matched to 50 ohms. External DC Block and bias choke are
required.
Backside Paddle. Multiple vias should be employed to minimize inductance and thermal
resistance; see page 7 for mounting configuration.
Evaluation Board PCB Specifications
Material Stack-Up and Layout
0.014"
Nelco N-4000-13
εr=3.7 typ.
0.062" ± 0.006"
Finished Board
Thickness
1 oz. Cu top layer
1 oz. Cu inner layer
Core
1 oz. Cu inner layer
0.014"
Nelco N-4000-13
1 oz. Cu bottom layer
Data Sheet: Rev D 05/15/12
© 2012 TriQuint Semiconductor, Inc.
- 6 of 8 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TQP369185
DC-6 GHz Gain Block
Mechanical Information
Package Marking and Dimensions
The component will be marked on the
top surface of package with a “369185”
designator and an alphanumeric lot code.
369185
PCB Mounting Pattern
All dimensions are in millimeters (inches). Angles are in degrees.
3.86 [0.152]
29X
3
1.26 [0.050]
0.63 [0.025]
0.76 [0.030]
4.50 [0.177]
Ø.254 (.010) PLATED THRU VIA HOLES
PACKAGE OUTLINE
2X 1.27 [0.050]
2X 0.58 [0.023]
2.65 [0.104]
2X 0.86 [0.034]
0.64 [0.025]
0.86 [0.034]
3.86 [0.152]
NOTES:
1. All dimensions are in millimeters[inches]. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We recommend a
0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25mm (0.10”).
4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
Data Sheet: Rev D 05/15/12
© 2012 TriQuint Semiconductor, Inc.
- 7 of 8 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TQP369185
DC-6 GHz Gain Block
Product Compliance Information
ESD Information
Solderability
Package lead plating: NiPdAu
ESD Rating:
Value:
Test:
Standard:
Class 2
Passes  2000 V to < 4000 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating:
Value:
Test:
Standard:
Class IV
Passes  1000 V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Compatible with both lead-free (260 °C max. reflow
temp.) and tin/lead (245 °C max. reflow temp.)
soldering processes.
RoHs Compliance
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain Hazardous
Substances in Electrical and Electronic Equipment).
This product also has the following attributes:
 Lead Free
 Halogen Free (Chlorine, Bromine)
 Antimony Free
 TBBP-A (C15H12Br402) Free
 PFOS Free
 SVHC Free
MSL Rating
Moisture Sensitivity Level 1 at 260°C per JEDEC standard
IPC/JEDEC J-STD-020.
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations, and information about
TriQuint:
Web: www.triquint.com
Email: [email protected]
Tel:
Fax:
+1.503.615.9000
+1.503.615.8902
For technical questions and application information:
Email: [email protected]
Important Notice
The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained
herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint
assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained
herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with
the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest
relevant information before placing orders for TriQuint products. The information contained herein or any use of such
information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property
rights, whether with regard to such information itself or anything described by such information. TriQuint products are not
warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other
applications where a failure would reasonably be expected to cause severe personal injury or death.
Data Sheet: Rev D 05/15/12
© 2012 TriQuint Semiconductor, Inc.
- 8 of 8 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®