Freescale Semiconductor Technical Data Document Number: MML20242H Rev. 2, 9/2014 Enhancement Mode pHEMT Technology (E--pHEMT) MML20242HT1 Low Noise Amplifier The MML20242H is a 2--stage low noise amplifier (LNA) with active bias and high isolation for use in cellular infrastructure applications. It is designed for a range of low noise, high linearity applications such as picocell, femtocell, tower mounted amplifiers (TMA) and receiver front--end circuits. It operates from a single voltage supply and is suitable for applications with frequencies from 1400 to 2800 MHz such as TD -- SCDMA, W -- CDMA, UMTS, PCS, LTE and BWA. 1400--2800 MHz, 34 dB 24 dBm, 0.59 dB NF E--pHEMT LNA Features Low Noise Figure: 0.59 dB @ 1950 MHz Frequency: 1400--2800 MHz Unconditionally Stable over Temperature High Reverse Isolation: --51 dB @ 1950 MHz P1dB: 24 dBm @ 1950 MHz Small--Signal Gain: 34 dB @ 1950 MHz Third Order Output Intercept Point: 39.5 dBm @ 1950 MHz Active Bias Control (adjustable externally) Single 5 V Supply Supply Current: 160 mA 50 Ohm Operation (some external matching required) Cost--effective 12--pin, 3 mm QFN Surface Mount Plastic Package In Tape and Reel. T1 Suffix = 1,000 Units, 12 mm Tape Width, 7--inch Reel. Table 1. Typical Performance (1) Table 2. Maximum Ratings Rating Symbol 1400 MHz 1950 MHz 2800 MHz Unit Noise Figure (2) NF 0.55 0.59 0.97 dB Input Return Loss (S11) IRL --15 --18 --18 dB Output Return Loss (S22) ORL --14 --15 --15 dB Small--Signal Gain (S21) Gp 38 34 31.5 dB P1dB 23.5 24 24 dBm Third Order Input Intercept Point IIP3 1 5.5 8 dBm Third Order Output Intercept Point OIP3 39 39.5 39.5 dBm Characteristic Power Output @ 1dB Compression QFN 3 3 Symbol Value Unit Supply Voltage VDD 6 V Supply Current IDD 300 mA RF Input Power (3) Pin 28 dBm Storage Temperature Range Tstg --65 to +150 C Junction Temperature TJ 175 C 3. Measured using CW test signal. 1. VDD = 5 Vdc, TA = 25C, 50 ohm system, application circuit tuned for specified frequency. 2. Noise figure value calculated with connector losses removed. Table 3. Thermal Characteristics Characteristic Thermal Resistance, Junction to Case Case Temperature 95C, 5 Vdc, 163 mA, no RF applied Symbol Value (4) Unit RJC 40 C/W 4. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf. Select Documentation/Application Notes -- AN1955. Freescale Semiconductor, Inc., 2012--2014. All rights reserved. RF Device Data Freescale Semiconductor, Inc. MML20242HT1 1 Table 4. Electrical Characteristics (VDD = 5 Vdc, 2140 MHz, TA = 25C, 50 ohm system, in Freescale Application Circuit) Symbol Min Typ Max Unit Small--Signal Gain (S21) Gp 30.6 32.5 — dB Input Return Loss (S11) IRL — --18 — dB Output Return Loss (S22) ORL — --15 — dB Power Output @ 1dB Compression P1dB — 24 — dBm IIP3 — 7 — dBm Third Order Output Intercept Point OIP3 — 39.5 — dBm Reverse Isolation (S12) |S12| — --50 — dBm Noise Figure (1) NF — 0.7 — dB Supply Current (2) IDD 117 160 207 mA Supply Voltage VDD — 5 — V Characteristic Third Order Input Intercept Point Table 5. ESD Protection Characteristics Test Methodology Class Human Body Model (per JESD22--A114) 0 Machine Model (per EIA/JESD22--A115) A Charge Device Model (per JESD22--C101) IV Table 6. Moisture Sensitivity Level Test Methodology Per JESD22--A113, IPC/JEDEC J--STD--020 Rating Package Peak Temperature Unit 1 260 C 1. Noise figure value calculated with connector losses removed. 2. DC current measured with no RF signal applied. RF Feedback VDD1 RF FB N.C. VDD1 12 RFMATCH RFin RFin VDD2/RFout BIAS CIRCUIT BIAS CIRCUIT RFMATCH 1 RFin 2 RFin 3 11 10 GND 9 N.C. 8 VDD2/RFout 7 N.C. 4 5 6 VBA1 N.C. VBA2 Note: Exposed backside of the package is DC and RF ground. VBA1 VBA2 Figure 1. Functional Block Diagram Figure 2. Pin Connections MML20242HT1 2 RF Device Data Freescale Semiconductor, Inc. 50 OHM APPLICATION CIRCUIT: 1950 MHz 12 VDD1 L3 R1 C8 11 L4 10 VDD2 9 1 C5 C3 L2 L1 Z2 8 2 C4 RF OUTPUT Z3 C2 RF INPUT Z1 C1 3 BIAS CIRCUIT C7 4 R2 5 C10 7 BIAS CIRCUIT 6 C11 R3 C12 Z1 Z2 Z3 C13 0.248 0.021 Microstrip 0.050 0.021 Microstrip 0.030 0.021 Microstrip Figure 3. MML20242HT1 Test Circuit Schematic Table 7. MML20242HT1 Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C5 18 pF Chip Capacitors GJM1555C1H180GB01 Murata C2, C3, C8, C11, C12 18 pF Chip Capacitors GRM1555C1H180JA01 Murata C4, C10, C13 0.1 F Chip Capacitors GRM155R61A104K01 Murata C6, C9 Components Not Placed C7 0.6 pF Chip Capacitor GJM1555C1HR60WB01 Murata L1 3.3 nH Chip Inductor 0402HP--3N3XJLW Coilcraft L2, L4 10 nH Chip Inductors 0402CS--10NXJLW Coilcraft L3 2.2 nH Chip Inductor 0402CS--2N2XJLW Coilcraft R1 180 Chip Resistor RC0402FR--07--180RL Yageo R2, R3 1200 Chip Resistors RC0402FR--07--1K2RL Yageo PCB 0.010, r = 3.48, Multilayer RO4350B Rogers Note: Component numbers C6 and C9 are labeled on board but not placed. MML20242HT1 RF Device Data Freescale Semiconductor, Inc. 3 50 OHM APPLICATION CIRCUIT: 1950 MHz VDD2 VDD1 Via A C9* Via B L4 C8 R1 C6* RFIN C5 C4 C3 L3 RFOUT L2 L1 C2 C1 C7 Via A R2 C10 C11 R3 Via B C12 C13 QFN 3x3--12E Rev. 0 Note: Component numbers C6* and C9* are labeled on board but not placed. Figure 4. MML20242HT1 Test Circuit Component Layout Table 7. MML20242HT1 Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C5 18 pF Chip Capacitors GJM1555C1H180GB01 Murata C2, C3, C8, C11, C12 18 pF Chip Capacitors GRM1555C1H180JA01 Murata C4, C10, C13 0.1 F Chip Capacitors GRM155R61A104K01 Murata C6, C9 Components Not Placed C7 0.6 pF Chip Capacitor GJM1555C1HR60WB01 Murata L1 3.3 nH Chip Inductor 0402HP--3N3XJLW Coilcraft L2, L4 10 nH Chip Inductors 0402CS--10NXJLW Coilcraft L3 2.2 nH Chip Inductor 0402CS--2N2XJLW Coilcraft R1 180 Chip Resistor RC0402FR--07--180RL Yageo R2, R3 1200 Chip Resistors RC0402FR--07--1K2RL Yageo PCB 0.010, r = 3.48, Multilayer RO4350B Rogers (Test Circuit Component Designations and Values repeated for reference.) MML20242HT1 4 RF Device Data Freescale Semiconductor, Inc. --50 35 --4 --51 30 --8 --52 25 --12 --53 20 --16 --20 S12 (dB) 0 85C 25C --24 --28 1800 --56 5 VDD = 5 Vdc 1860 1920 2040 2100 VDD = 5 Vdc 1860 1920 1980 2040 f, FREQUENCY (MHz) f, FREQUENCY (MHz) Figure 5. S11 versus Frequency versus Temperature Figure 6. S12 versus Frequency versus Temperature 40 --7 --40C 36 S21 (dB) 1980 --57 0 1800 --4 2100 --10 85C 25C 28 24 --13 --40C --16 85C --19 20 16 1800 25C --40C --54 15 44 32 85C --55 10 --40C S22 (dB) S11 (dB) 50 OHM TYPICAL CHARACTERISTICS: 1950 MHz 25C --22 VDD = 5 Vdc 1860 1920 1980 2040 2100 --25 1800 VDD = 5 Vdc 1860 1920 1980 2040 f, FREQUENCY (MHz) f, FREQUENCY (MHz) Figure 7. S21 versus Frequency versus Temperature Figure 8. S22 versus Frequency versus Temperature 2100 MML20242HT1 RF Device Data Freescale Semiconductor, Inc. 5 50 OHM TYPICAL CHARACTERISTICS: 1950 MHz 1.4 35 38 1 Gps, POWER GAIN (dB) NF, NOISE FIGURE (dB) 1.2 85C 0.8 25C 0.6 --40C 0.4 0.2 1860 1920 1980 2040 34 20 33 15 32 85C 25C 31 10 30 5 29 VDD = 5 Vdc f = 1950 MHz 15 16 17 18 19 20 21 22 f, FREQUENCY (MHz) f, FREQUENCY (MHz) Figure 9. Noise Figure versus Frequency versus Temperature Figure 10. Power Gain versus Output Power versus Temperature, CW 44 43 42 --40C 41 40 25C 39 38 85C 37 36 1800 --40C 0 28 2100 P1dB, 1 dB COMPRESSION POINT, CW (dBm) OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm) 0 1800 VDD = 5 Vdc 37 30 36 25 35 VDD = 5 Vdc 1 MHz Tone Spacing 1860 1920 1980 2040 2100 f, FREQUENCY (MHz) Figure 11. Third Order Output Intercept Point (Two--Tone) versus Frequency versus Temperature 23 26 25 --40C 24 85C 23 25C 22 21 20 19 1800 VDD = 5 Vdc 1860 1920 1980 2040 2100 f, FREQUENCY (MHz) Figure 12. P1dB versus Frequency versus Temperature, CW MML20242HT1 6 RF Device Data Freescale Semiconductor, Inc. 50 OHM APPLICATION CIRCUIT: 2535 MHz VDD1 L3 C8 12 11 L4 10 VDD2 9 1 C5 C3 L2 L1 Z2 8 2 C4 RF OUTPUT Z3 C2 RF INPUT Z1 C1 3 BIAS CIRCUIT C7 4 R2 5 C10 7 BIAS CIRCUIT 6 C11 R3 C12 Z1 Z2 Z3 C13 0.248 0.021 Microstrip 0.050 0.021 Microstrip 0.030 0.021 Microstrip Figure 13. MML20242HT1 Test Circuit Schematic Table 8. MML20242HT1 Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C5 18 pF Chip Capacitors GJM1555C1H180GB01 Murata C2, C3, C8, C11, C12 18 pF Chip Capacitors GRM1555C1H180JA01 Murata C4, C10, C13 0.1 F Chip Capacitors GRM155R61A104K01 Murata C6, C9 Components Not Placed C7 0.6 pF Chip Capacitor GJM1555C1HR60WB01 Murata L1 2.7 nH Chip Inductor 0402HP--2N7XJLW Coilcraft L2, L4 6.8 nH Chip Inductors 0402CS--6N8XJLW Coilcraft L3 1.0 nH Chip Inductor 0402CS--1N0XJLW Coilcraft R1 Component Not Placed R2, R3 1200 Chip Resistors RC0402FR--07--1K2RL Yageo PCB 0.010, r = 3.48, Multilayer RO4350B Rogers Note: Component numbers C6, C9 and R1 are labeled on board but not placed. MML20242HT1 RF Device Data Freescale Semiconductor, Inc. 7 50 OHM APPLICATION CIRCUIT: 2535 MHz VDD2 VDD1 Via A C9* Via B L4 C8 R1* C6* RFIN C5 C4 C3 L3 RFOUT L2 L1 C2 C1 C7 Via A R2 C10 C11 R3 Via B C12 C13 QFN 3x3--12E Rev. 0 Note: Component numbers C6*, C9* and R1* are labeled on board but not placed. Figure 14. MML20242HT1 Test Circuit Component Layout Table 8. MML20242HT1 Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C5 18 pF Chip Capacitors GJM1555C1H180GB01 Murata C2, C3, C8, C11, C12 18 pF Chip Capacitors GRM1555C1H180JA01 Murata C4, C10, C13 0.1 F Chip Capacitors GRM155R61A104K01 Murata C6, C9 Components Not Placed C7 0.6 pF Chip Capacitor GJM1555C1HR60WB01 Murata L1 2.7 nH Chip Inductor 0402HP--2N7XJLW Coilcraft L2, L4 6.8 nH Chip Inductors 0402CS--6N8XJLW Coilcraft L3 1.0 nH Chip Inductor 0402CS--1N0XJLW Coilcraft R1 Component Not Placed R2, R3 1200 Chip Resistors RC0402FR--07--1K2RL Yageo PCB 0.010, r = 3.48, Multilayer RO4350B Rogers (Test Circuit Component Designations and Values repeated for reference.) MML20242HT1 8 RF Device Data Freescale Semiconductor, Inc. 0 --44 35 --5 --45 30 --10 --46 25 --15 --47 20 S12 (dB) S11 (dB) 50 OHM TYPICAL CHARACTERISTICS: 2535 MHz --20 --49 10 --25 --50 5 --30 VDD = 5 Vdc 2460 2520 2580 2640 --51 0 2400 2700 2460 2520 2580 2640 f, FREQUENCY (MHz) Figure 15. S11 versus Frequency Figure 16. S12 versus Frequency 38 --4 36 --7 34 --10 32 --13 30 28 2700 --16 --19 --22 26 24 2400 VDD = 5 Vdc f, FREQUENCY (MHz) S22 (dB) S21 (dB) --35 2400 --48 15 VDD = 5 Vdc 2460 2520 2580 2640 2700 --25 2400 VDD = 5 Vdc 2460 2520 2580 2640 f, FREQUENCY (MHz) f, FREQUENCY (MHz) Figure 17. S21 versus Frequency Figure 18. S22 versus Frequency 2700 MML20242HT1 RF Device Data Freescale Semiconductor, Inc. 9 NF, NOISE FIGURE (dB) 1.4 1.2 1 0.8 0.6 0.4 0.2 0 2400 VDD = 5 Vdc 2460 2520 2580 2640 f, FREQUENCY (MHz) Figure 19. Noise Figure versus Frequency 2700 OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm) 50 OHM TYPICAL CHARACTERISTICS: 2535 MHz 44 43 42 41 40 39 38 37 36 VDD = 5 Vdc 1 MHz Tone Spacing 2400 2460 2520 2580 2640 2700 f, FREQUENCY (MHz) Figure 20. Third Order Output Intercept Point (Two--Tone) versus Frequency MML20242HT1 10 RF Device Data Freescale Semiconductor, Inc. 3.00 0.70 0.30 2.00 3.40 0.50 1.6 1.6 solder pad with thermal via structure. All dimensions in mm. Figure 21. PCB Pad Layout for QFN 3 3 ML02 YWZ Figure 22. Product Marking MML20242HT1 RF Device Data Freescale Semiconductor, Inc. 11 PACKAGE DIMENSIONS MML20242HT1 12 RF Device Data Freescale Semiconductor, Inc. MML20242HT1 RF Device Data Freescale Semiconductor, Inc. 13 MML20242HT1 14 RF Device Data Freescale Semiconductor, Inc. APPENDIX: APPLICATION CIRCUITS WITH TWO--SUPPLY VOLTAGE 50 OHM APPLICATION CIRCUIT: 1950 MHz 12 VDD1 L3 R1 C8 11 C9 10 VDD2 9 1 C5 C3 L2 L1 Z2 8 2 C4 RF OUTPUT Z3 C2 RF INPUT Z1 C1 3 BIAS CIRCUIT C7 4 R2 5 C10 7 BIAS CIRCUIT 6 C11 R3 C12 Z1 Z2 Z3 C13 0.248 0.021 Microstrip 0.050 0.021 Microstrip 0.030 0.021 Microstrip Figure A--1. MML20242HT1 Test Circuit Schematic Table A--1. MML20242HT1 Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C5 18 pF Chip Capacitors GJM1555C1H180GB01 Murata C2, C3, C8, C11, C12 18 pF Chip Capacitors GRM1555C1H180JA01 Murata C4, C9, C10, C13 0.1 F Chip Capacitors GRM155R61A104K01 Murata C6 Component Not Placed C7 0.6 pF Chip Capacitor GJM1555C1HR60WB01 Murata L1 3.3 nH Chip Inductor 0402HP--3N3XJLW Coilcraft L2 10 nH Chip Inductor 0402CS--10NXJLW Coilcraft L3 2.2 nH Chip Inductor 0402CS--2N2XJLW Coilcraft R1 180 Chip Resistor RC0402FR--07--180RL Yageo R2, R3 1200 Chip Resistors RC0402FR--07--1K2RL Yageo PCB 0.010, r = 3.48, Multilayer RO4350B Rogers Note: Component number C6 is labeled on board but not placed. MML20242HT1 RF Device Data Freescale Semiconductor, Inc. 15 Appendix: Application Circuits with Two--Supply Voltage (continued) 50 OHM APPLICATION CIRCUIT: 1950 MHz VDD2 VDD1 Via A Via B C9 C8 R1 C6* RFIN C5 C4 C3 L3 RFOUT L2 L1 C2 C1 C7 Via A R2 C10 C11 R3 Via B C12 C13 QFN 3x3--12E Rev. 0 Note: Component number C6* is labeled on board but not placed. Figure A--2. MML20242HT1 Test Circuit Component Layout Table A--1. MML20242HT1 Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C5 18 pF Chip Capacitors GJM1555C1H180GB01 Murata C2, C3, C8, C11, C12 18 pF Chip Capacitors GRM1555C1H180JA01 Murata C4, C9, C10, C13 0.1 F Chip Capacitors GRM155R61A104K01 Murata C6 Component Not Placed C7 0.6 pF Chip Capacitor GJM1555C1HR60WB01 Murata L1 3.3 nH Chip Inductor 0402HP--3N3XJLW Coilcraft L2 10 nH Chip Inductor 0402CS--10NXJLW Coilcraft L3 2.2 nH Chip Inductor 0402CS--2N2XJLW Coilcraft R1 180 Chip Resistor RC0402FR--07--180RL Yageo R2, R3 1200 Chip Resistors RC0402FR--07--1K2RL Yageo PCB 0.010, r = 3.48, Multilayer RO4350B Rogers (Test Circuit Component Designations and Values repeated for reference.) MML20242HT1 16 RF Device Data Freescale Semiconductor, Inc. Appendix: Application Circuits with Two--Supply Voltage (continued) 50 OHM APPLICATION CIRCUIT: 2535 MHz VDD1 L3 C8 12 11 C9 10 VDD2 9 1 C5 C3 L2 L1 Z2 8 2 C4 RF OUTPUT Z3 C2 RF INPUT Z1 C1 3 BIAS CIRCUIT C7 4 R2 5 C10 7 BIAS CIRCUIT 6 C11 R3 C12 Z1 Z2 Z3 C13 0.248 0.021 Microstrip 0.050 0.021 Microstrip 0.030 0.021 Microstrip Figure A--3. MML20242HT1 Test Circuit Schematic Table A--2. MML20242HT1 Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C5 18 pF Chip Capacitors GJM1555C1H180GB01 Murata C2, C3, C8, C11, C12 18 pF Chip Capacitors GRM1555C1H180JA01 Murata C4, C9, C10, C13 0.1 F Chip Capacitors GRM155R61A104K01 Murata C6 Component Not Placed C7 0.6 pF Chip Capacitor GJM1555C1HR60WB01 Murata L1 2.7 nH Chip Inductor 0402HP--2N7XJLW Coilcraft L2 6.8 nH Chip Inductor 0402CS--6N8XJLW Coilcraft L3 1.0 nH Chip Inductor 0402CS--1N0XJLW Coilcraft R1 Component Not Placed R2, R3 1200 Chip Resistors RC0402FR--07--1K2RL Yageo PCB 0.010, r = 3.48, Multilayer RO4350B Rogers Note: Component numbers C6 and R1 are labeled on board but not placed. MML20242HT1 RF Device Data Freescale Semiconductor, Inc. 17 Appendix: Application Circuits with Two--Supply Voltage (continued) 50 OHM APPLICATION CIRCUIT: 2535 MHz VDD2 VDD1 Via A Via B C9 C8 R1* C6* RFIN C5 C4 C3 L3 RFOUT L2 L1 C2 C1 C7 Via A R2 C10 C11 R3 Via B C12 C13 QFN 3x3--12E Rev. 0 Note: Component number C6* and R1* are labeled on board but not placed. Figure A--4. MML20242HT1 Test Circuit Component Layout Table A--2. MML20242HT1 Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C5 18 pF Chip Capacitors GJM1555C1H180GB01 Murata C2, C3, C8, C11, C12 18 pF Chip Capacitors GRM1555C1H180JA01 Murata C4, C9, C10, C13 0.1 F Chip Capacitors GRM155R61A104K01 Murata C6 Component Not Placed C7 0.6 pF Chip Capacitor GJM1555C1HR60WB01 Murata L1 2.7 nH Chip Inductor 0402HP--2N7XJLW Coilcraft L2 6.8 nH Chip Inductor 0402CS--6N8XJLW Coilcraft L3 1.0 nH Chip Inductor 0402CS--1N0XJLW Coilcraft R1 Component Not Placed R2, R3 1200 Chip Resistors RC0402FR--07--1K2RL Yageo PCB 0.010, r = 3.48, Multilayer RO4350B Rogers (Test Circuit Component Designations and Values repeated for reference.) MML20242HT1 18 RF Device Data Freescale Semiconductor, Inc. PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following resources to aid your design process. Application Notes AN1955: Thermal Measurement Methodology of RF Power Amplifiers AN3100: General Purpose Amplifier and MMIC Biasing Software .s2p File Development Tools Printed Circuit Boards For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to Software & Tools on the part’s Product Summary page to download the respective tool. FAILURE ANALYSIS At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In cases where Freescale is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third party vendors with moderate success. For updates contact your local Freescale Sales Office. REVISION HISTORY The following table summarizes revisions to this document. Revision Date Description 0 Oct. 2012 Initial Release of Data Sheet 1 Apr. 2013 Features bullet for noise figure value: changed from 0.57 dB to 0.59 dB to reflect the true capability of the device, p. 1 Table 1, Typical Performance: changed 1950 MHz noise figure from 0.57 dB to 0.59 dB and 2800 MHz noise figure from 0.89 dB to 0.97 dB to reflect the true capability of the device, p. 1 Added 1950 MHz, 50 Ohm Operation, application circuit figures as follows: -- Fig. 5, S11 versus Frequency versus Temperature, p. 5 -- Fig. 6, S12 versus Frequency versus Temperature, p. 5 -- Fig. 7, S21 versus Frequency versus Temperature, p. 5 -- Fig. 8, S22 versus Frequency versus Temperature, p. 5 -- Fig. 9, Noise Figure versus Frequency versus Temperature, p. 6 -- Fig. 10, Power Gain versus Output Power versus Temperature, CW, p. 6 -- Fig. 11, Third Order Output Intercept Point (Two--Tone) versus Frequency versus Temperature, p. 6 -- Fig. 12, P1dB versus Frequency versus Temperature, CW, p. 6 Added 2535 MHz, 50 Ohm Operation, application circuit figures as follows: -- Fig. 15, S11 versus Frequency, p. 9 -- Fig. 16, S12 versus Frequency, p. 9 -- Fig. 17, S21 versus Frequency, p. 9 -- Fig. 18, S22 versus Frequency, p. 9 -- Fig. 19, Noise Figure versus Frequency, p. 10 -- Fig. 20, Third Order Output Intercept Point (Two--Tone) versus Frequency, p. 10 Added Appendix: Application Circuits with Two--Supply Voltage, pp. 15–18 2 Sept. 2014 Table 2, Maximum Ratings: added footnote to RF Input Power to indicate which test signal was used to derive the max ratings value and updated Junction Temperature from 150C to 175C to reflect recent test results of the device, p. 1 Added Failure Analysis information, p. 19 MML20242HT1 RF Device Data Freescale Semiconductor, Inc. 19 How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. E 2012--2014 Freescale Semiconductor, Inc. MML20242HT1 Document Number: MML20242H Rev. 2, 9/2014 20 RF Device Data Freescale Semiconductor, Inc.