TQM8M9076 0.05-4 GHz Digital Variable Gain Amplifier Applications 32-pin 5x5mm leadless SMT package The TQM8M9076 integrates a high performance digital step attenuator followed by a high linearity, broadband gain block. The input and output of the individual stages are accessible with external pins to allow for optimization of performance at any sub-band across the DVGA’s 0.05 to 4.0 GHz operating frequency range. The TQM8M9076 is packaged in a RoHS-compliant, compact 5x5 mm surface-mount leadless package. Superior thermal design allows the product to have a minimum MTTF rating of 1000 years at a mounting temperature of +85º C. The TQM8M9076 is targeted for use in wireless infrastructure, point-to-point, or can be used for any general purpose wireless application. © 2012 TriQuint Semiconductor, Inc. 25 CLK 26 SID 27 LE 1 24 NC GND 2 23 NC GND 3 22 NC ATTout 4 ACG1 5 ACG2 6 19 NC ACG3 7 18 NC ACG4 8 17 Vdd 21 NC 20 NC NC 16 NC 15 GND 13 ATTin 12 SOD 14 6-BIT SPI DSA Pin Configuration The TQM8M9076 is a digitally controlled variable gain amplifier (DVGA) with a broadband frequency range of 50 to 4000 MHz. The DVGA features high linearity and low noise while providing digital variable gain with a 31.5 dB of range in 0.5 dB steps through a 6-bit serial mode control interface. Datasheet: Rev. D 01-20-12 28 GND AMPin ACG5 General Description 29 AMPout 32 GND Integrates DSA + Amp Functionality 50-4000 MHz Broadband Performance 19.3 dB Gain @ 2.14 GHz 2.9 dB Noise Figure @ max gain setting +21.5 dBm P1dB +38.5 dBm OIP3 +5 V Supply Voltage 125 mA Operating Current MTTF > 1000 Years 9 Functional Block Diagram 30 GND Product Features 31 GND Wireless Infrastructure Fixed Wireless Microwave and Satellite Radio General Purpose Wireless NC 11 ACG6 10 Pin # Symbol 1 Ampin 2, 3, 13, 28, 30, 31, 32 GND (Ground) 4 ATTout 5, 6, 7, 8, 9, 10 ACG1-6 11, 15, 16, 18-24 NC (No Connect) 14 SOD 12 ATTin 17 Vdd 25 CLK 26 SID 27 LE 29 Ampout Backside Paddle RF/DC Ground Ordering Information Part No. TQM8M9076 - 1 of 11 - Description Digital Variable Gain Amplifier Disclaimer: Subject to change without notice Connecting the Digital World to the Global ® Network TQM8M9076 0.05-4 GHz Digital Variable Gain Amplifier TQM8M9076-PCB 0.3-4.0 GHz Evaluation Board Standard T/R size = 2500 pieces on a 13” reel. Datasheet: Rev. D 01-20-12 © 2012 TriQuint Semiconductor, Inc. - 2 of 11 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global ® Network TQM8M9076 0.05-4 GHz Digital Variable Gain Amplifier Specifications Absolute Maximum Ratings Parameter Storage Temperature RF Input Power, CW, 50Ω,T = 25ºC Supply Voltage (Vdd) Digital Input Voltage Recommended Operating Conditions Rating -65 to 150 °C +24 dBm +6 V Vdd+0.5 V Parameter Min Typ Vdd Idd Operating Temp. Range 4.75 5 125 Max Units -40 5.25 +85 Tch (for >106 hours MTTF) 190 V mA ° C ° C Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Operation of this device outside the parameter ranges given above may cause permanent damage. Electrical Specifications Test conditions unless otherwise noted: TLEAD=+25°C, Vdd=+5V Parameter Conditions Operational Frequency Range Test Frequency Gain Gain Control Range Gain Accuracy Attenuation Step Time rise / fall Time on, Time off Input Return Loss Output Return Loss Output P1dB Output IP3 Noise Figure Supply Voltage Supply Current Thermal Resistance Min Typical 50 Max Units 4000 MHz MHz dB dB dB 2140 18.0 19.5 31.5 ± (0.3 + 4% of Atten. Setting) Max 10% / 90% RF 50% CTL to 10% / 90% RF See Note 1 At max gain level +35 100 Channel to case 0.5 90 100 -13 -10 +22 dB ns ns dB dB dBm +38.5 2.9 +5 125 dBm dB V mA ° C/W 150 38 Notes: 1. OIP3 measured with two tones at an output power of +3 dBm / tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the OIP3 using a 2:1 rule. Datasheet: Rev. D 01-20-12 © 2012 TriQuint Semiconductor, Inc. - 3 of 11 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global ® Network TQM8M9076 0.05-4 GHz Digital Variable Gain Amplifier Serial Control Interface The TQM8M9076 has a CMOS SPITM input compatible serial interface. This serial control interface converts the serial data input stream to parallel output word. The input is 3-wire (CLK, LE and SERIN) SPITM input compatible. At power up, the serial control interface resets device attenuation state to 31.5dB. The 6-bit SERIN word is loaded into the register on rising edge of the CLK, MSB first. When LE is high, CLK is disabled. SERIN (MSB in First 6-Bit Word) Control Logic Truth Table Test conditions: 25ºC, Vdd = +5V 6-Bit Control Word to DSA LSB D5 1 1 1 1 1 1 0 0 MSB D4 1 1 1 1 1 0 1 0 D3 1 1 1 1 0 1 1 0 D2 1 1 1 0 1 1 1 0 D1 1 1 0 1 1 1 1 0 D0 1 0 1 1 1 1 1 0 Attenuation State Reference : IL 0.5 dB 1 dB 2 dB 4 dB 8 dB 16 dB 31.5 dB Any combination of the possible 64 states will provide an attenuation of approximately the sum of bits selected Serial Control Interface Timing Diagram CLK is disabled when LE is high Datasheet: Rev. D 01-20-12 © 2012 TriQuint Semiconductor, Inc. - 4 of 11 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global ® Network TQM8M9076 0.05-4 GHz Digital Variable Gain Amplifier D5-D0 MSB-LSB D5-D0 MSB-LSB LE tPLO CLK SERIN tSDSUP tLESUP tSDHLD tLEPW Serial Control Timing Characteristics Test conditions: 25ºC, Vdd = +5V Min Parameter Condition Clock Frequency LE Setup Time, tLESUP 50% Duty Cycle after last CLK rising edge LE Pulse Width, tLEPW SERIN set-up time, tSDSUP SERIN hold-time, tSDHLD LE Pulse Spacing tLE Propagation Delay tPLO before CLK rising edge after CLK rising edge LE to LE pulse spacing LE to Parallel output valid Max Units 10 MHz ns 10 30 10 10 630 30 ns ns ns ns ns Min Max Units 0 2.1 2.0 0 -10 0.8 Vdd Vdd 0.8 +10 V V V V µA Serial Control DC Logic Characteristics Test conditions: 25ºC, Vdd = +5V Parameter Low State Input Voltage High State Input Voltage Output High Voltage Output Low Voltage Input Current, IIH / IIL Datasheet: Rev. D 01-20-12 © 2012 TriQuint Semiconductor, Inc. Condition On SEROUT On SEROUT On SERIN, LE and CLK - 5 of 11 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global ® Network TQM8M9076 0.05-4 GHz Digital Variable Gain Amplifier Reference Design 300-4000 MHz C7 VDD J6 Pin 19 C3 C6 C11 C5 8 C7 C6 C5 C4 C4 6 5 4 3 C1 L1 RF Input 11 30 12 29 U1 TQM8M9076 13 14 15 J2 RF Output 28 26 16 25 17 SOD J6 Pin 14 C2 27 6-BIT SPI C11 C8 L1 31 Amp DSA C2 U1 1 2 32 10 C3 J1 C1 7 9 18 19 20 21 22 23 24 C8 J6 VDD J6 Pin 1 J6 Pins CLK SID LE 12 11 13 Notes: 1. See PC Board Specifications section for material and stackup. 2. C4, C5, C6 and C7 may be removed for operation above 700 MHz. Bill of Material Ref Des U1 L1 C1, C2, C3 C4, C5, C6, C7 C8 C11 Value n/a 68 nH 68 pF 330 pF 1000 pF 0.01 uF Datasheet: Rev. D 01-20-12 © 2012 TriQuint Semiconductor, Inc. Description Digital Variable Gain Amp Inductor, 0603 Capacitor, 0402 Capacitor, 0402 Capacitor, 0603 Capacitor, 0603 - 6 of 11 - Manufacturer TriQuint various various various various various Part Number TQM8M9076 Disclaimer: Subject to change without notice Connecting the Digital World to the Global ® Network TQM8M9076 0.05-4 GHz Digital Variable Gain Amplifier Typical Performance Test Conditions: Vdd=+5 V, Temp=+25°C, Idd=125 mA (Typ.) MHz 500 900 2140 2600 3500 Gain dB 24.1 23.2 19.5 17.6 15.3 Input Return Loss dB -15 -19 -13 -11 -9 Output Return Loss dB -9 -13 -10 -10 -9 Output P1dB dBm +21.8 +21.7 +21.5 +21.5 20.6 Output IP3 (Pout=+3 dBm per tone, 1 MHz spacing) dBm +38.0 +38.2 +38.5 +38.5 +38.9 dB 1.9 2.0 2.9 3.2 3.4 Frequency (1) Noise Figure (2) Notes: 1. Gain values reflect de-embedding of 0.4 dB eval board RF I/O line losses that would not be present in target applications. 2. Noise figure values reflect de-embedding of eval board RF I/O line loss that would not be present in target applications. 3. Performance plots shown below for DVGA maximum gain state. Gain vs. Frequency Gain (dB) 25 Input Return Loss vs. Frequency 0 Input Return Loss (dB) 30 +85°C +25°C 40°C 20 15 10 -10 +85°C -20 +25°C 40°C -30 -40 0 1000 2000 3000 4000 0 1000 2000 Frequency (MHz) Output Return Loss vs. Frequency 1 MHz Tone Spacing Pout / tone = +3 dBm +85°C -5 45 +25°C +85°C +25°C −40°C 40°C -10 -15 -20 40 35 30 -25 25 0 1000 2000 3000 4000 500 1000 Frequency (MHz) 2000 2500 3000 3500 4000 Noise Figure vs. Frequency 5 4 21 3 NF (dB) 23 +85°C +25°C −40°C 19 1500 Frequency (MHz) P1dB vs. Frequency 25 P1dB (dBm) 4000 OIP3 vs. Frequency 50 OIP3 (dBm) Output Return Loss (dB) 0 3000 Frequency (MHz) 17 2 +85°C +25°C −40°C 1 15 0 500 1000 1500 2000 2500 3000 3500 500 Frequency (MHz) Datasheet: Rev. D 01-20-12 © 2012 TriQuint Semiconductor, Inc. 1000 1500 2000 2500 3000 Frequency (MHz) - 7 of 11 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global ® Network TQM8M9076 0.05-4 GHz Digital Variable Gain Amplifier 25 CLK 26 SID 27 LE 28 GND 29 AMPout 30 GND 31 GND 32 GND Pin Description AMPin 1 24 NC GND 2 23 NC GND 3 ATTout 4 ACG1 5 ACG2 6 19 NC ACG3 7 18 NC ACG4 8 17 Vdd 22 NC 20 NC NC 16 NC 15 SOD 14 GND 13 ATTin 12 NC 11 9 ACG6 10 DSA ACG5 21 NC 6-BIT SPI Pin # Symbol Description 1 2, 3, 13, 28, 30, 31, 32 11, 15, 16, 18-24 29 12 4 5, 6, 7, 8, 9, 10 14 17 25 26 27 Ampin GND (Ground) NC (No Connect) Ampout ATTin ATTout ACG1-6 SOD Vdd CLK SID LE Backside Paddle RF/DC Ground Amp RF input DC ground No electrical connection. Provide land pads for PCB mounting integrity. Amp RF output / DC supply DSA Input DSA Output Place external capacitor to Ground for applications below 700 MHz. Serial Data Out DC supply Serial Clock Serial Data In Latch Enable RF/DC ground. Provide recommended via pattern (see page 8) and ensure good solder attach for best thermal and electrical performance. PC Board Specifications PCB Material (stackup): 1 oz. Cu top layer 0.014 inch Nelco N-4000-13 1 oz. Cu middle layer 1 Core Nelco N-4000-13 1 oz. Cu middle layer 2 0.014 inch Nelco N-4000-13 1 oz. Cu bottom layer Finished board thickness is 0.062±.006 The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. Datasheet: Rev. D 01-20-12 © 2012 TriQuint Semiconductor, Inc. - 8 of 11 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global ® Network TQM8M9076 0.05-4 GHz Digital Variable Gain Amplifier Mechanical Information Package Information & Dimensions Marking: Part number - TQM8M9076 Year, week, country code - YYWW CCCC Assembly code – AaXXXX .10 C 2X TERMINAL #1 IDENTIFIER 5.0±0.1 32X 0.10 TERMINAL #1 IDENTIFIER 32X 0.50 Pitch 0.25 4 (32X) 0.450x X 0.240y 0.10 C A B 1.90 TQM8M9076 YYWW CCC AaXXXX 4.50 5.0±0.1 1.90 0.25 (1X) shape 0.10 C A B .10 C 2X 1.90 0.20 1.90 5 4.50 GND/THERMAL PAD .10 C 32X 1.02±0.08 .08 C SEATING PLANE 5 C NOTES: 1. All dimensions are in millimeters. Angles are in degrees. 2. Except where noted, this part outline conforms to JEDEC standard MO-270, Issue B (Variation DAE) for extra thin profile, fine pitch, internal stacking module (ISM). 3. Dimension and tolerance formats conform to ASME Y14.4M-1994. 4. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012. 5. Co-planarity applies to the exposed ground/thermal pad as well as the contact pins. 6. Contact plating: Electrolytic plated Au over Ni PCB Mounting Pattern 25X 3 PACKAGE OUTLINE 28X 0.28 0.50 PITCH 0.12 1 28X 0.75 3.70 0.76 0.38 0.66 3.70 COMPONENT SIDE NOTES: 1. All dimensions are in millimeters. Angles are in degrees. 2. Use 1 oz. copper minimum for top and bottom layer metal. 3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25mm (0.10”). 4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance. 5. Place mounting screws near the part to fasten a back side heat sink. 6. Do not apply solder mask to the back side of the PC board in the heat sink contact region. 7. Ensure that the backside via region makes good physical contact with the heat sink. Datasheet: Rev. D 01-20-12 © 2012 TriQuint Semiconductor, Inc. - 9 of 11 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global ® Network TQM8M9076 0.05-4 GHz Digital Variable Gain Amplifier Product Compliance Information ESD Information Solderability Package Contact Plating: Electrolytic plated Au over Ni ESD Rating: Value: Test: Standard: Class 1A >250V to <500V Human Body Model (HBM) JEDEC Standard JESD22-A114 ESD Rating: Value: Test: Standard: Class IV >1000V Charged Device Model (CDM) JEDEC Standard JESD22-C101 Compatible with both lead-free (260 °C max. reflow temperature) and tin/lead (245 °C max. reflow temperature) soldering processes. RoHs Compliance This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). This product also has the following attributes: MSL Rating Level 3 at +260 °C convection reflow per JEDEC standard IPC/JEDEC J-STD-020. Halogen Free (Chlorine, Bromine) Antimony Free TBBP-A (C15H12Br402) Free PFOS Free SVHC Free Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: [email protected] Tel: Fax: +1.503.615.9000 +1.503.615.8902 For technical questions and application information: Email: [email protected] Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contain herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Datasheet: Rev. D 01-20-12 © 2012 TriQuint Semiconductor, Inc. - 10 of 11 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global ® Network