MSP430F417-DIE www.ti.com SLAS891 – JULY 2012 MIXED SIGNAL MICROCONTROLLER FEATURES 1 • • • • • • • Low Supply-Voltage Range, 1.8 V to 3.6 V Ultralow Power Consumption Five Power-Saving Modes Wake-Up From Standby Mode Frequency-Locked Loop (FLL+) 16-Bit RISC Architecture 16-Bit Timer_A With Three or Five Capture/Compare Registers • • • • • • Integrated LCD Driver for 96 Segments On-Chip Comparator Brownout Detector Supply Voltage Supervisor/Monitor − Programmable Level Detection Serial Onboard Programming, No External Programming Voltage Needed, Programmable Code Protection by Security Fuse Bootstrap Loader in Flash Devices DESCRIPTION The Texas Instruments MSP430 family of ultra-low-power microcontrollers consists of several devices featuring different sets of peripherals targeted for various applications. The architecture, combined with five low power modes, is optimized to achieve extended battery life in portable measurement applications. The device features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 6 μs. The MSP430F417 is a microcontroller configuration with one or two built-in 16-bit timers, a comparator, 96 LCD segment drive capability, and 48 I/O pins. Typical applications include sensor systems that capture analog signals, convert them to digital values, and process the data and transmit them to a host system. The comparator and timer make the configurations ideal for industrial meters, counter applications and handheld meters. ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE MSP430F417 TD Bare die in waffle pack (2) ORDERABLE PART NUMBER PACKAGE QUANTITY MSP430F417TDE1 100 MSP430F417TDE2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated MSP430F417-DIE SLAS891 – JULY 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION 2 DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 11 mils. Silicon with backgrind Floating AlCu/TiN 800 nm Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated MSP430F417-DIE www.ti.com SLAS891 – JULY 2012 Table 1. Bond Pad Coordinates in Microns PAD NUMBER X MIN Y MIN X MAX Y MAX DVCC DESCRIPTION 1 91.95 2586.7 166.95 2661.7 P6.3 2 91.95 2470.75 166.95 2545.75 P6.4 3 91.95 2356.7 166.95 2431.7 P6.5 4 91.95 2241.7 166.95 2316.7 P6.6 5 91.95 2126.7 166.95 2201.7 P6.7 6 91.95 2011.7 166.95 2086.7 N/C 7 91.95 1896.7 166.95 1971.7 XIN 8 91.95 1483.4 166.95 1558.4 XOUT 9 91.95 1251.25 166.95 1326.25 AVSS2 10 91.95 1129.05 166.95 1204.05 N/C 11 91.95 1008.45 166.95 1083.45 P5.1/S0 12 91.95 896.5 166.95 971.5 P5.0/S1 13 91.95 787.45 166.95 862.45 P4.7/S2 14 91.95 674.2 166.95 749.2 P4.6/S3 15 91.95 559.6 166.95 634.6 P4.5/S4 16 91.95 440.95 166.95 515.95 P4.4/S5 17 264.05 91.95 339.05 166.95 P4.3/S6 18 376.5 91.95 451.5 166.95 P4.2/S7 19 905.5 91.95 980.5 166.95 P4.1/S8 20 1007.6 91.95 1082.6 166.95 P4.0/S9 21 1109.7 91.95 1184.7 166.95 P3.7/S10 22 1211.8 91.95 1286.8 166.95 P3.6/S11 23 1313.9 91.95 1388.9 166.95 P3.5/S12 24 1416 91.95 1491 166.95 P3.4/S13 25 1518.1 91.95 1593.1 166.95 P3.3/S14 26 1620.2 91.95 1695.2 166.95 P3.2/S15 27 1722.3 91.95 1797.3 166.95 P3.1/S16 28 1824.4 91.95 1899.4 166.95 P3.0/S17 29 1926.5 91.95 2001.5 166.95 P2.7/S18 30 2290.1 91.95 2365.1 166.95 P2.6/CAOUT/S19 31 2392.3 91.95 2467.3 166.95 P2.5/TA1CLK/S20 32 2494.4 91.95 2569.4 166.95 P2.4/TA1.4/S21 33 2681.55 263.5 2756.55 338.5 P2.3/TA1.3/S22 34 2681.55 737.3 2756.55 812.3 P2.2/TA1.2/S23 35 2681.55 839.4 2756.55 914.4 COM0 36 2681.55 941.5 2756.55 1016.5 P5.2/COM1 37 2681.55 1044.05 2756.55 1119.05 P5.3/COM2 38 2681.55 1146.15 2756.55 1221.15 P5.4/COM3 39 2681.55 1248.25 2756.55 1323.25 R03 40 2681.55 1350.35 2756.55 1425.35 P5.5/R13 41 2681.55 1452.45 2756.55 1527.45 P5.6/R23 42 2681.55 1554.55 2756.55 1629.55 P5.7/R33 43 2681.55 1656.65 2756.55 1731.65 P2.1/TA1.1 44 2681.55 1758.75 2756.55 1833.75 P2.0/TA0.2 45 2681.55 1860.85 2756.55 1935.85 P1.7/CA1 46 2681.55 2228.25 2756.55 2303.25 P1.6/CA0 47 2681.55 2341.95 2756.55 2416.95 Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 3 MSP430F417-DIE SLAS891 – JULY 2012 www.ti.com Table 1. Bond Pad Coordinates in Microns (continued) PAD NUMBER X MIN Y MIN X MAX Y MAX P1.5/TA0CLK/ACLK DESCRIPTION 48 2681.55 2464.1 2756.55 2539.1 P1.4/TA1.0 49 2456.25 2781.15 2531.25 2856.15 P1.3/TA1.0/SVSOUT 50 2350 2781.15 2425 2856.15 P1.2/TA0.1 51 2245.35 2781.15 2320.35 2856.15 P1.1/TA0.0/MCLK 52 2092 2781.15 2167 2856.15 P1.0/TA0.0 53 1991 2781.15 2066 2856.15 TDO/TDI 54 1803.2 2781.15 1878.2 2856.15 TDI/TCLK 55 1401.45 2766.8 1476.45 2841.8 TMS 56 1209.6 2781.15 1284.6 2856.15 TCK 57 1105.85 2781.15 1180.85 2856.15 RST/NMI 58 1003.75 2781.15 1078.75 2856.15 P6.0 59 842.45 2781.15 917.45 2856.15 P6.1 60 721.45 2781.15 796.45 2856.15 P6.2 61 600.45 2781.15 675.45 2856.15 AVSS1 62 475.95 2781.15 550.95 2856.15 DVSS 63 373.75 2781.15 448.75 2856.15 AVCC 64 260.9 2781.15 335.9 2856.15 4 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 21-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) MSP430F417TDE1 ACTIVE 0 100 TBD Call TI N / A for Pkg Type MSP430F417TDE2 ACTIVE 0 10 TBD Call TI N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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