AD ADG779

a
CMOS 1.8 V to 5.5 V, 2.5 SPDT Switch/2:1 Mux In Tiny SC70 Package
ADG779
FEATURES
1.8 V to 5.5 V Single Supply
2.5 On Resistance
0.75 On-Resistance Flatness
–3 dB Bandwidth >200 MHz
Rail-to-Rail Operation
6-Lead SC70 Package
Fast Switching Times
t ON 20 ns
t OFF 6 ns
Typical Power Consumption (<0.01 W)
TTL/CMOS-Compatible
FUNCTIONAL BLOCK DIAGRAM
ADG779
S2
D
S1
IN
SWITCHES SHOWN FOR
A LOGIC "1" INPUT
APPLICATIONS
Battery-Powered Systems
Communication Systems
Sample Hold Systems
Audio Signal Routing
Video Switching
Mechanical Reed Relay Replacement
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The ADG779 is a monolithic CMOS SPDT (single-pole,
double-throw) switch. This switch is designed on a submicron process that provides low power dissipation yet gives
high switching speed, low on resistance and low leakage
currents.
1. Tiny 6-Lead SC70 Package.
The ADG779 operates from a single supply range of 1.8 V
to 5.5 V, making it ideal for use in battery-powered instruments and with the new generation of DACs and ADCs from
Analog Devices.
3. Very Low RON (5 Ω max at 5 V, 10 Ω max at 3 V). At 1.8 V
operation, RON is typically 40 Ω over the temperature range.
Each switch of the ADG779 conducts equally well in both
directions when on. The ADG779 exhibits break-before-make
switching action.
5. –3 dB Bandwidth >200 MHz.
Because of the advanced submicron process, –3 dB bandwidth
of greater than 200 MHz can be achieved.
7. 14 ns Switching Times.
2. 1.8 V to 5.5 V Single Supply Operation. The ADG779
offers high performance, including low on resistance and
fast switching times, and is fully specified and guaranteed
with 3 V and 5 V supply rails.
4. On-Resistance Flatness (RFLAT(ON)) (0.75 Ω typ).
6. Low Power Dissipation. CMOS construction ensures low
power dissipation.
The ADG779 is available in a 6-lead SC70 package.
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
www.analog.com
Fax: 781/326-8703
© Analog Devices, Inc., 2001
ADG779–SPECIFICATIONS1 (V
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
LEAKAGE CURRENTS2
Source OFF Leakage IS (OFF)
Channel ON Leakage ID, IS (ON)
= 5 V 10%, GND = 0 V)
B Version
–40C to
25C
+85C
0 V to VDD
2 .5
5
On Resistance Match Between
Channels (∆RON)
On-Resistance Flatness (RFLAT(ON))
DD
6
Unit
Test Conditions/Comments
V
Ω typ
Ω max
VS = 0 V to VDD, IS = –10 mA,
Test Circuit 1
1.2
Ω typ
Ω max
Ω typ
Ω max
± 0.01
± 0.05
nA typ
± 0.01
± 0.05
nA typ
2.4
0.8
V min
V max
± 0.1
µA typ
µA max
VIN = VINL or VINH
RL = 300 Ω, CL = 35 pF
VS = 3 V, Test Circuit 4
RL = 300 Ω, CL = 35 pF
VS = 3 V, Test Circuit 4
RL = 300 Ω, CL = 35 pF,
VS1 = VS2 = 3 V, Test Circuit 5
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz,
Test Circuit 6
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz,
Test Circuit 7
RL = 50 Ω, CL = 5 pF, Test Circuit 8
f = 1 MHz
f = 1 MHz
0.1
0.8
0.75
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
IINL or IINH
0.005
DYNAMIC CHARACTERISTICS2
tON
14
tOFF
3
Break-Before-Make Time Delay, tD
8
Off Isolation
–67
–87
ns typ
ns max
ns typ
ns max
ns typ
ns min
dB typ
dB typ
Channel-to-Channel Crosstalk
–62
–82
dB typ
dB typ
Bandwidth –3 dB
CS (OFF)
CD, CS (ON)
200
7
27
MHz typ
pF typ
pF typ
20
6
1
VS = 0 V to VDD, IS = –10 mA
VDD = 5.5 V
VS = 4.5 V/1 V, VD = 1 V/4.5 V,
Test Circuit 2
VS = VD = 1 V, or VS = VD = 4.5 V,
Test Circuit 3
VDD = 5.5 V
Digital Inputs = 0 V or 5 V
POWER REQUIREMENTS
IDD
VS = 0 V to VDD, IS = –10 mA
µA typ
µA max
0.001
1.0
NOTES
1
Temperature ranges are as follows: B Version, –40°C to +85°C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
–2–
REV. 0
1
SPECIFICATIONS
ADG779
(VDD = 3 V 10%, GND = 0 V)
Parameter
B Version
–40C to
25C
+85C
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
6
Unit
Test Conditions/Comments
0 V to VDD
7
10
V
Ω typ
Ω max
VS = 0 V to VDD, IS = –10 mA,
Test Circuit 1
0.1
0.8
2.5
Ω typ
Ω max
Ω typ
± 0.01
± 0.05
nA typ
± 0.01
± 0.05
nA typ
2.0
0.8
V min
V max
± 0.1
µA typ
µA max
VIN = VINL or VINH
RL = 300 Ω, CL = 35 pF
VS = 2 V, Test Circuit 4
RL = 300 Ω, CL = 35 pF
VS = 2 V, Test Circuit 4
RL = 300 Ω, CL = 35 pF
VS1 = VS2 = 2 V, Test Circuit 5
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz,
Test Circuit 6
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz,
Test Circuit 7
RL = 50 Ω, CL = 5 pF, Test Circuit 8
f = 1 MHz
f = 1 MHz
On Resistance Match Between
Channels (∆RON)
On-Resistance Flatness (RFLAT(ON))
2
LEAKAGE CURRENTS
Source OFF Leakage IS (OFF)
Channel ON Leakage ID, IS (ON)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
IINL or IINH
0.005
DYNAMIC CHARACTERISTICS2
tON
16
tOFF
4
Break-Before-Make Time Delay, tD
8
Off Isolation
–67
–87
ns typ
ns max
ns typ
ns max
ns typ
ns min
dB typ
dB typ
Channel-to-Channel Crosstalk
–62
–82
dB typ
dB typ
Bandwidth –3 dB
CS (OFF)
CD, CS (ON)
200
7
27
MHz typ
pF typ
pF typ
24
7
1
µA typ
µA max
0.001
1.0
NOTES
1
Temperature ranges are as follows: B Version, –40°C to +85°C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
REV. 0
VS = 0 V to VDD, IS = –10 mA
VDD = 3.3 V
VS = 3 V/1 V, VD = 1 V/3 V,
Test Circuit 2
VS = VD = 1 V, or VS = VD = 3 V,
Test Circuit 3
VDD = 3.3 V
Digital Inputs = 0 V or 3 V
POWER REQUIREMENTS
IDD
VS = 0 V to VDD, IS = –10 mA
–3–
ADG779
ABSOLUTE MAXIMUM RATINGS 1
TERMINOLOGY
(TA = 25°C unless otherwise noted)
VDD
GND
S
D
IN
RON
∆RON
Most Positive Power Supply Potential.
Ground (0 V) Reference.
Source Terminal. May be an input or output.
Drain Terminal. May be an input or output.
Logic Control Input.
Ohmic resistance between D and S.
On resistance match between any two channels
i.e., RON max – RON min.
RFLAT(ON)
Flatness is defined as the difference between the
maximum and minimum value of on resistance as
measured over the specified analog signal range.
Source Leakage Current with the switch “OFF.”
IS (OFF)
ID, IS (ON) Channel Leakage Current with the switch “ON.”
VD (VS)
Analog Voltage on Terminals D, S.
CS (OFF)
“OFF” Switch Source Capacitance.
CD, CS (ON) “ON” Switch Capacitance.
tON
Delay between applying the digital control input
and the output switching on.
tOFF
Delay between applying the digital control input
and the output switching off.
tD
“OFF” time or “ON” time measured between the
90% points of both switches, when switching
from one address state to another.
Crosstalk
A measure of unwanted signal that is coupled
through from one channel to another as a result
of parasitic capacitance.
Off Isolation A measure of unwanted signal coupling through
an “OFF” switch.
On Response The frequency response of the “ON” switch.
On Loss
The loss due to the “ON” resistance of the switch.
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog, Digital Inputs2 . . . . . . . . . . –0.3 V to VDD + 0.3 V or
30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
SC70 Package, Power Dissipation . . . . . . . . . . . . . . . . 315 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 332°C/W
θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 120°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2
Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
Table I. Truth Table
ADG779 IN
Switch S1
Switch S2
0
1
ON
OFF
OFF
ON
PIN CONFIGURATION
6-Lead SC70
IN 1
VDD 2
GND 3
ADG779
TOP VIEW
(Not to Scale)
6
S2
5
D
4
S1
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
Branding Information*
ADG779BKS
–40°C to +85°C
SC70 (Plastic Surface Mount)
KS-6
SKB
*Brand = Brand on these packages is limited to three characters due to space constraints.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG779 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
–4–
WARNING!
ESD SENSITIVE DEVICE
REV. 0
Typical Performance Characteristics– ADG779
6.0
0.15
5.5
VDD = 2.7V
VDD = 5V
VD = 4.5V/1V
VS = 1V/4.5V
TA = 25C
5.0
4.5
0.10
VDD = 4.5V
VDD = 3.0V
3.5
CURRENT – nA
RON – 4.0
3.0
2.5
VDD = 5.0V
2.0
ID, I S (ON)
0.05
1.5
0
1.0
0.5
IS (OFF)
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
–0.05
5.0
0
10
20
VD OR VS – DRAIN OR SOURCE VOLTAGE – V
TPC 1. On Resistance as a Function of VD (VS) Single
Supplies
70
80
90
TPC 4. Leakage Currents as a Function of Temperature
0.15
6.0
VDD = 3V
VD = 3V/1V
VS = 1V/3V
VDD = 3V
5.5
5.0
+85C
4.5
0.10
+25C
CURRENT – nA
4.0
–40C
RON – 30
40
50
60
TEMPERATURE – C
3.5
3.0
2.5
2.0
0.05
1.5
ID, I S (ON)
0
1.0
0.5
0
IS (OFF)
–0.05
0
0.5
1.0
1.5
2.0
2.5
VD OR VS – DRAIN OR SOURCE VOLTAGE – V
3.0
0
10
20
30
40
50
60
TEMPERATURE – C
70
80
90
TPC 5. Leakage Currents as a Function of Temperature
TPC 2. On Resistance as a Function of VD (VS) for
Different Temperatures VDD = 3 V
6.0
10m
5.5
VDD = 5V
VDD = 5V
1m
5.0
4.5
100
3.5
I SUPPLY – A
RON – 4.0
+85C
3.0
2.5
+25C
2.0
–40C
10
1
100n
1.5
1.0
10n
0.5
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
1n
5.0
VD OR VS – DRAIN OR SOURCE VOLTAGE – V
TPC 3. On Resistance as a Function of VD (VS) for
Different Temperatures VDD = 5 V
REV. 0
1
10
100
1k
10k
100k
FREQUENCY – Hz
1M
10M
100M
TPC 6. Supply Current vs. Input Switching Frequency
–5–
ADG779
0
–30
VDD = 5V, 3V
–40
VDD = 5V
–60
ON RESPONSE – dB
OFF ISOLATION – dB
–50
–70
–80
–90
–100
–2
–4
–110
–120
–130
10k
100k
–6
10k
100M 0
1M
10M
FREQUENCY – Hz
TPC 7. Off Isolation vs. Frequency
100k
1M
10M
FREQUENCY – Hz
100M
TPC 9. On Response vs. Frequency
–30
VDD = 5V, 3V
–40
CROSSTALK – dB
–50
–60
–70
–80
–90
–100
–110
–120
–130
10k
100k
1M
FREQUENCY – Hz
10M
100M 0
TPC 8. Crosstalk vs. Frequency
–6–
REV. 0
ADG779
Test Circuits
IDS
V1
S
IS (OFF)
D
A
VS
ID (OFF)
S
D
ID (ON)
S
A
VS
RON = V1/I DS
Test Circuit 2. Off Leakage
0.1F
A
VS
VD
Test Circuit 1. On Resistance
D
VD
Test Circuit 3. On Leakage
VDD
VIN
50%
50%
VDD
S
D
RL
300
IN
VS
GND
90%
90%
VOUT
VOUT
CL
35pF
tOFF
tON
Test Circuit 4. Switching Times
0.1F
VIN
VDD
S1
VS1
VDD
D
D2
S2
VS2
RL2
300
IN
CL2
35pF
VOUT
50%
0V
50%
VOUT
50%
0V
tD
GND
VIN
50%
tD
Test Circuit 5. Break-Before-Make Time Delay, tD
VDD
VDD
VDD
0.1F
0.1F
0.1F
NETWORK
ANALYZER
VDD
S
IN
50
50
VS
D
VIN
GND
RL
50
VOUT
VOUT
OFF ISOLATION = 20 LOG
VS
Test Circuit 6. Off Isolation
REV. 0
NETWORK
ANALYZER
VOUT
VDD
RL
50
S1
D
S2
50
VS
NETWORK
ANALYZER
VDD
S
R
50
50
IN
VS
D
IN
VIN
GND
GND
CHANNEL-TO-CHANNEL
VOUT
CROSSTALK = 20 LOG
VS
Test Circuit 7. Channel-to-Channel Crosstalk
–7–
INSERTION LOSS = 20 LOG
RL
50
VOUT
VOUT WITH SWITCH
VOUT WITHOUT SWITCH
Test Circuit 8. Bandwidth
ADG779
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
6-Lead Plastic Surface Mount Package (SC70)
(KS-6)
0.053 (1.35)
0.045 (1.15)
6
1
5
4
2
3
C02491–1.5–7/01(0)
0.087 (2.20)
0.071 (1.80)
0.094 (2.40)
0.071 (1.80)
PIN 1
0.026 (0.65) BSC
0.051 (1.30)
BSC
0.004 (0.10)
0.000 (0.00)
0.043 (1.10)
0.031 (0.80)
0.012 (0.30) SEATING
0.006 (0.15) PLANE
8
0.007 (0.18) 0
0.004 (0.10)
0.012 (0.30)
0.004 (0.10)
PRINTED IN U.S.A.
0.039 (1.00)
0.031 (0.80)
–8–
REV. 0