HLMP-D150, HLMP-D155, HLMP-K150 and HLMP-K155 T-13/4 (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps Data Sheet Description Features These solid state LED lamps utilize double heterojunction (DH) AlGaAs/GaAs material technology. This LED material has outstanding light output efficiency at very low drive currents. The color is deep red at the dominant wavelength of 637 nanometres. These lamps are ideally suited for use in applications where high light output is required with minimum power output. • Minimum luminous intensity specified at 1 mA • High light output at low currents • Wide viewing angle • Outstanding material efficiency • Low power/low forward voltage • CMOS/MOS compatible • TTL compatible • Deep red color Applications • Low power circuits • Battery powered equipment • Telecommunication indicators Package Dimensions 5.08 (0.200) 4.57 (0.180) Ø 3.17 (.125) 2.67 (.105) 3.43 (.135) 2.92 (.115) 9.19 (0.362) 8.43 (0.332) 4.70 (.185) 4.19 (.165) 0.89 (0.035) 0.64 (0.025) 6.35 (.250) 5.58 (.220) 0.65 (0.026) MAX. CATHODE 1.14 (.045) 0.51 (.020) 25.40 (1.00) MINIMUM 0.65 (0.026) max. 24.1(.95) min. 1.27(0.050) NOM. 0.55 (0.022) SQ. TYP. 0.40 (0.016) 1.52 (.060) 1.02 (.040) 6.10 (0.240) 5.59 (0.220) (0.022) 0.55 SQ. TYP. (0.016) 0.40 2.54 (0.100) NOM. A B Notes: 1. All dimensions are in mm (inches). 2. An epoxy meniscus may extend about 1 mm (0.040") down the leads. 3. For PCB hole recommendations, see the Precautions section. 2.79 (.110) 2.29 (.090) C Selection Guide Luminous Intensity Iv (mcd) at 1 mA Package Description Device HLMP- Min. Typ. Max. 2θ1/2[1] Degree T-1 3/4 Red Tinted Diffused D150 1.3 3.0 – 65 A D150-C00xx 1.3 3.0 – 65 A D155 5.4 10.0 – 24 B D155-F00xx 5.4 10.0 – 24 B K150 1.3 2.0 – 60 C K150-C00xx 1.3 2.0 – 60 C K150-CD0xx 1.3 3.0 4.2 60 C K155 2.1 3.0 – 45 C K155-D00xx 2.1 3.0 – 45 C T-1 3/4 Red Untinted Non-diffused T-1 Red Tinted Diffused T-1 Red Untinted Non-diffused Note: 1. θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 the on-axis value. Part Numbering System HLMP - x 1 xx - x x x xx Mechanical Option 00: Bulk 01: Tape & Reel, Crimped Leads 02: Tape & Reel, Straight Leads A1, B1: Right Angle Housing, Uneven Leads A2, B2: Right Angle Housing, Even Leads DD, DH: Ammo Pack Color Bin Options 0: Full color bin distribution Maximum Iv Bin Options 0: Open (No max. limit) Others: Please refer to the Iv bin table Minimum Iv Bin Options Please refer to the Iv bin table Lens Option 50: Tinted, Diffused 55: Untinted, Nondiffused Package Options D: T-13/4 (5 mm) K: T-1 (3 mm) 2 Package Outline Absolute Maximum Ratings at TA = 25°C Parameter Value Peak Forward Current[1] 300 mA Average Forward Current 20 mA DC Current[2] 30 mA Power Dissipation 87 mW Reverse Voltage (IR = 100 μA) 5V Transient Forward Current (10 μs Pulse)[3] 500 mA LED Junction Temperature 110°C Operating Temperature Range -20 to +100°C Storage Temperature Range -40 to +100°C Notes: 1. Maximum IPEAK at f = 1 kHz, DF = 6.7%. 2. Derate linearly as shown in Figure 4. 3. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and wire bonds. It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current. Electrical/Optical Characteristics at TA = 25°C Symbol Description VF Forward Voltage VR Reverse Breakdown Voltage λp Min. Typ. Max. Unit Test Condition 1.6 1.8 V IF = 1 mA 15.0 V IR = 100 μA Peak Wavelength 645 nm Measurement at Peak λd Dominant Wavelength 637 nm Note 1 Δλ1/2 Spectral Line Halfwidth 20 nm Wavelength width at spectral distribution 1/2 power point. τS Speed of Response 30 ns Exponential Time Constant, e-t/TS C Capacitance 30 pF VF = 0, f = 1 MHz RθJ-PIN Thermal Resistance 260[3] 210[4] 290[5] °C/W Junction to Cathode Lead ηV Luminous Efficacy 80 Im/W Note 2 5.0 Notes: 1. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and represents the color of the device. 2. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = lV/ηV, where IV is the luminous intensity in candelas and ηV is luminous efficacy in lumens/watt. 3. HLMP-D150. 4. HLMP-D155. 5. HLMP-K150/-K155. 3 Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage. Figure 3. Relative luminous intensity vs. dc forward current. Figure 4. Maximum forward dc current vs. ambient temperature. Derating based on TJ Max. = 110 °C. Figure 5. Relative luminous intensity vs. angular displacement. HLMP-D150. Figure 6. Relative luminous intensity vs. angular displacement. HLMP-K150. 4 Figure 7. Relative luminous intensity vs. angular displacement. HLMP-D155. Intensity Bin Limits Intensity Range (mcd) Color Bin Min. Max. Red C 1.5 2.4 D 2.4 3.8 E 3.8 6.1 F 6.1 9.7 G 9.7 15.5 H 15.5 24.8 I 24.8 39.6 J 39.6 63.4 K 63.4 101.5 L 101.5 162.4 M 162.4 234.6 N 234.6 340.0 O 340.0 540.0 P 540.0 850.0 Q 850.0 1200.0 R 1200.0 1700.0 S 1700.0 2400.0 T 2400.0 3400.0 U 3400.0 4900.0 V 4900.0 7100.0 W 7100.0 10200.0 X 10200.0 14800.0 Y 14800.0 21400.0 Z 21400.0 30900.0 Note: Maximum tolerance for each bin limit is ± 18%. 5 Figure 8. Relative luminous intensity vs. angular displacement. HLMP-K155. Mechanical Option Matrix Mechanical Option Code Definition 00 Bulk Packaging, minimum increment 500 pcs/bag 01 Tape & Reel, crimped leads, minimum increment 1300 pcs for T-13/4, 1800 pcs for T-1 02 Tape & Reel, straight leads, minimum increment 1300 pcs for T-13/4, 1800 pcs for T-1 A1 T-1, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag A2 T-1, Right Angle Housing, even leads, minimum increment 500 pcs/bag B1 T-13/4, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag B2 T-13/4, Right Angle Housing, even leads, minimum increment 500 pcs/bag DD Ammo Pack, straight leads with minimum 2K increment DH Ammo Pack, straight leads with minimum 2K increment Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago representative for further clarification/information. 6 Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Soldering and Handling: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59 mm • ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering condition: Wave Manual Solder Soldering[1],[2]Dipping Pre-heat Temperature 105°C Max. – Pre-heat Time 60 sec Max. – Peak Temperature 250°C Max. 260°C Max. Dwell Time 3 sec Max. 5 sec Max. Note: 1. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads. LED Component Lead Size Diagonal Plated ThroughHole Diameter Lead size (typ.) 0.45 × 0.45 mm (0.018 × 0.018 in.) 0.636 mm (0.025 in) 0.98 to 1.08 mm (0.039 to 0.043 in) Dambar shear- 0.65 mm off area (max.) (0.026 in) 0.919 mm (0.036 in) Lead size (typ.) 0.50 × 0.50 mm (0.020 × 0.020 in.) 0.707 mm (0.028 in) Dambar shear- 0.70 mm off area (max.) (0.028 in) 0.99 mm (0.039 in) 1.05 to 1.15 mm (0.041 to 0.045 in) • Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of TH LED lamps. 7 Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR HOT AIR KNIFE TURBULENT WAVE 250 Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) TEMPERATURE (°C) 200 Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec) 150 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) 100 Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) 50 PREHEAT 0 10 20 30 Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec) 40 50 60 TIME (MINUTES) 70 80 90 100 Note: Allow for board to be sufficiently cooled to Packaging Label: (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Color Bin (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin Lamps Baby Label (1P) PART #: Part Number 8 RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity room temperature before exerting mechanical force. DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Color Bin DATECODE: Date Code For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes 5898-4249EN AV02-1562EN - June 19, 2013