CM1693-04DE, CM1693-06DE, CM1693-08DE L-C LCD and Camera EMI Filter Array with ESD Protection http://onsemi.com Product Description The CM1693 is a family of pi−style EMI filter arrays with ESD protection, which integrates four, six or eight filters (C−L−C) into a small−form factor, uDFN 0.40 mm pitch package. Each EMI filter channel is implemented as a 3−pole L−C filter, where the component values are 10 pF−26 nH−12 pF. The CM1693’s roll−off frequency at −6 dB attenuation is 300 MHz and can be used in applications where the data rates are as high as 140 Mbps. The CM1693 also provides greater than −30 dB attenuation over the 800 MHz to 6 GHz frequency range. The device includes ESD diodes on every pin that provide a very high level of protection for sensitive electronic components against possible electrostatic discharge (ESD). The ESD protection diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of ±18 kV, which is beyond the maximum requirement of the IEC61000−4−2 international standard. This device is particularly well suited for wireless handsets, mobile LCD modules and PDAs because of its small package format and easy−to−use pin assignments. In particular, the CM1693 is ideal for EMI filtering and protecting data and control lines for the LCD display and camera interface in mobile handsets. The CM1693 is housed in space saving, low profile, 0.40 mm pitch uDFN packages in a RoHS compliant, Pb−Free format. Features • 4, 6 or 8 Channels of EMI Filtering with Integrated ESD Protection • Pi−Style EMI Filters in a Capacitor−Inductor−Capacitor (C−L−C) • • • • • • Network +18 kV ESD Protection on Each Channel (IEC 61000−4−2 Level 4, Contact Discharge) Greater than −35 dB Attenuation (Typical) at 1GHz uDFN Lead−Free Package with 0.40 mm Lead Pitch: ♦ 4−Ch. = 8−Lead uDFN ♦ 6−Ch. = 12−Lead uDFN ♦ 8−Ch. = 16−Lead uDFN uDFN Package size: ♦ 8−Lead: 1.70 mm x 1.35 mm ♦ 12−Lead: 2.50 mm x 1.35 mm ♦ 16−Lead: 3.30 mm x 1.35 mm Increased Robustness Against Vertical Impacts During Manufacturing Process These Devices are Pb−Free and are RoHS Compliant 1 16 1 uDFN8 DE SUFFIX CASE 517BC 1 uDFN12 DE SUFFIX CASE 517BD uDFN16 DE SUFFIX CASE 517BE ELECTRICAL SCHEMATIC 26 nH Filter + ESDn* 10 pF Filter + ESDn* 12 pF GND 1 of 4, 6 or 8 EMI/RFI Filter Channels with Integrated ESD protection * See Package/Pinout Diagram for expanded pin information MARKING DIAGRAM P93 MG G 1 P936 MG G P938 MG G 1 1 XXXX = Specific Device Code M = Month Code G = Pb−Free Package (*Note: Microdot may be in either location) Package Shipping† CM1693−04DE uDFN−8 (Pb−Free) 3000/Tape & Reel CM1693−06DE uDFN−12 (Pb−Free) 3000/Tape & Reel CM1693−08DE uDFN−16 (Pb−Free) 3000/Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. • Handheld PCs/PDAs • LCD and Camera Modules • EMI Filtering for Data Ports in Cell Phones, PDAs • LCD and Camera Data Lines in Mobile Handsets • I/O Port Protection for Mobile Handsets, Notebook or Notebook Computers. Computers, PDAs etc. May, 2013 − Rev. 3 12 ORDERING INFORMATION Applications © Semiconductor Components Industries, LLC, 2013 8 • Wireless Handsets 1 Publication Order Number: CM1693/D CM1693−04DE, CM1693−06DE, CM1693−08DE PACKAGE / PINOUT DIAGRAMS Table 1. PIN DESCRIPTIONS Device Pin(s) TOP VIEW (Pins Down View) −04 −06 −08 Name 1; 8 1; 12 1; 16 FILTER1 Filter + ESD Channel 1 2; 7 2; 11 2; 15 FILTER2 Filter + ESD Channel 2 3; 6 3; 10 3; 14 FILTER3 Filter + ESD Channel 3 4; 5 4; 9 4; 13 FILTER4 Filter + ESD Channel 4 5; 8 5; 12 FILTER5 Filter + ESD Channel 5 6; 7 6; 11 FILTER6 Filter + ESD Channel 6 7; 10 FILTER7 Filter + ESD Channel 7 8; 9 FILTER8 Filter + ESD Channel 8 GND PAD Description GND 8 7 6 BOTTOM VIEW (Pins Up View) 5 P93 (x) Single Digit Date Code 1 2 Pin 1 Marking 3 12 11 10 9 Single Digit Date Code 8 4 8 CM1693−04DE 8−Lead uDFN Package Bottom View (Pins Up View) 1 7 P936(x) 1 2 3 4 2 3 4 5 6 8 7 GND PAD 5 6 12 11 10 9 Pin 1 Marking CM1693−06DE 12−Lead uDFN Package BOTTOM VIEW (Pins Up View) TOP VIEW (Pins Down View) Single Digit Date Code 16 15 14 13 12 11 10 9 1 2 3 P938 (x) Pin 1 Marking 1 2 3 4 5 6 4 5 6 7 8 13 12 11 10 9 GND PAD 7 16 15 14 8 CM1693−08DE 16−Lead uDFN Package http://onsemi.com 2 3 4 GND PAD Device Ground Top View (Pins Down View) 2 1 7 6 5 CM1693−04DE, CM1693−06DE, CM1693−08DE SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units –65 to +150 °C Current per Inductor 30 mA DC Package Power Rating 500 mW Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units –40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Parameter Symbol L Conditions Min Channel Inductance Typ CTOTAL Total Channel Capacitance At 2.5 VDC Reverse Bias, 1 MHz, 30 mVAC 17.6 VDIODE 5.5 pF 0.1 1.0 mA 6.8 –0.8 9.0 −0.4 IDIODE = 10 mA Diode Leakage Current (reverse bias) VDIODE = +3.3 V VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10 mA ILOAD = –10 mA VESD In−system ESD Withstand Voltage Contact Discharge per IEC 61000−4−2 Level 4 RDYN Dynamic Resistance Positive Negative 2.3 0.9 Roll−off Frequency at −6 dB Attenuation ZSOURCE = 50 W, ZLOAD = 50 W 300 (Notes 2, 3 and 4) nH 26.4 Standoff Voltage 5.6 –1.5 Units 22 ILEAK fR Max 26 V V kV ±18 W MHz 1. TA = 25°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. 3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin (i.e. if ESD is applied to pin A1 then clamping voltage is measured at pin C1). Unused pins are left open. 4. These parameters are guaranteed by design and characterization. http://onsemi.com 3 CM1693−04DE, CM1693−06DE, CM1693−08DE PERFORMANCE INFORMATION Typical Filter Performance (TA = 25°C, DC Bias = 0 V, 50 Ohm Environment) Figure 1. Typical Filter Insertion Loss (CM1693) Typical Diode Capacitance vs. Input Voltage Figure 2. Filter Capacitance vs. Input Voltage (Normalized to Capacitance at 0 VDC and 25°C) http://onsemi.com 4 CM1693−04DE, CM1693−06DE, CM1693−08DE MECHANICAL DETAILS uDFN−08, uDFN−12 and uDFN−16 Mechanical Specifications, 0.4mm The 8−lead, 12−lead and 16−lead, 0.4 mm pitch uDFN package dimensions are presented below. Table 5. TAPE AND REEL SPECIFICATIONS Pocket Size (mm) Tape Width† Package Size (mm) B0 x A0 x K0 W Reel Diameter Qty per Reel P0 P1 CM1693−04DE 1.70 x 1.35 x 0.50 1.95 x 1.60 x 0.60 8 mm 178 mm (7″) 3000 4 mm 4 mm CM1693−06DE 2.50 x 1.35 x 0.50 2.75 x 1.60 x 0.60 8 mm 178 mm (7″) 3000 4 mm 4 mm CM1693−08DE 3.30 x 1.35 x 0.50 3.50 x 1.55 x 0.70 12 mm 178 mm (7″) 3000 4 mm 4 mm Part Number †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 10 Pitches Cumulative P0 Top Î Î Î Î ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ Tolerance On Tape ±0.2 mm Cover Tape K0 For Tape Feeder Reference Only Including Draft Concentric Around B A0 W B0 Embossment P1 User Direction of Feed http://onsemi.com 5 Center Lines of Cavity CM1693−04DE, CM1693−06DE, CM1693−08DE PACKAGE DIMENSIONS UDFN8, 1.7x1.35, 0.4P CASE 517BC−01 ISSUE O A B D 2X 0.10 C PIN ONE REFERENCE 2X 0.10 C ÉÉ ÉÉ ÇÇ ÇÇ ÉÉ MOLD CMPD EXPOSED Cu A1 E NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A3 DETAIL B ALTERNATE CONSTRUCTIONS TOP VIEW A DETAIL B 0.05 C 8X L L1 DETAIL A 0.05 C NOTE 4 SIDE VIEW DETAIL A 8X L (A3) L A1 C SEATING PLANE ALTERNATE TERMINAL CONSTRUCTIONS D2 1 DIM A A1 A3 b D D2 E E2 e K L L1 RECOMMENDED SOLDERING FOOTPRINT* E2 1.40 8X 8 K e e/2 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.70 BSC 1.10 1.30 1.35 BSC 0.30 0.50 0.40 BSC 0.15 −−− 0.20 0.30 −−− 0.05 8X 0.40 8X b PACKAGE OUTLINE 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW 1.55 0.50 8X 0.25 1 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 CM1693−04DE, CM1693−06DE, CM1693−08DE PACKAGE DIMENSIONS UDFN12, 2.5x1.35, 0.4P CASE 517BD−01 ISSUE O A B D 2X 0.10 C PIN ONE REFERENCE 2X L1 ÉÉÉ ÉÉÉ 0.10 C DETAIL A E OPTIONAL CONSTRUCTIONS TOP VIEW A DETAIL B (A3) A1 0.05 C NOTE 4 12X A1 SIDE VIEW 6 1 C SEATING PLANE A3 DETAIL B OPTIONAL CONSTRUCTION 12 DIM A A1 A3 b D D2 E E2 e K L L1 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 2.50 BSC 1.90 2.10 1.35 BSC 0.30 0.50 0.40 BSC 0.15 −−− 0.20 0.30 −−− 0.05 RECOMMENDED SOLDERING FOOTPRINT* E2 PACKAGE OUTLINE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DETAIL A D2 L ÇÇ ÇÇ ÉÉ MOLD CMPD EXPOSED Cu 0.05 C 12X L L 7 e BOTTOM VIEW 12X 2.20 12X 0.40 b 0.10 C A B 0.05 C 1.55 NOTE 3 0.50 12X 0.40 PITCH 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 CM1693−04DE, CM1693−06DE, CM1693−08DE PACKAGE DIMENSIONS UDFN16, 3.3x1.35, 0.4P CASE 517BE−01 ISSUE O A B D 2X 0.10 C PIN ONE REFERENCE 2X 0.10 C ÉÉÉ ÉÉÉ L1 DETAIL A E OPTIONAL CONSTRUCTIONS TOP VIEW EXPOSED Cu A DETAIL B 0.05 C (A3) 16X A1 0.05 C NOTE 4 16X A1 SIDE VIEW 8 1 K 16 9 e C ÇÇ ÉÉ DIM A A1 A3 b D D2 E E2 e K L L1 MOLD CMPD A3 DETAIL B SEATING PLANE OPTIONAL CONSTRUCTION MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 3.30 BSC 2.70 2.90 1.35 BSC 0.30 0.50 0.40 BSC 0.15 −−− 0.20 0.30 −−− 0.05 DETAIL A D2 L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L RECOMMENDED SOLDERING FOOTPRINT* E2 16X PACKAGE OUTLINE b BOTTOM VIEW 3.00 16X 0.40 0.10 C A B 0.05 C 1.55 NOTE 3 0.50 16X 0.40 PITCH 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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